TWI481680B - 用於鎳－磷記憶碟之拋光組合物 - Google Patents
用於鎳－磷記憶碟之拋光組合物 Download PDFInfo
- Publication number
- TWI481680B TWI481680B TW099116166A TW99116166A TWI481680B TW I481680 B TWI481680 B TW I481680B TW 099116166 A TW099116166 A TW 099116166A TW 99116166 A TW99116166 A TW 99116166A TW I481680 B TWI481680 B TW I481680B
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- polishing composition
- polishing
- substrate
- particles
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 152
- 239000000203 mixture Substances 0.000 title claims description 109
- 239000002245 particle Substances 0.000 claims description 129
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 82
- 239000000758 substrate Substances 0.000 claims description 62
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 44
- 239000010455 vermiculite Substances 0.000 claims description 38
- 229910052902 vermiculite Inorganic materials 0.000 claims description 38
- 235000019354 vermiculite Nutrition 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 31
- 239000007800 oxidant agent Substances 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 239000002736 nonionic surfactant Substances 0.000 claims description 20
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 19
- HDMGAZBPFLDBCX-UHFFFAOYSA-M potassium;sulfooxy sulfate Chemical compound [K+].OS(=O)(=O)OOS([O-])(=O)=O HDMGAZBPFLDBCX-UHFFFAOYSA-M 0.000 claims description 14
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 13
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 13
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Natural products NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 10
- 239000008139 complexing agent Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000004471 Glycine Substances 0.000 claims description 6
- -1 siloxane unit Chemical group 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 2
- 235000011152 sodium sulphate Nutrition 0.000 claims description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 2
- 125000003275 alpha amino acid group Chemical group 0.000 claims 2
- 125000003630 glycyl group Chemical group [H]N([H])C([H])([H])C(*)=O 0.000 claims 2
- 125000000466 oxiranyl group Chemical group 0.000 claims 2
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 239000000138 intercalating agent Substances 0.000 claims 1
- 239000011164 primary particle Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000007517 polishing process Methods 0.000 description 7
- 230000003115 biocidal effect Effects 0.000 description 6
- 239000003139 biocide Substances 0.000 description 6
- 239000012141 concentrate Substances 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 239000003002 pH adjusting agent Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000006179 pH buffering agent Substances 0.000 description 3
- 239000011163 secondary particle Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000005305 interferometry Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229920000847 nonoxynol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- NGWOVIOEEGSBCX-UHFFFAOYSA-J tetrasodium;2-[1,2-dicarboxylatoethyl(hydroxy)amino]butanedioate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CC(C([O-])=O)N(O)C(CC([O-])=O)C([O-])=O NGWOVIOEEGSBCX-UHFFFAOYSA-J 0.000 description 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical group C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 235000009754 Vitis X bourquina Nutrition 0.000 description 1
- 235000012333 Vitis X labruscana Nutrition 0.000 description 1
- 240000006365 Vitis vinifera Species 0.000 description 1
- 235000014787 Vitis vinifera Nutrition 0.000 description 1
- URRHWTYOQNLUKY-UHFFFAOYSA-N [AlH3].[P] Chemical compound [AlH3].[P] URRHWTYOQNLUKY-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000009881 electrostatic interaction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 235000019589 hardness Nutrition 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- MGIYRDNGCNKGJU-UHFFFAOYSA-N isothiazolinone Chemical compound O=C1C=CSN1 MGIYRDNGCNKGJU-UHFFFAOYSA-N 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/50—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges
- G11B23/505—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges of disk carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/455,631 US9330703B2 (en) | 2009-06-04 | 2009-06-04 | Polishing composition for nickel-phosphorous memory disks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201105759A TW201105759A (en) | 2011-02-16 |
| TWI481680B true TWI481680B (zh) | 2015-04-21 |
Family
ID=43298492
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099116166A TWI481680B (zh) | 2009-06-04 | 2010-05-20 | 用於鎳－磷記憶碟之拋光組合物 |
| TW103135280A TWI596202B (zh) | 2009-06-04 | 2010-05-20 | 用於鎳-磷記憶碟之拋光組合物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103135280A TWI596202B (zh) | 2009-06-04 | 2010-05-20 | 用於鎳-磷記憶碟之拋光組合物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9330703B2 (OSRAM) |
| JP (2) | JP5684801B2 (OSRAM) |
| CN (1) | CN102804345B (OSRAM) |
| MY (1) | MY158719A (OSRAM) |
| SG (1) | SG176661A1 (OSRAM) |
| TW (2) | TWI481680B (OSRAM) |
| WO (1) | WO2010141652A2 (OSRAM) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8623766B2 (en) * | 2011-09-20 | 2014-01-07 | Cabot Microelectronics Corporation | Composition and method for polishing aluminum semiconductor substrates |
| US9039914B2 (en) * | 2012-05-23 | 2015-05-26 | Cabot Microelectronics Corporation | Polishing composition for nickel-phosphorous-coated memory disks |
| US8518135B1 (en) * | 2012-08-27 | 2013-08-27 | Cabot Microelectronics Corporation | Polishing composition containing hybrid abrasive for nickel-phosphorous coated memory disks |
| WO2015057433A1 (en) | 2013-10-18 | 2015-04-23 | Cabot Microelectronics Corporation | Polishing composition and method for nickel-phosphorous coated memory disks |
| US10358579B2 (en) * | 2013-12-03 | 2019-07-23 | Cabot Microelectronics Corporation | CMP compositions and methods for polishing nickel phosphorous surfaces |
| US9401104B2 (en) | 2014-05-05 | 2016-07-26 | Cabot Microelectronics Corporation | Polishing composition for edge roll-off improvement |
| JP6495095B2 (ja) * | 2014-05-20 | 2019-04-03 | 花王株式会社 | 磁気ディスク基板用研磨液組成物 |
| SG11201702051VA (en) * | 2014-10-14 | 2017-04-27 | Cabot Microelectronics Corp | Nickel phosphorous cmp compositions and methods |
| US9481811B2 (en) | 2015-02-20 | 2016-11-01 | Cabot Microelectronics Corporation | Composition and method for polishing memory hard disks exhibiting reduced edge roll-off |
| MY201421A (en) | 2019-01-11 | 2024-02-21 | Cmc Mat Llc | Dual additive composition for polishing memory hard disks exhibiting edge roll off |
| JP7666904B2 (ja) * | 2020-09-30 | 2025-04-22 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1598062A (zh) * | 2003-08-29 | 2005-03-23 | Cmp罗姆和哈斯电子材料控股公司 | 用于镍基涂层平坦化的无颗粒抛光流体 |
| TW200621961A (en) * | 2004-10-28 | 2006-07-01 | Cabot Microelectronics Corp | CMP composition comprising surfactant |
| CN1903748A (zh) * | 2005-07-27 | 2007-01-31 | 株式会社日本触媒 | 含有亚氨基羧酸盐的固体组合物及其制造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5885362A (en) * | 1995-07-27 | 1999-03-23 | Mitsubishi Chemical Corporation | Method for treating surface of substrate |
| US5958288A (en) * | 1996-11-26 | 1999-09-28 | Cabot Corporation | Composition and slurry useful for metal CMP |
| JP2000340532A (ja) * | 1999-05-31 | 2000-12-08 | Mitsubishi Materials Corp | 研磨用スラリー及びこれを用いた研磨方法 |
| AU6537000A (en) * | 1999-08-13 | 2001-03-13 | Cabot Microelectronics Corporation | Polishing system with stopping compound and method of its use |
| US6471884B1 (en) * | 2000-04-04 | 2002-10-29 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with an amino acid-containing composition |
| US6623355B2 (en) * | 2000-11-07 | 2003-09-23 | Micell Technologies, Inc. | Methods, apparatus and slurries for chemical mechanical planarization |
| US20040232379A1 (en) * | 2003-05-20 | 2004-11-25 | Ameen Joseph G. | Multi-oxidizer-based slurry for nickel hard disk planarization |
| JP2006282755A (ja) * | 2005-03-31 | 2006-10-19 | Dainippon Ink & Chem Inc | 有機無機ハイブリッド粒子水性分散体及びそれから得られる研磨スラリー |
| JP5142594B2 (ja) * | 2007-06-11 | 2013-02-13 | 花王株式会社 | ハードディスク基板の製造方法 |
| JP2008307676A (ja) * | 2007-06-18 | 2008-12-25 | Kao Corp | ハードディスク基板用研磨液組成物 |
| JP5192953B2 (ja) * | 2007-09-14 | 2013-05-08 | 三洋化成工業株式会社 | 磁気ディスク用ガラス基板洗浄剤 |
-
2009
- 2009-06-04 US US12/455,631 patent/US9330703B2/en active Active
-
2010
- 2010-05-20 TW TW099116166A patent/TWI481680B/zh active
- 2010-05-20 TW TW103135280A patent/TWI596202B/zh active
- 2010-06-03 SG SG2011089638A patent/SG176661A1/en unknown
- 2010-06-03 CN CN201080034414.6A patent/CN102804345B/zh not_active Expired - Fee Related
- 2010-06-03 WO PCT/US2010/037158 patent/WO2010141652A2/en not_active Ceased
- 2010-06-03 JP JP2012514107A patent/JP5684801B2/ja active Active
- 2010-06-03 MY MYPI2011005864A patent/MY158719A/en unknown
-
2014
- 2014-08-20 JP JP2014167757A patent/JP5856256B2/ja not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1598062A (zh) * | 2003-08-29 | 2005-03-23 | Cmp罗姆和哈斯电子材料控股公司 | 用于镍基涂层平坦化的无颗粒抛光流体 |
| TW200621961A (en) * | 2004-10-28 | 2006-07-01 | Cabot Microelectronics Corp | CMP composition comprising surfactant |
| CN1903748A (zh) * | 2005-07-27 | 2007-01-31 | 株式会社日本触媒 | 含有亚氨基羧酸盐的固体组合物及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015017259A (ja) | 2015-01-29 |
| JP2012529133A (ja) | 2012-11-15 |
| WO2010141652A2 (en) | 2010-12-09 |
| MY158719A (en) | 2016-11-15 |
| TWI596202B (zh) | 2017-08-21 |
| CN102804345B (zh) | 2016-01-20 |
| CN102804345A (zh) | 2012-11-28 |
| US9330703B2 (en) | 2016-05-03 |
| SG176661A1 (en) | 2012-01-30 |
| TW201105759A (en) | 2011-02-16 |
| JP5856256B2 (ja) | 2016-02-09 |
| US20100308016A1 (en) | 2010-12-09 |
| TW201504417A (zh) | 2015-02-01 |
| JP5684801B2 (ja) | 2015-03-18 |
| WO2010141652A3 (en) | 2011-03-10 |
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