CN102730956A - Processing method of protective glass - Google Patents
Processing method of protective glass Download PDFInfo
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- CN102730956A CN102730956A CN2011100894176A CN201110089417A CN102730956A CN 102730956 A CN102730956 A CN 102730956A CN 2011100894176 A CN2011100894176 A CN 2011100894176A CN 201110089417 A CN201110089417 A CN 201110089417A CN 102730956 A CN102730956 A CN 102730956A
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Abstract
The invention relates to a cutting processing method of window glass for covering screens of terminals of a touch screen type portable telephone, a PMP(portable media player), a notebook computer and the like, or tempered glass (commonly named protective glass) used in back sides of the terminals. The cutting processing method of the protective glass of the invention comprises the steps of masking a plurality of protective glass shapes with a film or ink on a large glass substrate, etching a part of the glass substrate with 30-80% of the thickness of the glass substrate by using an infiltration etching technology, and completing the cutting of the protective glass according to a spray etching technology. According to the invention, an additional chamfering technology is not needed after the cutting technology, so the cost is saved; and a problem that the spray-etched cutting surface is dull because of inclination or fluctuation can be solved, so the dimension accuracy can be ensured, thereby the price competitiveness of the protective glass is finally improved.
Description
Technical field
The present invention relates to be used to hide the working method of protective glass of panel screen of the flat-panel monitor of portable telephone terminal, relating in particular to the intensity of utilizing etching and processing and making the glass of the terminal screens such as screen, portable media playback equipment (PMP) or notebook computer that are used to hide the touch-screen type portable phone or be used in the back side, said terminal increases the method with glass.
Background technology
Recently, the demand that is called as the portable telephone terminal that touches mobile phone is sharply increased.Corresponding to this, the demand of its component parts equally also increases severely thereupon.For the touch-screen type portable phone, its button is removed and possesses wide screen, and the user operates portable phone through screen is exerted pressure.The screen of touch-screen type portable phone utilizes so-called window glass to hide, and at the said peristome that is formed for installing speaker as the indispensable function of portable phone, microphone, camera etc. with different shape on glass.Therefore, the protective glass of touch-screen type portable phone is preferably and satisfies following requirement.
That is, owing to can often exert pressure to glass, the surface need possess the hardness that can therefore not produce cut.And, for its processing, need control through accurate dimensions it is accurately cooperated with the size of terminal enclosure, and various peristome also need form according to desired shape.
According to above-mentioned requirements, generally with window glass (soda-lime glass:, carry out intensified process to improve density soda lime glass) by after the predetermined big or small cutting processing.Below, to employed cutting process method and enhanced processing method described in the past.
For the method that large-scale soda-lime glass is cut into the size of predetermined protective glass, use the cutting mode that utilizes diamond wheel (diamond wheel) is arranged, water cutter (water jet) mode, sandblast (sand blast) mode etc.
When use is equivalent to the boart boart wheel mode of physical property patterning method; Owing to cut through revolving wheel; Therefore help whole glass cutting peripheral for quadrangle; But for the essential peristome (with reference to Fig. 1) that is used to install speaker, microphone, camera on glass, but be difficult to process through revolving wheel.
Water cutter mode is a mixed-abrasive in water, and utilizes strong hydraulic pressure to impact glass substrate, with the method for glass-cutting.Because at the moment impact glass substrate, so hydraulic pressure acts on as guaranteeing the high pressure that glass substrate fully is cut.For water cutter mode, if the control injector then can be processed into desired shape accurate structure, and facet forms sharp keen vertical surface, so has the high advantage of size precision after all.After carrying out cutting processing, the cutting part of glass substrate is carried out chamfered, to prevent shattered crack (micro crack).
Afterwards, carry out intensified process in order to improve glass intensity, and this intensified process comprises the hot schedule of reinforcement of general building materials and the chemical enhanced mode of handling with pharmaceutical chemicals.
Hot schedule of reinforcement is through dropping into glass in smelting furnace (furnace); And heat to compare about 800 ℃ low slightly temperature of glass melting temperature; And supply potassium (K) element environment is K with sodium (Na) element substitution that will be contained in the glass, improves the density of glass thus and realizes strengthening.But this schedule of reinforcement can make glass substrate become curved for the glass substrate of strengthening thinner thickness, therefore is difficult to adopt this mode.
In contrast, chemical enhanced mode is through soaking into glass substrate to about 400 ℃ saltpetre (KNO
3) in the solution; So that potassium (K) iontophoretic injection is in the glass substrate and strengthen; Therefore than the hot schedule of reinforcement that under the higher state of relative temperature, carries out; The problem that glass substrate bends is less, so when the glass substrate of the following thickness of 1mm is strengthened, mainly adopt chemical enhanced.
But; For said water cutter mode; In any case all need polish the chamfer machining of the sharp keen sense of cut edge, but there is limitation in this for automated job, so Partial Jobs needs manual process; So need pay more effort than cutting technique, the problem that exists price to be enhanced after all.
The sandblast mode is sheltered through mulch film on the surface that is surrounded by line of cut of glass substrate or coating ink, and comes to go out glass by desired pattern-cut through spraying silicon carbide.Employed silicon carbide particle is thin more in sandblast, then need more times more, but processing quality is more excellent.When utilizing sandblast mode glass-cutting, compare cutting, exist cutting section not sharp keen based on above-mentioned water cutter mode, and the shortcoming of run-off the straight and even fluctuating shown in Fig. 2 b.
And; When the glass substrate that utilizes sandblast to process is carried out intensified process; Heated when 400 ℃ medicine is handled when using, exist and often take place according to expand because of the glass heat shortcoming of unfavorable conditions such as breakage easily of the microcrack on the ballistic glass substrate of sandblast.
But when using the fine emery grit period of the day from 11 p.m. to 1 a.m, chamfer machining can be saved manufacturing expense, so have the part advantage owing to be not when must project omitting.
In addition, attempting to utilize etching (chemical milling) to come the glass-cutting substrate.Glass surface except line of cut is sheltered with film or ink, and comes glass-cutting through spraying strong acid solution.The cutting of this etching mode can realize mass production easily, and when intensified process, can not produce shattered crack, therefore has the low advantage of fraction defective.But, there is the distinctive phenomenon of etch process, promptly the shape of facet is not sharp keen, and the shortcoming of inclination or formation fluctuating that can become, and aspect size precision, still has disadvantageous one side after all.When the volume production protective glass, scale error just can be considered to satisfy specification when ± 30 to ± 70 μ m levels, therefore also need improve the cutting of etching mode.
Summary of the invention
The present invention proposes in order to solve the problems of the technologies described above, and its purpose is to provide a kind of glass cutting working method that improves the etching mode of size precision.
The present invention can provide the working method of protective glass, the working method of this protective glass be included in shelter on the large-size glass substrate by the step on the surface that surrounds of the line of cut that will cut; Masked said glass substrate is soaked in the etching solution, with the step of etching line of cut part; And, spray etching solution with atomizer along the line of cut that is soaked into etched said glass substrate, to accomplish step of cutting.
And in the working method of said glass of the present invention, said sheltering through coated film or ink carried out.
And; In the working method of said glass of the present invention; 30% to 80% in soaking into etching step, cut in the thickness of the glass substrate that will cut, the atomizer of remaining 20% to 70% thickness through etching solution sprays and carries out and accomplish cutting.
And; In the working method of said protective glass of the present invention; In soaking into etching step, use the strong acid solution of PH 1.0 to 2.5; And with 20 ℃ to 30 ℃ Temperature Treatment 5 minutes to 30 minutes, spraying in the step of etching solution with atomizer, the spraying pressure of atomiser nozzle is 1.2 ± 0.5kgf/cm
2
According to the present invention; Price competitiveness can boosted productivity and guarantee to the cutting processing of glass therefore owing to can save chamfer angle technique, and owing to be accompanied by the infiltration etch process; Therefore can realize the sharp keen sense of facet, thereby have the effect that improves size precision.
Description of drawings
Fig. 1 is the plat that the shape of various glass is shown;
Fig. 2 a to Fig. 2 d is the sectional view that illustrates according to the facet of prior art and glass of the present invention;
Fig. 3 is for conceptually putting the schema of cutting technique of the present invention in order.
Embodiment
Below, through specifying according to a preferred embodiment of the invention with reference to accompanying drawing.
Fig. 1 is the figure of various formations that the glass of the screen that is used to hide the touch-screen type portable phone is shown, and Fig. 2 a to Fig. 2 d illustrates to make water cutter mode, sandblast mode, spraying etching mode and according to the infiltration of present embodiment and the etched sectional view of the facet of glass substrate when using mode with of spraying.
Fig. 3 is the schema of the process step of present embodiment.
Pattern along the glass of desired size on the large-size glass substrate of 370mm * 470mm or 550mm * 650mm size and thickness 0.2mm to 0.7mm carries out process for masking (S100).Masking material is film (film) or chemical resistant properties ink; For example; Can be by SE (PVC, poly vinyl chloride), polyolefine (PO, poly olefine), Vilaterm (PE; Poly ethylene), the film that constitutes such as polyethylene terephthalate (PET, poly ethylene terephthlate).And said chemical resistant properties ink can use " GER-1000PHR30 " (trade(brand)name).Said process for masking carries out comparatively easily through using laminating machine or spin coater.
To soak into through the said glass substrate of sheltering in the strong acid solution of PH 1.0 to 2.5, to carry out etch process (S200).Use strong acid solution also to heat simultaneously in the described infiltration etching; To keep 20 ℃ to 30 ℃ temperature; And strong acid solution uses with hydrogen peroxide (Hydrogen peroxide), sulfuric acid (Sulfuric acid), organic acid blended solution such as (Organic acid); The infiltrating time of substrate is in 5 minutes to 30 minutes, so that 30% to 80% of the whole thickness of glass substrate is carried out etching.This infiltration etch process has the advantage that uniform shape and size are guaranteed in the etching cross section that can make glass substrate.
Then, from etching solution, take out glass substrate, utilize the spraying etching to accomplish cutting (S300).When spraying etching, also use the identical etching solution of employed etching solution when soaking into etching, and the spraying pressure of atomiser nozzle is adjusted into 1.2 ± 0.5kgf/cm
2, with complete glass-cutting substrate.
Afterwards, need not to carry out chamfer angle technique, directly carry out intensified process, to accomplish the processing of protective glass.
When mix using aforesaid infiltration etching, can solve the problem that facet because of glass substrate rises and falls or tilts to reduce size precision with the spraying etching.
Facet sectional view with model utility in Fig. 2 d according to the glass substrate of present embodiment illustrates.
Right of the present invention is not limited to embodiment discussed above, should decide according to the scope that claims are put down in writing.In the field of the invention, have and to carry out various distortion in the interest field that the technician of common knowledge put down in writing and change is conspicuous in claims.
Claims (4)
1. the working method of a glass is characterized in that comprising:
On large-size glass substrate, shelter by the step on the surface that surrounds of the line of cut that will cut;
Masked said glass substrate is soaked in the etching solution, with the step of etching line of cut part; And
Line of cut along being soaked into etched said glass substrate sprays etching solution with atomizer, to accomplish step of cutting.
2. the working method of glass according to claim 1 is characterized in that, said sheltering through coated film or ink carried out.
3. the working method of glass according to claim 1 is characterized in that, 30% to 80% in soaking into etching step, cut in the thickness of the glass substrate that will cut,
The atomizer of remaining 20% to 70% thickness through etching solution sprays and carries out and accomplish cutting.
4. like the working method of claim 1 or 3 described glass, it is characterized in that, in soaking into etching step, use the strong acid solution of PH 1.0 to 2.5, and with 20 ℃ to 30 ℃ Temperature Treatment 5 minutes to 30 minutes,
Spraying in the step of etching solution with atomizer, the spraying pressure of atomiser nozzle is 1.2 ± 0.5kgf/cm
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110089417.6A CN102730956B (en) | 2011-04-11 | 2011-04-11 | The working method of protective glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110089417.6A CN102730956B (en) | 2011-04-11 | 2011-04-11 | The working method of protective glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102730956A true CN102730956A (en) | 2012-10-17 |
| CN102730956B CN102730956B (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110089417.6A Expired - Fee Related CN102730956B (en) | 2011-04-11 | 2011-04-11 | The working method of protective glass |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103011608A (en) * | 2012-12-03 | 2013-04-03 | 汕头市拓捷科技有限公司 | Manufacturing method for glass cover plate of display equipment |
| CN103359948A (en) * | 2013-07-12 | 2013-10-23 | 深圳南玻伟光导电膜有限公司 | Method for cutting tempered glass |
| CN103853375A (en) * | 2012-12-03 | 2014-06-11 | 株式会社太星技研 | Processing method of tempered glass sheet and making method of g2 touch screen |
| TWI461379B (en) * | 2012-12-20 | 2014-11-21 | Omi Optronics Corp Ltd | Method for processing glass |
| CN111149025A (en) * | 2017-09-27 | 2020-05-12 | 日本电气硝子株式会社 | Glass plate with optical film and method for producing same |
| US11802078B2 (en) | 2020-11-23 | 2023-10-31 | Samsung Display Co., Ltd. | Glass and method of manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1435328A (en) * | 2003-03-10 | 2003-08-13 | 河南恒昊化工技术有限公司 | Method for producing matt three-D patterned glass |
| CN1669967A (en) * | 2004-03-17 | 2005-09-21 | 西山不锈化学股份有限公司 | Glass panel surface etching method and apparatus, glass panel and flat display |
| CN201381279Y (en) * | 2009-03-16 | 2010-01-13 | 亚智科技股份有限公司 | Etching equipment |
-
2011
- 2011-04-11 CN CN201110089417.6A patent/CN102730956B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1435328A (en) * | 2003-03-10 | 2003-08-13 | 河南恒昊化工技术有限公司 | Method for producing matt three-D patterned glass |
| CN1669967A (en) * | 2004-03-17 | 2005-09-21 | 西山不锈化学股份有限公司 | Glass panel surface etching method and apparatus, glass panel and flat display |
| CN201381279Y (en) * | 2009-03-16 | 2010-01-13 | 亚智科技股份有限公司 | Etching equipment |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103011608A (en) * | 2012-12-03 | 2013-04-03 | 汕头市拓捷科技有限公司 | Manufacturing method for glass cover plate of display equipment |
| CN103853375A (en) * | 2012-12-03 | 2014-06-11 | 株式会社太星技研 | Processing method of tempered glass sheet and making method of g2 touch screen |
| CN103011608B (en) * | 2012-12-03 | 2016-08-03 | 广东拓捷科技股份有限公司 | A kind of manufacture method of the glass cover-plate of display device |
| TWI461379B (en) * | 2012-12-20 | 2014-11-21 | Omi Optronics Corp Ltd | Method for processing glass |
| CN103359948A (en) * | 2013-07-12 | 2013-10-23 | 深圳南玻伟光导电膜有限公司 | Method for cutting tempered glass |
| CN111149025A (en) * | 2017-09-27 | 2020-05-12 | 日本电气硝子株式会社 | Glass plate with optical film and method for producing same |
| US11802078B2 (en) | 2020-11-23 | 2023-10-31 | Samsung Display Co., Ltd. | Glass and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102730956B (en) | 2015-08-26 |
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