CN102791083A

CN102791083A - Circuit board communication process

Info

Publication number: CN102791083A
Application number: CN2011101306699A
Authority: CN
Inventors: 何忠亮
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-05-18
Filing date: 2011-05-18
Publication date: 2012-11-21

Abstract

The invention relates to a circuit board manufacturing process, in particular to a circuit board communication process. The circuit board communication process comprises the following steps of: punching a circuit copper foil at one side and a middle insulating layer to a circuit copper foil at the other side; and filling conducting materials into openings and covering the edges of the openings of an opening circuit board. According to the double-sided circuit board communication process disclosed by the invention, the communication of the circuit copper foils at both the sides is completed by punching the openings and connecting the circuit copper foils at both the sides in the openings by the conducting materials or attaching the circuit copper foils at both the sides by stamping; the integral process has no chemical reaction process; the discharge of pollutants is reduced; the environment is protected; compared with the prior art, the integral steps are greatly simplified; and the processing efficiency is improved.

Description

Circuit board is communicated with technology

Technical field

The present invention relates to a kind of circuit board manufacturing process, especially a kind of circuit board is communicated with technology.

Background technology

In existing two-sided and multilayer circuit board circuit board, generally comprise the insulating barrier and the conducting wire Copper Foil of being located at the layer of insulation board two sides at middle part, in the conducting wire; Some places need the conducting of the circuit Copper Foil on two sides, existing general manufacture method for machinery to wiring board boring, then circuit board is sunk copper, plating; Thereby the circuit Copper Foil on two sides is communicated with, but heavy copper all is all to be that chemical technology is processed with electroplating, and can produce a large amount of industrial wastewaters; Cause very big pollution to environment; And existing conducting technology, operation is various, and production efficiency is comparatively low.

Summary of the invention

The purpose of this invention is to provide a kind of pollution less, the high circuit board of production efficiency is communicated with technology.

To achieve these goals, the present invention adopts following technical scheme:

It comprises the steps:

A, a lateral circuit Copper Foil and intermediate insulating layer punched expose to opposite side circuit Copper Foil inboard;

B, to perforate inside filled conductive material and cover the verge of opening of perforate circuit board.

Preferably, the punching in the described steps A is for using rig boring.

Preferably, the punching in the described steps A is that laser is directly punched a lateral circuit Copper Foil and an intermediate insulating layer.

Preferably, described steps A comprises step:

A1, a lateral circuit Copper Foil is punched;

A2, intermediate insulating layer in the hole is used laser drilling.

Preferably, in the said steps A 1 lateral circuit Copper Foil punching employing boring, forms of corrosion are punched.

Preferably, described step B is that scolding tin is handled in perforate, connects two lateral circuit Copper Foils through scolding tin.

Preferably, described step B connects two lateral circuit Copper Foils in perforate, to spray electric conducting material through electric conducting material.

The present invention also provides a kind of double-sided PCB to be communicated with technology, the steps include:

C, the room is set at the desire punch position of intermediate insulating layer;

D, the circuit Copper Foil is set in the intermediate insulating layer both sides;

E, from lateral circuit Copper Foil punching press in the hole, punching press to opposite side circuit Copper Foil riveted;

F, to the reverse punch riveting of the pressing direction of E step.

Double-sided PCB of the present invention is communicated with technology through punching; In the hole, connect two lateral circuit Copper Foils or through punching press two lateral circuit Copper Foils are fitted through electric conducting material, accomplish the connection of two lateral circuit Copper Foils, whole process does not have chemical reaction process; Reduced the discharging of pollutant; Protected environment, and whole steps more significantly simplification, working (machining) efficiency increased.

Description of drawings

Fig. 1 is the flow chart of first embodiment of the invention;

Fig. 2 is steps A 1 particular flow sheet of first embodiment of the invention;

Fig. 3 is the original circuit board structure figure of first embodiment of the invention;

Fig. 4 is a first embodiment of the invention wiring board punching back structural representation;

Fig. 5 is that first embodiment of the invention is provided with structural representation behind the electric conducting material;

Fig. 6 is that the first embodiment of the invention another kind is provided with the conducting material structure sketch map;

Fig. 7 is the flow chart of second embodiment of the invention;

Fig. 8 is the structural representation after the intermediate insulating layer of second embodiment of the invention punches;

Fig. 9 is a structural representation after the second embodiment of the invention punching press;

Figure 10 is that the back structural representation is pressed in the second embodiment of the invention recoil.

The object of the invention, function and advantage will combine embodiment, further specify with reference to accompanying drawing.

Embodiment

As shown in Figure 1, the double-sided PCB of present embodiment is communicated with technology and comprises the steps:

As shown in Figure 3, original double-sided PCB comprises intermediate insulating layer 1 and two lateral circuit Copper Foils 2 and circuit 3, after steps A processing, forms the structure like Fig. 4, after punching, has a hole 4 on circuit 2 and the intermediate insulating layer 1, and expose in hole 4 inboard of circuit 3.

Wherein, the punching in the described steps A is that laser is directly punched a lateral circuit Copper Foil and an intermediate insulating layer.

Because there is reflective phenomenon when bright and clean in the metal surface, so produce reflective problem when thinking directly that at laser a lateral circuit Copper Foil is moved, described steps A can also comprise step:

A1, a lateral circuit Copper Foil is punched;

A2, intermediate insulating layer in the hole is used laser drilling.

Gone out outside the above-mentioned dual mode, can also adopt boring, forms of corrosion drilling to lateral circuit Copper Foil punching in the said steps A 1.Use forms of corrosion in the circuit board corrosion circuit, in the lump perforate to be corroded out, original first hole knockout is changed into advanced row line make punching again, improved operating efficiency and accuracy.

When using electric conducting material to connect two lateral circuit Copper Foils, described step B be that scolding tin is handled in perforate, can connect two lateral circuit Copper Foils through scolding tin, handles afterwards as shown in Figure 5ly, in hole 4, comes the circuit Copper Foil of conducting both sides through scolding tin 5; Also can use the piezoelectric ink jet printer in perforate, to spray electric conducting material, connect two lateral circuit Copper Foils through electric conducting material, as shown in Figure 6 after handling, in hole 4, come conducting two lateral circuit Copper Foils through electric conducting material 6.

The foregoing description and figure all are with double-layer circuit board as an example, except being used for double-layer circuit board, also can be used in the multilayer circuit board technology.

The second embodiment of the present invention also provides a kind of double-sided PCB to be communicated with technology, the steps include:

C, the room is set at the desire punch position of intermediate insulating layer; As shown in Figure 7, reserve position, a hole 91 in the intermediate layer 9 between two lateral circuit Copper Foils 7 and circuit 8.

E, from lateral circuit Copper Foil punching press in the hole, punching press to opposite side circuit Copper Foil riveted, the structure after the punching press is as shown in Figure 9, circuit 7 passes position, hole 91 and fits with circuit 8, realizes conducting;

F, to the reverse punch riveting of the pressing direction of E step, strengthen conducting riveted position, keep the stability of riveted.Structure behind the reverse punch riveting is shown in figure 10.

The above is merely the preferred embodiments of the present invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.

Claims

1. a circuit board is communicated with technology, it is characterized in that, comprises the steps:

A, a lateral circuit Copper Foil and intermediate insulating layer are punched to opposite side circuit Copper Foil;

2. circuit board as claimed in claim 1 is communicated with technology, it is characterized in that: the punching in the described steps A is for using rig boring.

3. circuit board as claimed in claim 1 is communicated with technology, and it is characterized in that: the punching in the described steps A is that laser is directly punched a lateral circuit Copper Foil and an intermediate insulating layer.

Preferably, described steps A comprises step:

A1, a lateral circuit Copper Foil is punched;

A2, intermediate insulating layer in the hole is used laser drilling.

4. circuit board as claimed in claim 1 is communicated with technology, it is characterized in that: in the said steps A 1 lateral circuit Copper Foil punching employing boring, forms of corrosion are punched.

5. circuit board as claimed in claim 1 is communicated with technology, it is characterized in that: described step B handles for scolding tin in perforate, connects two lateral circuit Copper Foils through scolding tin.

6. circuit board as claimed in claim 1 is communicated with technology, and it is characterized in that: described step B connects two lateral circuit Copper Foils in perforate, to spray electric conducting material through electric conducting material.

7. a circuit board is communicated with technology, the steps include:

F, to the reverse punch riveting of the pressing direction of E step.