CN102804345B - 用于镍-磷存储盘的抛光组合物 - Google Patents

用于镍-磷存储盘的抛光组合物 Download PDF

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Publication number
CN102804345B
CN102804345B CN201080034414.6A CN201080034414A CN102804345B CN 102804345 B CN102804345 B CN 102804345B CN 201080034414 A CN201080034414 A CN 201080034414A CN 102804345 B CN102804345 B CN 102804345B
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CN
China
Prior art keywords
weight
polishing composition
polishing
substrate
complexing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080034414.6A
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English (en)
Chinese (zh)
Other versions
CN102804345A (zh
Inventor
S.帕拉尼萨米钦娜萨姆比
H.西里瓦达尼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of CN102804345A publication Critical patent/CN102804345A/zh
Application granted granted Critical
Publication of CN102804345B publication Critical patent/CN102804345B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
    • G11B23/50—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges
    • G11B23/505—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges of disk carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
CN201080034414.6A 2009-06-04 2010-06-03 用于镍-磷存储盘的抛光组合物 Expired - Fee Related CN102804345B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/455,631 2009-06-04
US12/455,631 US9330703B2 (en) 2009-06-04 2009-06-04 Polishing composition for nickel-phosphorous memory disks
PCT/US2010/037158 WO2010141652A2 (en) 2009-06-04 2010-06-03 Polishing composition for nickel-phosphorous memory disks

Publications (2)

Publication Number Publication Date
CN102804345A CN102804345A (zh) 2012-11-28
CN102804345B true CN102804345B (zh) 2016-01-20

Family

ID=43298492

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080034414.6A Expired - Fee Related CN102804345B (zh) 2009-06-04 2010-06-03 用于镍-磷存储盘的抛光组合物

Country Status (7)

Country Link
US (1) US9330703B2 (OSRAM)
JP (2) JP5684801B2 (OSRAM)
CN (1) CN102804345B (OSRAM)
MY (1) MY158719A (OSRAM)
SG (1) SG176661A1 (OSRAM)
TW (2) TWI481680B (OSRAM)
WO (1) WO2010141652A2 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651403B (zh) 2014-05-20 2019-02-21 日商花王股份有限公司 磁碟基板用研磨液組合物

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8623766B2 (en) * 2011-09-20 2014-01-07 Cabot Microelectronics Corporation Composition and method for polishing aluminum semiconductor substrates
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
US8518135B1 (en) * 2012-08-27 2013-08-27 Cabot Microelectronics Corporation Polishing composition containing hybrid abrasive for nickel-phosphorous coated memory disks
WO2015057433A1 (en) 2013-10-18 2015-04-23 Cabot Microelectronics Corporation Polishing composition and method for nickel-phosphorous coated memory disks
US10358579B2 (en) * 2013-12-03 2019-07-23 Cabot Microelectronics Corporation CMP compositions and methods for polishing nickel phosphorous surfaces
US9401104B2 (en) 2014-05-05 2016-07-26 Cabot Microelectronics Corporation Polishing composition for edge roll-off improvement
SG11201702051VA (en) * 2014-10-14 2017-04-27 Cabot Microelectronics Corp Nickel phosphorous cmp compositions and methods
US9481811B2 (en) 2015-02-20 2016-11-01 Cabot Microelectronics Corporation Composition and method for polishing memory hard disks exhibiting reduced edge roll-off
MY201421A (en) 2019-01-11 2024-02-21 Cmc Mat Llc Dual additive composition for polishing memory hard disks exhibiting edge roll off
JP7666904B2 (ja) * 2020-09-30 2025-04-22 株式会社フジミインコーポレーテッド 研磨用組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6015506A (en) * 1996-11-26 2000-01-18 Cabot Corporation Composition and method for polishing rigid disks
US6228823B1 (en) * 1995-07-27 2001-05-08 Mitsubishi Chemical Corporation Method for treating surface of substrate and surface treatment composition used for the same
CN1550526A (zh) * 2003-05-20 2004-12-01 CMP��ķ�͹�˹���Ӳ��Ͽعɹ�˾ 用于镍质硬盘平坦化的多氧化剂基浆料
CN1598062A (zh) * 2003-08-29 2005-03-23 Cmp罗姆和哈斯电子材料控股公司 用于镍基涂层平坦化的无颗粒抛光流体
CN1903748A (zh) * 2005-07-27 2007-01-31 株式会社日本触媒 含有亚氨基羧酸盐的固体组合物及其制造方法
CN101044600A (zh) * 2004-10-28 2007-09-26 卡伯特微电子公司 包含表面活性剂的化学机械抛光(cmp)组合物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000340532A (ja) * 1999-05-31 2000-12-08 Mitsubishi Materials Corp 研磨用スラリー及びこれを用いた研磨方法
AU6537000A (en) * 1999-08-13 2001-03-13 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
US6471884B1 (en) * 2000-04-04 2002-10-29 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with an amino acid-containing composition
US6623355B2 (en) * 2000-11-07 2003-09-23 Micell Technologies, Inc. Methods, apparatus and slurries for chemical mechanical planarization
JP2006282755A (ja) * 2005-03-31 2006-10-19 Dainippon Ink & Chem Inc 有機無機ハイブリッド粒子水性分散体及びそれから得られる研磨スラリー
JP5142594B2 (ja) * 2007-06-11 2013-02-13 花王株式会社 ハードディスク基板の製造方法
JP2008307676A (ja) * 2007-06-18 2008-12-25 Kao Corp ハードディスク基板用研磨液組成物
JP5192953B2 (ja) * 2007-09-14 2013-05-08 三洋化成工業株式会社 磁気ディスク用ガラス基板洗浄剤

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6228823B1 (en) * 1995-07-27 2001-05-08 Mitsubishi Chemical Corporation Method for treating surface of substrate and surface treatment composition used for the same
US6015506A (en) * 1996-11-26 2000-01-18 Cabot Corporation Composition and method for polishing rigid disks
CN1550526A (zh) * 2003-05-20 2004-12-01 CMP��ķ�͹�˹���Ӳ��Ͽعɹ�˾ 用于镍质硬盘平坦化的多氧化剂基浆料
CN1598062A (zh) * 2003-08-29 2005-03-23 Cmp罗姆和哈斯电子材料控股公司 用于镍基涂层平坦化的无颗粒抛光流体
CN101044600A (zh) * 2004-10-28 2007-09-26 卡伯特微电子公司 包含表面活性剂的化学机械抛光(cmp)组合物
CN1903748A (zh) * 2005-07-27 2007-01-31 株式会社日本触媒 含有亚氨基羧酸盐的固体组合物及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651403B (zh) 2014-05-20 2019-02-21 日商花王股份有限公司 磁碟基板用研磨液組合物

Also Published As

Publication number Publication date
JP2015017259A (ja) 2015-01-29
JP2012529133A (ja) 2012-11-15
WO2010141652A2 (en) 2010-12-09
MY158719A (en) 2016-11-15
TWI596202B (zh) 2017-08-21
CN102804345A (zh) 2012-11-28
US9330703B2 (en) 2016-05-03
TWI481680B (zh) 2015-04-21
SG176661A1 (en) 2012-01-30
TW201105759A (en) 2011-02-16
JP5856256B2 (ja) 2016-02-09
US20100308016A1 (en) 2010-12-09
TW201504417A (zh) 2015-02-01
JP5684801B2 (ja) 2015-03-18
WO2010141652A3 (en) 2011-03-10

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Granted publication date: 20160120

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