CN102737973A - 增强igbt可靠性的器件制造方法 - Google Patents
增强igbt可靠性的器件制造方法 Download PDFInfo
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CN2011103096619A CN102737973A (zh) | 2011-10-13 | 2011-10-13 | 增强igbt可靠性的器件制造方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104409379A (zh) * | 2014-11-20 | 2015-03-11 | 上海华虹宏力半导体制造有限公司 | 改善硅片背面晶圆热点测试颜色异常的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030235959A1 (en) * | 2002-06-25 | 2003-12-25 | Siliconix Incorporated | Self-aligned differential oxidation in trenches by ion implantation |
CN101826552A (zh) * | 2010-05-06 | 2010-09-08 | 天津环鑫科技发展有限公司 | 一种具有场截止构造的非穿通型深沟槽igbt及其制造方法 |
CN102024848A (zh) * | 2010-11-04 | 2011-04-20 | 天津环鑫科技发展有限公司 | 用于功率器件的沟槽结构及其制造方法 |
CN102054702A (zh) * | 2009-11-09 | 2011-05-11 | 上海华虹Nec电子有限公司 | 沟槽功率mosfet器件制造方法 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030235959A1 (en) * | 2002-06-25 | 2003-12-25 | Siliconix Incorporated | Self-aligned differential oxidation in trenches by ion implantation |
CN102054702A (zh) * | 2009-11-09 | 2011-05-11 | 上海华虹Nec电子有限公司 | 沟槽功率mosfet器件制造方法 |
CN101826552A (zh) * | 2010-05-06 | 2010-09-08 | 天津环鑫科技发展有限公司 | 一种具有场截止构造的非穿通型深沟槽igbt及其制造方法 |
CN102024848A (zh) * | 2010-11-04 | 2011-04-20 | 天津环鑫科技发展有限公司 | 用于功率器件的沟槽结构及其制造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104409379A (zh) * | 2014-11-20 | 2015-03-11 | 上海华虹宏力半导体制造有限公司 | 改善硅片背面晶圆热点测试颜色异常的方法 |
CN104409379B (zh) * | 2014-11-20 | 2017-06-23 | 上海华虹宏力半导体制造有限公司 | 改善硅片背面晶圆热点测试颜色异常的方法 |
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