CN102779905A - Preparation method of solar cell electrode - Google Patents
Preparation method of solar cell electrode Download PDFInfo
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- CN102779905A CN102779905A CN2012103021195A CN201210302119A CN102779905A CN 102779905 A CN102779905 A CN 102779905A CN 2012103021195 A CN2012103021195 A CN 2012103021195A CN 201210302119 A CN201210302119 A CN 201210302119A CN 102779905 A CN102779905 A CN 102779905A
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Abstract
The invention discloses a preparation method of a solar cell electrode. The method comprises the following steps of: firstly, changing the hydrophilic surface of an antireflection film on a solar cell substrate to a hydrophobic surface; and then forming a groove pattern on the antireflection film on the solar cell substrate, and preparing the solar cell electrode in a groove area by means of photo-induced electroplating, and after the preparation for the electrode is finished, removing the metal deposits generated due to redundant electroplating. Via the method, the preparation cost of the solar cell electrode is decreased, photoelectric conversion efficiency is increased compared with the traditional screen printing technology, and the negative effects of the metal deposits generated due to the redundant electroplating on the efficiency and service life of a solar cell are avoided.
Description
Technical field
The present invention relates to the preparation method of solar cell, be specifically related to a kind of preparation method of electrode of solar battery.
Background technology
Solar energy is human inexhaustible regenerative resource. also is clean energy resource, do not produce any environmental pollution.In the middle of effective utilization of solar energy, big sun can solar photovoltaic utilization be a research field with fastest developing speed in the last few years, most active, is one of project that wherein attracts most attention.For this reason, people develop and have developed solar cell.Manufacturing solar cells mainly is to be the basis with the semi-conducting material, and its operation principle is after utilizing photoelectric material to absorb luminous energy the opto-electronic conversion reaction to take place.Generally require the forbidden band of semi-conducting material can not be too wide to solar cell material, and higher photoelectric conversion efficiency will be arranged.Therefore silicon is a kind of very desirable solar cell material.At present the preparation technology's flow process based on the solar cell of silicon substrate comprises: remove silicon chip surface affected layer, making herbs into wool face, form p type layer and n type layer, in the front plating SiNx antireflective coating, make positive backplate and sintering forms ohmic contact etc.
The manufacture method of electrode of solar battery mainly is to utilize screen printing technique that the silver slurry is printed onto solar cell surface by certain printed patterns at present.Silver slurry is the thick slurry of a kind of mechanical mixture of forming of a kind of particulate by highly purified (99.9%) argent, adhesive, solvent, auxiliary agent.Using the advantage of screen printing technique manufacturing solar cells electrode is that technology is simple, and production capacity is higher.But the electrode live width that the method for silk screen printing silver slurry is produced has its limitation, and wide relatively electrode wires occupies bigger solar cell effective area, thereby reduces photoelectric conversion efficiency.In addition since the cost of argent particulate very
Height, other metals replace silvery and make the inexorable trend that electrode of solar battery has become the electrode of solar battery preparation.Copper has been applied as electrode material widely as a kind of low resistance metal cheaply on integrated circuit industry, its cost is 1/50th of a silver electrode.In recent years, copper was by in the preparation that is applied to electrode of solar battery of success.Because copper is very easy in silicon, spread, thereby reduce the solar cell photoelectric transformation efficiency, must isolating metal copper and solar cell functional area when the manufacturing solar cells electrode.Copper electrode has become the focus that solar cell is studied how to utilize simple process to make cheaply.
Fig. 1 has shown a kind of common solar cell preparation flow.Shown in Fig. 1 a, at first accomplish the solar cell substrate 101 front surfaces formation layer of sin x antireflective coating 102 that p type layer and n type layer are made, antireflective coating 102 contacts with n type layer.Form back electrode 105 again at the solar cell substrate back side, normally the method with silk screen printing prepares back side aluminium electrode, and shown in Fig. 1 b, back electrode 105 contacts with p type layer.Shown in Fig. 1 c, form channel patterns 103 on the solar cell substrate surface then through removing part Si Nx antireflective coating 102, and at channel patterns 103 bottom-exposed n type layers.Existing electrode preparation method is to utilize silk screen printing printed silver slurry in groove, and annealing forms electrode then.Because silver slurry cost is higher, the electrochemistry plating progressively has been used to replace silk screen printing.Before the electrochemistry plating, plate one deck inculating crystal layer 104 in groove 103 bottoms through methods such as chemical plating, ink spray printing, colloidal sol spray printings earlier usually, shown in Fig. 1 d.And then utilize photoinduction to electroplate (light induced plating) formation metal electrode in the electroplate liquid positive being immersed in of solar cell substrate with at least one auxiliary electrode.The advantage that photoinduction is electroplated is to not be used in the solar cell substrate front to carry out electrode and connect, and electrode is connected to the back side of solar cell substrate, can simplify greatly electroplating technology (CN101257059B, CN101562217A).Although the invention of technology that electroplate to form electrode of solar battery with photoinduction is as far back as the 70's of last century
(US4144139, US4251327), but the photoinduction plating runs into problems in practical application; One of them be unnecessary plating produce metal deposit seriously reduce solar battery efficiency and the life-span (Industrial LCP selective emitter solar cells with plated contacts, D. Kray, N. Bay; G. Cimiotti, S. Kleinschmidt, N. K terke; A. L el
M.?Sailer,?A.?Tr?er,?H.?Kühnlein,?H.?Nussbaumer,?C.?Fleischmann,?F.Granek，Photovoltaic?Specialists?Conference?(PVSC),?2010?35th?IEEE）。The SiNx antireflective coating normally is prepared into the solar cell substrate surface with the method for PECVD.Because reaction temperature is lower, the density of the SiNx film of generation is low and have a more hole.On the SiNx film, form channel patterns and can use traditional mask etching, also can use laser ablation.The pattern line-width that laser ablation forms is narrower, has reduced the area of surface electrode.The method (LDSE) of utilizing lf to mix can also increase the concentration that the n type mixes in the electrode zone n type layer, improves the efficient of solar cell.Yet laser ablation can form more defects and hole in the nigh SiNx antireflective coating.Before making inculating crystal layer,, remove the SiO2 layer of n type laminar surface with HF cleaning solar energy cell substrate surface.But when removing SiO2; HF also can corrode the SiNx antireflective coating; Form bigger hole (Improved ghost plating of light-induced plating on crystalline silicon, Dongye Sun, Wen-Pei Sung and Ran Chen; Applied Mechanics and Materials, Volumes
71?–?78,?Page?2290-2293,?2011）。
Because strongly hydrophilic (the Investigation of attractive forces between PECVD silicon nitride microstructures and an oxidized silicon substrate of SiNx antireflective coating; P. R. Scheeper; J. A. Voorthuyzen, W. Olthurs and P. Bergveld, Sensors and Actuators A; 30; 231-239,1992), electrolyte is easy to touch through the hole of SiNx antireflective coating the n type layer of lower floor in the photoinduction electroplating process; In hole, form unnecessary plated metal deposit, the defective of perhaps conducting electricity through contacting with the p type layer of solar cell substrate conducting and n type layer is at the unnecessary plated metal deposit of antireflective coating surface formation.The metal deposit that unnecessary plating forms can cover the absorption of solar cell substrate surface barrier light, lowers efficiency.Unnecessary electroplated metal deposit contacts also with p type layer can cause the solar cell short circuit.If for the employing copper electrode that reduces cost, the copper that unnecessary plating produces be diffused into more easily the efficient that reduces solar cell in the solar cell substrate and the life-span (Improved LDSE processing for the avoidance of overplating yielding 19.2% efficiency on commercial grade crystalline Si solar cell, Eunjoo Lee; Hyunwoo Lee, Junyoung Choi, Dongjun Oh; Jimyung Shim, Kyungyeun Cho, Jisun Kim; Soohong Lee, Brett Hallam, Stuart R. Wenham; Haeseok Lee, Solar Energy Materials and Solar Cells, Volume 95; Issue 12, and December 2011, Pages 3592 – 3595).Therefore will the photoinduction electroplating technology be used for the preparation of commercialization electrode of solar battery, the metal deposit of avoiding and remove unnecessary plating generation is the problem that must solve.
Summary of the invention
The object of the present invention is to provide a kind of preparation method of new electrode of solar battery; This method at first will accomplish antireflective coating on p type layer, n type layer, the n type layer, and p type layer on the antireflective coating of the back electrode solar cell substrate of making carry out surface treatment and make the antireflective coating surface be hydrophobicity; And etched portions antireflective coating formation channel patterns, form new antireflective coating surface and expose n type layer.Can in groove, make inculating crystal layer or barrier layer then.To accomplish the positive and at least one auxiliary electrode of antireflective coating surface-treated solar cell substrate more is immersed in the electroplate liquid and between solar cell substrate back electrode and auxiliary electrode, applies a voltage; Use a light source irradiation solar cell substrate positive simultaneously, utilize photoinduction electric plating method metal plated electrode in the groove of solar cell substrate front.After completing, metal electrode stops photoinduction plating and rayed solar cell substrate.Surface treated antireflective coating hydrophobic surface can stop electroplate liquid to get in the hole of antireflective coating, has prevented that unnecessary plating from forming metal deposit in the antireflective coating hole.Clean at last and dry solar cell substrate.
This method utilizes the photoinduction electroplating technology to prepare electrode of solar battery; In order to replace traditional silk screen printing and silver slurry; Reduce the manufacturing cost of solar cell, and avoided of the negative effect of the metal deposit of unnecessary plating generation in the photoinduction electroplating technology solar battery efficiency and life-span.
Description of drawings
Fig. 1 is a kind of sketch map of solar cell preparation process commonly used;
The sketch map of the electrode of solar battery preparation process that Fig. 2 is provided for the embodiment of the invention one;
The sketch map of the electrode of solar battery substrate that Fig. 3 is provided for the embodiment of the invention one;
The electrode of solar battery preparation method's that Fig. 4 is provided for the embodiment of the invention one sketch map;
The sketch map of the electrode of solar battery preparation process that Fig. 5 is provided for the embodiment of the invention three.
Embodiment
To combine accompanying drawing and specific embodiment to specify the present invention below, be used for explaining the present invention in this illustrative examples of the present invention and explanation, but not as to qualification of the present invention.
Embodiment one:
The preparation method's of a kind of electrode of solar battery that Fig. 2 provides for the embodiment of the invention one sketch map.
Shown in Fig. 2, this method mainly may further comprise the steps:
Step 1: have the solar cell substrate of accomplishing p type layer and the making of n type layer; Its back side has back electrode contact p type layer and its front has SiNx antireflective coating contact n type layer;
Step 2: said SiNx antireflective coating is carried out surface treatment, make its surface become hydrophobicity, get rid of the part antireflective coating, form channel patterns, in channel patterns, expose n type layer by hydrophily;
Step 3: in said channel patterns, make barrier layer and inculating crystal layer;
Step 4: said solar cell substrate front and at least one auxiliary electrode are immersed in the electroplate liquid, and between solar cell substrate back electrode and auxiliary electrode, apply voltage;
Step 5: positive with the said solar cell substrate of a light source irradiation, utilize photoinduction to electroplate and on said inculating crystal layer, form metal electrode;
Step 6: stop said photoinduction and electroplate and use the rayed solar cell substrate;
Step 7: remove the metal deposit that the unnecessary plating in said antireflective coating surface forms;
Step 8: said solar cell substrate is taken out from electroplate liquid;
Step 9: clean and dry said solar cell substrate.
Present embodiment, shown in Fig. 3 a, when not carrying out surface treatment, said SiNx antireflective coating 102 surfaces have-the OH group, make its surface have very strong hydrophily.When contacting with electroplate liquid, electroplate liquid can get in the hole of SiNx film 102 and touch n type laminar surface, in the process that said photoinduction is electroplated, forms unnecessary electroplated metal deposit.In step 2, said solar cell substrate is immersed the convertible solution of its surface infiltration characteristic, SiNx antireflective coating 102 is carried out surface treatment.This solution is by the compound of convertible surface infiltration characteristic; For example HMDS (hexamethyldisilazane, HMDS) etc. and at least a fluid carrier; For example at least a solvent is carrying out being pre-mixed completion before the surface treatment to the solar cell substrate surface antireflection film.Through the active ingredient in the solution of convertible surface infiltration characteristic; HMDS (hexamethyldisilazane for example; HMDS), treatment S iNx film 102 surfaces, usefulness-O-Si (CH3) 3 groups replacement SiNx film surface-the OH group; Make SiNx film 102 surfaces become water-based, shown in Fig. 3 b by hydrophily.When contacting with electroplate liquid, electroplate liquid just can't get in the hole of SiNx antireflective coating 102 like this, thereby has avoided the unnecessary plating in SiNx film 102 holes.Except that HMDS; The compound of other any same function; Can the surface of SiNx antireflective coating 102 or other materials antireflective coating or diaphragm be become hydrophobicity by hydrophily, for example dichlorodimethylsilane (dichlorodimethylsilane, DCDMS), trimethoxy vinyl silicon alkane (trimethoxyvinylsilane; TMVS), other do not contain hydrophilic radical macromolecule etc., all within protection range of the present invention.Said to antireflective coating carry out containing HMDS, dichlorodimethylsilane, trimethoxy vinyl silicon alkane in the surface-treated solution, do not contain hydrophilic radical macromolecule in a kind of and more than one mixture.Hydrophilic radical refers generally to strong polar functional group, as :-CONH2 ,-OH ,-COOCH3 ,-COOH ,-SO3-.Surface hydrophobic processing procedure is actual to be at SiNx surface coverage one deck hydrophobic film, comprises that monomolecular adsorbed film and hydrophobic material film.Step 2 comprises necessary technological process, for example cleaning between processing step and drying.
Present embodiment; Shown in Fig. 4 a; After said antireflective coating 102 surface conversion are hydrophobicity, solar cell substrate front and at least one auxiliary electrode are immersed in the electroplate liquid, and between solar cell substrate back electrode 105 and auxiliary electrode 201, apply voltage v1; Positive with a light source 202 irradiation solar cell substrate simultaneously, utilize photoinduction to electroplate and on inculating crystal layer 104, form metal electrode 107.Said light source is fixed wave length light source, wavelength-tunable joint light source or natural daylight.Utilize said photoinduction to electroplate the metal electrode material that forms and be copper, nickel, cobalt, silver, tin, gold, lead, a kind of alloy of and more than one metals in the zinc.Because antireflective coating 102 surfaces are hydrophobicity, electroplate liquid can't get into the unnecessary electroplating sediment of formation in the hole of antireflective coating 102.But owing to reasons such as defectives, unnecessary plating still possibly form little metal deposit 106 on antireflective coating 102 surfaces.After photoinduction is electroplated and accomplished, in step 7, utilize the method for said electrochemical corrosion to remove unnecessary plating at reflectance coating 102 surface formation metal deposits 106.Shown in Fig. 4 b, between said solar cell substrate back electrode 105 and auxiliary electrode 201, apply voltage v3, p type layer and the conducting of n type layer cause unnecessary plating to be etched electrochemically at the metal deposit that antireflective coating 102 surfaces produce.Such little metal deposit 106 relative its volumes have bigger surface area usually, in the electrolytic corrosion process, produce the current density building-up effect easily, and galvano-cautery speed is exceedingly fast.But, electrochemical corrosion has corrosiveness equally because electroplating the metal electrode 107 that forms to photoinduction; When removing unnecessary plating at the metal deposit 106 that antireflective coating 102 surfaces form; The metal electrode 107 that need form the photoinduction plating simultaneously applies safeguard measure and prevents its corrosion, for example between metal electrode 107 and solar cell substrate back electrode 105, applies voltage v2.After removing the metal deposit 106 of unnecessary plating generation, said solar cell substrate is cleaned and drying.Antireflective coating 102 surfaces are transformed into hydrophily when cleaning.
The advantage of present embodiment is to make the antireflective coating surface become hydrophobicity by hydrophily through said surface treatment step; Avoid in SiNx antireflective coating hole, producing unnecessary plated metal deposit; And after completion is electroplated in said photoinduction; Utilize the method for electrochemical corrosion to remove the unnecessary plated metal deposit on SiNx antireflective coating surface; Utilize the electrochemical method protection with the metal electrode that the photoinduction electro-plating method forms simultaneously, avoid unnecessary plated metal deposit to reduce solar battery efficiency and life-span.
Embodiment two:
The embodiment of the invention two provides a kind of preparation method of electrode of solar battery, and this method is mainly wrapped
Draw together following steps:
Step 1: have the solar cell substrate of accomplishing p type layer and the making of n type layer; Its back side has back electrode contact p type layer and its front has SiNx antireflective coating contact n type layer;
Step 2: said SiNx antireflective coating is carried out surface treatment, make its surface become hydrophobicity, get rid of the part antireflective coating, form channel patterns, and in channel patterns, expose n type layer by hydrophily;
Step 3: in said channel patterns, make barrier layer and inculating crystal layer;
Step 4: solar cell substrate front and at least one auxiliary electrode are immersed in the electroplate liquid, and between solar cell substrate back electrode and said auxiliary electrode, apply voltage;
Step 5: positive with the said solar cell substrate of a light source irradiation, utilize photoinduction to electroplate and on said inculating crystal layer, form metal electrode;
Step 6: stop said photoinduction and electroplate and use the rayed solar cell substrate;
Step 7: remove the metal deposit that the unnecessary plating in said antireflective coating surface forms;
Step 8: said solar cell substrate is taken out from electroplate liquid;
Step 9: clean and dry said solar cell substrate.
Present embodiment, shown in Fig. 3 a, when not carrying out surface treatment, said SiNx antireflective coating 102 surfaces have-the OH group, make its surface have very strong hydrophily.When contacting with electroplate liquid, electroplate liquid can get in the hole of SiNx film 102 and touch n type laminar surface, in the process that photoinduction is electroplated, forms unnecessary electroplated metal deposit.In step 2, said solar cell substrate is placed a gas-phase reaction environment, SiNx antireflective coating 102 is carried out surface treatment.Through fluid carrier, be generally inert carrier gas, for example nitrogen; With the compound of convertible surface infiltration characteristic, for example HMDS (hexamethyldisilazane, HMDS); Be transferred to SiNx film 102 surfaces and carry out surface treatment; Usefulness-O-Si (CH3) 3 groups replace SiNx film surface-OH group, make SiNx film 102 surfaces become hydrophobicity by hydrophily, shown in Fig. 3 b.When contacting with electroplate liquid, electroplate liquid just can't get in the hole of SiNx antireflective coating 102 like this, thereby has avoided the unnecessary plating in SiNx film 102 holes.Except that HMDS; The compound of other any same function becomes hydrophobicity with the surface of SiNx antireflective coating 102 or other materials antireflective coating or diaphragm by hydrophily, for example dichlorodimethylsilane (dichlorodimethylsilane; DCDMS), trimethoxy vinyl silicon alkane (trimethoxyvinylsilane; TMVS), other do not contain hydrophilic radical macromolecule etc., all within protection range of the present invention.Contain HMDS, dichlorodimethylsilane, trimethoxy vinyl silicon alkane in the said antireflective coating surface treatment gaseous environment, do not contain hydrophilic radical macromolecule in a kind of and more than one mixture.Hydrophilic radical refers generally to strong polar functional group, as :-CONH2 ,-OH ,-COOCH3 ,-COOH ,-SO3-.Surface hydrophobic processing procedure is actual to be at SiNx surface coverage one deck hydrophobic film, comprises that monomolecular adsorbed film and hydrophobic material film.Step 2 comprises necessary technological process, for example cleaning between processing step and drying.
The difference of present embodiment and embodiment one is, in the present embodiment said antireflective coating being carried out surface treatment, to make its surface become hydrophobicity by hydrophily be in gas phase, to accomplish.
Embodiment three:
The preparation method's of a kind of solar cell copper electrode that Fig. 5 provides for the embodiment of the invention three sketch map.Shown in Fig. 5, this method mainly may further comprise the steps:
Step 1: have the solar cell substrate of accomplishing p type layer and the making of n type layer; Its back side has back electrode contact p type layer and its front has antireflective coating SiNx contact n type layer;
Step 2: said SiNx antireflective coating is carried out surface treatment, make its surface become hydrophobicity, get rid of the part antireflective coating, form channel patterns, and in channel patterns, expose n type layer by hydrophily;
Step 3: in said channel patterns, make the nickel inculating crystal layer;
Step 4: said nickel inculating crystal layer is heat-treated, form the nickel silicide barrier layer;
Step 5: said solar cell substrate front and at least one auxiliary electrode are immersed in the copper sulphate electroplate liquid, and between solar cell substrate back electrode and auxiliary electrode, apply voltage;
Step 6: positive with the said solar cell substrate of a light source irradiation, utilize photoinduction to electroplate and on said nickel inculating crystal layer, form the metallic copper electrode;
Step 7: stop said photoinduction and electroplate and use the rayed solar cell substrate;
Step 8: utilize electrochemical corrosion to remove the metallic copper that the unnecessary plating in said antireflective coating surface forms;
Step 9: said solar cell substrate is taken out from the copper sulphate electroplate liquid;
Step 10: on the said copper electrode that utilizes photoinduction to electroplate and form, form the tin metal passivation layer;
Step 11: clean and dry said solar cell substrate.
Present embodiment because said SiNx antireflective coating surface has-the OH group, makes its surface have very strong hydrophily.When contacting with the copper sulphate electroplate liquid, the copper sulphate electroplate liquid can get in the hole of SiNx film and touch n type laminar surface, in the process that photoinduction is electroplated, forms the copper deposit of unnecessary plating.Because copper is very easy in silicon, spread, efficient and life-span that the metallic copper that unnecessary plating produces can reduce solar cell greatly.In step 2, the SiNx antireflective coating on the said solar cell substrate is carried out surface treatment.Through the compound of convertible surface infiltration characteristic, for example HMDS
(hexamethyldisilazane HMDS), carries out chemical reaction with SiNx film surface, usefulness-O-Si (CH3) 3 groups replacement SiNx film surface-the OH group, make SiNx film surface become hydrophobicity by hydrophily.When contacting with the copper sulphate electroplate liquid, the copper sulphate electroplate liquid just can't get in the hole of SiNx antireflective coating like this, thereby has avoided the metallic copper that unnecessary plating produces in the SiNx fenestra hole.Except that HMDS, the compound of other any same function becomes hydrophobicity with the surface of SiNx antireflective coating 102 or other materials antireflective coating or diaphragm by hydrophily, for example dichlorodimethylsilane
(dichlorodimethylsilane, DCDMS), trimethoxy vinyl silicon alkane (trimethoxyvinylsilane, TMVS), other do not contain hydrophilic radical macromolecule etc., all within protection range of the present invention.Hydrophilic radical refers generally to strong polar functional group, as :-CONH2 ,-OH ,-COOCH3 ,-COOH ,-SO3-.Surface hydrophobic processing procedure is actual to be at SiNx surface coverage one deck hydrophobic film, comprises that monomolecular adsorbed film and hydrophobic material film.Step 2 comprises necessary technological process, for example cleaning between processing step and drying.
In step 6,, utilize said photoinduction to electroplate and on the nickel inculating crystal layer, form the metallic copper electrode with light source irradiation solar cell substrate surface.This light source is fixed wave length light source, wavelength-tunable joint light source or natural daylight.After photoinduction is electroplated and accomplished, in step 8, utilize the method for said electrochemical corrosion to remove unnecessary plating at reflectance coating surface formation metallic copper.Because electrochemical corrosion has corrosiveness equally to the metallic copper electrode; When removing unnecessary plating at reflectance coating surface formation metallic copper; Need apply safeguard measure to the metallic copper electrode that the photoinduction plating forms and prevent its corrosion, for example at metallic copper electrode and solar energy
Apply voltage between the cell substrate back electrode.After removing unnecessary plating generation metal deposit, solar cell substrate is cleaned and drying.The antireflective coating surface is transformed into hydrophily when cleaning.
Present embodiment provide a kind of on solar cell substrate the processing step of photoinduction electro-coppering electrode.Heat treatment step behind the said making nickel inculating crystal layer forms the nickel silicide barrier layer, has stoped copper electrode to the solar cell substrate diffusion inside, so this step also is the preparation process to the barrier layer of copper diffusion.The nickel inculating crystal layer can comprise chemical plating through the several different methods preparation, electroplates with photoinduction and electroplates.The surface treatment of said antireflective coating prevents that the copper sulphate electroplate liquid from getting into the antireflective coating cavity and electroplating electrochemical corrosion afterwards with photoinduction and remove surperficial unnecessary electroplated metal copper, the light transmittance of having avoided the copper of unnecessary plating to cause
The copper of decline and unnecessary plating is diffused into the problem that solar battery efficiency and life-span reduction are caused in solar cell substrate inside.Form the nickel silicide barrier layer at copper electrode and n type interlayer, then avoided the copper of electrode to be diffused into the problem that solar battery efficiency and life-span reduction are caused in solar cell substrate inside, and reduced the ohmic contact resistance of copper electrode and n type interlayer simultaneously.Said metallic tin passivation layer also can be electroplated and the preparation of photoinduction electric plating method by chemical plating.The tin passivation layer not only has protective effect to copper electrode, also is convenient to connect simultaneously outer lead.
Certainly, the method for the copper electrode of electrochemical preparation described in the foregoing description also can be used for preparing the electrode of other material, like nickel, cobalt, silver, tin, gold, and lead, a kind of alloy of and more than one metals in the zinc.Yet copper electrode replaces the manufacturing cost that silver electrode can greatly reduce solar cell.
Need to prove that the present invention is not only applicable to all kinds of crystal silicon solar batteries, other kind solar cells also can be used method manufacturing solar cells electrode of the present invention.
More than the scheme that the embodiment of the invention provided has been carried out illustrated in detail, used concrete example among the present invention principle of the present invention and execution mode set forth, above embodiment explanation only is applicable to that help understands the principle of the embodiment of the invention.For one of ordinary skill in the art, according to the embodiment of the invention, on embodiment and range of application, all can change to some extent, on the basis of not departing from aim of the present invention, this description should not be construed as limitation of the present invention.
Claims (10)
1. the preparation method of an electrode of solar battery is characterized in that, comprising: have the solar cell substrate of accomplishing p type layer and the making of n type layer; Its back side has back electrode contact p type layer and its front has antireflective coating contact n type layer;
Antireflective coating on the said solar cell substrate is carried out surface treatment, make its surface become hydrophobicity;
Remove the said antireflective coating of part,, and in channel patterns, expose n type layer at the positive formation of said solar cell substrate channel patterns;
Said solar cell substrate front is contacted with electroplate liquid with at least one auxiliary electrode simultaneously, and between solar cell substrate back electrode and auxiliary electrode, apply a voltage, begin with a light source irradiation solar cell substrate positive;
Utilize photoinduction to electroplate deposit metal electrodes on the channel patterns zone in said solar cell substrate front;
Stop said photoinduction plating and rayed solar cell substrate;
Clean and dry said solar cell substrate.
2. according to the preparation method of the described electrode of solar battery of claim 1; It is characterized in that; Behind the positive formation of said solar cell substrate channel patterns; Plated metal inculating crystal layer and carry out heat treatment step in the positive channel patterns that forms of solar cell substrate forms metal silicide layer.
3. according to the preparation method of the described electrode of solar battery of claim 1; It is characterized in that; In the antireflective coating surface treatment step on said solar cell substrate said solar cell substrate is exposed to and contains and can the antireflective coating surface be transformed into by hydrophily in the environment of compound of hydrophobicity, said compound comprises HMDS, dichlorodimethylsilane, trimethoxy vinyl silicon alkane, do not contain hydrophilic radical macromolecule in a kind of and more than one mixture.
4. according to the preparation method of the described electrode of solar battery of claim 3; It is characterized in that, before the antireflective coating surface treatment environment of the compound that said antireflective coating surface is transformed into hydrophobicity by hydrophily on getting into solar cell substrate with the carrier fluid premixed.
5. according to the preparation method of the described electrode of solar battery of claim 1, it is characterized in that the hydrophobic surface of said antireflective coating stops electroplate liquid to get in the hole of antireflective coating.
6. according to the preparation method of the described electrode of solar battery of claim 1, it is characterized in that during with light source irradiation solar cell substrate front, said light source comprises the optics of fixed wave length, the optics and the natural daylight of wavelength-tunable joint.
7. according to the preparation method of the described electrode of solar battery of claim 1; It is characterized in that; Electroplate after deposit metal electrodes on the channel patterns zone in solar cell substrate front in said photoinduction, utilize the method for electrochemical corrosion to remove the metal deposit that unnecessary plating forms on the antireflective coating surface.
8. according to the preparation method of the described electrode of solar battery of claim 7; It is characterized in that, the method for utilizing said electrochemical corrosion is removed the metal deposit that unnecessary plating forms on the antireflective coating surface when to implementing electrochemical protection with the metal electrode of photoinduction electro-plating method deposition.
9. according to the preparation method of the described electrode of solar battery of claim 1, it is characterized in that the metal electrode material of utilizing said photoinduction to electroplate deposition is copper, nickel, cobalt, silver, tin, gold, lead, a kind of alloy of and more than one metals in the zinc.
10. according to the preparation method of the described electrode of solar battery of claim 1, it is characterized in that when cleaning said solar cell substrate surface, the antireflective coating surface conversion is a hydrophily.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013143350A1 (en) * | 2012-03-29 | 2013-10-03 | 无锡尚德太阳能电力有限公司 | Solar cell, module and method for manufacturing solar cell electrode |
| CN103726088A (en) * | 2013-12-25 | 2014-04-16 | 国电新能源技术研究院 | Improved copper electroplating method of crystal silicon solar battery |
| WO2015192739A1 (en) * | 2014-06-19 | 2015-12-23 | 常州天合光能有限公司 | Solar cell local-area doping method |
| CN106653935A (en) * | 2015-11-02 | 2017-05-10 | 钧石(中国)能源有限公司 | Tin layer protecting method in preparation of metal grid line of solar cell |
| CN114335257A (en) * | 2022-03-11 | 2022-04-12 | 浙江爱旭太阳能科技有限公司 | Preparation method of solar cell, solar cell module and power generation system |
| CN114703468A (en) * | 2022-03-21 | 2022-07-05 | 晶澳（扬州）太阳能科技有限公司 | Method for plating nickel layer on silicon substrate and preparation method of solar cell nickel electrode |
| CN116344683A (en) * | 2023-02-20 | 2023-06-27 | 通威太阳能（成都）有限公司 | Solar cell and preparation method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2013143350A1 (en) * | 2012-03-29 | 2013-10-03 | 无锡尚德太阳能电力有限公司 | Solar cell, module and method for manufacturing solar cell electrode |
| CN103726088A (en) * | 2013-12-25 | 2014-04-16 | 国电新能源技术研究院 | Improved copper electroplating method of crystal silicon solar battery |
| CN103726088B (en) * | 2013-12-25 | 2017-07-28 | 国电新能源技术研究院 | A kind of improved crystal silicon solar batteries copper electro-plating method |
| WO2015192739A1 (en) * | 2014-06-19 | 2015-12-23 | 常州天合光能有限公司 | Solar cell local-area doping method |
| CN106653935A (en) * | 2015-11-02 | 2017-05-10 | 钧石(中国)能源有限公司 | Tin layer protecting method in preparation of metal grid line of solar cell |
| CN106653935B (en) * | 2015-11-02 | 2019-02-19 | 钧石(中国)能源有限公司 | A kind of guard method preparing tin layers in solar battery metal grid lines |
| CN114335257A (en) * | 2022-03-11 | 2022-04-12 | 浙江爱旭太阳能科技有限公司 | Preparation method of solar cell, solar cell module and power generation system |
| CN114335257B (en) * | 2022-03-11 | 2022-08-19 | 浙江爱旭太阳能科技有限公司 | Preparation method of solar cell, solar cell module and power generation system |
| CN114703468A (en) * | 2022-03-21 | 2022-07-05 | 晶澳（扬州）太阳能科技有限公司 | Method for plating nickel layer on silicon substrate and preparation method of solar cell nickel electrode |
| CN116344683A (en) * | 2023-02-20 | 2023-06-27 | 通威太阳能（成都）有限公司 | Solar cell and preparation method thereof |
| CN116344683B (en) * | 2023-02-20 | 2024-07-23 | 通威太阳能（成都）有限公司 | Solar cell and preparation method thereof |
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