CN102763221B - 用以产生红外线光侦测器的方法 - Google Patents
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Abstract
一种用以产生红外线光侦测器(1)的方法,具有以下步骤:提供多个连接接脚(11、12),所述连接接脚(11、12)布置成其一个纵向末端(17、18)全部保持在一水平面中,其中所述连接接脚(11、12)从所述水平面向下延伸,并且提供具有平坦底面(8)的电路板(6),其中在所述底面(8)中为所述连接接脚(11、12)中的每一个提供凹座(15、16),且所述凹座(15、16)布置在所述电路板(6)的某个区域中,在所述区域中,与所述相应凹座(15、16)相关的所述连接接脚(11、12)将被连接,其中所述凹座(15、16)各自具有相同的形状;用焊膏填充所述凹座(15、16),使得在所述凹座(15、16)中的每一个中所形成的焊膏体(21)具有相同量的焊膏;将所述电路板(6)定位于所述连接接脚(11、12)上方,使得所述连接接脚(11、12)中的每一个的所述纵向末端(17、18)在分配给所述连接接脚(11、12)的所述凹座(15、16)中延伸,并且伸入到位于所述相应凹座(15、16)中的所述焊膏体(21)中;使所述焊膏体(21)液化,使得在所述连接接脚(11、12)与所述焊膏体(21)之间形成导电连接,并且使得由于所述焊膏体(21)中的表面张力和所述电路板(6)的自重,所述电路板(6)的所述底面(8)定向成平行于所述水平面;使所述焊膏体(21)凝固,使得在所述电路板(6)与所述连接接脚(11、12)之间由所述焊膏体(21)形成机械刚性连接,并且使得所述电路板(6)的所述底面(8)的所述定向固定为平行于所述水平面。
Description
技术领域
本发明涉及一种用以产生红外线光侦测器的方法。
背景技术
常规红外线光侦测器具有电路板和位于所述电路板的顶面上的多个传感器芯片,其中构造传感器芯片来侦测红外线光。举例来说,为了可用具有不同波段的红外线光照射所述传感器芯片,具有相对应的设计的红外线滤光片位于传感器芯片前方,并且集成到红外线光侦测器的外壳中。外壳由杯形外壳盖和封闭所述外壳盖的外壳底形成,并且电路板和其传感器芯片布置在外壳的内部。传感器芯片定位成面对其相关红外线滤光片,并且可由附接到电路板的电子电路进行操作。传感器芯片中所产生的电信号可由连接到电路板的连接接脚进行分接,其中连接接脚从电路板通过外壳底而布线到外壳的外部。连接接脚通过电路板中的孔而布线,从而在连接接脚与位于电路板上的电子电路之间形成电连接。但是,由于电路板中存在这些孔,可用来布置传感器芯片和电路的空间受到限制,因此,红外线光侦测器的部件密度较低。
为了使传感器芯片具有高测量精度,特别需要红外线滤光片与其传感器芯片高度平行。因为传感器芯片作为集成部件而布置在电路板上,并且红外线滤光片作为集成部件布置在外壳盖上,所以电路板与外壳盖之间必须足够平行。要实现上述情形,在制造红外线光侦测器的过程中需要复杂的措施。
本发明所解决的问题如下:形成一种用以产生红外线光侦测器的方法,其中所述红外线光侦测器具有高部件密度和高精度。
发明内容
根据本发明的用以产生红外线光侦测器的方法具有如下步骤:提供多个连接接脚,所述连接接脚保持彼此平行并且布置成其一个纵向末端全部在一水平面中,其中所述连接接脚从所述水平面向下延伸,并且[提供]具有平坦底面的电路板,其中在所述底面中为所述连接接脚中的每一个提供凹座,并且每个凹座布置在电路板中的某个区域中,在所述区域中,与相应凹座相关的连接接脚将被连接,其中所述凹座各具有相同的形状;用焊膏填充所述凹座,使得在所述凹座中的每一个中所形成的焊膏体具有相同量的焊膏;将电路板定位在连接接脚上方,使得所述连接接脚中的每一个的纵向末端在与所述连接接脚相关的凹座内延伸,并且伸入到位于相应凹座中的焊膏体中;使焊膏体液化,使得在连接接脚与焊膏体之间形成导电连接,并且使得由于焊膏体的表面张力和电路板的自重,电路板的底面定向成平行于所述水平面;使焊膏体凝固,使得在电路板与连接接脚之间由焊膏体形成机械刚性连接,且使得电路板的底面的定向固定为平行于所述水平面。
用根据本发明的方法所产生的红外线光侦测器包括电路板,其中电路板的顶面没有凹座,使得电路板的整个顶面可用来容纳传感器芯片和电子电路。与用传统方法所产生的红外线光侦测器的电路板相比,表面为传感器芯片和电子电路提供的空间较大,在传统方法中,电路板具有用于连接接脚的孔。因此,有可能实现根据本发明所产生的红外线光侦测器的高部件密度,由此使根据本发明所产生的红外线光侦测器的几何尺寸小于用传统方式所产生的红外线光侦测器的几何尺寸。另外,根据本发明的方法实现了相对于电路板来定位连接接脚的高精度。
电路板优选是通过如下方式来定位:所述连接接脚中的至少一个的纵向末端与分配给所述连接接脚的凹座的底部接触。使焊膏体液化的步骤优选是通过加热焊膏体来实现,并且使焊膏体凝固的步骤是通过冷却焊膏体来实现。另外,优选的是:作为用以产生红外线光侦测器的方法的部分而提供外壳底,且所述外壳底布置成平行于所述水平面,其中所述外壳底中包括用于连接接脚中的每一个的通道,其中分配给每个相应通道的连接接脚延伸穿过所述通道,使得所述连接接脚由所述外壳底在所述通道中保持在适当位置。用这种方式在外壳底与电路板之间实现了高度平行。
用以产生红外线光侦测器的方法的其他优选步骤为:提供杯形外壳盖;将外壳盖附接到外壳底,使得外壳由外壳盖和外壳底形成,并且电路板容纳于外壳中。因为在外壳底与电路板之间实现了平行,所以同样在电路板与外壳盖之间实现了高度平行。
其他优选步骤为:将至少一个传感器芯片附接到电路板的顶面,所述顶面背对底面;在外壳盖中提供红外线滤光片,其中所述红外线滤光片分配给所述传感器芯片,以便用来自红外线光侦测器外部的红外线光照射所述传感器芯片。这样,通过根据本发明的产生方法实现了传感器与其所分配红外线滤光片之间的高度平行,这是因为通过连接接脚、外壳底和外壳盖实现了具有传感器芯片的电路板相对于红外线滤光片的准确定位。
因此,通过根据本发明的方法产生的红外线光侦测器具有高测量精度。
附图说明
下文中参考附图说明来解释通过根据本发明的方法产生的红外线光侦测器的一项优选实施例,其中:
图1所示为红外线光侦测器的实施例的横截面,
图2所示为图1中的剖面I,以及
图3所示为图1中的细节II。
参考元件符号列表
1:红外线光侦测器
2:外壳
3:外壳盖
4:外壳底
5:接合附件
6:电路板
7:电路板顶面
8:电路板底面
9:传感器芯片
10:红外线光窗口
11:第一连接接脚
12:第二连接接脚
13:第一通道
14:第二通道
15:第一凹座
16:第二凹座
17:第一接脚的纵向末端
18:第二接脚的纵向末端
19:第一焊料附件
20:第二焊料附件
21:焊膏体
22:焊膏体表面
23:连接接脚尖端
24:凹座底部
具体实施方式
如图1到图3中可见,根据本发明所产生的红外线光侦测器1具有由外壳盖3和外壳底4形成的外壳2。外壳盖3设计成杯形并且其外边缘由接合附件5附接到外壳底4。外壳2的内部空间由外壳盖3和外壳底4界定,并且电路板6布置在这个内部空间内。电路板6具有电路板顶面7和电路板底面8,其中电路板顶面7在图1中布置在顶部,而电路板底面8在图1中布置在底部。多个传感器芯片9(根据图2为四个)附接到电路板顶面7。在传感器芯片9中的每一个上方提供一个红外线滤光片10,且红外线滤光片10中的每一个集成于外壳盖3中。在电路板底面8上提供多个连接接脚11、12,且这些连接接脚电连接到电路板6中的电子电路(图中未示)。连接器接脚11、12垂直地延伸穿过外壳底4。在外壳底4中为连接接脚11、12中的每一个提供通道13、14。
电路板底面8上有用于每个连接接脚11、12的凹座15、16,每个连接接脚11、12的纵向末端17、18延伸到所述凹座15、16中。连接接脚11、12由焊料附件19、20附接到凹座15、16中,并且用导电的方式连接到电子电路。焊料附件19、20各自由焊料体21形成,所述焊料体21是由焊膏产生于凹座15、16中。在产生焊料附件19、20的过程中,使焊料体21液化,其中围绕连接接脚11、12中的每一个形成焊料体表面22(如圆锥体的表面)。连接接脚11、12的纵向末端17、18各自具有与凹座底部24相邻的尖端23。
在产生红外线光侦测器1的过程中,必须执行以下步骤:必须提供电路板6,在电路板6中必须(例如)通过蚀刻产生凹座15、16。必须将传感器芯片9和电子电路附接到电路板顶面7。另外,必须将连接接脚11、12布置成彼此平行并保持在适当位置,其中连接接脚11、12的纵向末端17、18布置在一水平面中,并且连接接脚11、12垂直于所述水平面而延伸。另外,提供具有通道13、14的外壳底4,其中连接接脚11、12中的一个插入到通道13、14中的每一个中,从而使所述连接接脚在那个位置保持在适当位置。通过这种方式,保持连接接脚11、12稳定地彼此平行并且垂直于外壳底4。
连接接脚11、12与凹座15、16的位置通过如下方式彼此匹配:凹座15、16中的一个分配给连接接脚11、12中的每一个。必须(例如)通过蚀刻将凹座15、16设计成相同的形状。另外,必须用焊膏填充所述凹座,其中必须将相同量的焊膏放到凹座15、16中的每一个中。接下来,将电路板6定位于连接接脚11、12上方,使得连接接脚11、12中的每一个的纵向末端17、18伸入到相应的焊膏体21中。接下来,例如在烤箱中将焊膏体21加热到300℃,使得焊膏体液化。由于液化后的焊膏的表面张力和电路板6的自重,电路板6定向成相对于连接接脚11、12位于中央。通过这种方式,使电路板6形成垂直定向,其中连接接脚11、12垂直于电路板6而延伸。
随后,使焊膏体21冷却下来,因此,焊膏体21凝固,并且在电路板6与凹座15、16中的连接接脚11、12之间形成机械刚性连接,并且通过焊膏体21在连接接脚11、12与电子电路之间形成导电连接[sic]。将外壳盖3放在外壳底4上,位于电路板6上方,并且构造接合附件。
将连接接脚11、12稳定地并且精确地保持在外壳底4中的通道13、14中。由于焊膏体21中的表面张力和电路板6的自重,通过凹座15、16中的焊料附件19、20将电路板6本身布置成相对于连接接脚11、12且因此相对于外壳底4精确地位于中央。将外壳盖3放在外壳底4上,使得集成到外壳盖3中的红外线滤光片10相对于传感器芯片9精确地布置。通过这种方式,在传感器芯片9与其功能上分配的红外线滤光片10之间实现高度平行,并且红外线光侦测器1的测量精度因此较高。另外,电路板6的整个电路板表面7用来构造传感器芯片9和电子电路,并且红外线光侦测器1因此具有高部件密度。
Claims (6)
1.一种用以产生红外线光侦测器(1)的方法,具有以下步骤:
提供多个连接接脚(11、12),所述连接接脚(11、12)布置成其一个纵向末端(17、18)全部保持在一水平面中,其中所述连接接脚(11、12)从所述水平面向下延伸,并且提供具有平坦底面(8)的电路板(6),其中在所述底面(8)中为所述连接接脚(11、12)中的每一个提供凹座(15、16),且所述凹座(15、16)布置在所述电路板(6)的某个区域中,在所述区域中,与所述相应凹座(15、16)相关的所述连接接脚(11、12)将被连接,其中所述凹座(15、16)各自具有相同的形状;
用焊膏填充所述凹座(15、16),使得在所述凹座(15、16)中的每一个中所形成的焊膏体(21)具有相同量的焊膏;
将所述电路板(6)定位于所述连接接脚(11、12)上方,使得所述连接接脚(11、12)中的每一个的所述纵向末端(17、18)在分配给所述连接接脚(11、12)的所述凹座(15、16)中延伸,并且伸入到位于所述相应凹座(15、16)中的所述焊膏体(21)中;
使所述焊膏体(21)液化,使得在所述连接接脚(11、12)与所述焊膏体(21)之间形成导电连接,并且使得由于所述焊膏体(21)中的表面张力和所述电路板(6)的自重,所述电路板(6)的所述底面(8)定向成平行于所述水平面;
使所述焊膏体(21)凝固,使得在所述电路板(6)与所述连接接脚(11、12)之间由所述焊膏体(21)形成机械刚性连接,并且使得所述电路板(6)的所述底面(8)的所述定向固定为平行于所述水平面。
2.根据权利要求1所述的方法,其中所述电路板(6)是通过如下方式来定位:所述连接接脚(11、12)中的至少一个的所述纵向末端与分配给所述连接接脚(11、12)的所述凹座(15、16)的凹座底部(24)接触。
3.根据权利要求1或2所述的方法,其中所述焊膏体(21)的所述液化是通过加热所述焊膏体(21)来实现,并且所述焊膏体(21)的所述凝固是通过冷却所述焊膏体(21)来实现。
4.根据权利要求1或2所述的方法,其中提供布置成平行于所述水平面的外壳底(4),在所述外壳底(4)中为所述连接接脚(11、12)中的每一个提供一个通道(13、14),其中分配给所述通道(13、14)的所述连接接脚(11、12)延伸穿过所述通道(13、14)中的每一个,使得所述连接接脚(11、12)由所述外壳底(4)在所述通道(13、14)中保持在适当位置。
5.根据权利要求4所述的方法,具有以下步骤:
提供杯形外壳盖(3);
将所述外壳盖(3)附接到所述外壳底(4),使得外壳(2)由所述外壳底(4)和所述外壳盖(3)形成,所述电路板(6)容纳于所述外壳(2)中。
6.根据权利要求5所述的方法,具有以下步骤:
在所述电路板(6)的顶面(7)上附接至少一个传感器芯片(9),所述顶面(7)背对所述底面(8);
在所述外壳盖(3)中提供红外线滤光片(10),所述红外线滤光片(10)是在功能上分配给所述传感器芯片(9),以便用来自所述红外线光侦测器(1)外部的红外线光照射所述传感器芯片(9)。
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