CN102792412A - Photocurable composition - Google Patents
Photocurable composition Download PDFInfo
- Publication number
- CN102792412A CN102792412A CN2011800132946A CN201180013294A CN102792412A CN 102792412 A CN102792412 A CN 102792412A CN 2011800132946 A CN2011800132946 A CN 2011800132946A CN 201180013294 A CN201180013294 A CN 201180013294A CN 102792412 A CN102792412 A CN 102792412A
- Authority
- CN
- China
- Prior art keywords
- carbon number
- alkyl
- bond
- aralkyl
- aryl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 82
- -1 oxime ester compound Chemical class 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 26
- 239000000178 monomer Substances 0.000 claims abstract description 13
- 239000011230 binding agent Substances 0.000 claims abstract description 12
- VYOKOQDVBBWPKO-UHFFFAOYSA-N 1-nitro-9h-carbazole Chemical group N1C2=CC=CC=C2C2=C1C([N+](=O)[O-])=CC=C2 VYOKOQDVBBWPKO-UHFFFAOYSA-N 0.000 claims abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 52
- 229910052799 carbon Inorganic materials 0.000 claims description 52
- 239000011521 glass Substances 0.000 claims description 28
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 24
- 125000003118 aryl group Chemical group 0.000 claims description 24
- 125000000217 alkyl group Chemical group 0.000 claims description 16
- 125000005843 halogen group Chemical group 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 12
- 239000000428 dust Substances 0.000 claims description 9
- 239000000049 pigment Substances 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 5
- 125000003368 amide group Chemical group 0.000 claims description 4
- 125000001424 substituent group Chemical group 0.000 claims description 4
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 51
- 239000000758 substrate Substances 0.000 description 31
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 20
- 238000013329 compounding Methods 0.000 description 19
- 238000000576 coating method Methods 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 238000005245 sintering Methods 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 16
- 239000002253 acid Substances 0.000 description 12
- 210000000981 epithelium Anatomy 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 10
- 238000011161 development Methods 0.000 description 10
- 230000018109 developmental process Effects 0.000 description 10
- 239000003513 alkali Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000000016 photochemical curing Methods 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 4
- UBEWDCMIDFGDOO-UHFFFAOYSA-N cobalt(2+);cobalt(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Co+2].[Co+3].[Co+3] UBEWDCMIDFGDOO-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 2
- SQNZJJAZBFDUTD-UHFFFAOYSA-N durene Chemical compound CC1=CC(C)=C(C)C=C1C SQNZJJAZBFDUTD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 229910000464 lead oxide Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 235000011007 phosphoric acid Nutrition 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000012800 visualization Methods 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- RSROEZYGRKHVMN-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;oxirane Chemical compound C1CO1.CCC(CO)(CO)CO RSROEZYGRKHVMN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- SSOONFBDIYMPEU-UHFFFAOYSA-N [3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COCC(CO)(CO)COC(=O)C=C SSOONFBDIYMPEU-UHFFFAOYSA-N 0.000 description 1
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229960005274 benzocaine Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- WZWSOGGTVQXXSN-UHFFFAOYSA-N cyclohexanone;toluene Chemical compound CC1=CC=CC=C1.O=C1CCCCC1 WZWSOGGTVQXXSN-UHFFFAOYSA-N 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940043237 diethanolamine Drugs 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- MWQBWSPPTQGZII-UHFFFAOYSA-N ethoxy(phenyl)phosphinic acid Chemical compound CCOP(O)(=O)C1=CC=CC=C1 MWQBWSPPTQGZII-UHFFFAOYSA-N 0.000 description 1
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 description 1
- QDHCHVWSKUMZDZ-UHFFFAOYSA-N ethyl dihydrogen phosphite Chemical compound CCOP(O)O QDHCHVWSKUMZDZ-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052816 inorganic phosphate Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- CDXVUROVRIFQMV-UHFFFAOYSA-N oxo(diphenoxy)phosphanium Chemical compound C=1C=CC=CC=1O[P+](=O)OC1=CC=CC=C1 CDXVUROVRIFQMV-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 150000003004 phosphinoxides Chemical class 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229940072033 potash Drugs 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- AYEFIAVHMUFQPZ-UHFFFAOYSA-N propane-1,2-diol;prop-2-enoic acid Chemical compound CC(O)CO.OC(=O)C=C AYEFIAVHMUFQPZ-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229960005137 succinic acid Drugs 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003738 xylenes Chemical class 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/32—Compounds containing nitrogen bound to oxygen
- C08K5/33—Oximes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
- H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/22—Electrodes, e.g. special shape, material or configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/22—Electrodes, e.g. special shape, material or configuration
- H01J11/24—Sustain electrodes or scan electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/22—Electrodes
- H01J2211/225—Material of electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/44—Optical arrangements or shielding arrangements, e.g. filters or lenses
- H01J2211/444—Means for improving contrast or colour purity, e.g. black matrix or light shielding means
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Gas-Filled Discharge Tubes (AREA)
Abstract
Disclosed are: a photocurable composition which enables the formation of a highly fine pattern and which enables the formation of a pattern without causing any line defects by undercutting in a bus electrode (4a, 4b) having a white/black two-layered structure; and a bus electrode having a white/black two-layered structure which is produced using the photocurable composition. The photocurable composition is characterized by comprising an inorganic powder, an organic binder, a photopolymerizable monomer, and a photopolymerization initiator which comprises an oxime ester compound having a nitrocarbazole structure and is represented by general formula (I).
Description
Technical field
The present invention relates on the front substrate of plasma display panel (being designated hereinafter simply as " PDP "), form the Photocurable composition of alkali developable useful in the fine electrode circuit and use it to form the PDP of the black layer (lower floor) in the double-deck bus electrode of electrode, particularly black and white.
Background technology
PDP utilizes the flat-panel screens of carrying out the demonstration of video, information based on the luminous of plasma discharge.The principle that shows based on the color of PDP is following: make the plasma discharge generation in the opposed two interelectrode battery spaces (discharge space) that on the front glass substrate that is separated by rib (dividing wall) and back side glass substrate, form; Through the ultraviolet ray excited fluorophor that is formed at back side glass substrate inner face that the discharge by gases such as the He that in each battery space, encloses, Xe produces, the visible light of 3 primary colors is produced.Each battery space is through being demarcated by the rib that is parallel to real estate arrangement setting among the AC type PDP that becomes main flow now.Below, Yi Bian describe on one side with reference to accompanying drawing.
Fig. 1 illustrates the structure example of face discharge mode PDP of 3 electrode structures of panchromatic demonstration partly.The lower surface of glass substrate 1 in front; A pair of show electrode 2a, 2b are provided with multiple row with the spacing arrangement of regulation, said show electrode 2a, 2b by transparency electrode 3a that is used to discharge or 3b and the bus electrode 4a or the 4b that are used to reduce the line resistance of this transparency electrode form.Last at these show electrodes 2a, 2b, be formed for the transparency dielectric layer 5 (low-melting glass) of stored charge, vapor deposition matcoveredn (MgO) 6 above that through printing, sintering.
On the other hand, on the glass substrate 11, be provided with the rib (dividing wall) 12 and the addressing electrode (data electrode) 13 that is configured in each discharge space of the striated in multiple row dividing discharge space with the spacing arrangement of regulation overleaf.In addition, dispose the fluorescent membrane of red (14a), blue (14b), green (14c) 3 looks regularly at the inner face of each discharge space.In panchromatic demonstration, constitute a pixel with fluorescent membrane 14a, 14b, the 14c of these 3 red, blue, green primary colors.
In the PDP of said structure, between a pair of show electrode 2a and 2b, apply ac pulse voltage, it is discharged between the electrode on the same substrate, therefore be called as " face discharge mode ".In addition, be formed with following structure (reflection-type): fluorescent membrane 14a, 14b, the 14c of the ultraviolet ray excited back substrate 11 that produces through discharge see through the transparency electrode 3a, 3b of front glass substrate 1 and see the visible light of generation.
About the formation of bus electrode 4a, 4b, up to now through vapor deposition, three layers of sputter Cr-Cu-Cr and film forming, utilize photoetching process to carry out patterning then to carry out.But,, therefore carry out following method recently: with the method for sintering after the conductive paste silk screen printings such as silver-colored paste because operation quantity is many, cost is high; Perhaps at coating photoelectric sensitivity conductive property paste and after, develop, then the method for sintering through the pattern mask exposure in order to form the live width below the 150 μ m.
In recent years; In order to improve the contrast of picture; When forming bus electrode; Sometimes at the black layer of the black conductive property paste that becomes the lower floor's printing conductive property difference that shows side, the white layer of the good silver-colored paste of printing conductive property above that forms the double-deck electrode of black and white (for example with reference to patent documentation 1 etc.).
Yet, in the double-deck mode of this black and white, because the weary light transmission of white break; Black layer as lower floor can't carry out sufficient photocuring, after the development, can produce the live width with respect to white layer; The live width of black layer very little (undercut, undercutting) the such problem that becomes.
The prior art document
Patent documentation
Patent documentation 1: japanese kokai publication hei 4-272634 communique
Summary of the invention
The problem that invention will solve
The present invention makes in view of the above problems; Its purpose is to provide a kind of Photocurable composition; Said Photocurable composition can form high fine pattern, and in addition in the double-deck bus electrode of black and white, it is damaged and form pattern not produce the lines that caused by undercutting.
The scheme that is used to deal with problems
In order to reach aforementioned purpose; According to an embodiment of the invention; A kind of Photocurable composition is provided; It is characterized in that the Photoepolymerizationinitiater initiater that it contains inorganic powder, organic binder bond, photopolymerization monomer and comprises oxime ester compound, said oxime ester compound have the nitro carbazole structure shown in the formula (I).Thus, can form the black and white double-decker bus electrode that has reduced undercutting.
(in the formula, R
1The alkyl of expression carbon number 1 ~ 20, the aryl of carbon number 6 ~ 30, the aralkyl or the CN of carbon number 7 ~ 30, the hydrogen atom of alkyl, aryl and aralkyl can be further by OR
11, COR
11, SR
11, NR
12R
13,-NCOR
12-OCOR
13, CN, halogen atom ,-CR
11=CR
12R
13Or-CO-CR
11=CR
12R
13Replace R
11, R
12And R
13Represent the alkyl of hydrogen atom, carbon number 1 ~ 20, the aryl of carbon number 6 ~ 30, the aralkyl of carbon number 7 ~ 30 or the heterocyclic radical of carbon number 2 ~ 20 independently of one another;
R
2Expression R
21Or OR
21, R
21Alkyl, the aryl of carbon number 6 ~ 30 or the aralkyl of carbon number 7 ~ 30 of expression carbon number 1 ~ 20, the hydrogen atom of alkyl, aryl and aralkyl can further be replaced R by halogen atom
3Alkyl, the aryl of carbon number 6 ~ 30 or the aralkyl of carbon number 7 ~ 30 of expression carbon number 1 ~ 20;
R
1, R
3, R
11, R
12And R
13The methylene of represented substituent alkylene moiety can be interrupted 1 ~ 5 time by unsaturated bond, ehter bond, thioether bond, ester bond, thioester bond, amido link or amino-formate bond; Above-mentioned substituent moieties can have side chain; It also can be cyclic alkyl; Above-mentioned substituent alkyl end can be a unsaturated bond, R
3Can form ring with the phenyl ring of adjacency;
R
4And R
5Represent R independently of one another
21, OR
21, CN or halogen atom, a and b are 0 ~ 3 independently of one another.)
The effect of invention
According to Photocurable composition of the present invention, can form high fine pattern, in addition in the double-deck bus electrode of black and white, can realize further that undercutting reduces.
Description of drawings
Fig. 1 is the exploded stereogram of the AC type PDP of face discharge mode.
Fig. 2 is the partial cutaway schematic of an example of the formation operation of double-deck bus electrode of expression black and white.
Embodiment
Discoveries such as inventor of the present invention; In the formation of the double-deck bus electrode of black and white; Photoepolymerizationinitiater initiater through use contains inorganic powder, organic binder bond, photopolymerization monomer and comprises oxime ester compound can form the pattern that has suppressed undercutting, thereby has accomplished the present invention; Wherein, said oxime ester compound has the nitro carbazole structure shown in the formula (I).
Below the Photocurable composition of this execution mode is elaborated.
At first, the Photocurable composition that in the black skin membrane (lower floor) of the double-deck bus electrode of black and white, uses (below be called " black layer is used composition ") is elaborated.
The inorganic powder that in the Photocurable composition of this execution mode, uses is according to the purposes of electrode pattern and difference when using with composition as black layer, is used black pigment.
As the black pigment that uses in composition at the black layer of this execution mode and since after state and carry out 300 ~ 600 ℃ of such high temperature sinterings in the sintering circuit, therefore preferred use at high temperature has the stable inorganic pigment of tone.Particularly, for example can enumerate out by separate metal oxides such as Cu, Fe, Cr, Mn, Co, Ni, Ru, La, Sr and/or the black pigment processed by the composite oxides that two or more metallic elements form.The viewpoint that black epithelium densification that particularly forms behind the sintering and tone are excellent, can use copper-chromium aptly is that black composite oxide, copper-iron are black composite oxide, cobaltosic oxide (Co
3O
4) etc.They can two or more alone or in combination uses.
As the average grain diameter (D50) of this black pigment, the particle diameter below the preferred 2 μ m.Average grain diameter is 2 μ m when following, does not damage adaptation etc. even a small amount of interpolation also can form fine and close sintering epithelium, can satisfy sufficient interlayer conductivity (interlayer conduction that transparency electrode and bus electrode are white layer) and blackness simultaneously.On the other hand, if average grain diameter is bigger than 2 μ m, the compactness variation of sintering epithelium then, the blackness of the black electrode pattern of formation reduces easily.In addition, if littler than 0.01 μ m, covering power reduces and also presents transparent feel sometimes, therefore more preferably 0.01 ~ 1 μ m.
In addition, as the compounding amount of this black pigment, be the scope of 10 ~ 100 mass parts in preferred per 100 mass parts organic binder bonds.Than above-mentioned scope after a little while, can't obtain sufficient blackness behind the sintering.On the other hand, than above-mentioned scope for a long time, light transmission reduces, change be easy to generate undercutting.50 ~ 100 mass parts more preferably.
In addition, as inorganic powder, in order to improve behind the sintering adaptation to substrate, compounding glass dust as required.As this glass dust; Preferred glass transition temperature (Tg) is that 300 ~ 500 ℃, glass softening point (Ts) are 400 ~ 600 ℃ low-melting glass powder, can suit to use with lead oxide, bismuth oxide, zinc oxide, lithia or with the glass dust of alkali borosilicate as principal component.
As being the preferred example of the glass dust of principal component with lead oxide, can enumerate out quality % in the oxide benchmark, have PbO and be 48 ~ 82%, a B
2O
3Be 0.5 ~ 22%, SiO
2Be 3 ~ 32%, Al
2O
3Be 0 ~ 12%, BaO is 0 ~ 15%, TiO
2Be 0 ~ 2.5%, Bi
2O
3Be 0 ~ 25% composition, the amorphous glass powder (frit) that softening point is 420 ~ 580 ℃.
In addition,, can enumerate out quality %, have Bi in the oxide benchmark as being the preferred example of the glass dust of principal component with the bismuth oxide
2O
3Be 6 ~ 88%, B
2O
3Be 5 ~ 30%, SiO
2Be 5 ~ 25%, Al
2O
3Be 0 ~ 5%, BaO is 0 ~ 20%, ZnO is 1 ~ 20% composition, the amorphous glass powder that softening point is 420 ~ 580 ℃.
In addition,, can enumerate out quality %, have ZnO and be 25 ~ 60%, a K in the oxide benchmark as being the preferred example of the glass dust of principal component with zinc oxide
2O is 2 ~ 15%, B
2O
3Be 25 ~ 45%, SiO
2Be 1 ~ 7%, Al
2O
3Be 0 ~ 10%, BaO is 0 ~ 20%, MgO is 0 ~ 10% composition, the amorphous glass powder that softening point is 420 ~ 580 ℃.
About the compounding amount of this glass dust, can carry out compounding with the ratio that in per 100 mass parts organic binder bonds is below 200 parts, be preferably below 100 parts.
As the organic binder bond of the black layer that is used for this execution mode with composition, contain carboxy resin, particularly, himself have containing the carboxyl photoresist and not having containing carboxy resin and all can using of ethylenical unsaturated double bonds of ethylenical unsaturated double bonds.As the resin that can suit to use (oligomer and polymer all can), can enumerate out the following carboxy resin that contains.
(1) through making the carboxy resin that contains that unsaturated carboxylic acid and the compound copolymerization with unsaturated double-bond obtain.
(2) through containing the carboxyl photoresist as side group to what unsaturated carboxylic acid and the copolymer with unsaturated double-bond compound carried out that addition obtains with the olefinic unsaturated group.
(3) make unsaturated carboxylic acid and, compound with epoxy radicals and unsaturated double-bond and have the copolymer reaction of the compound of unsaturated double-bond, and the secondary hydroxyl of generation is reacted with multi-anhydride and obtain contain the carboxyl photoresist.
(4) make compound with hydroxyl and unsaturated double-bond with, have the acid anhydrides of unsaturated double-bond and have copolymer reaction and obtain contain the carboxyl photoresist of the compound of unsaturated double-bond.
(5) make the reaction of epoxy compounds and unsaturated monocarboxylic, and the secondary hydroxyl that makes generation react with multi-anhydride and obtain contain the carboxyl photoresist.
(6) make the organic acid that has 1 carboxyl in 1 molecule and do not have ethylenic unsaturated bond with, have the compound of unsaturated double-bond and the epoxy reaction of the copolymer of (methyl) glycidyl acrylate, and the secondary hydroxyl of generation is reacted with multi-anhydride and obtain contain carboxy resin.
(7) make the reaction of hydroxyl polymer-containing and multi-anhydride and obtain contain carboxy resin.
(8) make the reaction of hydroxyl polymer-containing and multi-anhydride and obtain contain carboxy resin further react with compound with epoxy radicals and unsaturated double-bond and obtain contain the carboxyl photoresist.
Need to prove that in this manual, (methyl) acrylic acid ester is the term that acrylic acid ester, methacrylate and their mixture are referred to as, other similar expression also is identical.
This carboxy resin that contains can be separately or mix and use, under any circumstance, and all preferably with their the ratio compounding of 10 ~ 80 quality % that add up to total composition.The compounding amount is compared with above-mentioned scope when very few, and it is inhomogeneous that the distribution of the above-mentioned resin in the epithelium of formation becomes easily, is difficult to obtain the sufficient photo-curable and the photocuring degree of depth, based on selectivity exposure, the patterning that the develops difficulty that becomes.On the other hand, compare with above-mentioned scope when too much, the skew, the live width that are easy to generate pattern during sintering are shunk.
As this weight average molecular weight that contains carboxy resin, be preferably 1000 ~ 100000 respectively.Molecular weight is lower than at 1000 o'clock, and the adaptation of epithelium that can be when developing causes harmful effect.On the other hand, be higher than at 100000 o'clock, be easy to generate poor visualization.5000 ~ 70000 scope more preferably.
In addition, as the acid number that contains carboxy resin, be preferably the scope of 50 ~ 250mgKOH/g respectively.When acid number is lower than 50mgKOH/g, thereby to the insufficient poor visualization that is easy to generate of the dissolubility of aqueous alkali.On the other hand, when higher, be easy to generate the deterioration of the adaptation of epithelium, the dissolving of photocuring portion (exposure portion) during development than 250mgKOH/g.
In addition, under the situation that contains the carboxyl photoresist, preferably its pair key equivalent is 350 ~ 2000.Under the little situation of two key equivalent proportion 350, easy residual residue during sintering.On the other hand, under 2000 big situation, the operation allowance during development is narrow, needs high exposure in addition during photocuring.More preferably 400 ~ 1500.
The photopolymerization monomer that uses in composition at the black layer of this execution mode uses with raising development property for the photo-curable that promotes composition.As this photopolymerization monomer; Can enumerate out for example acrylic acid 2-hydroxy methacrylate, acrylic acid 2-hydroxy propyl ester, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethyleneglycol diacrylate, urethane diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, tetramethylol methane tetraacrylate, trimethylolpropane oxirane modification triacrylate, trimethylolpropane epoxy pronane modification triacrylate, dipentaerythritol five acrylic acid ester, dipentaerythritol acrylate and each methyl acrylic ester corresponding with the aforesaid propylene acid esters; The monoesters of polyacids such as phthalic acid, adipic acid, maleic acid, itaconic acid, butanedioic acid, trihemellitic acid, terephthalic acid (TPA) and (methyl) acrylic acid hydroxyalkyl acrylate, diester, three esters or its above polyester etc.; But do not receive the restriction of specific material, these can two or more alone or in combination uses in addition.In these photopolymerization monomers, has the polyfunctional monomer of plural (methyl) acryloyl group in preferred 1 molecule.
About the compounding amount of this photopolymerization monomer, be that 20 ~ 100 mass parts are suitable in per 100 mass parts organic binder bonds.The compounding amount is difficult to obtain the sufficient photo-curable of composition than 20 mass parts after a little while, and on the other hand, when surpassing the volume of 100 mass parts, the photocuring of epithelium surface element is compared with its deep and accelerated, therefore be easy to generate solidify inhomogeneous.
As the Photoepolymerizationinitiater initiater of the black layer that is used for this execution mode, importantly use oxime ester compound with the nitro carbazole structure shown in the formula (I) with composition.Therefore oxime ester compound shown in the formula (I) has ISO, even below white layer that light transmission lacks, also can carry out sufficient photocuring, can suppress the generation of undercutting.
(in the formula, R
1The alkyl of expression carbon number 1 ~ 20, the aryl of carbon number 6 ~ 30, the aralkyl or the CN of carbon number 7 ~ 30, the hydrogen atom of alkyl, aryl and aralkyl can be further by OR
11, COR
11, SR
11, NR
12R
13,-NCOR
12-OCOR
13, CN, halogen atom ,-CR
11=CR
12R
13Or-CO-CR
11=CR
12R
13Replace R
11, R
12And R
13Represent the alkyl of hydrogen atom, carbon number 1 ~ 20, the aryl of carbon number 6 ~ 30, the aralkyl of carbon number 7 ~ 30 or the heterocyclic radical of carbon number 2 ~ 20 independently of one another;
R
2Expression R
21Or OR
21, R
21Alkyl, the aryl of carbon number 6 ~ 30 or the aralkyl of carbon number 7 ~ 30 of expression carbon number 1 ~ 20, the hydrogen atom of alkyl, aryl and aralkyl can further be replaced R by halogen atom
3Alkyl, the aryl of carbon number 6 ~ 30 or the aralkyl of carbon number 7 ~ 30 of expression carbon number 1 ~ 20;
R
1, R
3, R
11, R
12And R
13The methylene of represented substituent alkylene moiety can be interrupted 1 ~ 5 time by unsaturated bond, ehter bond, thioether bond, ester bond, thioester bond, amido link or amino-formate bond; Above-mentioned substituent moieties can have side chain; It also can be cyclic alkyl; Above-mentioned substituent alkyl end can be a unsaturated bond, R
3Can form ring with the phenyl ring of adjacency.
R
4And R
5Represent R independently of one another
21, OR
21, CN or halogen atom, a and b are 0 ~ 3 independently of one another.)
About the compounding amount of this Photoepolymerizationinitiater initiater,, be preferably 0.5 ~ 20 mass parts with respect to 100 mass parts organic binder bonds.When being lower than 0.5 mass parts, be difficult to obtain the sufficient photo-curable of composition.On the other hand, when surpassing 20 mass parts, the photocuring of epithelium surface element is compared with its deep and is accelerated, and it is inhomogeneous therefore to be easy to generate curing.1 ~ 10 mass parts more preferably.
In addition, also can be as required with above-mentioned other Photoepolymerizationinitiater initiaters of Photoepolymerizationinitiater initiater compounding, sensitizer etc.
As this Photoepolymerizationinitiater initiater, can enumerate out for example benzoin and benzoin alkylether classes such as benzoin, benzoin methylether, benzoin ethyl ether, benzoin iso-propylether; Acetophenone, 2,2-dimethoxy-2-phenyl acetophenone, 2,2-diethoxy-2-phenyl acetophenone, 1, acetophenones such as 1-dichloroacetophenone; 2-methyl isophthalic acid-[4-(methyl mercapto) phenyl]-2-morpholino propane-1-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholino phenyl)-1-butanone, 2-(dimethylamino)-2-[ (4-aminomethyl phenyl) methyl ]-1-[ 4-(4-morpholinyl) phenyl ]-aminoacetophenone classes such as 1-butanone; Anthraquinone classes such as 2-methylanthraquinone, 2-EAQ, 2-tert-butyl group anthraquinone, 1-chloroanthraquinone; 2,4-dimethyl thioxanthones, 2,4-diethyl thioxanthone, 2-clopenthixal ketone, 2, thioxanthene ketones such as 4-diisopropyl thioxanthones; Ketal classes such as acetophenone dimethyl ketal, benzil dimethyl ketal; Benzophenones such as benzophenone; Or xanthene ketone; (2,6-dimethoxy benzoyl) (2,4, the 4-amyl group) phosphine oxide, two (2,4, the 6-trimethylbenzoyl)-phenyl phosphine oxide, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, 2,4, phosphinoxides such as 6-trimethylbenzoyl phenyl-phosphonic acid ethyl ester; 1-[ 9-ethyl-6-(2-toluyl)-9H-carbazole-9-yl ]-1-oxime ester classes such as (O-acetyl oximes); Various peroxides etc., these Photoepolymerizationinitiater initiaters can two or more alone or in combination uses.
In addition; As sensitizer; Can enumerate out for example N; N-dimethyl ethyl aminobenzoate, N, the such photosensitizers of tertiary amines such as N-dimethylaminobenzoic acid isopentyl ester, amyl group-4-dimethylaminobenzoic acid ester, triethylamine, triethanolamine, these sensitizers can use a kind perhaps to make up two or more uses.
For through with the black layer of this execution mode with the composition dilution pasteization, make it can be easily to coatings such as base materials, but the solvent of the suitable amount of compounding.
As this solvent, can enumerate out for example ketone such as MEK, cyclohexanone; Toluene, xylenes, durene etc. are aromatic hydrocarbon based; Glycol ethers such as cellosolve, methyl cellosolve, carbitol, methyl carbitol, BC, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, DPG diethyl ether, Triethylene glycol ethyl ether; Ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, BC acetate, propylene glycol monomethyl ether acetate, 2,2,4-trimethyl-1, ester classes such as 3-pentanediol list isobutyl ester; Alcohols such as ethanol, propyl alcohol, ethylene glycol, propane diols, terpineol; Aliphatic hydrocarbon such as octane, decane; Oil series solvents such as benzinum, naphtha, hydrogenated naphtha, solvent naphtha etc.They can two or more alone or in combination uses.
In addition, in order to improve the storage stability of Photocurable resin composition, preferred add the metal that belongs to the inorganic powder composition or have with oxide powder complexing materialization or the compound that forms effect such as salt as stabilizer.
As this stabilizer; Can enumerate out various organic acids such as malonic acid, adipic acid, formic acid, acetic acid, acetoacetate, citric acid, stearic acid, maleic acid, fumaric acid, phthalic acid; Acid such as various phosphate cpds (inorganic phosphate, organic phosphoric acid), boric acid such as phosphoric acid, phosphorous acid, hypophosphorous acid, methyl orthophosphoric acid, etherophosphoric acid, butylphosphoric acid ester, phenyl phosphate, phosphorous acid ethyl ester, phosphorous acid diphenyl ester, list (2-methacryloxyethyl) phosphate ester acid can two or more alone or in combination uses.This stabilizer is preferably in per 100 mass parts inorganic powders to be the ratio interpolation of 0.1 ~ 10 mass parts.
And then so known additives such as silane coupler such as antifoaming agent such as thickeners such as hot polymerization inhibitor such as compounding quinhydrones, hydroquinone monomethyl ether, tert-butyl catechol, 1,2,3,-thrihydroxy-benzene, phenthazine, fine particle silica, organobentonite, imvite, silicon-type, fluorine system, macromolecular and/or levelling agent, imidazoles system, thiazole system, triazole system as required.
Need to prove that more than the black layer of explanation promptly is used in the material of black matrix pattern with composition, also can use no problemly.
Then, the Photocurable composition of the white skin membrane (upper strata) that is used for the double-deck bus electrode of black and white (below, be called " white layer is used composition ") is elaborated.
The white layer of this execution mode replaces the above-mentioned black layer of black pigment with composition as the inorganic powder with composition except using electroconductive powder, is same composition, compounding ratio basically.Therefore, use composition about the white layer of this execution mode, below only explanation and above-mentioned black layer of difference with composition.
Electroconductive powder as using in composition at the white layer of this execution mode can use for example simple substance and alloys thereof such as Ag, Au, Ni, Cu, Al, Sn, Pt, Ru, and SnO
2, In
2O
3, ITO (Indium Tin oxide, indium tin oxide), RuO
2Deng.They can two or more alone or in combination uses.
As the shape of this electroconductive powder, can use different shapes such as spherical, sheet (flake) shape, dendritic crystalline, if consider light characteristic, dispersiveness, then preferred use spherical.In addition, as average grain diameter (D50), from the average grain diameter below the preferred 10 μ m of the viewpoint of lines shape.The more preferably average grain diameter below the 5 μ m.In addition, as specific area, be preferably 0.01 ~ 2.0m
2/ g.The not enough 0.01m of specific area
2During/g, cause sedimentation during preservation easily, on the other hand, surpass 2.0m
2During/g, the oil suction quantitative change is big and the flowability of composition suffers damage.0.1 ~ 1.0m more preferably
2/ g.
In addition, for the oxidation that prevents electroconductive powder, improve dispersiveness in the composition, make development property stabilisation, especially preferably Ag, Ni, Al are handled with aliphatic acid.As this aliphatic acid, can enumerate out for example oleic acid, linoleic acid, leukotrienes, stearic acid etc.
About the compounding amount of this electroconductive powder, be made as 50 ~ 2000 mass parts in preferred per 100 mass parts organic binder bonds.The compounding amount of conductive powder is difficult to obtain good electrical conductivity than 50 mass parts after a little while, when surpassing 2000 mass parts, the tendency of paste change difficulty is arranged.
Photopolymerization monomer as using in composition at the white layer of this execution mode can use to be used for the photopolymerization monomer of black layer with composition, and particularly the viewpoint of the live width behind the inhibition sintering is preferably used two functional monomers.
The white layer of this execution mode with composition in, compounding is used for the black layer of Photoepolymerizationinitiater initiater with composition as required.Even is also can be cured and form electrode pattern because be unworthy of the mixed light polymerization initiator with Photoepolymerizationinitiater initiater as any composition.Think this be because, after state bus electrode and form in the operation, during the dry or exposure of coating, the Photoepolymerizationinitiater initiater during lower floor's (black layer) films can carry out cross-linking reaction through coating film diffusion upwards in last coating film; When perhaps making public, the cross-linking reaction in the following coating film proceeds to coating film, is cured thus.
On the other hand, when the white layer of single-layer electrodes pattern application is used composition, need the compounding Photoepolymerizationinitiater initiater.At this moment, the oxime ester compound that has the nitro carbazole structure shown in the above-mentioned general formula (I) through compounding can obtain good resolution as Photoepolymerizationinitiater initiater.
Then, the electrode pattern formation method to the Photocurable composition that uses this execution mode is elaborated.
About Photocurable composition of the present invention, film forming is under the situation of film like in advance, is laminated on the substrate to get final product; Under the situation for paste-like; Coating process through it is suitable that silk screen print method, rod are coated with machine, scraper plate coating machine etc. is coated on the substrate, for example on the glass substrate of the front substrate that becomes PDP; Then in order to obtain dry to touch property; At for example about 60 ~ 120 ℃ times dry about 5 ~ 40 minutes, make solvent evaporation with heated air circulation type drying oven, far infrared drying stove etc., what cannot not obtain stickingly films.After this, make public, development, sintering, form the telegraph circuit of the pattern of regulation.
As exposure process, can be to use the contact exposure and the noncontact exposure of negative mask with regulation exposing patterns.As the light source that is used to make public, use Halogen lamp LED, high-pressure mercury lamp, laser, metal halide lamp, black light lamp, electrodeless lamp etc.Exposure is preferably 50 ~ 1000mJ/cm
2About.
As developing procedure, can use spray-on process, infusion process etc.As developer solution, can enumerate out NaOH, the aqueous solution of amine such as the metal base aqueous solution, MEA, diethanol amine, triethanolamine such as potassium hydroxide, sodium carbonate, potash, sodium metasilicate.Particularly can suit to use the dilute alkaline aqueous solution of the concentration below about 1.5 quality %, as long as with the carboxyl saponification that contains carboxy resin in the composition, uncured (unexposed portion) of removal, to the not restriction of above-mentioned developer solution.In addition, in order after development, to remove unwanted developer solution, preferably wash, the acid neutralization.
As sintering circuit, the substrate after developing is carried out about 400 ~ 600 ℃ heat treated in atmosphere or blanket of nitrogen, form the conductive pattern of hoping.Wherein, the programming rate of this moment is preferably set to below 20 ℃/minute.
With Fig. 2 the situation that forms the double-deck bus electrode of black and white is elaborated.
At first; Shown in Fig. 2 (A); Utilize known in the past means such as sputtering method, ion plating, chemical vapor deposition, electro-deposition through ITO (Indium tin oxide in advance; Indium tin oxide) etc. use composition being formed with on the front glass substrate 200 of transparency electrode 201 the above-mentioned black layer of coating, carry out dry then and form sticking black layer 202.
Then, shown in Fig. 2 (B), on the black layer 202 that forms, be coated with the high white layer of conductivity that contains electroconductive powder and use composition, carry out dry white layer of sticking (conductive layer) 203 that form then.
Then, shown in Fig. 2 (C) that it is overlapping with the photomask 204 with exposing patterns, filming of 2 layers of black and white made public.Then, develop through aqueous alkali and to remove non-exposed portion,, shown in Fig. 2 (D), on transparency electrode 201, form the bus electrode 205 that forms by black layer (lower floor) 202 and white layer (upper strata) 203 then through sintering.
In addition, using composition and white layer to use composition at black layer is in advance under the situation of film forming as the dry film of film like, in thermo-compressed on the substrate and after carrying out lamination successively, can through make public, each operation of development and print (sintering) makes.In addition; Also can adopt following method: the black layer of coating is with composition and carry out each operation of drying, exposure, development, print and form lower floor's (black) afterwards on substrate, and the white layer of coating is with composition and carry out each operation of drying, exposure, development and print and form the method for upper strata (white).
Embodiment
Below embodiment is shown and comparative example specifies the present invention, certainly, the present invention does not receive the restriction of following embodiment.Wherein, following " part " and " % " short of special instruction are quality criteria.
[ synthesizing of organic binder bond (alkali soluble resin A) ]
In the flask that possesses thermometer, mixer, dropping funel and reflux condenser; Mol ratio with 0.87:0.13 drops into methyl methacrylate and methacrylic acid; Adding is as the diethylene glycol monomethyl ether acetate of solvent, as the azodiisobutyronitrile of catalyst; In blanket of nitrogen, 80 ℃ stirred 7 hours down, obtain alkali soluble resin A solution.About this alkali soluble resin A solution, the weight average molecular weight of alkali soluble resin A is about 10000, and acid number is 95mgKOH/g, and its solid constituent is 57%.
Wherein, the weight average molecular weight of the alkali soluble resin A (copolymer resins) of gained is measured with chromatographic column Shodex (registered trade mark) KF-804, KF-803, three high performance liquid chromatography that are connected of KF-802 of electrician's manufactured with clear through the pump LC-6AD that Shimadzu Seisakusho Ltd. makes.
According to the various compositions shown in the table 1, ratio (mass parts) compounding, mixing after being pre-mixed with mixer through triple-roller mill, obtain as white layer with the composition 1,2 of composition, as black layer of a composition 3,4 with composition.
[table 1]
* 1:1,9-nonanediol diacrylate (manufacturing of chemical company of common prosperity society)
* 2: trimethylolpropane EO modification triacrylate (manufacturing of East Asia Synesis Company)
* 3: oxime ester initator (ADEKA.Corporation manufacturing)
* 4:1-[9-ethyl-6-(2-methyl benzoyl)-9H-carbazole-3-yl]-ethyl ketone 1-(O-acetyl oxime) (Xiba Special Chemical Product Co.,Ltd make oxime ester initator)
* 5: average grain diameter (D50) 2.2 μ m, maximum particle diameter (D max) 6.3 μ m, specific area 0.3m
2/ g
* 6: cobaltosic oxide, average grain diameter (D50) 0.3 μ m
* 7:Bi
2O
350%, B
2O3 16%, ZnO 14%, SiO
22%, BaO 18% thermalexpansioncoefficient
300=86 * 10
-7/ ℃, 501 ℃ of glass softening points
* 8:MODAFLOW (Monsanto Japan Limited. make levelling antifoaming agent)
* 9:P-1M (chemical company of common prosperity society make phosphate be stabilizer)
* 10: the diethylene glycol monomethyl ether acetate
< estimating the making of substrate >
Coating is dry: (the double-deck epithelium of black and white)
Composition shown in the table 13,4 is used whole the printing on glass substrate of 300 purpose polyester nets respectively, descended dry 20 minutes at 100 ℃, on substrate, form filming of black thus with IR formula drying oven.
Then; Use composition 1 on the black coating film that uses composition 3, on the black coating film of use composition 4, using composition 2; Use whole the coating on aforementioned black coating film of 200 purpose polyester nets respectively; With IR formula drying oven 100 ℃ dry 20 minutes down, form double-deck epithelium of the good black and white of dry to touch property, with it as estimating substrate.
Coating is dry: (individual layer epithelium)
Composition shown in the table 11,2 is used whole the printing on glass substrate of 200 purpose polyester nets respectively, with IR formula drying oven 100 ℃ dry 20 minutes down, form the epithelium of the good white of dry to touch property, with it as estimating substrate.
As the double-deck bus electrode of black and white, the evaluation substrate that the evaluation substrate that composition 1,3 is combined combines as embodiment 1, with composition 2,4 is as comparative example 1.In addition, as the single-layer electrodes pattern, with the evaluation substrate that uses composition 1 as embodiment 2, will use composition 2 the evaluation substrate as comparative example 2, carry out following evaluation.
< evaluation >
(resolution)
Using metal halide lamp as light source, is 200mJ/cm with the accumulation light quantity on the composition
2Mode above-mentioned evaluation substrate is made public after, use 0.4% aqueous sodium carbonate of 30 ℃ of liquid temperature, make developing time be 10,15,30 and and 40 seconds, develop, through the washing back with the air knife drying.After this observe remaining lines, with the lines of the remaining minimum widith in N/D ground as resolution.
[table 2]
Embodiment 2 is the situation that the Photocurable composition of this execution mode are applied to (individual layer) electrode, can know to have obtained good resolution.On the other hand, use in the comparative example 2 of Photocurable composition in the past, can't form lines, can know that photo-curable is insufficient.
Description of reference numerals
1,200: the front glass substrate
2a, 2b: show electrode
3a, 3b, 201: transparency electrode
4a, 4b, 205: bus electrode
5: transparency dielectric layer
6: protective layer
11: back side glass substrate
12: rib (dividing wall)
13: addressing electrode
14a, 14b, 14c: fluorescent membrane
202: black layer (lower floor)
203: white layer (upper strata, conductive layer)
204: photomask
Claims (6)
1. a black and white double-decker bus electrode is used Photocurable composition; It is characterized in that; The Photoepolymerizationinitiater initiater that it contains inorganic powder, organic binder bond, photopolymerization monomer and comprises oxime ester compound, said oxime ester compound have the nitro carbazole structure shown in the formula (I)
In the formula, R
1The alkyl of expression carbon number 1 ~ 20, the aryl of carbon number 6 ~ 30, the aralkyl or the CN of carbon number 7 ~ 30, the hydrogen atom of alkyl, aryl and aralkyl can be further by OR
11, COR
11, SR
11, NR
12R
13,-NCOR
12-OCOR
13, CN, halogen atom ,-CR
11=CR
12R
13Or-CO-CR
11=CR
12R
13Replace R
11, R
12And R
13Represent the alkyl of hydrogen atom, carbon number 1 ~ 20, the aryl of carbon number 6 ~ 30, the aralkyl of carbon number 7 ~ 30 or the heterocyclic radical of carbon number 2 ~ 20 independently of one another;
R
2Expression R
21Or OR
21, R
21Alkyl, the aryl of carbon number 6 ~ 30 or the aralkyl of carbon number 7 ~ 30 of expression carbon number 1 ~ 20, the hydrogen atom of alkyl, aryl and aralkyl can further be replaced R by halogen atom
3Alkyl, the aryl of carbon number 6 ~ 30 or the aralkyl of carbon number 7 ~ 30 of expression carbon number 1 ~ 20;
R
1, R
3, R
11, R
12And R
13The methylene of represented substituent alkylene moiety can be interrupted 1 ~ 5 time by unsaturated bond, ehter bond, thioether bond, ester bond, thioester bond, amido link or amino-formate bond; Said substituent moieties can have side chain; It also can be cyclic alkyl; Said substituent alkyl end can be a unsaturated bond, R
3Can form ring with the phenyl ring of adjacency;
R
4And R
5Represent R independently of one another
21, OR
21, CN or halogen atom, a and b are 0 ~ 3 independently of one another.
2. black and white double-decker bus electrode according to claim 1 is used Photocurable composition, it is characterized in that, said inorganic powder comprises at least a arbitrarily in black pigment, electroconductive powder and the glass dust.
3. a plasma display panel is characterized in that, it uses claim 1 or the described black and white double-decker of claim 2 bus electrode to obtain with Photocurable composition.
4. a single-layer electrodes pattern is used Photocurable composition; It is characterized in that; The Photoepolymerizationinitiater initiater that it contains inorganic powder, organic binder bond, photopolymerization monomer and comprises oxime ester compound, said oxime ester compound have the nitro carbazole structure shown in the formula (I)
In the formula, R
1The alkyl of expression carbon number 1 ~ 20, the aryl of carbon number 6 ~ 30, the aralkyl or the CN of carbon number 7 ~ 30, the hydrogen atom of alkyl, aryl and aralkyl can be further by OR
11, COR
11, SR
11, NR
12R
13,-NCOR
12-OCOR
13, CN, halogen atom ,-CR
11=CR
12R
13Or-CO-CR
11=CR
12R
13Replace R
11, R
12And R
13Represent the alkyl of hydrogen atom, carbon number 1 ~ 20, the aryl of carbon number 6 ~ 30, the aralkyl of carbon number 7 ~ 30 or the heterocyclic radical of carbon number 2 ~ 20 independently of one another;
R
2Expression R
21Or OR
21, R
21Alkyl, the aryl of carbon number 6 ~ 30 or the aralkyl of carbon number 7 ~ 30 of expression carbon number 1 ~ 20, the hydrogen atom of alkyl, aryl and aralkyl can further be replaced R by halogen atom
3Alkyl, the aryl of carbon number 6 ~ 30 or the aralkyl of carbon number 7 ~ 30 of expression carbon number 1 ~ 20;
R
1, R
3, R
11, R
12And R
13The methylene of represented substituent alkylene moiety can be interrupted 1 ~ 5 time by unsaturated bond, ehter bond, thioether bond, ester bond, thioester bond, amido link or amino-formate bond; Said substituent moieties can have side chain; It also can be cyclic alkyl; Said substituent alkyl end can be a unsaturated bond, R
3Can form ring with the phenyl ring of adjacency;
R
4And R
5Represent R independently of one another
21, OR
21, CN or halogen atom, a and b are 0 ~ 3 independently of one another.
5. single-layer electrodes pattern according to claim 4 is used Photocurable composition, it is characterized in that, said inorganic powder comprises at least a arbitrarily in black pigment, electroconductive powder and the glass dust.
6. a plasma display panel is characterized in that, it uses claim 4 or the described single-layer electrodes pattern of claim 5 to obtain with Photocurable composition.
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JP2010-083419 | 2010-03-31 | ||
JP2010083419 | 2010-03-31 | ||
PCT/JP2011/001923 WO2011122026A1 (en) | 2010-03-31 | 2011-03-30 | Photocurable composition |
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CN102792412A true CN102792412A (en) | 2012-11-21 |
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ID=44711781
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CN2011800132946A Pending CN102792412A (en) | 2010-03-31 | 2011-03-30 | Photocurable composition |
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JP (1) | JPWO2011122026A1 (en) |
KR (1) | KR20130019379A (en) |
CN (1) | CN102792412A (en) |
WO (1) | WO2011122026A1 (en) |
Cited By (2)
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CN106444282A (en) * | 2015-08-13 | 2017-02-22 | 常州强力先端电子材料有限公司 | Photosensitive resin composition containing oxime ester photoinitiator and application of photosensitive resin composition |
CN108475019A (en) * | 2016-03-29 | 2018-08-31 | 株式会社艾迪科 | Black-colored photosensitive resin composition |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1841618A (en) * | 2005-03-30 | 2006-10-04 | 太阳油墨股份有限公司 | Light sensitive black paste for first sintering and method for fabricating PDP front substrate by using same |
US20080272684A1 (en) * | 2007-03-28 | 2008-11-06 | Akihiro Horikawa | Plasma display panel and method for producing the same |
CN101528694A (en) * | 2006-12-27 | 2009-09-09 | 株式会社艾迪科 | Oxime ester compound and photopolymerization initiator containing the compound |
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JP5140903B2 (en) * | 2004-07-02 | 2013-02-13 | 三菱化学株式会社 | Colored resin composition, color filter, and liquid crystal display device |
JP5143683B2 (en) * | 2007-09-21 | 2013-02-13 | 東進セミケム株式会社 | Slurry composition for forming plasma display panel electrode |
JP2010061041A (en) * | 2008-09-05 | 2010-03-18 | Jsr Corp | Radiation-sensitive composition, color filter, black matrix, and liquid crystal display element |
-
2011
- 2011-03-30 KR KR1020127023630A patent/KR20130019379A/en not_active Application Discontinuation
- 2011-03-30 CN CN2011800132946A patent/CN102792412A/en active Pending
- 2011-03-30 JP JP2012508096A patent/JPWO2011122026A1/en active Pending
- 2011-03-30 WO PCT/JP2011/001923 patent/WO2011122026A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1841618A (en) * | 2005-03-30 | 2006-10-04 | 太阳油墨股份有限公司 | Light sensitive black paste for first sintering and method for fabricating PDP front substrate by using same |
CN101528694A (en) * | 2006-12-27 | 2009-09-09 | 株式会社艾迪科 | Oxime ester compound and photopolymerization initiator containing the compound |
US20080272684A1 (en) * | 2007-03-28 | 2008-11-06 | Akihiro Horikawa | Plasma display panel and method for producing the same |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106444282A (en) * | 2015-08-13 | 2017-02-22 | 常州强力先端电子材料有限公司 | Photosensitive resin composition containing oxime ester photoinitiator and application of photosensitive resin composition |
CN108475019A (en) * | 2016-03-29 | 2018-08-31 | 株式会社艾迪科 | Black-colored photosensitive resin composition |
CN108475019B (en) * | 2016-03-29 | 2022-02-11 | 株式会社艾迪科 | Black photosensitive resin composition |
Also Published As
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JPWO2011122026A1 (en) | 2013-07-04 |
WO2011122026A1 (en) | 2011-10-06 |
KR20130019379A (en) | 2013-02-26 |
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