CN201405164Y - Novel double optical path green ray millipore processing unit - Google Patents
Novel double optical path green ray millipore processing unit Download PDFInfo
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- CN201405164Y CN201405164Y CN 200920038933 CN200920038933U CN201405164Y CN 201405164 Y CN201405164 Y CN 201405164Y CN 200920038933 CN200920038933 CN 200920038933 CN 200920038933 U CN200920038933 U CN 200920038933U CN 201405164 Y CN201405164 Y CN 201405164Y
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Abstract
The utility model provides a double optical path green ray millipore processing unit, which comprises a picosecond pulse laser, a nanosecond pulse laser, an optical path calibration system and an optical focusing system. The output end of the picosecond pulse laser is provided with a first reflector. The output end of the nanosecond pulse laser is provided with a second reflector. The first and second reflectors are connected with a third reflector. The output end of the third reflector is provided with an optical gate. The output end of the optical gate is connected with a beam expanding lens. The output end of the beam expanding lens is connected with a fourth reflector. The fourth reflector is connected with the optical focusing system through the optical path calibration system. Two lasers whose optical pulse lengths are nanosecond and picosecond are adopted, selection of the beam is controlled by an optical path selection system, and only one lase is used for processing, and alsotwo lasers are alternately used during the processing. The double optical path system not only can maintain the advantages of utilizing the laser to process millipore, but also can aim at different processing fineness and cost requirement to flexibly select the processing mode.
Description
Technical field
The utility model relates to the laser micropore system of processing, relates in particular to a kind of device that utilizes the double light path green laser that multiple materials such as metal, pottery, plastics are carried out the micropore retrofit.
Background technology
At present, laser has been used in the capillary processing field.Utilize optical system laser can be focused on luminous point less than 10um, the power density at luminous point place can reach 10
9～10
12W/cm
2, adding the man-hour material and be melted, gasify, thereby form aperture, the I of bore dia reaches about 25um.Than three kinds of processing modes such as mechanical drill processing, spark machined and etching and processing, laser processing technology has significant advantage: can process the micropore of diameter less than 0.1mm; Process velocity is fast, and can process thousands of holes each second, and the hole uniformity is better; Cost is lower, no tool loss; Life-span is long, working stability.
The used diode pumped solid state laser of Laser Processing is generally pulse laser, can be divided into nanosecond (10-according to its laser pulse width laser instrument
9S), psec (10-
12S), femtosecond (10-
15S) laser instrument.What present industrial laser brill micropore generally used is single nanosecond laser.Because light impulse length that nanosecond laser produced is a nanosecond, fuel factor is obvious when interacting with material, and phenomenons such as that bore edges occurs is rough, burn, chipping, fire check cause processing the fineness reduction.Its fuel factor was more obvious when especially softer the or material of amorphous phase (as organic film, glass etc.) was gone up boring at some, even can't process.And the light pulse that picosecond laser produced is very short, and pulse power is 1000 times of nanosecond pulse power, and material is directly gasified and without molten state, thereby can effectively reduce the generation of fuel factor.But the commercial Application of picosecond laser is less at present, and apparatus expensive, and processing cost is higher.
Summary of the invention
The purpose of this utility model is to overcome the deficiency that prior art exists, and a kind of novel double light path green light micropore processing device is provided, and is intended to improve the processing fineness, saves cost, reduces the fuel factor that adds man-hour.
The purpose of this utility model is achieved through the following technical solutions:
Novel double light path green light micropore processing device, comprise the picosecond pulse laser device, the ps pulsed laser and ns pulsed laser device, light path calibration system and optical focusing system, characteristics are: the output of described picosecond pulse laser device is furnished with first speculum, the output of described ps pulsed laser and ns pulsed laser device is furnished with second speculum, first speculum all is connected with the 3rd speculum mutually with second speculum, the output of the 3rd speculum is provided with optical gate, the output of optical gate is connected with beam expanding lens, the output of beam expanding lens is connected the 4th speculum, and the 4th speculum is connected with optical focusing system mutually by the light path calibration system.
Further, above-mentioned novel double light path green light micropore processing device, wherein, described first speculum is installed on the electronic one dimension translation stage.
Further, above-mentioned novel double light path green light micropore processing device, wherein, the laser of described picosecond pulse laser device and the output of ps pulsed laser and ns pulsed laser device is green laser, and wavelength is 532nm.
Again further, above-mentioned novel double light path green light micropore processing device, wherein, the enlargement ratio of described beam expanding lens be 3～10 times adjustable.
The substantive distinguishing features of technical solutions of the utility model and progressive being mainly reflected in:
Adopting light pulse length is two kinds of laser instruments of nanosecond, psec, and output is the 532nm green laser, and the selection of light beam can only use a kind of laser instrument to process by the control of light path selective system, also can be used alternatingly by two kinds of laser instruments in process.Double beam system has not only kept the advantage of Laser Processing micropore, and at different processing fineness and cost requirement, can select processing mode flexibly: processing then can be selected to process with picosecond laser as the need high-fineness; Not high as required precision, then can select nanosecond laser processing; As process fineness and cost all will be considered, then can carry out gross porosity processing with nanosecond laser earlier, and then carry out refine with picosecond laser.Its light channel structure is simple, and is easy to adjust; Improve the processing fineness greatly, reduced cost, significantly reduced the fuel factor that adds man-hour.Simple and easy being suitable for is the new design of a practicality.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1: the schematic diagram of the utility model light channel structure;
Fig. 2: the organigram of the utility model device.
The implication of each Reference numeral sees the following form among the figure:
| Reference numeral | Implication | Reference numeral | Implication | Reference numeral | Implication |
| 1 | The picosecond pulse laser device | 2 | The ps pulsed laser and ns |
3 | |
| 4 | |
5 | The 3rd speculum | 6 | |
| 7 | |
8 | The |
9 | The light |
| 10 | Optical focusing |
11 | |
12 | Electronic one dimension translation stage |
The specific embodiment
Design a kind of double beam system, the nanosecond laser (wavelength 532nm) and the light path of picosecond laser (wavelength 532nm) are integrated, make that entering optical system through the calibration back by same path with the laser beam of the different pulse widths of two bundles of picosecond pulse laser device outgoing from the ps pulsed laser and ns pulsed laser device focuses on, thereby carry out capillary processing.
As shown in Figure 1 and Figure 2, double light path green light micropore processing device, adopt double laser light source, comprise light path selection, optic path, light path calibration and optical focus four parts, the output of picosecond pulse laser device 1 is furnished with first speculum 4, first speculum 4 is installed on the electronic one dimension translation stage 12 of high accuracy, make light path select by electronic one dimension translation stage 12 controls of high accuracy, platform back and forth movement precision height, guarantee that laser passes through constant path, can select to carry out single Laser Processing or two Laser Processing; The output of ps pulsed laser and ns pulsed laser device 2 is furnished with second speculum 3, first speculum 4 all is connected with the 3rd speculum 5 mutually with second speculum 3, the output of the 3rd speculum 5 is provided with optical gate 6, the output of optical gate 6 is connected with beam expanding lens 7, the output of beam expanding lens 7 is connected has the 4th speculum 8, the four speculums 8 to be connected mutually with optical focusing system 10 by light path calibration system 9.
The laser beam of picosecond pulse laser device 1 and the different pulse widths of ps pulsed laser and ns pulsed laser device 2 generations, through entering transmission laser system after the light path selective system, light beam is gone into optics focusing system 10 through light path calibration system 9 is laggard afterwards, thereby focus of the light beam into the material surface to be processed on the processing platform 11, get out micropore.By the switching of software control light path, can be used alone laser and process, or successively use two kinds of laser to process in the processing.
The laser of picosecond pulse laser device 1 and 2 outputs of ps pulsed laser and ns pulsed laser device is green laser, and wavelength is 532nm; When light path was changed, the optical element in Laser Transmission and the focusing system need not to change, and the adjusting of light path is also more succinct.
Optical gate 6 plays the external control of laser break-make in the optic path, can stop laser when not being in machining state, also plays the certain protection effect, prevents that operating personnel are subjected to unexpected injury.
The enlargement ratio of beam expanding lens 7 from 3～10 times adjustable, its effect is with the enlarged-diameter of laser beam and collimates, and makes the depth of parallelism of outgoing beam better, helps light beam is focused in follow-up system.The multiplying power of beam expanding lens and the diameter of focal beam spot are inversely proportional to, so adjustable diameter and the energy size that can effectively control focal beam spot of multiplying power.
Light path calibration system 9 is used for the light path calibration of double light path, and its principle is to make laser by being in two apertures separated by a distance on the same axis to determine its transmission path.Utilize the light path selective system to select a kind of light beam (as picosecond laser), regulate the 3rd speculum 5, beam expanding lens 7, the 4th speculum 8, make laser pass through calibration system; Close laser, select another kind of light beam (nanosecond laser), keep the position of the 3rd speculum 5, beam expanding lens 7, the 4th speculum 8 motionless this moment, regulates second speculum 3, make laser pass through calibration system equally, the two-way light beam just can enter optical focusing system 10 by same paths like this.
In sum, it is two kinds of laser instruments of nanosecond, psec that the utility model adopts light pulse length, and output is the 532nm green laser, and the selection of light beam is controlled by the light path selective system, can only use a kind of laser instrument to process, also can in process, be used alternatingly by two kinds of laser instruments.Double beam system has not only kept the advantage of Laser Processing micropore, and at different processing fineness and cost requirement, can select processing mode flexibly: processing then can be selected to process with picosecond laser as the need high-fineness; Not high as required precision, then can select nanosecond laser processing; As process fineness and cost all will be considered, then can carry out gross porosity processing with nanosecond laser earlier, and then carry out refine with picosecond laser.Its light channel structure is simple, and is easy to adjust; Improve the processing fineness greatly, reduced cost, significantly reduced the fuel factor that adds man-hour.
It is emphasized that: above only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any simple modification, equivalent variations and modification that above embodiment did.
Claims (4)
1. novel double light path green light micropore processing device, comprise the picosecond pulse laser device, the ps pulsed laser and ns pulsed laser device, light path calibration system and optical focusing system, it is characterized in that: the output of described picosecond pulse laser device is furnished with first speculum, the output of described ps pulsed laser and ns pulsed laser device is furnished with second speculum, first speculum all is connected with the 3rd speculum mutually with second speculum, the output of the 3rd speculum is provided with optical gate, the output of optical gate is connected with beam expanding lens, the output of beam expanding lens is connected the 4th speculum, and the 4th speculum is connected with optical focusing system mutually by the light path calibration system.
2. novel double light path green light micropore processing device according to claim 1 is characterized in that: described first speculum is installed on the electronic one dimension translation stage.
3. novel double light path green light micropore processing device according to claim 1 is characterized in that: the laser of described picosecond pulse laser device and the output of ps pulsed laser and ns pulsed laser device is green laser, and wavelength is 532nm.
4. novel double light path green light micropore processing device according to claim 1 is characterized in that: the enlargement ratio of described beam expanding lens is 3～10 times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920038933 CN201405164Y (en) | 2009-04-30 | 2009-04-30 | Novel double optical path green ray millipore processing unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920038933 CN201405164Y (en) | 2009-04-30 | 2009-04-30 | Novel double optical path green ray millipore processing unit |
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| Publication Number | Publication Date |
|---|---|
| CN201405164Y true CN201405164Y (en) | 2010-02-17 |
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ID=41676086
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920038933 Expired - Lifetime CN201405164Y (en) | 2009-04-30 | 2009-04-30 | Novel double optical path green ray millipore processing unit |
Country Status (1)
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|---|---|
| CN (1) | CN201405164Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102059451A (en) * | 2010-11-08 | 2011-05-18 | 北京理工大学 | Nano-femtosecond dual-laser composite machining system |
| CN102189335A (en) * | 2010-03-15 | 2011-09-21 | 埃瓦格股份公司 | Laser processing device and method for manufacturing a rotation symmetric tool |
| CN102455508A (en) * | 2010-10-26 | 2012-05-16 | 大立光电股份有限公司 | Dual-light-path optical imaging system |
| CN102747214A (en) * | 2012-06-29 | 2012-10-24 | 中国科学院力学研究所 | Multi optical path combined shock peening system |
| US8908014B2 (en) | 2010-10-06 | 2014-12-09 | Largan Precision Co., Ltd. | Optical imaging lens system with double optical paths |
| CN105057886B (en) * | 2015-08-10 | 2016-08-17 | 济南金威刻科技发展有限公司 | A kind of cutting machine reflection generating device of laser |
| CN106077953A (en) * | 2016-08-03 | 2016-11-09 | 武汉华工激光工程有限责任公司 | A kind of method and system that sheet metal is carried out nanosecond laser welding |
| CN106808087A (en) * | 2017-02-13 | 2017-06-09 | 江苏华博数控设备有限公司 | A kind of method of workpiece deformation quantity after reduction laser melting coating |
| CN107234345A (en) * | 2017-07-14 | 2017-10-10 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting system and its cutting method |
| CN114682934A (en) * | 2022-06-01 | 2022-07-01 | 杭州凌像科技有限公司 | Multi-pulse width composite printed circuit board laser processing device |
-
2009
- 2009-04-30 CN CN 200920038933 patent/CN201405164Y/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102189335A (en) * | 2010-03-15 | 2011-09-21 | 埃瓦格股份公司 | Laser processing device and method for manufacturing a rotation symmetric tool |
| CN102189335B (en) * | 2010-03-15 | 2016-03-16 | 埃瓦格股份公司 | For the manufacture of laser processing device and the method for rotation symmetric tool |
| US8908014B2 (en) | 2010-10-06 | 2014-12-09 | Largan Precision Co., Ltd. | Optical imaging lens system with double optical paths |
| CN102455508A (en) * | 2010-10-26 | 2012-05-16 | 大立光电股份有限公司 | Dual-light-path optical imaging system |
| CN102059451A (en) * | 2010-11-08 | 2011-05-18 | 北京理工大学 | Nano-femtosecond dual-laser composite machining system |
| CN102747214A (en) * | 2012-06-29 | 2012-10-24 | 中国科学院力学研究所 | Multi optical path combined shock peening system |
| CN105057886B (en) * | 2015-08-10 | 2016-08-17 | 济南金威刻科技发展有限公司 | A kind of cutting machine reflection generating device of laser |
| CN106077953A (en) * | 2016-08-03 | 2016-11-09 | 武汉华工激光工程有限责任公司 | A kind of method and system that sheet metal is carried out nanosecond laser welding |
| CN106808087A (en) * | 2017-02-13 | 2017-06-09 | 江苏华博数控设备有限公司 | A kind of method of workpiece deformation quantity after reduction laser melting coating |
| CN107234345A (en) * | 2017-07-14 | 2017-10-10 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting system and its cutting method |
| CN107234345B (en) * | 2017-07-14 | 2019-06-14 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting system and its cutting method |
| CN114682934A (en) * | 2022-06-01 | 2022-07-01 | 杭州凌像科技有限公司 | Multi-pulse width composite printed circuit board laser processing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee before: Suzhou Delphi Laser Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100217 |