CN102747214B - Multi optical path combined shock peening system - Google Patents
Multi optical path combined shock peening system Download PDFInfo
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- CN102747214B CN102747214B CN201210223527.1A CN201210223527A CN102747214B CN 102747214 B CN102747214 B CN 102747214B CN 201210223527 A CN201210223527 A CN 201210223527A CN 102747214 B CN102747214 B CN 102747214B
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Abstract
The invention discloses a multi optical path combined shock peening method which comprises steps of: moving a first total reflection mirror frame to places except the laser light path exposed by a first laser generator when the first laser generator is used for laser radiation, the laser exposed by the first laser generator directly passing through a focus mirror frame and radiating the device surface; while when the second laser generator is used for radiation to the device surface, moving the first total reflection mirror frame to the laser light path of the first laser generator, so that the laser generated by the second laser generator successively passing through a second total reflection mirror frame, the first total reflection mirror frame and the focus mirror frame and radiating the device surface, thereby impacting and strengthening the device surface through lasers with different facula sizes and same power density. The method can realize the shock peening of lasers with different spot sizes but same power density to complex structural members by combining two laser generators having different parameter indexes, so that optimization of surface shock peening track can be realized by using different spot sizes, thereby enabling homogenization of surface residual stress.
Description
Technical field
The present invention relates to a kind of laser shock peening method.
Background technology
Reiforcing laser impact technology is a kind of novel material surface treatment process, the plasma shockwave that it utilizes intense laser beam to produce, at material surface, produce certain thickness unrelieved stress layer, and change surfacing weave construction, thereby improve antifatigue, the wear-resistant and resistance to corrosion of metallic substance.
Compare with the reinforcing process such as shot-peening in the past, laser impact intensified have outstanding advantages such as noncontact,, unrelieved stress layer depth strong without heat affected zone, controllability and strengthening effect be remarkable.Laser impact intensified cardinal principle is: on the absorption layer that a branch of high-energy-density laser radiation is adhered at target body material surface, absorption layer absorbing laser energy generates rapidly high pressure plasma, the high pressure of plasma generation suffer restraints layer effect can not decay very soon, be subject to High Pressure, material surface can produce shockwave and to internal communication.Due to the yield strength of pressure over material, the part material of shock wave can produce viscous deformation, forms the unrelieved stress with certain distribution at material surface, and these residual stress distribution can effectively stop the generation of surface crack.Thereby material is subject to High Pressure can produce certain phase transformation and forms hardened layer simultaneously, improves surperficial resistance to corrosion.
Laser impact intensified as a kind of novel material processing technique, its shock peening effect depends primarily on laser parameter, restraint layer thickness and absorption layer quality.In order to make shock peening act on total surface, for circular light spot, should there is certain Duplication.
This effects on surface absorption layer has proposed very large test, because after laser facula effect for the first time, absorption layer is all or part of being consumed often, if impact hot spot, there is Duplication, the absorption layer of next laser facula zone of action is just very inhomogeneous, thereby cause pressure skewness in the zone of action, strengthening effect will be influenced.Conventionally the method adopting is repeatedly to change absorption layer and change shock peening laser head movement rule, and to shock peening, operation brings certain triviality for this.
The important evaluation index of Effect of Laser Shock Processing is the residual compressive stress distribution on test specimen top layer, the Duplication of laser facula can directly have influence on the distribution of unrelieved stress, if Duplication is not good, even may form residual tension on surface, have a strong impact on shock peening effect.
For the shock peening of complex structural member, structure specific position needs the laser facula zone of action of different sizes, but can not change laser energy density.Want to realize above-mentioned operating mode, except regulating the position of laser condensing lens, also need to change the energy of Laser output.And laser resonant cavity only just can reach best laser distribution for specific output energy (being generally maximum output energy), changing energy can affect laser spatial distribution state, thereby affects laser impact intensified effect.
Summary of the invention
The problem existing for prior art, the object of the present invention is to provide a kind of multi-pass combination impact reinforcing method, can to complex structural member, carry out shock peening better.
A kind of multi-pass combination impact reinforcing method of the present invention comprises the steps:
1) by the first laser generator, produce the laser of preset parameter index, and in the Output of laser light path of described the first laser generator, being disposed with movably the first total reflection mirror holder and focusing mirror holder, the laser of described the first laser generator output sees through focusing mirror holder and is irradiated on pending device surface;
2) by the second laser generator, produce the identical but laser that parameter index is different of power density with described the first laser apparatus generation, in the Output of laser light path of described the second laser generator, be provided with the second total reflection mirror holder, the laser total reflection that described the second total reflection mirror holder produces described the second laser generator is to described the first total reflection mirror holder, overlap with the laser optical path of described the first laser generator output, and be irradiated on described pending device surface through described focusing mirror holder;
3) when described the first laser generator carries out laser radiation, described the first total reflection mirror holder moves to the place outside the light path of the laser that the first laser generator irradiates, and allows laser that described the first laser generator irradiates directly see through to focus on mirror holder described device surface is irradiated; And when carrying out the surface of described device to irradiate with described the second laser generator, described the first total reflection mirror holder is moved on the laser optical path of described the first laser generator, make laser that the second laser generator produces successively by the second total reflection mirror holder, the first total reflection mirror holder and focus on the surface that mirror holder is irradiated to described device, thereby by different spot sizes but the identical laser of power density carries out shock peening to described device surface.
Preferably, described parameter index comprises: single pulse energy, repetition rate, pulse width and spot size.
The present invention is by combining the laser generator of two different parameters indexs, can realize the different spot sizes of complex structural member but identical laser impact intensified of power density.Thereby can utilize different spot sizes to realize the optimization of surface impacts strengthening tracks, make surface residual stress homogenizing; Reduce absorption layer and change number of times, and simplify procedures.In addition, the present invention can also be able to realize laser impact intensified to complex structural member corner location.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the schematic diagram to plate impact that utilizes combined optical path of the present invention to realize.
Embodiment
As shown in Figure 1, the present invention includes: the first laser generator 1 and the second laser generator 2, the first laser generator 1, for generation of the laser of preset parameter index, is disposed with the first total reflection mirror holder 3 and focuses on mirror holder 4 in the Output of laser light path of the first laser generator 1.The laser of the first laser generator 1 output sees through focusing mirror holder 4 and is irradiated on pending 6 surfaces of the device with complex surface.The second laser generator 2 is for generation of the power density producing from the first laser apparatus 1 is identical but the laser that parameter index is different, in the Output of laser light path of the second laser generator 2, be provided with the second total reflection mirror holder 5, on laser total reflection to the first total reflection mirror holder 3 that the second total reflection mirror holder 5 produces the second laser generator 2, overlap with the laser optical path of the first laser generator 1 output, and be irradiated on pending device 6 surfaces through focusing on mirror holder 4.
In embodiments of the present invention, mobile predetermined distance in the light path of the laser that the first total reflection mirror holder 3 also can reflect along the second total reflection mirror holder 5, its effect is when the first laser generator 1 carries out laser radiation, the first total reflection mirror holder 3 moves to the place outside the light path of the laser that the first laser generator 1 irradiates, allow the laser that the first laser generator 1 irradiates directly through focusing on 4 pairs of device 6 surfaces of mirror holder, irradiate, and in the time need to carrying out the surface of device 6 to irradiate with the second laser generator 2, the first total reflection mirror holder 3 is moved on the laser optical path of the first laser generator 1, the laser that the second laser generator 2 is produced passes through the second total reflection mirror holder 5 successively, the first total reflection mirror holder 3 and focusing mirror holder 4 are irradiated to the surface of device 6.
Because the present invention is by combining the laser generator of two different parameters indexs, can realize the different spot sizes of complex structural member but identical laser impact intensified of power density.Thereby can utilize different spot sizes to realize the optimization of surface impacts strengthening tracks, make surface residual stress homogenizing; Reduce absorption layer and change number of times, and simplify procedures.
In addition, can also be able to realize laser impact intensified to complex structural member corner location.
Enumerating object lesson below describes.The parameter of the first laser generator 1 is: single pulse energy 2.5J, repetition rate 5Hz, pulse width 10ns; The single pulse energy 20J of the second laser generator 2, repetition rate 0.5Hz, pulse width 20ns.
The starting position of the first total reflection mirror holder 3 is that the pilot light of 0, the first laser generator 1 transmitting arrives device 6 specific positions, and this position is point of application.Regulate to focus on mirror holder 4 positions, make to act on hot spot on point of application and reach and estimate size, thereby obtain predetermined power density, power density computation formula is:
Wherein E is pulse energy, and λ is pulse width, and r is spot radius.When obtaining more small light spot, first the first total reflection support 3 is adjusted to 1 position (leaving the light path of the laser of the first laser generator 1 transmitting), then regulate and focus on mirror holder 4 positions, W is remained unchanged, at this moment just obtained less effect hot spot.As shown in Figure 2, the schematic diagram to plate impact for utilizing combined optical path of the present invention to realize.
Claims (1)
1. a multi-pass combination impact reinforcing method, is characterized in that, comprises the steps:
1) by the first laser generator, produce the laser of preset parameter index, and in the Output of laser light path of described the first laser generator, being disposed with movably the first total reflection mirror holder and focusing mirror holder, the laser of described the first laser generator output sees through focusing mirror holder and is irradiated on pending device surface;
2) by the second laser generator, produce the identical but laser that parameter index is different of power density with described the first laser apparatus generation, in the Output of laser light path of described the second laser generator, be provided with the second total reflection mirror holder, the laser total reflection that described the second total reflection mirror holder produces described the second laser generator is to described the first total reflection mirror holder, overlap with the laser optical path of described the first laser generator output, and be irradiated on described pending device surface through described focusing mirror holder;
3) when described the first laser generator carries out laser radiation, described the first total reflection mirror holder moves to the place outside the light path of the laser that the first laser generator irradiates, and allows laser that described the first laser generator irradiates directly see through to focus on mirror holder described device surface is irradiated; And when carrying out the surface of described device to irradiate with described the second laser generator, described the first total reflection mirror holder is moved on the laser optical path of described the first laser generator, make laser that the second laser generator produces successively by the second total reflection mirror holder, the first total reflection mirror holder and focus on the surface that mirror holder is irradiated to described device, thereby by different spot sizes but the identical laser of power density carries out shock peening to described device surface; Utilize different spot sizes to realize the optimization of surface impacts strengthening tracks, make surface residual stress homogenizing; Described parameter index comprises: single pulse energy, repetition rate, pulse width and spot size.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210223527.1A CN102747214B (en) | 2012-06-29 | 2012-06-29 | Multi optical path combined shock peening system |
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| CN201210223527.1A CN102747214B (en) | 2012-06-29 | 2012-06-29 | Multi optical path combined shock peening system |
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| CN102747214A CN102747214A (en) | 2012-10-24 |
| CN102747214B true CN102747214B (en) | 2014-09-24 |
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| CN103484653B (en) * | 2013-09-04 | 2015-09-09 | 中国航空工业集团公司北京航空制造工程研究所 | The apparatus and method of loop laser shock peening fastener hole |
| CN104372167B (en) * | 2014-10-11 | 2016-08-24 | 江苏大学 | A kind of complex-curved uniform intensifying method of laser-impact based on projection gray level |
| CN106808087B (en) * | 2017-02-13 | 2018-12-21 | 江苏华博数控设备有限公司 | A kind of method of workpiece deformation quantity after reduction laser melting coating |
| CN108817675B (en) * | 2018-08-14 | 2020-07-07 | 北京理工大学 | Femtosecond laser shock peening enhancement method based on electronic dynamic regulation |
| CN112981397B (en) * | 2021-05-20 | 2021-10-19 | 武汉锐科光纤激光技术股份有限公司 | Laser cladding method and device for roller, storage medium and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201355403Y (en) * | 2009-02-19 | 2009-12-02 | 深圳市大族激光科技股份有限公司 | Multi-light path layout device for laser |
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| JPH01251010A (en) * | 1988-03-31 | 1989-10-06 | Toshiba Corp | Optical axis adjusting device |
| JPH0722685A (en) * | 1993-06-21 | 1995-01-24 | Mitsubishi Heavy Ind Ltd | Focus composition method of beam and its focus composition device |
| CN201405164Y (en) * | 2009-04-30 | 2010-02-17 | 苏州德龙激光有限公司 | Novel double optical path green ray millipore processing unit |
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| CN201355403Y (en) * | 2009-02-19 | 2009-12-02 | 深圳市大族激光科技股份有限公司 | Multi-light path layout device for laser |
Non-Patent Citations (2)
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| JP平1-251010A 1989.10.06 |
| JP特开平7-22685A 1995.01.24 |
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