CN102742379A - 用于将rfid芯片模块附连到基底尤其是标签上的安装装置 - Google Patents

用于将rfid芯片模块附连到基底尤其是标签上的安装装置 Download PDF

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CN102742379A
CN102742379A CN2010800628699A CN201080062869A CN102742379A CN 102742379 A CN102742379 A CN 102742379A CN 2010800628699 A CN2010800628699 A CN 2010800628699A CN 201080062869 A CN201080062869 A CN 201080062869A CN 102742379 A CN102742379 A CN 102742379A
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S.比勒
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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Abstract

一种用于将具有至少一个电连接件的RFID芯片模块（2）附连到具有至少一个导体的基底（4）的安装装置，尤其是附连到标签上的安装装置，具有以下特征：(a)冲压装置（10），用于从具有多个芯片模块（2）的载体条带（8）冲压出RFID芯片模块（2），其中冲压装置包括：具有冲压孔（20）的冲压基体（22），由此，待冲压出的RFID芯片模块（2）被位置精确地接收；以及设置在冲压孔（20）上方的冲压模（16），其中，在冲压孔（20）的下面设置有用于位置精确地接收基底（4）的支撑件（24），冲压模（16）能够朝向并抵着基底（4）运动；(b)抽吸装置（26），用于保持RFID芯片模块（2）到冲压模（16）；以及加热装置（12），用于熔化任何存在于RFID芯片模块（2）上的焊接构件，用于在RFID芯片模块（2）的每个电连接件和基底（4）的相应导体之间产生导电连接。

Description

用于将RFID芯片模块附连到基底尤其是标签上的安装装置
技术领域
本发明涉及根据权利要求1的前序所述的一种用于将RFID芯片模块附连到基底尤其是标签上的安装装置。
背景技术
为了提供具有至少一个导体的基底，尤其是提供具有RFID应答器芯片的标签，如在WO 2009/003299A1中已经示出的，这被证明是有利的：首先放置这种RFID应答器芯片到RFID芯片模块上，该模块的连接件通过焊接构件提供。这些RFID芯片模块然后需要以方便的方式附连到条状的预制基底如标签尤其是纺织标签上。例如，这样的导体被印、织、缝在基底里面或上，或通过其它类似方法进行。这种导体例如是用于RFID芯片模块的天线导体。RFID芯片模块通过熔化所述焊接构件而在焊接构件被设置所在的位置被连接到导体。然而，这种安装方式是复杂的和费力的。
发明内容
因此，本发明的目的是提供一种安装装置，其能允许简化上述安装过程，同时也能改善精度。
本发明用权利要求1所述的安装装置来完成上述任务。据此，本发明的措施主要有以下结果：一方面，本发明的安装装置的各种功能允许简化，同时另一方面，生产过程的更高精度也能达到。
如果抽吸装置包括安置在冲压模的冲压侧的冲压孔时，本发明的安装装置尤其有利的。为了通过抽吸管线实施抽真空，冲压孔连接到抽吸装置上，优选连接到抽吸泵。
而且，如果加热装置包括形成在冲压模的冲压侧的热点部时，会非常有利的。热点部可以配置成例如在冲压模的冲压侧的孔，通过所述孔，激光束撞击RFID芯片模块上的具有焊接构件的位置。热点部能被构造成热电极，所述热电极优选可以朝向焊接区域进给并通过形成在冲压模里的导引通道而从那里缩回，并且通过激光或者加热套给所述热电极供热。
根据本发明所使用的上述元件，以及在下列示例性实施例中所要求和描述的元件，在它们的尺寸，形状，材料选择和技术设计方面并不以排他的方式受限于任何特定情形，以使得在各自应用领域里的已知选择标准能够无限制地使用。
附图说明
参考附图能够更详细的描述本发明的实例，其中：
图1是用于附连RFID芯片模块到标签上的安装装置的示意图；
图2是根据图1的在起始位置上的安装装置的垂直剖面图；
图3是根据图2的在布置和焊接RFID芯片模块时期的安装装置；
图4是安装装置的冲压模的详图。
具体实施方式
图1-4示出了用于安装RFID芯片模块2到标签形式的基底4上的装置，其中基底4以基底条带6的形式供应，并且RFID芯片模块2以载体条带8的形式供应给冲压装置10。冲压装置10每次从载体条带8中冲压出RFID芯片模块2且把芯片模块2直接递送到设置在下方的基底4。冲压装置10结合加热装置12，加热装置12连接已经设置有焊接构件的RFID芯片模块2到导体上，尤其是天线导体上，RFID芯片模块2通过熔化焊接构件而布置在基底4上。存在于RFID芯片模块2上的焊接构件和布置在基底4上的导体，尤其是天线导体，未示出。
冲压装置10包括布置在可移动的承载板14上的冲压模16，冲压模的冲压侧18面对冲压基体22的冲压孔20。载体条带8位于冲压基体22的顶部，且被递送以使得待冲压出的RFID芯片模块2被位置精确地定位在冲压孔20处。驱动装置这里未详细示出，驱动装置驱动冲压模16从而通过冲压孔20朝向且抵着基底4冲压出RFID芯片模块，所述基底4位置精确地布置在冲压孔20下面的支撑件24上。具有RFID芯片模块2的载体条带8和具有基底4的基底条带6的位置精确的递送，原则上能够手动执行，但是具有依照基底和RFID芯片模块的实施例通过控制构件控制的导轨和递送装置，会更加方便。
为了避免被冲压出的RFID芯片模块的不受控制地落下，冲压装置10配置有抽吸装置26，其能保持RFID芯片模块2在其冲压出的冲压侧18，直到附连到基底4上。为了这个目的，在目前的实例中，具有至少一个抽吸孔28，该抽吸孔28设置在冲压侧并且通过冲压模16里的抽吸通道30以未示出的方式连接到抽真空装置。当冲压出RFID芯片模块时，在抽吸孔处施加抽真空，在RFID芯片模块连接到基底以后，关闭抽真空。
和冲压装置10结合的加热装置12包括在冲压模16的冲压侧18的热点部32，热点部被分配给焊接点，由此，热供应可以通过各种方法和构件完成（激光，加热套等）。在目前的实例里，热点部32优选通过加热元件（热电极）34形成，该加热元件34设置在通过在此未详细示出的驱动构件可移动的支撑件36上。在RFID芯片模块2被冲压出及沉积在基底4上以后，加热元件34通过冲压模16里的导引通道38实现和RFID芯片模块2的接触，目的是熔化在RFID芯片模块上的焊接构件，将其连接件与基底4的导体线连接。在熔化焊接构件后，加热元件34被退回，冲压模16保持在RFID芯片模块2直到焊接构件已经固化，由此来防止其分离。随后，冲压模16移动回其起始位置。尤其有利的是，加热装置包括激光装置，其能通过各导引通道发射激光束到RFID芯片模块的相应的焊接点上。激光装置允许在热量和时间方面改善焊接过程的控制。
基底可以是例如由纸，塑料，或者织物材料制成的条带。导体可以通过印刷，缝合，尤其是织入或者编织连接到相应的基底。尤其的，基底是标签。
附图标记列表
2RFID芯片模块
4基底
6基底条带
8载体条带
10冲压装置
12加热装置
14承载板
16冲压模
18冲压侧
20冲压孔
22冲压基体
24支撑件
26抽吸装置
28抽吸孔
30抽吸通道
32热点部
34加热元件
36支撑件
38导引通道

Claims (7)

1.一种用于将具有至少一个电连接件的RFID芯片模块（2）附连到具有至少一个导体的基底（4）的安装装置，尤其是附连到标签上的安装装置，
其特征是，
冲压装置（10），用于从具有多个芯片模块（2）的载体条带（8）冲压出RFID芯片模块（2），其中所述冲压装置包括：具有冲压孔（20）的冲压基体（22），用于位置精确地接收待冲压出的RFID芯片模块（2）；以及设置在冲压孔（20）上方的冲压模（16），
其中，在冲压孔（20）的下面设置有用于位置精确地接收基底（4）的支撑件（24），并且其中，所述冲压模（16）能够朝向并抵着基底（4）运动；
抽吸装置（26），用于保持RFID芯片模块（2）到冲压模（16）；以及，
加热装置（12），用于熔化任何存在于RFID芯片模块（2）上的焊接构件，用于在RFID芯片模块（2）的每个电连接件和基底（4）的相应导体之间产生导电连接。
2.根据权利要求1的安装装置，其特征是，所述抽吸装置（26）包括用于在冲压模（16）的冲压侧（18）的至少一个点上抽真空的抽吸构件。
3.根据权利要求2的安装装置，其特征是，所述抽吸构件包括用于施加抽真空的设置在冲压模（16）的冲压侧（18）的冲压孔（28）。
4.根据权利要求3的安装装置，其特征是，所述冲压孔（28）经由延伸通过冲压模的抽吸通道（30）与真空提供源连接。
5.根据权利要求1-4的任一权利要求的安装装置，其特征是，所述加热装置（12）包括热电极（34），所述热电极构造为朝向焊接区域进给以及通过形成在冲压模里的导引通道（38）从那里退回。
6.根据权利要求5的安装装置，其特征是，所述热电极（34）通过激光束源或者加热套供热。
7.根据权利要求1-4的任一权利要求的安装装置，其特征是，所述加热装置（12）包括激光装置，所述激光装置包括分别导向到RFID芯片模块的待焊接位置的激光束源。
CN201080062869.9A 2010-02-06 2010-11-30 用于将rfid芯片模块附连到基底尤其是标签上的安装装置 Expired - Fee Related CN102742379B (zh)

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EP10001244A EP2355645B1 (de) 2010-02-06 2010-02-06 Montageeinrichtung zum Aufbringen eines RFID-Chipmoduls auf ein Substrat, insbesondere eine Etikette
EP10001244.2 2010-02-06
PCT/EP2010/068570 WO2011095241A1 (de) 2010-02-06 2010-11-30 Montageeinrichtung zum aufbringen eines rfid-chipmoduls auf ein substrat, insbesondere eine etikette

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WO2011095241A1 (de) 2011-08-11
CA2786765A1 (en) 2011-08-11
CA2786765C (en) 2016-08-02
US8776361B2 (en) 2014-07-15
HK1174477A1 (zh) 2013-06-07
KR20120130754A (ko) 2012-12-03
BR112012019278A2 (pt) 2018-05-08
JP2013519220A (ja) 2013-05-23
ES2386614T3 (es) 2012-08-23
US20130074327A1 (en) 2013-03-28
CN102742379B (zh) 2016-01-20
EP2355645B1 (de) 2012-06-13

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