CN102730956B - The working method of protective glass - Google Patents
The working method of protective glass Download PDFInfo
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- CN102730956B CN102730956B CN201110089417.6A CN201110089417A CN102730956B CN 102730956 B CN102730956 B CN 102730956B CN 201110089417 A CN201110089417 A CN 201110089417A CN 102730956 B CN102730956 B CN 102730956B
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- glass
- cutting
- glass substrate
- cut
- etching
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Abstract
The cutting process method of the window glass that the present invention relates to the screen for hiding the terminals such as touch-screen type portable telephone terminal, PMP, notebook computer or the strengthening glass (being referred to as " protective glass ") being used in the described terminal back side.The cutting processing of protective glass of the present invention; large-size glass substrate is sheltered the shape film of multiple protective glass or ink; and after 30% to 80% of thickness of glass substrate being etched according to infiltration etch process, complete the cutting of protective glass according to spraying etch process.According to the present invention; without the need to other chamfer angle technique after cutting technique, thus can cost be saved, and can solve according to spraying etching cut surface because of tilt or rise and fall and obtuse problem; thus can size precision be guaranteed, finally can improve the price competitiveness of protective glass.
Description
Technical field
The present invention relates to the working method of the protective glass of the panel screen of the flat-panel monitor for hiding portable telephone terminal, particularly relating to and utilize etching and processing and manufacture the glass of the terminal screens such as screen, portable media playback equipment (PMP) or the notebook computer for hiding touch-screen type portable phone or be used in the method for intensity increase glass at the described terminal back side.
Background technology
Recently, the demand being called as the portable telephone terminal touching mobile phone is sharply increased.Corresponding to this, the demand of its component parts also increases severely equally thereupon.For touch-screen type portable phone, its button is removed and possesses wide screen, and user operates portable phone by exerting pressure to screen.The screen of touch-screen type portable phone utilizes so-called window glass to hide, and forms the opening portion for installing loud speaker, microphone, camera etc. as portable phone necessary functions using different shape on described glass.Therefore, the protective glass of touch-screen type portable phone preferably meets following requirement.
That is, due to can often exert pressure to glass, so surface needs possess therefore can not produce the hardness of cut.Further, for its processing, need to make it accurately coordinate with the size of terminal enclosure by accurate size control, and various opening portion also needs to be formed according to desired shape.
According to above-mentioned requirements, generally by window glass (soda-lime glass: soda lime glass) by after predetermined size cutting processing, carry out intensive treatment to improve density.Below, in the past used cutting process method and enhanced processing method are described.
For the method for size large-scale soda-lime glass being cut into predetermined protective glass, use and have the cutting mode, water cutter (water jet) mode, sandblasting (sandblast) mode etc. that utilize diamond wheel (diamond wheel).
When use is equivalent to the boart boart wheel mode of physical property patterning method, owing to being cut by revolving wheel, therefore be conducive to whole glass cutting for quadrangle is peripheral, but for the opening portion (with reference to Fig. 1) for installing loud speaker, microphone, camera essential on glass, be but difficult to be processed by revolving wheel.
Water cutter mode is mixed-abrasive in water, and utilizes strong hydraulic pressure to impact glass substrate, with the method for glass-cutting.Due at moment impact glass substrate, therefore hydraulic pressure acts on as guaranteeing the high pressure that glass substrate is fully cut.For water cutter mode, if control injector, then desired shape can be processed into accurate structure, and cut surface forms sharp keen vertical surface, therefore after all has the high advantage of size precision.After carrying out cutting processing, chamfered is carried out to the cutting part of glass substrate, to prevent shattered crack (micro crack).
Afterwards, carry out intensive treatment to improve the intensity of glass, and this intensive treatment comprises the hot schedule of reinforcement of general building materials and the chemical enhanced mode with pharmaceutical chemicals process.
Hot schedule of reinforcement is by dropping into smelting furnace (furnace) by glass, and heat with the temperature of about 800 DEG C that the melt temperature comparing glass is slightly low, and supply potassium (K) element environment with the sodium that will be contained in glass (Na) element substitution for K, improve the density of glass thus and realize strengthening.But this schedule of reinforcement, for the glass substrate of strengthening thinner thickness, can make glass substrate become curved, therefore be difficult to adopt in this way.
In contrast, chemical enhanced mode is by infiltrating the saltpetre (KNO to about 400 DEG C by glass substrate
3) in solution, strengthen to make in potassium (K) iontophoretic injection to glass substrate, therefore compared to the hot schedule of reinforcement carried out under the state that relative temperature is higher, the problem that glass substrate bends is less, so mainly adopt chemical enhanced when strengthening the glass substrate of below 1mm thickness.
But, for described water cutter mode, in any case all need the chamfer machining of the sharp keen sense carrying out polishing cut edge, but there is limitation in this for automated job, therefore Partial Jobs needs manual process, so need to pay more effort compared to cutting technique, after all there is the problem that price is enhanced.
Sandblasting mode by mulch film on the surface surrounded by line of cut of glass substrate or coating ink and sheltering, and is carried out pattern-cut by the expected go out glass by being sprayed silicon carbide.The silicon carbide finer particles used in sandblasting, then more need more times, but processing quality is more excellent.When utilizing sandblasting mode glass-cutting, compare the cutting based on above-mentioned water cutter mode, there is cutting section not sharp keen, and the shortcoming of run-off the straight and even fluctuating as shown in Figure 2 b.
And, when carrying out intensive treatment to the glass substrate utilizing sandblasting to process, when being processed to the medicine of 400 DEG C with heating, there is the shortcoming of microcrack on the glass substrate that often occurs to impact according to the sandblasting easy unfavorable condition such as damaged because of glass thermal expansion.
But, when using the fine emery grit period of the day from 11 p.m. to 1 a.m, chamfer machining due to be not must project and omit time, manufacturing expense can be saved, therefore there is certain advantages.
In addition, attempting to utilize etching (chemical milling) to carry out glass-cutting substrate.Glass surface film except line of cut or ink are sheltered, and carry out glass-cutting by spraying strong acid solution.The cutting of this etching mode can easily realize a large amount of production, and can not produce shattered crack when intensive treatment, therefore has the advantage that fraction defective is low.But there is the distinctive phenomenon of etch process, namely the shape of cut surface is not sharp keen, and can becomes or form the shortcoming risen and fallen, after all in size precision, still there is disadvantageous one side.When volume production protective glass, scale error just can be considered to meet specification when ± 30 to ± 70 μm of levels, therefore also needs the cutting improving etching mode.
Summary of the invention
The present invention proposes to solve the problems of the technologies described above, and its object is to provides a kind of glass cutting working method improving the etching mode of size precision.
The present invention can provide the working method of protective glass, and the working method of this protective glass is included in the step of large-size glass substrate being sheltered the surface surrounded by the line of cut that will cut; Masked described glass substrate is infiltrated in etching solution, to etch the step of line of cut part; And along being infiltrated the line of cut of the described glass substrate of etching, spray etching solution with atomizer, to complete the step of cutting.
Further, in the working method of described glass of the present invention, described in shelter and undertaken by coated film or ink.
And, in the working method of described glass of the present invention, in the thickness of the glass substrate cut, 30% to 80% cuts in infiltration etching step, and the thickness of remaining 20% to 70% is sprayed by the atomizer of etching solution and carries out and complete cutting.
And; in the working method of described protective glass of the present invention; infiltrating the strong acid solution using PH 1.0 to 2.5 in etching step; and with the Temperature Treatment 5 minutes to 30 minutes of 20 DEG C to 30 DEG C; spraying in the step of etching solution with atomizer, the spraying pressure of atomiser nozzle is 1.2 ± 0.5kgf/cm
2.
According to the present invention, the cutting processing of glass, owing to saving chamfer angle technique, therefore can boost productivity and guarantee price competitiveness, and due to along with infiltration etch process, therefore, it is possible to realize the sharp keen sense of cut surface, thus there is the effect improving size precision.
Accompanying drawing explanation
Fig. 1 is the orthographic plan of the shape that various glass is shown;
Fig. 2 a to Fig. 2 d is the sectional view of the cut surface illustrated according to prior art and glass of the present invention;
Fig. 3 is the schema conceptually arranging cutting technique of the present invention.
Embodiment
Below, describe in detail according to a preferred embodiment of the invention by referring to accompanying drawing.
To be the figure of the various formations of the glass of the screen illustrated for hiding touch-screen type portable phone, Fig. 2 a to Fig. 2 d be Fig. 1 that the sectional view using water cutter mode, sandblasting mode, spraying etching mode and the cut surface according to glass substrate during mixed mode with spraying etching of the infiltration of the present embodiment is shown.
Fig. 3 is the schema of the processing step of the present embodiment.
At 370mm × 470mm or 550mm × 650mm size the large-size glass substrate of thickness 0.2mm to 0.7mm carries out process for masking (S100) along the pattern of the glass of desired size.Masking material is film (film) or chemical resistant properties ink, such as, can be by polyvinyl chloride (PVC, poly vinylchloride), polyolefine (PO, poly olefine), polyethylene (PE, poly ethylene), the film that forms such as polyethylene terephthalate (PET, poly ethylene terephthlate).Further, described chemical resistant properties ink can use " GER-1000PHR30 " (trade(brand)name).Described process for masking carries out comparatively easily by using laminating machine or spin coater.
Described glass substrate through sheltering is infiltrated in the strong acid solution of PH 1.0 to 2.5, to carry out etch process (S200).Use strong acid solution in described infiltration etching and heat simultaneously, to maintain the temperature of 20 DEG C to 30 DEG C, and strong acid solution uses the solution with mixing such as hydrogen peroxide (Hydrogen peroxide), sulfuric acid (Sulfuric acid), organic acids (Organic acid), the infiltrating time of substrate is within 5 minutes to 30 minutes, to etch 30% to 80% of the whole thickness of glass substrate.This infiltration etch process has the advantage that the etching cross section of glass substrate can be made to guarantee uniform shape and size.
Then, from etching solution, take out glass substrate, utilize spraying etching to carry out cutting (S300).When carrying out spraying etching, also use the etching solution identical with the etching solution carrying out using when infiltrating and etch, and the spraying pressure of atomiser nozzle is adjusted to 1.2 ± 0.5kgf/cm
2, with complete glass-cutting substrate.
Afterwards, without the need to carrying out chamfer angle technique, directly carry out intensive treatment, to complete the processing of protective glass.
When infiltration as above etching used in combination and spraying etching, the cut surface that can solve because of glass substrate rises and falls or tilts and reduce the problem of size precision.
According to the cut surface of the glass substrate of the present embodiment in figure 2d in mode the sectional view of property illustrate.
Right of the present invention is not limited to embodiment discussed above, should scope described in claims and determining.In the field of the invention, various distortion can be carried out in the interest field that the technician with usual knowledge is described in detail in the claims and change is apparent.
Claims (3)
1. a cutting method for glass, is characterized in that comprising:
Glass substrate for display is sheltered with film the step on the surface surrounded by the line of cut with predetermined shape that will cut;
Masked described glass substrate is infiltrated in highly acid etching solution, to etch the step of line of cut part; And
Along being infiltrated the line of cut of the described glass substrate of etching, spray etching solution with atomizer, to complete the step of cutting,
Wherein, in the thickness of the glass substrate that cut, 30% to 80% cuts in infiltration etching step,
The thickness of remaining 20% to 70% is sprayed by the atomizer of etching solution and carries out and complete cutting.
2. the cutting method of glass according to claim 1, is characterized in that, described film is one in polyvinyl chloride, polyolefine, polyethylene terephthalate.
3. the cutting method of glass as claimed in claim 1, is characterized in that, is infiltrating the strong acid solution using pH 1.0 to 2.5 in etching step, and with the Temperature Treatment 5 minutes to 30 minutes of 20 DEG C to 30 DEG C,
Spraying in the step of etching solution with atomizer, the spraying pressure of atomiser nozzle is 1.2 ± 0.5kgf/cm
2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110089417.6A CN102730956B (en) | 2011-04-11 | 2011-04-11 | The working method of protective glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110089417.6A CN102730956B (en) | 2011-04-11 | 2011-04-11 | The working method of protective glass |
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| Publication Number | Publication Date |
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| CN102730956A CN102730956A (en) | 2012-10-17 |
| CN102730956B true CN102730956B (en) | 2015-08-26 |
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| CN201110089417.6A Expired - Fee Related CN102730956B (en) | 2011-04-11 | 2011-04-11 | The working method of protective glass |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103011608B (en) * | 2012-12-03 | 2016-08-03 | 广东拓捷科技股份有限公司 | A kind of manufacture method of the glass cover-plate of display device |
| KR101379684B1 (en) * | 2012-12-03 | 2014-04-01 | 주식회사 태성기연 | One tempered glass sheet shaped of the unit cell g2 touch sensor processing method and g2 touch screen making method |
| TWI461379B (en) * | 2012-12-20 | 2014-11-21 | Omi Optronics Corp Ltd | Method for processing glass |
| CN103359948A (en) * | 2013-07-12 | 2013-10-23 | 深圳南玻伟光导电膜有限公司 | Method for cutting tempered glass |
| JP7054066B2 (en) * | 2017-09-27 | 2022-04-13 | 日本電気硝子株式会社 | Glass plate with optical film and its manufacturing method |
| KR20220072012A (en) | 2020-11-23 | 2022-06-02 | 삼성디스플레이 주식회사 | Glass and method for manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1435328A (en) * | 2003-03-10 | 2003-08-13 | 河南恒昊化工技术有限公司 | Method for producing matt three-D patterned glass |
| CN1669967A (en) * | 2004-03-17 | 2005-09-21 | 西山不锈化学股份有限公司 | Glass panel surface etching method and apparatus, glass panel and flat display |
| CN201381279Y (en) * | 2009-03-16 | 2010-01-13 | 亚智科技股份有限公司 | Etching equipment |
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2011
- 2011-04-11 CN CN201110089417.6A patent/CN102730956B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1435328A (en) * | 2003-03-10 | 2003-08-13 | 河南恒昊化工技术有限公司 | Method for producing matt three-D patterned glass |
| CN1669967A (en) * | 2004-03-17 | 2005-09-21 | 西山不锈化学股份有限公司 | Glass panel surface etching method and apparatus, glass panel and flat display |
| CN201381279Y (en) * | 2009-03-16 | 2010-01-13 | 亚智科技股份有限公司 | Etching equipment |
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| CN102730956A (en) | 2012-10-17 |
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