CN102765166A - S-shaped flow path plastic packaging component for four groups of MGP moulds - Google Patents
S-shaped flow path plastic packaging component for four groups of MGP moulds Download PDFInfo
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- CN102765166A CN102765166A CN2012102746629A CN201210274662A CN102765166A CN 102765166 A CN102765166 A CN 102765166A CN 2012102746629 A CN2012102746629 A CN 2012102746629A CN 201210274662 A CN201210274662 A CN 201210274662A CN 102765166 A CN102765166 A CN 102765166A
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- shaped flow
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Abstract
The invention discloses an S-shaped flow path plastic packaging component for four groups of MGP moulds, comprising a feeding cylinder (1). Two sides of the feeding cylinder (1) are connected with 2 to 5 rows of cavities through flow paths in special shapes; the joints of the cavities and the flow paths are provided with plastic inlets (8); the flow paths in special shapes are provided with flow path sprues (2) in special shapes between the first rows of cavities and the second rows of cavities so that the material flows into the plastic inlets (8) of the first rows of cavities. By adopting the S-shaped flow path sprues, multiple products can be filled continuously, the filling efficiency can be improved, and the production cost can be reduced.
Description
Technical field
The present invention relates to the special-shaped flow passage plastic-sealed body, relate in particular to the S type runner plastic-sealed body that is used for four groups of MGP moulds.
Background technology
Along with the development day by day of semiconductor packages industry, compete also more and more fierce at present, the profit of product is then but in constantly compression minimizing; At present behind IC semiconductor in the road packaging process; Because the structural design of lead frame is to the development of many rows multiple row, and the width widen of lead frame also has limitation, so just requiring on the band of original width, to enable encapsulation mostly is products; The single spacing of product is littler, and is closeer.As shown in Figure 1, particularly outstanding especially as the product packaging efficiency problem of this quasi-tradition of DIP8L, once can only encapsulate two products, to die cavity 10 filling chargings, flow into next die cavity through line flowing channel 11 through cast gate 9 again.This just requires to encapsulate the cost that enterprise reduces product as far as possible.And traditional double DIP8L can't satisfy the rival demand in market.
Summary of the invention
The problem that the present invention will solve is that existing single or double DIP8L encapsulating products is limited, can not satisfy market demand, provides the single spacing of a kind of product littler, closeer many row DIP8L S shape special-shaped flow passage plastic-sealed bodies for this reason.
Technical scheme of the present invention is: a kind of S type runner plastic-sealed body that is used for four groups of MGP moulds; It comprises the barrel that is used for charging; The barrel both sides are connected with 2-5 row die cavity through shaped flow channel respectively; Said die cavity and shaped flow channel junction have glue-feeder, and said shaped flow channel has the shaped flow channel cast gate between first row and second row's die cavity, make charging flow into the glue-feeder of first row's die cavity.
Die cavity in the such scheme has five rows respectively in the barrel both sides.
The improvement of this programme is that said shaped flow channel is the S type.
The invention has the beneficial effects as follows through adopting a plurality of products of the S shape continuous filling of special-shaped flow passage cast gate, pack effectiveness is improved, reduced production cost.
Description of drawings
Fig. 1 is existing single DIP8L sketch map;
Fig. 2 is a sketch map of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is further specified.
As shown in Figure 2; The present invention includes the barrel 1 that is used for charging; Barrel 1 both sides are connected with 2-5 row die cavity through shaped flow channel respectively; Said die cavity and shaped flow channel junction have glue-feeder 8, and said shaped flow channel has shaped flow channel cast gate 2 between first row and second row's die cavity, make charging flow into the glue-feeder 8 of first row's die cavity.
Traditional two products of DIP8L straight line filling, position, a sprue cisoid chamber of the present invention intersect to form S shape and cross each product of continuous filling through glue-feeder 8 again.
Preference of the present invention is that said die cavity has five rows respectively in barrel 1 both sides.The product that can encapsulate continuously like this is more, and the present invention is not limited to have only five row's die cavities certainly, can be provided with more as required.
The present invention can also be designed to the S type to shaped flow channel, and what need like this that the material of filling can flow on shaped flow channel is more smooth, flows into the glue-feeder of every row's die cavity more efficiently.
The present invention is work like this: filler such as resin are filled into first row's die cavity 3 of first row's die cavity plastic-sealed body through cast gate; Get into second row's die cavity 4 of second row's plastic-sealed body then at the glue-feeder 8 of every row's die cavity through S shape runner; The 5th row's die cavity 7 that gets into the 3rd row's die cavity 5, the 4th row's die cavity 6 and last row more successively is filled to the die cavity plastic-sealed body, realizes that five rows intersect S shape special-shaped flow passage cast gate fillings encapsulation.
Claims (3)
1. S type runner plastic-sealed body that is used for four groups of MGP moulds; It is characterized in that it comprises the barrel (1) that is used for charging; Barrel (1) both sides are connected with 2-5 row die cavity through shaped flow channel respectively; Said die cavity and shaped flow channel junction have glue-feeder (8), and said shaped flow channel has shaped flow channel cast gate (2) between first row and second row's die cavity, make charging flow into the glue-feeder (8) of first row's die cavity.
2. a kind of S type runner plastic-sealed body that is used for four groups of MGP moulds as claimed in claim 1 is characterized in that said die cavity has five rows respectively in barrel (1) both sides.
3. a kind of S type runner plastic-sealed body that is used for four groups of MGP moulds as claimed in claim 1 is characterized in that said shaped flow channel is the S type.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2012102746629A CN102765166A (en) | 2012-08-03 | 2012-08-03 | S-shaped flow path plastic packaging component for four groups of MGP moulds |
Applications Claiming Priority (1)
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CN2012102746629A CN102765166A (en) | 2012-08-03 | 2012-08-03 | S-shaped flow path plastic packaging component for four groups of MGP moulds |
Publications (1)
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CN102765166A true CN102765166A (en) | 2012-11-07 |
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Family Applications (1)
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CN2012102746629A Pending CN102765166A (en) | 2012-08-03 | 2012-08-03 | S-shaped flow path plastic packaging component for four groups of MGP moulds |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01232733A (en) * | 1988-03-14 | 1989-09-18 | Hitachi Ltd | Semiconductor resin sealing device |
US5071334A (en) * | 1990-01-05 | 1991-12-10 | Kabushiki Kaisha Toshiba | Multiple transfer molding die |
CN200974321Y (en) * | 2006-06-17 | 2007-11-14 | 铜陵三佳科技股份有限公司 | Multi-head injection circuit packaging mould for big material cakes |
CN201594532U (en) * | 2009-08-20 | 2010-09-29 | 吉林华微电子股份有限公司 | Full packing die of semiconductor device with retractable locating needles by extruding plastic package material |
CN202826275U (en) * | 2012-08-03 | 2013-03-27 | 铜陵三佳山田科技有限公司 | S-shaped runner plastic package body of four groups of metal gauze packing (MGP) moulds |
-
2012
- 2012-08-03 CN CN2012102746629A patent/CN102765166A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01232733A (en) * | 1988-03-14 | 1989-09-18 | Hitachi Ltd | Semiconductor resin sealing device |
US5071334A (en) * | 1990-01-05 | 1991-12-10 | Kabushiki Kaisha Toshiba | Multiple transfer molding die |
CN200974321Y (en) * | 2006-06-17 | 2007-11-14 | 铜陵三佳科技股份有限公司 | Multi-head injection circuit packaging mould for big material cakes |
CN201594532U (en) * | 2009-08-20 | 2010-09-29 | 吉林华微电子股份有限公司 | Full packing die of semiconductor device with retractable locating needles by extruding plastic package material |
CN202826275U (en) * | 2012-08-03 | 2013-03-27 | 铜陵三佳山田科技有限公司 | S-shaped runner plastic package body of four groups of metal gauze packing (MGP) moulds |
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Application publication date: 20121107 |