CN102779905B - Preparation method of solar cell electrode - Google Patents
Preparation method of solar cell electrode Download PDFInfo
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- CN102779905B CN102779905B CN201210302119.5A CN201210302119A CN102779905B CN 102779905 B CN102779905 B CN 102779905B CN 201210302119 A CN201210302119 A CN 201210302119A CN 102779905 B CN102779905 B CN 102779905B
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Abstract
The invention discloses a preparation method of a solar cell electrode. The method comprises the following steps of: firstly, changing the hydrophilic surface of an antireflection film on a solar cell substrate to a hydrophobic surface; and then forming a groove pattern on the antireflection film on the solar cell substrate, and preparing the solar cell electrode in a groove area by means of photo-induced electroplating, and after the preparation for the electrode is finished, removing the metal deposits generated due to redundant electroplating. Via the method, the preparation cost of the solar cell electrode is decreased, photoelectric conversion efficiency is increased compared with the traditional screen printing technology, and the negative effects of the metal deposits generated due to the redundant electroplating on the efficiency and service life of a solar cell are avoided.
Description
Technical field
The present invention relates to the preparation method of solar cell, be specifically related to a kind of preparation method of electrode of solar battery.
Background technology
Solar energy is the inexhaustible regenerative resources of the mankind. is also clean energy resource, do not produce any environmental pollution.In the middle of effective utilization of solar energy, large sun can solar photovoltaic utilization be research field with fastest developing speed in the last few years, most active, is one of project wherein attracted most attention.For this reason, people Study and Development solar cell.Make solar cell mainly based on semi-conducting material, its operation principle is, after utilizing photoelectric material to absorb luminous energy, opto-electronic conversion reaction occurs.Can not be too wide to the forbidden band of solar cell material General Requirements semi-conducting material, and higher photoelectric conversion efficiency will be had.Therefore silicon is a kind of ideal solar cell material.Current preparation technology's flow process based on the solar cell of silicon substrate comprises: remove damaged layer on surface of silicon slice, making herbs into wool face, form p type layer and n type layer, at front plating SiNx antireflective coating, make positive backplate and sintering formation ohmic contact etc.
The manufacture method of current electrode of solar battery mainly utilizes screen printing technique that silver slurry is printed onto solar cell surface by certain printed patterns.The thick slurry of a kind of mechanical mixture that silver slurry is a kind of particulate by highly purified (99.9%) argent, adhesive, solvent, auxiliary agent form.The advantage using screen printing technique to make electrode of solar battery is that technique is simple, and production capacity is higher.But the electrode live width that the method for silk screen printing silver slurry is produced has its limitation, and relatively wide electrode wires occupies larger solar cell effective area, thus reduces photoelectric conversion efficiency.In addition due to argent particulate cost very
Height, other metals replace silvery and make electrode of solar battery and become inexorable trend prepared by electrode of solar battery.Copper, as a kind of metal of low resistance low cost, has been widely used as electrode material on integrated circuit industry, and its cost is 1/50th of silver electrode.In recent years, copper was successfully applied in the preparation of electrode of solar battery.Because copper is very easy to spread in silicon, thus reduce solar cell photoelectric transformation efficiency, must isolating metal copper and solar cell functional area when making electrode of solar battery.The copper electrode how utilizing simple process to make low cost has become a focus of solar cell research.
Fig. 1 shows a kind of common solar cell preparation flow.As shown in Fig. 1 a, first form layer of sin x antireflective coating 102 at solar cell substrate 101 front surface completing p type layer and the making of n type layer, antireflective coating 102 contacts with n type layer.Form back electrode 105 at the solar cell substrate back side again, normally prepare back aluminium electrode by the method for silk screen printing, as shown in Fig. 1 b, back electrode 105 contacts with p type layer.Then, as shown in Fig. 1 c, channel patterns 103 is formed by removing part SiNx antireflective coating 102 on solar cell substrate surface, and at channel patterns 103 bottom-exposed n type layer.Existing electrode preparation method utilizes silk screen printing to print silver slurry in the trench, and then annealing forms electrode.Because silver slurry cost is higher, electrochemistry plating has progressively been used to replace silk screen printing.Before electrochemistry plating, usually first bottom groove 103, plate one deck inculating crystal layer 104, as shown in Fig. 1 d by methods such as chemical plating, ink spray printing, colloidal sol spray printings.And then solar cell substrate front and at least one auxiliary electrode be immersed in electroplate liquid utilize photoinduction to electroplate (light induced plating) to form metal electrode.The advantage of photoinduction plating not be used in solar cell substrate front to carry out Electrode connection, and Electrode connection, to the back side of solar cell substrate, can simplify electroplating technology (CN101257059B, CN101562217A) greatly.Although form the invention of the technology of electrode of solar battery as far back as the 70's of last century with photoinduction plating
(US4144139, US4251327), but photoinduction plating run into problems in actual applications, one of them be unnecessary plating generation metal deposit seriously reduce solar battery efficiency and the life-span (Industrial LCP selective emitter solar cells with plated contacts, D. Kray, N. Bay, G. Cimiotti, S. Kleinschmidt, N. K terke, A. L el
M. Sailer, A. Tr?er, H. Kühnlein, H. Nussbaumer, C. Fleischmann, F.Granek，Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE）。SiNx antireflective coating is normally prepared into solar cell substrate surface by the method for PECVD.Because reaction temperature is lower, the density of the SiNx film of generation is low and have more hole.SiNx film is formed channel patterns and with traditional mask etching, also can use laser ablation.The pattern line-width that laser ablation is formed is narrower, reduces the area of surface electrode.The method (LDSE) utilizing lf to adulterate can also increase the concentration of n type doping in electrode zone n type layer, improves the efficiency of solar cell.But laser ablation can form more defect and hole in nigh SiNx antireflective coating.Before making inculating crystal layer, with HF cleaning solar energy cell substrate surface, remove the SiO2 layer on n type layer surface.But while removing SiO2, HF also can corrode SiNx antireflective coating, form larger hole (Improved ghost plating of light-induced plating on crystalline silicon, Dongye Sun, Wen-Pei Sung and Ran Chen, Applied Mechanics and Materials, Volumes
71 – 78, Page 2290-2293, 2011）。
Due to strongly hydrophilic (the Investigation of attractive forces between PECVD silicon nitride microstructures and an oxidized silicon substrate of SiNx antireflective coating, P. R. Scheeper, J. A. Voorthuyzen, W. Olthurs and P. Bergveld, Sensors and Actuators A, 30, 231-239, 1992), in photoinduction electroplating process, electrolyte touches the n type layer of lower floor easily via the hole of SiNx antireflective coating, unnecessary plated metal deposit is formed in hole, or by forming unnecessary plated metal deposit with the defect that the p type layer and n type layer of solar cell substrate conducting contact and conduct electricity on antireflective coating surface.The metal deposit that unnecessary plating is formed can cover the absorption of solar cell substrate surface barrier light, lowers efficiency.The metal deposit of unnecessary plating contacts with p type layer and also can cause solar cell short circuit.If in order to reduce costs employing copper electrode, the copper that unnecessary plating produces more easily is diffused in solar cell substrate the efficiency and life-span (Improved LDSE processing for the avoidance of overplating yielding 19.2% efficiency on commercial grade crystalline Si solar cell that reduce solar cell, Eunjoo Lee, Hyunwoo Lee, Junyoung Choi, Dongjun Oh, Jimyung Shim, Kyungyeun Cho, Jisun Kim, Soohong Lee, Brett Hallam, Stuart R. Wenham, Haeseok Lee, Solar Energy Materials and Solar Cells, Volume 95, Issue 12, December 2011, Pages 3592 – 3595).Therefore photoinduction electroplating technology will be used for the preparation of commercialization electrode of solar battery, the metal deposit avoiding and remove unnecessary plating generation is the problem that must solve.
Summary of the invention
The object of the present invention is to provide a kind of preparation method of new electrode of solar battery, first the antireflective coating completing the solar cell substrate that back electrode makes on antireflective coating and p type layer on p type layer, n type layer, n type layer is carried out surface treatment by the method makes antireflective coating surface be hydrophobicity, and etched portions antireflective coating forms channel patterns, form new antireflective coating surface and expose n type layer.Then inculating crystal layer or barrier layer can be made in groove.To be immersed in completing antireflective coating surface-treated solar cell substrate front and at least one auxiliary electrode in electroplate liquid and to apply a voltage between solar cell substrate back electrode and auxiliary electrode again, use a light source irradiation solar cell substrate front simultaneously, utilize photoinduction electric plating method to plate metal electrode in the groove of solar cell substrate front.Photoinduction plating and illumination is stopped to penetrate solar cell substrate after metal electrode completes.Surface treated antireflective coating hydrophobic surface can stop electroplate liquid to enter in the hole of antireflective coating, prevents unnecessary plating to form metal deposit in antireflective coating hole.Finally clean and dry solar cell substrate.
The method utilizes photoinduction electroplating technology to prepare electrode of solar battery, in order to replace traditional silk screen printing and silver slurry, reduce the manufacturing cost of solar cell, and avoid metal deposit that in photoinduction electroplating technology, unnecessary plating produces to solar battery efficiency and the negative effect in life-span.
Accompanying drawing explanation
Fig. 1 is a kind of schematic diagram of conventional solar cell preparation process;
The schematic diagram of the electrode of solar battery preparation process that Fig. 2 provides for the embodiment of the present invention one;
The schematic diagram of the electrode of solar battery substrate that Fig. 3 provides for the embodiment of the present invention one;
The schematic diagram of the electrode of solar battery preparation method that Fig. 4 provides for the embodiment of the present invention one;
The schematic diagram of the electrode of solar battery preparation process that Fig. 5 provides for the embodiment of the present invention three.
Embodiment
Describe the present invention in detail below in conjunction with accompanying drawing and specific embodiment, be used for explaining the present invention in this illustrative examples of the present invention and explanation, but not as a limitation of the invention.
Embodiment one:
The schematic diagram of the preparation method of a kind of electrode of solar battery that Fig. 2 provides for the embodiment of the present invention one.
As shown in Figure 2, the method mainly comprises the following steps ginseng:
Step one: there is the solar cell substrate completing p type layer and the making of n type layer; Its back side has back electrode contact p type layer and its front has SiNx antireflective coating contact n type layer;
Step 2: carry out surface treatment to described SiNx antireflective coating, makes its surface become hydrophobicity by hydrophily, gets rid of part antireflective coating, forms channel patterns, exposes n type layer in channel patterns;
Step 3: make barrier layer and inculating crystal layer in described channel patterns;
Step 4: described solar cell substrate front and at least one auxiliary electrode are immersed in electroplate liquid, and apply voltage between solar cell substrate back electrode and auxiliary electrode;
Step 5: with solar cell substrate front described in a light source irradiation, utilizes photoinduction to electroplate and form metal electrode on described inculating crystal layer;
Step 6: stop described photoinduction electroplate and use up irradiation solar cell substrate;
Step 7: remove the metal deposit that the plating of described antireflective coating excess surface is formed;
Step 8: described solar cell substrate is taken out from electroplate liquid;
Step 9: clean and dry described solar cell substrate.
The present embodiment, as shown in Figure 3 a, when not carrying out surface treatment, described SiNx antireflective coating 102 surface has-OH group, makes its surface have very strong hydrophily.When with plating solution contacts, electroplate liquid can enter in the hole of SiNx film 102 and touch n-layer surface, forms the metal deposit of unnecessary plating in the process that described photoinduction is electroplated.In step 2, described solar cell substrate is immersed the convertible solution of its surface infiltration characteristic, surface treatment is carried out to SiNx antireflective coating 102.This solution is by the compound of convertible surface infiltration characteristic, such as hexamethyldisiloxane (hexamethyldisilazane, HMDS) etc., and at least one fluid carrier, such as at least one solvent, has been pre-mixed before carrying out surface treatment to solar cell substrate surface antireflection film.By the active ingredient in the solution of convertible surface infiltration characteristic, such as hexamethyldisiloxane (hexamethyldisilazane, HMDS), treatment S iNx film 102 surface,-OH the group on SiNx film surface is replaced with-O-Si (CH3) 3 group, SiNx film 102 surface is made to become water-based from hydrophily, as shown in Figure 3 b.Like this when with plating solution contacts, electroplate liquid just cannot enter in the hole of SiNx antireflective coating 102, thus avoids the unnecessary plating in SiNx film 102 hole.Except hexamethyldisiloxane; the compound of other any phase same-action; the surface of SiNx antireflective coating 102 or other materials antireflective coating or diaphragm can be become hydrophobicity from hydrophily; such as dichlorodimethylsilane (dichlorodimethylsilane; DCDMS), trimethoxy vinyl silicon alkane (trimethoxyvinylsilane; TMVS), other containing hydrophilic radical macromolecule etc., all within scope.Described to antireflective coating carry out in surface-treated solution containing hexamethyldisiloxane, dichlorodimethylsilane, trimethoxy vinyl silicon alkane, containing hydrophilic radical macromolecule in a kind of and more than one mixture.Hydrophilic radical refers generally to strong polar functional group, as :-CONH2 ,-OH ,-COOCH3 ,-COOH ,-SO3-.Surface hydrophobic processing procedure is actual is at SiNx surface coverage one deck hydrophobic film, comprises monomolecular adsorbed film and hydrophobic material film.Step 2 comprises necessary technological process, such as, cleaning between processing step and drying.
The present embodiment, as shown in Fig. 4 a, after described antireflective coating 102 surface conversion is hydrophobicity, solar cell substrate front and at least one auxiliary electrode is immersed in electroplate liquid, and applies voltage v1 between solar cell substrate back electrode 105 and auxiliary electrode 201; Irradiate solar cell substrate front with a light source 202 simultaneously, utilize photoinduction to electroplate and form metal electrode 107 on inculating crystal layer 104.Described light source is fixed wave length light source, Wavelength tunable joint light source or natural daylight.The metal electrode material formed is copper, nickel, cobalt, silver, tin, gold to utilize described photoinduction to electroplate, plumbous, a kind of alloy of and more than one metals in zinc.Because antireflective coating 102 surface is hydrophobicity, electroplate liquid cannot enter in the hole of antireflective coating 102 and form unnecessary electroplating sediment.But due to reasons such as defects, unnecessary plating still may form a small amount of metal deposit 106 on antireflective coating 102 surface.After photoinduction has been electroplated, in step 7, utilize the method for described electrochemical corrosion to remove unnecessary plating and form metal deposit 106 on reflectance coating 102 surface.As shown in Fig. 4 b, between described solar cell substrate back electrode 105 and auxiliary electrode 201, apply voltage v3, the metal deposit that p type layer and the conducting of n type layer cause unnecessary plating to produce on antireflective coating 102 surface is etched electrochemically.Such a small amount of metal deposit 106 its volume relative has larger surface area usually, and easily generation current dense aggregate effect in electrolytic corrosion process, galvano-cautery speed is exceedingly fast.But because electrochemical corrosion has corrosiveness equally to the metal electrode 107 that photoinduction plating is formed; when removing unnecessary plating at the metal deposit 106 that antireflective coating 102 surface is formed; needing the metal electrode 107 simultaneously formed photoinduction plating to apply safeguard measure prevents it from corroding, such as, between metal electrode 107 and solar cell substrate back electrode 105, apply voltage v2.After removing the metal deposit 106 of unnecessary plating generation, cleaning is carried out and drying to described solar cell substrate.Antireflective coating 102 surface is transformed into hydrophily when cleaning.
The advantage of the present embodiment makes antireflective coating surface become hydrophobicity from hydrophily by described surface treatment step; avoid producing unnecessary plated metal deposit in SiNx antireflective coating hole; and after described photoinduction has been electroplated; the method of electrochemical corrosion is utilized to remove the unnecessary plated metal deposit on SiNx antireflective coating surface; the metal electrode simultaneously utilizing electrochemical method protection photoinduction electro-plating method to be formed, avoids unnecessary plated metal deposit to reduce solar battery efficiency and life-span.
Embodiment two:
The embodiment of the present invention two provides a kind of preparation method of electrode of solar battery, and the method is mainly wrapped
Draw together following steps:
Step one: there is the solar cell substrate completing p type layer and the making of n type layer; Its back side has back electrode contact p type layer and its front has SiNx antireflective coating contact n type layer;
Step 2: carry out surface treatment to described SiNx antireflective coating, makes its surface become hydrophobicity by hydrophily, gets rid of part antireflective coating, forms channel patterns, and in channel patterns, exposes n type layer;
Step 3: make barrier layer and inculating crystal layer in described channel patterns;
Step 4: solar cell substrate front and at least one auxiliary electrode are immersed in electroplate liquid, and apply voltage between solar cell substrate back electrode and described auxiliary electrode;
Step 5: with solar cell substrate front described in a light source irradiation, utilizes photoinduction to electroplate and form metal electrode on described inculating crystal layer;
Step 6: stop described photoinduction electroplate and use up irradiation solar cell substrate;
Step 7: remove the metal deposit that the plating of described antireflective coating excess surface is formed;
Step 8: described solar cell substrate is taken out from electroplate liquid;
Step 9: clean and dry described solar cell substrate.
The present embodiment, as shown in Fig. 3 a, when not carrying out surface treatment, described SiNx antireflective coating 102 surface has-OH group, makes its surface have very strong hydrophily.When with plating solution contacts, electroplate liquid can enter in the hole of SiNx film 102 and touch n type layer surface, forms the metal deposit of unnecessary plating in the process of photoinduction plating.In step 2, described solar cell substrate is placed in a gas-phase reaction environment, surface treatment is carried out to SiNx antireflective coating 102.Pass through fluid carrier, be generally inert carrier gas, such as nitrogen, such as, by the compound of convertible surface infiltration characteristic, hexamethyldisiloxane (hexamethyldisilazane, HMDS), be transferred to SiNx film 102 surface and carry out surface treatment, replace-OH the group on SiNx film surface with-O-Si (CH3) 3 group, make SiNx film 102 surface become hydrophobicity from hydrophily, as shown in Fig. 3 b.Like this when with plating solution contacts, electroplate liquid just cannot enter in the hole of SiNx antireflective coating 102, thus avoids the unnecessary plating in SiNx film 102 hole.Except hexamethyldisiloxane; the compound of other any phase same-action; the surface of SiNx antireflective coating 102 or other materials antireflective coating or diaphragm is become hydrophobicity from hydrophily; such as dichlorodimethylsilane (dichlorodimethylsilane; DCDMS), trimethoxy vinyl silicon alkane (trimethoxyvinylsilane; TMVS), other containing hydrophilic radical macromolecule etc., all within scope.In described antireflective coating surface treatment gaseous environment containing hexamethyldisiloxane, dichlorodimethylsilane, trimethoxy vinyl silicon alkane, containing hydrophilic radical macromolecule in a kind of and more than one mixture.Hydrophilic radical refers generally to strong polar functional group, as :-CONH2 ,-OH ,-COOCH3 ,-COOH ,-SO3-.Surface hydrophobic processing procedure is actual is at SiNx surface coverage one deck hydrophobic film, comprises monomolecular adsorbed film and hydrophobic material film.Step 2 comprises necessary technological process, such as, cleaning between processing step and drying.
The difference of the present embodiment and embodiment one is, carrying out surface treatment to described antireflective coating in the present embodiment, to make its surface become hydrophobicity from hydrophily be complete in the gas phase.
Embodiment three:
The schematic diagram of the preparation method of a kind of solar cell copper electrode that Fig. 5 provides for the embodiment of the present invention three.As shown in Figure 5, the method mainly comprises the following steps ginseng:
Step one: there is the solar cell substrate completing p type layer and the making of n type layer; Its back side has back electrode contact p type layer and its front has antireflective coating SiNx contact n type layer;
Step 2: carry out surface treatment to described SiNx antireflective coating, makes its surface become hydrophobicity by hydrophily, gets rid of part antireflective coating, forms channel patterns, and in channel patterns, exposes n type layer;
Step 3: make nickel inculating crystal layer in described channel patterns;
Step 4: heat-treat described nickel inculating crystal layer, forms nickel silicide blocking layer;
Step 5: described solar cell substrate front and at least one auxiliary electrode are immersed in copper sulfate baths, and apply voltage between solar cell substrate back electrode and auxiliary electrode;
Step 6: with solar cell substrate front described in a light source irradiation, utilizes photoinduction to electroplate and form metallic copper electrode on described nickel inculating crystal layer;
Step 7: stop described photoinduction electroplate and use up irradiation solar cell substrate;
Step 8: utilize electrochemical corrosion to remove the metallic copper of described antireflective coating excess surface plating formation;
Step 9: described solar cell substrate is taken out from copper sulfate baths;
Step 10: form tin metal passivation layer on the described copper electrode utilizing photoinduction to electroplate formation;
Step 11: clean and dry described solar cell substrate.
The present embodiment, because described SiNx antireflective coating surface has-OH group, makes its surface have very strong hydrophily.When contacting with copper sulfate baths, copper sulfate baths can enter in the hole of SiNx film and touch n type layer surface, forms the copper deposit of unnecessary plating in the process of photoinduction plating.Because copper is very easy to spread in silicon, the metallic copper that unnecessary plating produces can reduce efficiency and the life-span of solar cell greatly.In step 2, the SiNx antireflective coating in described solar cell substrate is carried out surface treatment.By the compound of convertible surface infiltration characteristic, such as hexamethyldisiloxane
(hexamethyldisilazane, HMDS), carries out chemical reaction with SiNx film surface, replaces-OH the group on SiNx film surface with-O-Si (CH3) 3 group, makes SiNx film surface become hydrophobicity from hydrophily.Like this when contacting with copper sulfate baths, copper sulfate baths just cannot enter in the hole of SiNx antireflective coating, thus avoids the metallic copper that in SiNx fenestra hole, unnecessary plating produces.Except hexamethyldisiloxane, the compound of other any phase same-action, becomes hydrophobicity by the surface of SiNx antireflective coating 102 or other materials antireflective coating or diaphragm from hydrophily, such as dichlorodimethylsilane
(dichlorodimethylsilane, DCDMS), trimethoxy vinyl silicon alkane (trimethoxyvinylsilane, TMVS), other containing hydrophilic radical macromolecule etc., all within scope.Hydrophilic radical refers generally to strong polar functional group, as :-CONH2 ,-OH ,-COOCH3 ,-COOH ,-SO3-.Surface hydrophobic processing procedure is actual is at SiNx surface coverage one deck hydrophobic film, comprises monomolecular adsorbed film and hydrophobic material film.Step 2 comprises necessary technological process, such as, cleaning between processing step and drying.
In step 6, with a light source irradiation solar cell substrate surface, utilize described photoinduction to electroplate and form metallic copper electrode on nickel inculating crystal layer.This light source is fixed wave length light source, Wavelength tunable joint light source or natural daylight.After photoinduction has been electroplated, in step 8, utilize the method for described electrochemical corrosion to remove unnecessary plating and form metallic copper on reflectance coating surface.Because electrochemical corrosion has corrosiveness equally to metallic copper electrode; when removing unnecessary plating at reflectance coating surface formation metallic copper; needing the metallic copper electrode formed photoinduction plating to apply safeguard measure prevents it from corroding, such as, at metallic copper electrode and solar energy
Voltage is applied between cell substrate back electrode.After removing unnecessary plating generation metal deposit, cleaning is carried out and drying to solar cell substrate.Antireflective coating surface is transformed into hydrophily when cleaning.
Present embodiments provide a kind of processing step of photoinduction electro-coppering electrode in solar cell substrate.Heat treatment step after described making nickel inculating crystal layer forms nickel silicide blocking layer, prevents copper electrode to solar cell substrate diffusion inside, and therefore this step is also the preparation process on the barrier layer to copper diffusion.Nickel inculating crystal layer can be prepared by multiple method, comprises chemical plating, and plating and photoinduction are electroplated.The surface treatment of described antireflective coating prevents copper sulfate baths from entering the metallic copper of antireflective coating cavity and the plating of photoinduction plating rear electrochemical corrosion removal excess surface, the light transmittance that the copper avoiding unnecessary plating causes
The copper of decline and unnecessary plating is diffused into the problem that solar battery efficiency and service life reduction are caused in solar cell substrate inside.Form nickel silicide blocking layer at copper electrode and n type interlayer, then the copper avoiding electrode is diffused into the problem that solar battery efficiency and service life reduction are caused in solar cell substrate inside, and reduces the ohmic contact resistance of copper electrode and n type interlayer simultaneously.Described metallic tin passivation layer also can by chemical plating, prepared by plating and photoinduction electric plating method.Tin passivation layer not only has protective effect to copper electrode, is also convenient to connect outer lead simultaneously.
Certainly, the method that electrochemistry described in above-described embodiment prepares copper electrode also can be used for preparing the electrode of other material, as nickel, cobalt, silver, tin, gold, plumbous, a kind of alloy of and more than one metals in zinc.But copper electrode replaces the manufacturing cost that silver electrode greatly can reduce solar cell.
It should be noted that, the present invention is not only applicable to all kinds of crystal silicon solar batteries, and other kind solar cells also can make electrode of solar battery by method of the present invention.
The scheme provided the embodiment of the present invention has above carried out detailed explanation, applies specific case and set forth principle of the present invention and execution mode in the present invention, and above embodiment illustrates and is only applicable to the principle helping to understand the embodiment of the present invention.For one of ordinary skill in the art, according to the embodiment of the present invention, all can change to some extent in specific embodiments and applications, do not departing from the basis of present inventive concept, this description should not be construed as limitation of the present invention.
Claims (9)
1. a preparation method for electrode of solar battery, is characterized in that, comprising:
There is the solar cell substrate completing p-type layer and n-layer making; Its back side has back electrode contact p-type layer and its front has antireflective coating contact n-layer, and described antireflective coating is SiNx material;
In gaseous environment, surface treatment is carried out to the antireflective coating in described solar cell substrate, make its surface become hydrophobicity;
Remove part described antireflective coating, form channel patterns in described solar cell substrate front, and in channel patterns exposing n-type layer;
By described solar cell substrate front and at least one auxiliary electrode simultaneously and plating solution contacts, and apply a voltage between solar cell substrate back electrode and auxiliary electrode, start with a light source irradiation solar cell substrate front;
Utilize photoinduction to electroplate deposit metal electrodes on the channel patterns region in described solar cell substrate front, wherein, the hydrophobic surface of antireflective coating stops electroplate liquid to enter in the hole of antireflective coating and contacts the n-layer surface that antireflective coating covers;
Described photoinduction plating and illumination is stopped to penetrate solar cell substrate;
Clean and dry described solar cell substrate.
2. the preparation method of electrode of solar battery according to claim 1, it is characterized in that, after described solar cell substrate front forms channel patterns, plated metal inculating crystal layer in the channel patterns that solar cell substrate front is formed also carries out heat treatment step, forms metal silicide layer.
3. the preparation method of electrode of solar battery according to claim 1, it is characterized in that, in antireflective coating surface treatment step in described solar cell substrate, described solar cell substrate is exposed to containing can antireflective coating surface is transformed in the environment of the compound of hydrophobicity by hydrophily, described compound comprise hexamethyldisiloxane, dichlorodimethylsilane, trimethoxy vinyl silicon alkane, not containing a kind of and more than one the mixture in the macromolecule of hydrophilic radical.
4. the preparation method of electrode of solar battery according to claim 3, it is characterized in that, the compound that described antireflective coating surface is transformed into hydrophobicity by hydrophily before entering the antireflective coating surface treatment environment in solar cell substrate with carrier fluid premixed.
5. the preparation method of electrode of solar battery according to claim 1, is characterized in that, during with a light source irradiation solar cell substrate front, described light source comprises the optics of fixed wave length, the optics of Wavelength tunable joint and natural daylight.
6. the preparation method of electrode of solar battery according to claim 1, it is characterized in that, in described photoinduction plating on the channel patterns region in solar cell substrate front after deposit metal electrodes, the metal deposit utilizing the method for electrochemical corrosion to remove unnecessary plating to be formed on the surface at antireflective coating.
7. the preparation method of electrode of solar battery according to claim 6; it is characterized in that, while removing utilizing the method for described electrochemical corrosion the metal deposit that unnecessary plating formed on the surface at antireflective coating, electrochemical protection being implemented to the metal electrode deposited with photoinduction electro-plating method.
8. the preparation method of electrode of solar battery according to claim 1, is characterized in that, the metal electrode material utilizing described photoinduction electrodeposition is copper, a kind of alloy of and more than one metals in nickel, cobalt, silver, tin, gold, lead, zinc.
9. the preparation method of electrode of solar battery according to claim 1, is characterized in that, when cleaning described solar cell substrate surface, antireflective coating surface conversion is hydrophily.
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| CN103367468A (en) * | 2012-03-29 | 2013-10-23 | 无锡尚德太阳能电力有限公司 | Solar cell, module and method for manufacturing solar cell electrode |
| CN103726088B (en) * | 2013-12-25 | 2017-07-28 | 国电新能源技术研究院 | A kind of improved crystal silicon solar batteries copper electro-plating method |
| CN104022188B (en) * | 2014-06-19 | 2016-05-11 | 常州天合光能有限公司 | Solar battery local doping method |
| CN106653935B (en) * | 2015-11-02 | 2019-02-19 | 钧石(中国)能源有限公司 | A kind of guard method preparing tin layers in solar battery metal grid lines |
| CN115084312B (en) * | 2022-03-11 | 2024-07-02 | 广东爱旭科技有限公司 | Solar cell manufacturing method, solar cell module and power generation system |
| CN114703468A (en) * | 2022-03-21 | 2022-07-05 | 晶澳（扬州）太阳能科技有限公司 | Method for plating nickel layer on silicon substrate and preparation method of solar cell nickel electrode |
| CN116344683B (en) * | 2023-02-20 | 2024-07-23 | 通威太阳能（成都）有限公司 | Solar cell and preparation method thereof |
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| US6303500B1 (en) * | 1999-02-24 | 2001-10-16 | Micron Technology, Inc. | Method and apparatus for electroless plating a contact pad |
| CN102171804A (en) * | 2008-11-25 | 2011-08-31 | 英特尔公司 | Method of enabling selective area plating on a substrate |
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