KR101000065B1 - Photosensitive electrode paste - Google Patents

Abstract

The present invention relates to a photosensitive electrode paste. The photosensitive electrode paste according to the present invention includes 3 to 9 wt% of an organic binder, 3.5 to 6.5 wt% of a photopolymerizable monomer, 2 to 10 wt% of glass frit, 50 to 70 wt% of silver powder, 8 to 11 wt% of a solvent, and 4-10 wt% of an oligomer, with an acid value of 30-100 mgKOH / g. Thereby, it is possible to prevent the occurrence of residues of the black matrix during development while the electrodes maintain sufficient photocurability.

Residue, electrode paste, acid value

Description

Photosensitive electrode paste

The present invention relates to a photosensitive electrode paste, and relates to a photosensitive electrode paste containing an oligomer having an acid value of 30 to 100 mgKOH / g.

In general, a plasma display panel (PDP) injects a discharge gas into a discharge cell separated by a partition wall, and is caused by an energy difference when ultraviolet rays generated during plasma emission excite phosphors and return to a ground state. A display device using a light emission phenomenon of visible light.

The plasma display panel includes an upper panel, which is a display surface on which an image is displayed, and a lower panel coupled in parallel thereto, and the upper panel includes a plurality of sustain electrode pairs formed by pairing a scan electrode and a sustain electrode on the upper substrate. In the lower panel, a plurality of address electrodes are arranged on the lower substrate to intersect a plurality of pairs of sustain electrodes formed in the upper panel.

The scan electrode and the sustain electrode comprise a transparent electrode and a bus electrode on the transparent electrode. On the other hand, when forming the bus electrode, in order to improve the contrast of the screen, the black matrix layer is printed with black paste, and the bus electrode is printed with the conductive silver (Ag) paste thereon, followed by a post-exposure developing process to form an electrode having a two-layer structure. Can be formed.

However, in this case, the lower part of the black matrix may not be sufficiently exposed, and during development, the non-exposed part may not be removed cleanly, resulting in poor straightness after firing and residue.

An object of the present invention is to provide a photosensitive electrode paste capable of preventing the occurrence of residues of a black matrix during development while the electrode maintains sufficient photocurability.

The photosensitive electrode paste according to the present invention for achieving the above object is 3 to 9 wt% of an organic binder, 3.5 to 6.5 wt% of a photopolymerizable monomer, 2 to 10 wt% of glass frit, 50 to 70 wt% of silver powder, 8 to 11 wt% solvent and 4 to 10 wt% oligomer, and the acid value of the oligomer is 30 to 100 mgKOH / g.

According to the present invention, the photosensitive electrode paste includes an oligomer having an acid value of 30 to 100 mgKOH / g, thereby preventing the occurrence of residue of the black matrix during development while the electrode maintains sufficient photocurability.

Hereinafter, with reference to the drawings will be described the present invention in more detail.

Photosensitive electrode paste according to an embodiment of the present invention is 3 to 9 wt% of organic binder, 3.5 to 6.5 wt% of photopolymerizable monomer, 2 to 10 wt% of glass frit, 50 to 70 wt% of silver powder and 8 to 11 of solvent. wt%, and may further include 4 to 10 wt% of an oligomer.

First, the organic binder functions as a binder of each component before firing, and is preferably prepared by suspension polymerization for uniformity. The organic binder may include a resin containing a carboxyl group, specifically, a carboxyl group-containing photosensitive resin having an ethylenically unsaturated double bond and a carboxyl group-containing resin not having an ethylenically unsaturated double bond.

For example, i) carboxyl group-containing resin obtained by copolymerizing an unsaturated carboxylic acid and a compound having an unsaturated double bond, and ii) a carboxyl group obtained by adding an ethylenically unsaturated group as a pendant to a copolymer of an unsaturated carboxylic acid and a compound having an unsaturated double bond. Containing photosensitive resin, iii) a carboxyl group-containing photosensitive resin obtained by reacting a copolymer of an acid anhydride having an unsaturated double bond with a compound having an unsaturated double bond, with a hydroxyl group and a compound having an unsaturated double bond, and the like. It is not.

The organic binder may be used alone or in combination with the various carboxyl group-containing resins described above, and may be included in an amount of 3 to 9 wt%.

When the organic binder is contained in less than 3 wt%, the distribution of the organic binder in the coating film to be formed may become uneven, and patterning by selective exposure and development may be difficult. On the other hand, when it exceeds 9 wt%, it is not easy to cause pattern collapse or line width shrinkage during firing of the electrode.

The photopolymerizable monomer is used to promote photocurability of the photosensitive electrode paste and to improve developability.

As the photopolymerizable monomer, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, polyurethane diacrylate, trimethylol Propane triacrylate, pentaerythrite triacrylate, pentaerythrite tetraacrylate, trimethylolpropane ethylene oxide modified triacrylate, trimethylolpropanepropylene oxide modified triacrylate, dipentaery little pentaacrylate, dipenta Erythritol hexaacrylate and each methacrylate corresponding to the acrylate; Mono-, di-, tri- or more polyesters of polybasic acids such as phthalic acid, adipic acid, maleic acid, ataconic acid, succinic acid, trimellitic acid and terephthalic acid with hydroxyalkyl (meth) acrylates. However, it is not limited to a specific thing, These can be used individually or in combination of 2 or more types.

When less than 3.5 wt% of the photopolymerizable monomer is included, it may be difficult to obtain sufficient photocurability. If it exceeds 6.5 wt%, curing unevenness may occur because the photocuring becomes too fast. Therefore, the photopolymerizable monomer may be included 3.5 to 6.5 wt%.

In addition, the glass frit may be included in 2 to 10 wt%. When the glass frit is included in less than 2 wt%, the adhesive strength of the conductive film to the substrate may not be sufficient, whereas when the glass frit is added in excess of 10 wt%, the sinterability of the conductive film is lowered and the resistance of the resulting electrode is reduced. This can increase.

Although it does not restrict | limit especially as a composition of a glass frit, It is preferable that the glass transition temperature (Tg) of a glass frit is 350-550 degreeC. When the glass transition point (Tg) of the glass frit is 350 ° C. or higher, generation of bubbles, expansion, etc. is suppressed, and adhesion with the 550 ° C. substrate is excellent, and shape defects such as pinholes and edge curls can be effectively suppressed. have.

In addition, in this invention, in order to make a glass frit effectively into the firing pattern without a pinhole, the fine powder which exists in the range of 0.5-2 micrometers of average particle diameters (D50) is preferable.

The silver (Ag) powder imparts conductivity to the paste, and the shape is not particularly limited as spherical or flake, but is preferably spherical in view of dispersibility. Such spherical silver powder may comprise 50 to 70 wt%.

First, if the spherical silver powder is less than 50 wt%, sufficient conductivity of the conductor pattern obtained from the paste is not obtained, while if it is contained in excess of 70 wt%, the viscosity of the electrode may be so high that printing may be difficult. Because it is not desirable.

On the other hand, when the average particle diameter (D50) of the spherical silver powder is smaller than 0.1 µm, the flowability of the prepared paste is not only degraded, but also the workability of the paste is increased, and in contrast, when the average particle diameter (D50) is larger than 2 µm, Since the electrical resistance of the formed electrode may be increased and the adhesion to the substrate may be reduced, the average particle diameter (D50) of the spherical silver powder is preferably 0.1 to 2 μm.

In addition, the solvent can dissolve the organic binder, it can be used with a boiling point of more than 150 degrees while being well mixed with other additives. These include a-terpinol, buty cabitol acetate, texanol, buty cabitol, di-propylene glycol monomethyl ether And the like, including an aldehyde group, but are not limited thereto.

Such solvents are preferably comprised between 8 and 11 wt%. When the content of the solvent is less than 8 wt%, it may be difficult to apply the paste uniformly on the substrate, whereas when it contains more than 11 wt%, sufficient conductivity of the conductor pattern is not obtained, and It is not preferable because the adhesion is poor.

On the other hand, the photosensitive electrode paste according to the present invention may further comprise an oligomer at 4 to 10wt%. In addition, the oligomer includes a carboxyl group, and the acid value is preferably 30 to 100 mgKOH / g.

When the photosensitive electrode paste is applied onto the black paste applied to form the black matrix, oligomers having a carboxyl group included in the photosensitive electrode paste may penetrate into the black paste. In this case, the black matrix and the electrode may be exposed and patterned. At this time, the unexposed portion can be efficiently removed by the developer, so that the residue of the black matrix can be effectively prevented.

In addition, since the oligomer containing a carboxyl group contains relatively many double structures which can react with light compared with a binder, the photosensitive electrode paste can maintain photocurability.

On the other hand, it is preferable that the acid value of an oligomer is 30-100 mgKOH / g. If the acid value is less than 30 mgKOH / g, poor solubility in an aqueous alkali solution may cause poor development, whereas if it exceeds 100 mgKOH / g, the adhesion of the film may be degraded at the time of development, or the dissolution of the photocurable part may occur. Is not desirable as it may occur.

In addition, when the addition amount of the oligomer is less than 4 wt% may adversely affect the adhesion of the film during development, if it exceeds 10wt% may cause poor development, the photosensitive electrode paste according to the present invention is 4 to 10wt It is preferred to include oligomers in%.

In addition, the photosensitive electrode paste of this invention is benzoin and benzoin alkyl ether, such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, as a photoinitiator; Acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone- Aminoacetophenones such as 1,2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone; Anthraquinones such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone and 1-chloroanthraquinone; Thioxanthones, such as 2, 4- dimethyl thioxanthone, 2, 4- diethyl thioxanthone, 2-chloro thioxanthone, and 2, 4- diisopropyl thioxanthone; Ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; Benzophenones such as benzophenone; Or xanthones; (2,6-dimethoxybenzoyl) -2,4,4-pentylphosphineoxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine jade Phosphine oxides such as seeds and ethyl-2,4,6-trimethylbenzoylphenylphosphinate; Various peroxides etc. are mentioned, These known conventional photoinitiators can be used individually or in combination of 2 or more types.

Moreover, the photosensitive electrode paste which concerns on this invention can mix | blend other additives, such as a defoaming and leveling agent, such as a silicone type and an acryl type, and a silane coupling agent for improving the adhesiveness of a film as needed.

In addition, a known conventional antioxidant for preventing oxidation of the conductive metal powder, a thermal polymerization inhibitor for improving thermal stability during storage, a metal oxide as a bonding component with a substrate during firing, and silicon, if necessary Fine particles such as oxides, boron oxides and low melting glass may be further added, and inorganic powders such as silica, bismuth oxide, aluminum oxide and titanium oxide, organometallic compounds, metal organic acid salts and metal alkoxides for the purpose of adjusting plastic shrinkage. Etc. can also be added.

1 is a cross-sectional view illustrating a bus electrode manufacturing process of a plasma display panel.

First, as shown in FIG. 1A, a transparent electrode 120 formed of ITO is formed on the upper substrate 110 through a process such as sputtering, ion plating, chemical vapor deposition, and electrodeposition. The black paste 130 is applied. The black paste 130 may include a complex oxide including a single metal oxide and / or two or more metal elements such as Cu, Fe, Cr, Mn, Co, Ru, and La which have color stability at high temperature. The organic solvent is then evaporated by drying in a hot air circulation drying furnace or a far infrared drying furnace.

Subsequently, as shown in (b), the photosensitive electrode paste 140 having the composition described above is applied onto the black paste 130 by an appropriate method such as a printing method, a bar coater, a blade coater, and then dried. At this time, the oligomers included in the photosensitive electrode paste 140 penetrate into the black paste 130 by diffusion. At this time, the oligomer preferably has an acid value of 30 to 100 mgKOH / g.

Subsequently, a mask 150 having a predetermined pattern is positioned on the upper substrate 110 to which the photosensitive electrode paste 140 is applied as shown in (c). In this case, the mask 150 has an opening 152 formed at a position corresponding to the position at which the bus electrode 142 and the black matrix 132 are to be formed.

After the mask 150 is positioned, the mask 150 is exposed for a predetermined time on the mask 150. The active light source used at this time includes visible light, near infrared ray, ultraviolet ray, electron beam, X-ray dimming laser light and the like, and preferably ultraviolet ray is used.

As the ultraviolet light source, a low pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, a halogen lamp and a germicidal lamp can be used. Preferably, an ultra-high pressure mercury lamp may be used, but is not limited thereto.

For example, when the ultraviolet light is irradiated, the photosensitive electrode paste 140 and the black paste 130 are cured in response to the ultraviolet light. In addition, since the oligomer included in the photosensitive electrode paste 140 includes a relatively large number of double bonds that may react with light, the photopolymerizable electrode paste 140 may have excellent photocurability.

At this time, only a predetermined portion is cured by the mask 150 placed on the photosensitive electrode paste 140 and the black paste 130. That is, the photosensitive electrode paste 140 and the black paste 130 positioned below the opening 152 are cured by being irradiated with ultraviolet rays, and the photosensitive electrode paste 140 positioned below the opening 152 is not formed. ) And the black paste 130 are not cured because the ultraviolet rays do not transmit.

The photosensitive electrode paste 140 according to the present invention includes an oligomer, and since the oligomer includes a relatively large number of double bonds that can react to light, the photosensitive electrode paste 140 may have sufficient photocurability. do.

After the mask 150 is removed, a developing process is performed. As the developing step, spraying, dipping and the like are used. As the developing solution, aqueous metal alkali solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium silicate, and amine aqueous solutions such as monoethanolamine, diethanolamine and triethanolamine may be used, but in particular, about 1.5 wt% or less Preference is given to dilute aqueous alkali solutions.

On the other hand, the oligomer having an acid value of 30 to 100 mgKOH / g penetrated into the black paste 130 helps to clean the non-exposed part of the black paste 130 efficiently. Therefore, it is possible to effectively prevent the occurrence of residues.

Subsequently, a firing process is performed to complete formation of the bus electrode 142 and the black matrix 132 as shown in (d).

EXAMPLES Hereinafter, although an Example is shown and this invention is demonstrated concretely, this invention is not limited to the following Example.

The photosensitive electrode paste of this invention is obtained by mix | blending the above-mentioned essential component and arbitrary components in predetermined ratio, and disperse | distributing uniformly in kneading machines, such as three rolls and a blender. The photosensitive electrode paste obtained in this way is formed as a pattern of an electrode by the process as mentioned above in FIG.

Table 1 below shows Examples and Comparative Examples according to the present invention. All units are by weight% unless otherwise stated.

In Table 1 below, a solvent of the photosensitive electrode paste was mixed with Butyl Carbitol and dipropylene glycol monomethyl ether (Di (propylene glycol) monomethyl ether), and 2-benzyl-2-dimethylamino-1- (4- as a photoinitiator. Morpholinophenyl) butan-1-one was used. In addition, the photopolymerizable monomer uses Trimethylopropane Triacrylate.

On the other hand, the oligomer was measured by varying the acid value included.

Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 bookbinder 9.0 6.0 3.0 6.0 8.0 12.0 Oligomer (0mgKOH / g) 6.0 Oligomer (30mgKOH / g) 4.0 Oligomer (60 mgKOH / g) 6.0 Oligomer (100 mgKOH / g) 10.0 Oligomer (140 mgKOH / g) 4.0 Butyl carbitol 5.0 6.0 8.0 6.0 6.0 6.0 Di (propylene glycol) monomethyl ether 3.0 3.0 3.0 3.0 3.0 3.0 Photopolymerizable monomer 6.5 6.5 3.5 6.5 6.5 6.5 Photoinitiator 1.5 1.5 1.5 1.5 1.5 1.5 Polymerization inhibitor 0.5 0.5 0.5 0.5 0.5 0.5 Silver powder 65.0 65.0 65.0 65.0 65.0 65.0 Glass frit 5.0 5.0 5.0 5.0 5.0 5.0 Leveling agent 0.5 0.5 0.5 0.5 0.5 0.5 Total 100.0 100.0 100.0 100.0 100.0 100.0

Using the photosensitive electrode paste having the composition shown in Table 1, the bus electrode and the black matrix were formed by the method described with reference to FIG. 1 to evaluate physical properties as shown in Table 2 below. The substrate used was PD200 glass, and the exposure mask width line was 90 μm.

At this time, the black matrix was dried at 100 ° C. for 10 minutes, and the bus electrode was dried at 105 ° C. for 10 minutes. The development speed was 800 mm / min, and the firing was carried out at 580 ° C. for 10 minutes (at 30 ° C./min in temperature).

Property evaluation Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Exposure amount mJ / 20.0mW 100 100 100 100 100 100 Resolution (μm) 30.00 30.00 30.00 Not present Pattern dropout 30.00 Thickness after development (㎛) 12.83 12.99 13.00 13.70 12.50 12.47 Line width after shape (㎛) 112.11 113.04 114.26 117.19 109.97 111.47 Undercut (μm) after development 18.72 19.44 20.52 10.21 24.09 20.44 Residue after development ○ ○ ○ × ○ × Pattern line width after firing 90.50 89.32 89.84 99.22 81.33 82.23 Pattern thickness after firing 4.49 4.58 4.69 4.32 4.98 5.27 Plastic shrinkage amount (㎛) 21.61 23.72 24.42 17.97 28.64 29.24 E / curl 0.89 1.02 1.76 0.00 3.21 5.47 Line resistance (Ω / 5㎝) 3.71 3.89 3.81 4.10 3.79 3.60 Resistivity 3.02 3.18 3.21 3.51 3.07 3.12

Examples 1-3 and Comparative Examples 1-3 were exposed by the same exposure amount, and it etched in the arithmetic solution for 15 minutes similarly.

First, Comparative Example 3 shows a case where an oligomer is not included. When the results of Comparative Example 3 are shown in Table 2, it can be seen that after the development, residues occur and the residue characteristics are not good. In Comparative Example 1, the acid value does not develop as it contains an oligomer having 0 mgKOH / g, Again, the residue characteristics are not good.

On the other hand, Examples 1 to 3 include good oligomers having an acid value of 30 to 100 mgKOH / g.

On the other hand, when looking at Comparative Example 2, the residue does not occur, the residue properties after development is good, but the acid value of the oligomer included is 140 mgKOH / g exceeded the above-mentioned preferred range, it is a case that the pattern is dropped. That is, the comparative example 2 is a case where the acid value of the oligomer contained exceeds 100 mgKOH / g, and adhesiveness of a film falls at the time of image development, or the photocurable part melt | dissolved.

In addition, it can be seen that in Examples 1 to 3, the edge curl of the formed electrode was 0.89 to 1.76 μm, which is 67.8% to 84.6% less than the edge curl of 5.47 μm of Comparative Example 3.

Therefore, the photosensitive electrode paste according to the present invention further includes an oligomer having an acid value of 30 to 100 mgKOH / g, thereby preventing the occurrence of residue during development while the electrode maintains sufficient photocurability. In addition, by reducing the phenomenon of the edge curl of the electrode to be formed, it is possible to prevent the generation of bubbles at the intersection of the glass substrate electrode and the dielectric film and to prevent the occurrence of dielectric breakdown by the voltage applied after the final panel is completed. It has an effect.

2 is a diagram illustrating a structure of a PDP including a black matrix formed of a black paste according to the present invention.

Referring to the drawings, the plasma display panel 200 includes a scan electrode 211, a sustain electrode 212 and a sustain electrode 212, which are formed on the upper substrate 210, and an address electrode 222 formed on the lower substrate 220. It includes.

The sustain electrode pairs 211 and 212 generally include transparent electrodes 211a and 212a and bus electrodes 211b and 212b formed of indium tin oxide (ITO), and the bus electrodes 211b, 212b) may be formed of a metal such as silver (Ag) or chromium (Cr) or a stack of chromium / copper / chromium (Cr / Cu / Cr) or a stack of chromium / aluminum / chromium (Cr / Al / Cr). .

The bus electrodes 211b and 212b are formed on the transparent electrodes 211a and 212a to reduce the voltage drop caused by the high resistance transparent electrodes 211a and 212a.

Meanwhile, between the transparent electrodes 211a and 212a of the scan electrode 211 and the sustain electrode 212 and the bus electrodes 211b and 211c, external light generated from the outside of the upper substrate 210 is absorbed to reduce reflection. The black matrix (BM, 215) is arranged to serve as a light blocking function and to improve the purity and contrast of the upper substrate 210.

The black matrix 215 is formed on the upper substrate 210, the first black matrix 215 formed at a position overlapping the partition wall 221, the transparent electrodes 211a and 212a and the bus electrodes 211b and 212b. Second black matrices 211c and 212c formed therebetween may be formed.

Meanwhile, the bus electrodes 211b and 211c have 3 to 9 wt% of an organic binder, 3.5 to 6.5 wt% of a photopolymerizable monomer, 2 to 10 wt% of glass frit, 50 to 70 wt% of silver powder, and 8 to 11 wt% of a solvent. And a photosensitive electrode paste including 4 to 10 wt% of an oligomer. In particular, it is preferable to include the oligomer whose acid value is 30-100 mgKOH / g. The oligomer having a carboxyl group can penetrate into the black paste, which helps to effectively wash the unexposed portions of the black paste by the developer. As a result, it is possible to prevent the occurrence of residues when developing the second matrices 211c and 212c.

In addition, by reducing the phenomenon of the edge curl of the electrode to be formed, it is possible to prevent the occurrence of bubbles at the intersection of the glass substrate electrode and the dielectric film and to prevent the occurrence of dielectric breakdown by the voltage applied after the final panel is completed It works.

Meanwhile, the first black matrix 215 and the second black matrices 211c and 212c, which are also called black layers or black electrode layers, may be simultaneously formed and physically connected in the formation process, or may not be simultaneously formed and thus not physically connected. .

In addition, when physically connected and formed, the first black matrix 215 and the second black matrix 211c and 212c may be formed of the same material, but may be formed of different materials when they are formed separately.

The passivation layer 214 protects the upper dielectric layer 213 from sputtering of charged particles generated during gas discharge, and increases emission efficiency of secondary electrons.

The address electrode 222 is formed in a direction crossing the scan electrode 211 and the sustain electrode 212.

The lower dielectric layer 224 and the partition wall 221 are formed on the lower substrate 220 on which the address electrode 222 is formed.

The lower dielectric layer 224 is electrically condensed to protect the address electrode 222 and is formed in white to prevent the discharge light from being transmitted to the rear substrate.

The method of forming the lower dielectric layer 224 is mainly used for screen printing, but may be formed by various coaters such as a green sheet laminate method, a slot coater method, and a roll coater method.

In addition, the phosphor layer 223 is formed on the surfaces of the lower dielectric layer 224 and the partition wall 221. The partition wall 221 has a vertical partition wall 221a and a horizontal partition wall 221b formed in a closed shape, and physically distinguishes the discharge cells, and prevents ultraviolet rays and visible light generated by the discharge from leaking to the adjacent discharge cells.

While the preferred embodiments of the present invention have been shown and described, the present invention is not limited to the specific embodiments described above, and the present invention is not limited to the specific embodiments of the present invention, without departing from the spirit of the invention as claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

1 is a cross-sectional view illustrating an electrode manufacturing process of a plasma display panel.

2 is a diagram illustrating a structure of a PDP including an electrode formed of a photosensitive electrode paste according to an embodiment of the present invention.

Claims (10)

Applied onto the black paste for forming the black matrix of the plasma display panel, 3 to 9 wt% of organic binder, 3.5 to 6.5 wt% of photopolymerizable monomer, 2 to 10 wt% of glass frit, 50 to 70 wt% of silver powder, 8 to 11 wt% of solvent and 4 to 10 wt% of oligomer having carboxyl group To include, The acid value of the oligomer is 30 to 100 mgKOH / g Photosensitive electrode paste. The method of claim 1, The organic binder is a photosensitive electrode paste containing a carboxyl group. The method of claim 1, The solvent is a-terpinol, buty cabitol acetate, texanol, buty cabitol and dipropylene glycol monomethyl ether (Di (propylene glycol) monomethyl) A photosensitive electrode paste containing at least one of ether). The method of claim 1, The photopolymerizable monomer is 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, polyurethane diacrylate, trimethylol Propane triacrylate, pentaerythrite triacrylate, pentaerythrite tetraacrylate, trimethylolpropane ethylene oxide modified triacrylate, trimethylolpropanepropylene oxide modified triacrylate, dipentaery little pentaacrylate, dipenta The photosensitive electrode paste containing at least one of an erythrile hexaacrylate and each methacrylate corresponding to the said acrylate. The method of claim 1, The photosensitive electrode paste of which the average particle size (D50) of the glass frit is 0.5 to 2 μm. The method of claim 1, The glass transition temperature (Tg) of the glass frit is 350 to 550 ℃ photosensitive electrode paste. The method of claim 1, The photosensitive electrode paste which further contains at least any one of a photoinitiator, a leveling agent, an antifoamer, and a coupling agent. The method of claim 7, wherein The photopolymerization initiator includes at least one of benzoin alkyl ethers, acetophenones, aminoacetophenones, anthraquinones, thioxanthones, benzophenones, xanthones, phosphine oxides and peroxides. Photosensitive electrode paste. An electrode formed of a fired product of the photosensitive electrode paste of any one of claims 1 to 8. A plasma display device comprising the electrode of claim 9.

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