CN107567206A - Double-side conduction construction processing method, linear circuit plate processing method and line source - Google Patents
Double-side conduction construction processing method, linear circuit plate processing method and line source Download PDFInfo
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- CN107567206A CN107567206A CN201710687770.1A CN201710687770A CN107567206A CN 107567206 A CN107567206 A CN 107567206A CN 201710687770 A CN201710687770 A CN 201710687770A CN 107567206 A CN107567206 A CN 107567206A
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- conductive layer
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Abstract
The present invention provides a kind of processing method of linear circuit plate, including provides insulating substrate；The first conductive layer and the 3rd conductive layer for providing mutually insulated setting are located at the insulating substrate same surface；And the second conductive layer is provided, located at another side surface of the insulating substrate, the edge of second conductive layer is recessed in the ipsilateral penumbra of first conductive layer, and forms step；Scolding tin is provided, first conductive layer and second conductive layer are electrically connected using printing welding procedure.The linear circuit plate of the present invention, technique is simple, and production reliability is high.The present invention also provides a kind of processing method of double-side conduction construction and the line source using the linear circuit plate processing method simultaneously.
Description
Technical field
The present invention relates to the double-side conduction construction processing side of printed circuit board industry, more particularly to a kind of printed circuit board (PCB)
Method, linear circuit plate processing method and the line source using the linear circuit plate processing method.
Background technology
With the development of hyundai electronicses science and technology, electronic product gradually gos deep into the life of people, each electronic product, is both needed to
Printed circuit board (PCB) is wanted to realize that the layout of various electronic devices connects with logic.
The mode of flexible printed circuit board generally use through hole conducting in the prior art, i.e., using bore process in the substrate
Through hole is set, in setting conductive layer in the through hole, ink plug sky is then provided again, continues the techniques such as follow-up plating, etching.
However, above-mentioned design still has following defect：
Firstly, because flexible printed circuit board is to realize pliability, more and more thinner, so to realize in flexible printing electricity
Road plate sets through hole to realize two-sided electrical connection, and technology difficulty is big, and yield is low, and cost is high；
Secondly, for linear printed circuit board (PCB), because device itself has pressure drop loss and conducting wire transmission belt
Pressure drop causes the driving voltage of some electronic devices to reach normal voltage, so causes the loss to electronic device, reduces
The global reliability of product.
Therefore it provides a kind of linear circuit plate processing method of new construction and the light source using the circuit board processing method
To solve the above problems.
The content of the invention
In order to solve the above-mentioned technical problem, the present invention provide one kind can maintain normal voltage reduce loss, technique it is simple and
Yield high double-side conduction construction processing method, printed circuit board (PCB) processing method and the line source using the printed circuit board (PCB).
A kind of processing method of double-side conduction construction, comprises the following steps：First conductive layer is provided；Insulating substrate is provided,
First conductive layer is located at the side surface of insulating substrate one；The second conductive layer is provided, located at the insulating substrate opposite side
Surface, and second conductive layer forms step with first conductive layer setting straggly；It is conductive in described second using scolding tin
Layer realizes first conductive layer and second conductive layer with the step of first conductive layer by the way that silk-screen printing is corresponding
Electrical connection.
Double-side conduction provided by the invention construction processing method a kind of preferred embodiment in, first conductive layer with
The relatively described insulating substrate of second conductive layer is symmetrical arranged.
In a kind of preferred embodiment of double-side conduction provided by the invention construction processing method, first conductive layer,
Second conductive layer is formed using layers of copper cutting.
In a kind of preferred embodiment of double-side conduction provided by the invention construction processing method, first conductive layer,
Second conductive layer is process using etch process.
In a kind of preferred embodiment of double-side conduction provided by the invention construction processing method, the scolding tin is using electric welding
Technique is processed.
A kind of processing method of linear circuit plate, including：Insulating substrate is provided；The first conduction that mutually insulated is set is provided
Layer is located at the insulating substrate same surface with the 3rd conductive layer；And the second conductive layer is provided, it is another located at the insulating substrate
Side surface, the edge of second conductive layer is recessed in the ipsilateral penumbra of first conductive layer, and forms step；Weldering is provided
Tin, first conductive layer and second conductive layer are electrically connected using printing welding procedure.
In a kind of preferred embodiment of processing method of linear circuit plate provided by the invention, first conductive layer includes
The first pad that multiple arrays are set, second conductive layer include the second pad that multiple arrays are set, first pad
Realized and electrically connected by scolding tin welding with second pad.
A kind of line source, including the first conductive layer of the setting that intercouples and the 3rd conductive layer, linear insulating substrate and
Two conductive layers, first conductive layer, the 3rd conductive layer are located at the linear side surface of insulating substrate one, the second conductive layer
Outside linear another side surface of insulating substrate, the second conductive layer edge epi to the first conductive layer edge
Side, first conductive layer are electrically connected with second conductive layer by scolding tin realization, first conductive layer and the described 3rd
Light-emittingdiode is set at conductive layer coupling.
Compared to prior art, the conducting of two electrodes of linear circuit plate provided by the invention coordinates pad real by scolding tin
The electrical connection of the lateral electrode of insulating substrate two is now located at, substitutes bore process, simplifies technique, it is cost-effective.When to linear circuit plate
When being cut, using the whole bar shaped copper foil of second electrode as electrode, there is identical potential, reduce pressure drop, improve product
Reliability.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other
Accompanying drawing, wherein：
Fig. 1 is a kind of side sectional view of double-side conduction construction provided by the invention；
Fig. 2 is the top view of the construction of double-side conduction shown in Fig. 1；
Fig. 3 is the side sectional view of the another embodiment of the construction of double-side conduction shown in Fig. 1；
Fig. 4 is the top view of the construction of double-side conduction shown in Fig. 3；
Fig. 5 is the side sectional view using the linear circuit plate of the construction of double-side conduction shown in Fig. 1；
Fig. 6 is the top view of linear circuit plate shown in Fig. 5；
Fig. 7 is the side sectional view of line source provided by the invention；And
Fig. 8 is the top view of line source shown in Fig. 7.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained all other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Please refer to Fig. 1 and Fig. 2, wherein Fig. 1 is the side sectional view of double-side conduction construction provided by the invention, Fig. 2
It is the top view of the construction of double-side conduction shown in Fig. 1.Double-side conduction construction 10 include the first conductive layer 11, insulating substrate 13,
Second conductive layer 15 and scolding tin 17.First conductive layer 11, insulating substrate 13, the second conductive layer 15 are folded set successively, that is,
Say, first conductive layer 11 is respectively arranged on two opposite flanks of the insulating substrate 13 with the insulating substrate 13.
First conductive layer 11 includes the first pad 111 that multiple arrays are set, the array spacings of the first pad 111
Located at first conductive layer 11 away from the side surface of insulating substrate 13.First conductive layer 11 is copper foil layer.
The insulating substrate 13 is that it is in strip that it is overall as made of insulating substrate using polyimides or polyester film
Wire.The width of the insulating substrate 13 is identical with the width of first conductive layer, two sides of the insulating substrate 13
The edge contour flush of edge and first conductive layer 11.
Second conductive layer 15 equally includes the second pad 151 that multiple arrays are set, the array of the second pad 151
Interval is located at second conductive layer 15 away from the side surface of insulating substrate 13, second pad 151 and the described first weldering
Disk 111 corresponds to respectively.Second conductive layer 15 is copper foil layer.The outer ledge profile extension of second conductive layer 15 is in institute
The outside of the first conductive layer 11 is stated, i.e.,：In vertical direction, the edge contour of second conductive layer 15 is exposed to described first and led
Outside the edge of electric layer 11 and the insulating barrier 13 so that the edge of first conductive layer 11 is recessed in second conductive layer
15 edge.
The scolding tin 17 is to be formed at first pad 111 with second pad 151, making by printing welding resistance technique
The electrical connection of first pad 111 and second pad 151 is obtained, and then realizes the first electrode 11 and the described second electricity
The corresponding conducting of pole 15.
Compared to prior art, in the double-side conduction construction 10 of the present invention, the first pad 111 and institute are connected using scolding tin
The mode for stating the second pad 151 realizes the electrical connection of the first electrode 11 and the second electrode 15, substitutes in the prior art
The step of being drilled to insulating substrate and the first conductive layer, simplify technique, it is cost-effective, while production reliability is also improved, reduce
Difficulty of processing.
When processing the double-side conduction construction, it comprises the following steps：
First conductive layer 11 is provided；
Insulating substrate 13 is provided, first conductive layer 11 is located at the side surface of insulating substrate 13 1；
Second conductive layer 15 is provided, located at 13 another side surface of insulating substrate, and second conductive layer 15 and institute
State 11 setting straggly of the first conductive layer and form step；
Silk-screen printing pair is passed through at the step of second conductive layer 13 and first conductive layer 11 using scolding tin 17
It should realize that first conductive layer 11 electrically connects with second conductive layer 17.
Fig. 3 and Fig. 4 are please referred to again, and wherein Fig. 3 is the side of the another embodiment of the construction of double-side conduction shown in Fig. 1
Face sectional view, Fig. 4 are the top views of the construction of double-side conduction shown in Fig. 3.The double-side conduction construction 20 and upper one of present embodiment is real
The difference for applying the double-side conduction construction 10 of mode is：The insulating substrate 23 is located in first conductive layer 21 and described the
Between two conductive layers 25, and the width of the insulating substrate 23 between first conductive layer 21 and second conductive layer 25 it
Between, the edge of the insulating substrate 23 between the edge of the edge of first conductive layer 21 and second conductive layer 25 it
Between.When the scolding tin 27 connects first pad 211 with the second pad 251, the insulating substrate 23 is covered
Edge.
Fig. 5 and Fig. 6 is referred to again, and wherein Fig. 5 is cutd open using the side of the linear circuit plate of the construction of double-side conduction shown in Fig. 1
View, Fig. 6 are the top views of linear circuit plate shown in Fig. 5.The linear circuit plate 30 is included with multiple first pads 311
The second conductive layer 32, the 3rd conductive layer 33, insulating substrate 35 and the scolding tin 37 of first conductive layer 31, the second pad 321 of multiple tools.
First conductive layer 31, the 3rd conductive layer 33 are located at a side surface of the insulating substrate 35, and described
First conductive layer 31 is set with the 33 corresponding mutually insulated of the 3rd conductive layer.First conductive layer 31 is conductive with the described 3rd
The outer ledge profile of layer 33 and the both sides of the edge profile flush of the insulating substrate 35.First conductive layer 31 with it is described
3rd conductive layer 33 is to be stacked at the surface of insulating substrate 35 by cutting the copper foil layer interval of the setting width formed.
Certainly, first conductive layer 31 can also be by plating or etch process shape with the 3rd conductive layer 33
Into the strip layers of copper circuit on the surface of insulating substrate 35.
The surface array of first conductive layer 31 is provided with multiple first pads 311.
Second conductive layer 32 is a plane electrode, and it is stacked at another side surface of the insulating substrate 35, its with
The first electrode 31, the 3rd electrode 33 are divided into two opposite flanks of the insulating substrate 35.Second conductive layer 32
Side edge contour and the 3rd conductive layer 33 outer ledge, the side edge contour of the insulating substrate 35 it is equal
Together.Extended to outside the opposite side edge contour of second conductive layer 32 outside the edge contour of first conductive layer 31,
That is the edge contour of first conductive layer 31 is recessed in the ipsilateral penumbra profile of second conductive layer 32 so that institute
State and form step in vertical direction between the first conductive layer 31 and second conductive layer 32.The surface of second conductive layer 32
Multiple second pads 321 are provided with, second pad 321 is correspondingly arranged respectively with first pad 311.
The scolding tin 37 electrically connects first pad 311 and second pad 321, realizes first conductive layer 31
With the electrical connection of second conductive layer 32.
In the linear circuit plate 30 of present embodiment, positioned at the first conductive layer 31 of the both sides of insulating substrate 35 and
Two conductive layers 32 coordinate pad to realize electrical connection by scolding tin, avoid drilling and the complicated technology such as electroplates, simplify structure, convenient to add
Work, and reduce the cost, there is provided production reliability.
When processing the linear circuit plate 30, it comprises the following steps：
Insulating substrate 35 is provided；
The first conductive layer 31 and the 3rd conductive layer 33 for providing mutually insulated setting are located at the homonymy table of insulating substrate 35
Face；And
The second conductive layer 32 is provided, located at 35 another side surface of insulating substrate, the edge of second conductive layer 32
The ipsilateral penumbra of first conductive layer 31 is recessed in, and forms step；
Scolding tin 37 is provided, first conductive layer 31 and second conductive layer 32 are electrically connected using printing welding procedure.
Again please refer to Fig. 7 and Fig. 8, wherein Fig. 7 is a kind of side sectional view of line source of the present invention, and Fig. 8 is Fig. 7 institutes
The top view of timberline light source.The line source includes linear circuit plate 40 and multiple spot lights 50.The multiple 50 gusts of spot light
Row are located at the surface of linear circuit plate 40, and the linear light sorurce 40 drives the multiple spot light 50 is luminous to form linear light
Body, i.e. line source.
The linear circuit plate 40 includes the first conductive layer 41, the second conductive layer 42, the 3rd conductive layer 43, insulating substrate 45
And scolding tin 47.
First conductive layer 41, second conductive layer 42 are located at the side surface of insulating substrate 45 1.Described first
Conductive layer 41 and second conductive layer 42 intercouple setting.3rd conductive layer 43 is another located at the insulating substrate 45
One side surface.First conductive layer 41, second conductive layer 42 are strip electrodes, its outer ledge respectively with it is described absolutely
The edge contour flush of edge base material 45.The edge wheel of the edge contour of second conductive layer 42 and first conductive layer 41
Wide setting straggly, and form step.
The surface of first conductive layer 41 is provided with multiple first pads 411.The surface of second pad 42 is provided with more
Individual second pad 421.First pad 411 is electrically connected with second pad 421 by the scolding tin, and then described in realization
Electrical connection between first conductive layer 41 and second conductive layer 42.
The first electrode layer 41 intercouples with the 3rd electrode layer 43 locates injection molding cup-shaped insulator.
The spot light 50 is corresponding to be packaged in the cup-shaped insulator using COB techniques.The spot light 50 is luminous
Diode.
When the line source works, there is provided voltage to the electrode 43 of second electrode 42 and the 3rd, drive described light
Source 50 is luminous, forms line source.
In the line source, the surface of the linear circuit plate 40 directly prints setting or plating set-up mode is formed
Conductive electrode, without processing the technique such as through hole and interior heavy electrically conductive ink, simplify manufacturing process, reduce cost.
Meanwhile the multiple spot light 50 and the pad 411,421 are set each along the bearing of trend array of base material 21
Put, so that when user needs to cut the line source of different length according to actual environment, directly cut according to length,
The conductive through hole position for avoiding prior art need not be corresponded to, meets that line source, linear circuit plate 40 freely make with length needs
With, waste of material is reduced, it is further cost-effective.
Furthermore using strip layers of copper or copper foil process the conductive layer to be formed as electrode substitute prior art leg,
Conductivity through-hole structure so that the pressure drop loss of the linear circuit plate 40 is reduced, and ensures that the point source 50 is in standard work
In range of voltage values, production reliability and service life are improved.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (8)
1. a kind of processing method of double-side conduction construction, comprises the following steps：
First conductive layer is provided；
Insulating substrate is provided, first conductive layer is located at the side surface of insulating substrate one；
Second conductive layer is provided, located at another side surface of the insulating substrate, and second conductive layer and described first conductive
Fault falls setting and forms step；
Using scolding tin in second conductive layer with the step of first conductive layer by silk-screen printing it is corresponding realize described in
First conductive layer electrically connects with second conductive layer.
2. the processing method of double-side conduction construction according to claim 1, it is characterised in that first conductive layer and institute
The relatively described insulating substrate of the second conductive layer is stated to be symmetrical arranged.
3. processing method according to claim 1, it is characterised in that first conductive layer, the second conductive layer use
Layers of copper cutting forms.
4. double-side conduction construction according to claim 1, it is characterised in that first conductive layer, the second conductive layer are adopted
It is process with etch process.
5. double-side conduction construction according to claim 1, it is characterised in that the scolding tin is processed using welding technology.
6. a kind of processing method of linear circuit plate, including：
Insulating substrate is provided；
The first conductive layer and the 3rd conductive layer for providing mutually insulated setting are located at the insulating substrate same surface；And
The second conductive layer is provided, located at another side surface of the insulating substrate, the edge of second conductive layer is recessed in described
The ipsilateral penumbra of first conductive layer, and form step；
Scolding tin is provided, first conductive layer and second conductive layer are electrically connected using printing welding procedure.
7. the processing method of linear circuit plate according to claim 6, it is characterised in that first conductive layer includes more
The first pad that individual array is set, second conductive layer include the second pad that multiple arrays are set, first pad with
Second pad is welded by scolding tin and realizes electrical connection.
8. a kind of line source processed using method as claimed in claim 6, including：
Intercouple the first conductive layer, the 3rd conductive layer of setting；
Linear insulating substrate, first conductive layer, the 3rd conductive layer are located at the linear side surface of insulating substrate one；
Second conductive layer, located at linear another side surface of insulating substrate；
On the outside of the second conductive layer edge epi to the first conductive layer edge, first conductive layer is led with described second
Electric layer realizes and electrically connected that first conductive layer sets light-emittingdiode with the 3rd conductive layer place of coupling by scolding tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710687770.1A CN107567206B (en) | 2017-08-11 | 2017-08-11 | Double-side conduction structure processing method, linear circuit board processing method and linear light source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710687770.1A CN107567206B (en) | 2017-08-11 | 2017-08-11 | Double-side conduction structure processing method, linear circuit board processing method and linear light source |
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| Publication Number | Publication Date |
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| CN107567206A true CN107567206A (en) | 2018-01-09 |
| CN107567206B CN107567206B (en) | 2020-11-10 |
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| CN201710687770.1A Active CN107567206B (en) | 2017-08-11 | 2017-08-11 | Double-side conduction structure processing method, linear circuit board processing method and linear light source |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108601210A (en) * | 2018-03-16 | 2018-09-28 | 沈雪芳 | Printed circuit board and preparation method thereof |
| CN110831352A (en) * | 2019-10-10 | 2020-02-21 | 惠州市金百泽电路科技有限公司 | Method for manufacturing thick plate pressing step |
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| US20090020889A1 (en) * | 2007-07-20 | 2009-01-22 | Shinko Electric Industries Co., Ltd. | Semiconductor apparatus and manufacturing method thereof |
| JP2009199107A (en) * | 2008-02-19 | 2009-09-03 | Mitsubishi Electric Corp | Display device with touch panel |
| CN102791083A (en) * | 2011-05-18 | 2012-11-21 | 何忠亮 | Circuit board communication process |
| CN106871078A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated substrates of surface-adhered type RGB LED and its manufacture method |
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| CN1214462C (en) * | 2000-03-15 | 2005-08-10 | 薄膜电子有限公司 | Vertical electrical interconnestions in stack |
| US20090020889A1 (en) * | 2007-07-20 | 2009-01-22 | Shinko Electric Industries Co., Ltd. | Semiconductor apparatus and manufacturing method thereof |
| JP2009199107A (en) * | 2008-02-19 | 2009-09-03 | Mitsubishi Electric Corp | Display device with touch panel |
| CN102791083A (en) * | 2011-05-18 | 2012-11-21 | 何忠亮 | Circuit board communication process |
| CN106871078A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated substrates of surface-adhered type RGB LED and its manufacture method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108601210A (en) * | 2018-03-16 | 2018-09-28 | 沈雪芳 | Printed circuit board and preparation method thereof |
| CN110831352A (en) * | 2019-10-10 | 2020-02-21 | 惠州市金百泽电路科技有限公司 | Method for manufacturing thick plate pressing step |
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| CN107567206B (en) | 2020-11-10 |
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Effective date of registration: 20190816 Address after: 516000 Dongjiang Hi-tech Industrial Park, Zhongkai Hi-tech Zone, Huizhou City, Guangdong Province, No. 3, Xingping West Road Applicant after: Huizhou Over-Frequency Sanquan Intelligent Lighting Technology Co., Ltd. Address before: 334000 Yingxin No. 13, Lingdi Village, Tongbanshan Town, Guangfeng County, Shangrao City, Jiangxi Province Applicant before: Shen Xuefang |
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