CN102717446A - Four-roller sapphire slicing machine - Google Patents
Four-roller sapphire slicing machine Download PDFInfo
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- CN102717446A CN102717446A CN2012102447966A CN201210244796A CN102717446A CN 102717446 A CN102717446 A CN 102717446A CN 2012102447966 A CN2012102447966 A CN 2012102447966A CN 201210244796 A CN201210244796 A CN 201210244796A CN 102717446 A CN102717446 A CN 102717446A
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Abstract
The invention provides a four-roller sapphire slicing machine. Axis connecting lines of four cutting rollers form an isosceles trapezoid, so that three segments of diamond lines with the same length and winding degree are formed among the four cutting rollers, and the precision of sapphire silicon ingots is ensured. In addition, the three sapphire silicon ingots can be simultaneously cut, and therefore, the four-roller sapphire slicing machine can be used for greatly increasing the working efficiency of cutting the sapphire silicon ingots as comparison with the prior art in which only one segment of cutting line is provided and only one sapphire silicon ingot can be cut at one step; and the cutting rollers capable of shaking in a reciprocated way are adopted, the sapphire silicon ingots are in point contact with the cutting lines, and therefore, the length of a contact surface between each diamond line and each sapphire silicon ingot is greatly reduced, i.e., the cutting resistance is weakened, the cutting capacity is improved, and the cutting precision is also improved.
Description
Technical field
The present invention relates to a kind of multi-thread cutting technique, particularly relate to a kind of four roller slicers that are used for the cutting sapphire silicon ingot.
Background technology
We know, LED in current society purposes very extensively, on for example various communication equipments, instrument and meter and display floater are backlight all with a large amount of LED is arranged.Sapphire (Sapphire) has critical role as the important materials of making LED at semiconductor applications.Before being formed for making LED silicon on sapphire substrate, still need carry out front end processing to the silicon on sapphire material, be about to the operation that the sapphire silicon ingot is cut into slices.Now the sapphire silicon ingot is carried out slice processing and generally adopt multi-thread cutting, multi-thread cutting technique is present more advanced in the world silicon chip process technology.Thereby its principle is the steel wire through a high-speed motion to be driven attached to the cutting blade material on the steel wire sapphire silicon ingot to be rubbed and reaches the cutting purpose.Line cutting technology is compared with traditional knife saw sheet, grinding wheel and interior circle cutting has the efficient height, and production capacity is high, less energy consumption, precision advantages of higher.
As shown in Figure 1, shown existing a kind of simplified structure sketch map that is used for the slicer of cutting sapphire silicon ingot.As shown in Figure 1, existing slicer comprises: frame 10 is arranged on the workbench 11 on the frame 10; The wire storage tube that is used for retractable Buddha's warrior attendant line; The a plurality of guide roller that the Buddha's warrior attendant line leads and two cutting rollers 12 that are crossed on the relative both sides of workbench of being used to, said two cutting rollers 12 are for being horizontally disposed with, and the Buddha's warrior attendant line that between twines forms one section line of cut 13; What be arranged on line of cut 13 tops send part tool 14, is fixed with sapphire silicon ingot 15 on the part tool 14 sending.In actual cutting process to sapphire silicon ingot 15; The Buddha's warrior attendant line is through the guiding of tens guide rollers; On the cutting roller 12 of the relative both sides of workbench, form a bracing cable net, send part tool 14 that fixing sapphire silicon ingot 15 is transported towards line of cut 13, compression pump effect under; Be assemblied in grinding agent automatic spraying device on the equipment and grinding agent be sprayed to the cutting position of line of cut 13 and sapphire silicon ingot 15; Drive grinding agent by line of cut 13 and back and forth tell motion, utilize abrasive sand that sapphire silicon ingot 15 is produced cutting, so that sapphire silicon ingot 15 once is cut into silicon on sapphire simultaneously.
On the sapphire silicon ingot slicer in the prior art; The cutting roller that is positioned at the relative both sides of workbench is set on relative two heel posts of frame, thereby the span between the left and right cutting roller is very big, so the Buddha's warrior attendant line cable run distance between the cutting roller of both sides is also very long; In the section operation of reality; When the cutting roller with the relative both sides of workbench lowers, when the Buddha's warrior attendant line between the cutting roller of both sides was urged to workpiece, it is very big around curvature that the Buddha's warrior attendant line is formed; Thereby the Buddha's warrior attendant line also just receives maximum running resistance all the time; Be difficult for cutting owing to workpiece itself often has very high hardness, add to the requirement of workpiece section precision very strict again, so above-mentioned set-up mode because of cutting roller causes the excessive influence cutting precision that is easy to of Buddha's warrior attendant wire-wound curvature.
In addition; In the above-mentioned crystalline silicon bar slicer; Only be provided with two cutting rollers of horizontal layout, make between the cutting area be used to supply the cutting sapphire silicon ingot single (be merely the steel wire that twines between two cutting rollers in both sides and form one section line of cut), so; Single can the cutting sapphire silicon ingot quantity also seldom (general single is only supported the cutting of a sapphire silicon ingot), the operating efficiency of cutting is lower.
Have again, send part tool, its complex structure and with high costs in the sapphire silicon ingot slicer of prior art; What is more important send the part tool to send the part wall for being driven by a supporting plate, and the supporting plate volume is big; Heavier, make and send the precision of part to control, especially require the sapphire rod of higher size less (diameter is littler) to the precision control of section; Problem is more outstanding, thereby influences the cut quality of follow-up sapphire silicon ingot.
Therefore, how a kind of cutting equipment that is applied to the sapphire silicon ingot is provided, to avoid above-described disappearance, real is dealer's problem demanding prompt solution of association area.
Summary of the invention
The shortcoming of prior art the object of the present invention is to provide a kind of four roller sapphire slicers in view of the above, and existing cutting precision is not high, the cutting operating efficiency is low and send the part precision to control problems such as bad to solve.
For realizing above-mentioned purpose and other relevant purposes, the present invention provides a kind of four roller sapphire slicers to comprise at least: frame has the work piece cut district; The cutting swing disc, axle is located in the work piece cut district of said frame, and its edge is provided with one section arc-shaped rack; Driven wheel is installed on the said frame, and is meshed with said arc-shaped rack, and when forward and reverse rotation, driving said cutting swing disc is that the axle center is predetermined angle and waves with its center of circle; First, second, third, fourth cutting roller; Be arranged on the said cutting swing disc and when said cutting swing disc is waved and together wave; The center of circle equidistance of the axle center of above-mentioned four cutting rollers and said cutting shaking tray; The axial connecting line of said first, second, third, fourth cutting roller constitutes two drift angles and is respectively 108 °, and two base angles are respectively 72 ° isosceles trapezoid; The Buddha's warrior attendant line; Be wound in successively on said the first, second and third, the 4th cutting roller; Said Buddha's warrior attendant line said first, second, third, and the 4th cutting roller between form four sections lines of cut; When said Buddha's warrior attendant line runs up, simultaneously three sapphire silicon ingots are carried out cutting operation by three sections isometric lines of cut wherein; And three sent the part tool, corresponding with said three sections isometric lines of cut respectively, be used for transporting respectively on said three sapphire silicon ingots to said three sections isometric lines of cut and carry out cutting operation.
Preferably, the rocking tendency of said cutting swing disc is ± 5 °.
Said three send the part tool comprise correspondence be formed on first of first cut length between said first and second cutting roller send part tool, correspondence be formed on said second with the 3rd cutting roller between second cut length second send part tool and corresponding to be formed on the 3rd of the 3rd cut length between the said the 4th and first cutting roller to send the part tool.
Wherein, said first send the part tool to comprise is arranged on the said frame, can towards the said first cut length straight line move be used to transport said sapphire silicon ingot break away from and/or oppress said line of cut send the part planker.
Said second, third send the part tool to comprise respectively: the swing arm seat is located on the said frame; Swing arm is coupling in the top of said swing arm seat through a rotating shaft, said swing arm can around with the scope of said rotating shaft in predetermined angle in swing; Send the part arm, be located in the said swing arm and and extend, fixing said sapphire silicon ingot towards said line of cut; Screw rodb base is located on the crossbeam of said frame; And driving mechanism; Be movably arranged in said screw rodb base and the swing arm; At least comprise drive motors and by the screw mandrel of said drive motor drives with the operation of stretching; The near-end that said screw mandrel closes on said drive motors is movably connected on the said screw rodb base, and away from the far-end and the said swing arm flexible connection of said drive motors, the said swing arm of said screw mandrel push-and-pull when flexible is swung so that said swing arm is transported said sapphire silicon ingot disengaging and/or oppressed said line of cut.
Wherein, Also comprise by said swing arm and extend the extension arm that connects; Its top is connected with the far end activity of said screw mandrel; The top of said extension arm and the far-end of said screw mandrel are provided with the first screw mandrel reviving joints, and dispose first feed screw nut who in the scope of predetermined angle, rotates in the said first screw mandrel reviving joints.
The near-end of said screw mandrel and said screw rodb base are provided with the second screw mandrel reviving joints, and dispose second feed screw nut who in the scope of predetermined angle, rotates in the said second screw mandrel reviving joints.
Said second, third send the part tool also to comprise to be arranged on said screw mandrel the top away from the far-end of said drive motors, be used to prevent that said screw mandrel breaks away from the error-proof structure that is connected with said first feed screw nut.
The Buddha's warrior attendant line speed of service in the four roller sapphire slicers of the present invention is more than or equal to 720m/min ~ 900m/min.
Four roller sapphire slicers of the present invention also comprise the directive wheel that is used for said Buddha's warrior attendant line guiding, be used to the wire storage tube that absorbs the regulating wheel of said Buddha's warrior attendant line tension and be used for the said Buddha's warrior attendant line of folding and unfolding.
As stated; Four roller sapphire slicers provided by the present invention; Four cutting rollers are provided, and the axial connecting line of four cutting rollers constitutes two drift angles and is respectively 108 °, and two base angles are respectively 72 ° isosceles trapezoid; Thereby guarantee between four said cutting rollers to form three segment length with around the identical Buddha's warrior attendant line of curvature, thereby guaranteed the accuracy of sapphire silicon ingot.And, can cut three sapphire silicon ingots simultaneously, compared to only providing one section line of cut single only to support the prior art of a sapphire silicon ingot cutting, the present invention can improve the operating efficiency of sapphire silicon ingot cutting greatly;
Moreover; Send the part tool in the present invention's four roller sapphire slicers; Mainly be to adopt swing arm slightly swing and the screw mandrel mode of accurately controlling the swing arm amplitude of oscillation transport the sapphire silicon ingot, push with respect to supporting plate of the prior art, realized sending the precision control of part; Improve the operation effectiveness that transports precision and follow-up cutting operation thereof of sapphire silicon ingot, produced high-quality silicon on sapphire;
Four roller sapphire slicers provided by the present invention, owing to adopt the cutting roller that can back and forth wave, the sapphire silicon ingot is the point type way of contact with the cutting linear array; Significantly reduce the contact-making surface length of Buddha's warrior attendant line and sapphire silicon ingot, promptly weakened the cutting resistance, also reduced the wearing and tearing of Buddha's warrior attendant line; Improved the service life of Buddha's warrior attendant line; Simultaneously, improve cutting power, also improved cutting accuracy.
Description of drawings
Fig. 1 is used for the simplified structure sketch map of the slicer of cutting sapphire silicon ingot for prior art.
Fig. 2 is shown as the simplified structure sketch map of the present invention's four roller sapphire slicers.
Fig. 3 is shown as the wabbler mechanism sketch map of the cutting swing disc in the present invention's four roller sapphire slicers.
Fig. 4 is shown as and send part tool structural scheme of mechanism in the present invention's four roller sapphire slicers.
Fig. 5 is shown as the mode of the waving sketch map of cutting swing disc.
Fig. 6 A to Fig. 6 C is the incision principle sketch map of the present invention's four roller sapphire slicers.
The specific embodiment
Below by particular specific embodiment embodiment of the present invention is described, be familiar with this technological personage and can understand other advantages of the present invention and effect easily by the content that this specification disclosed.
See also Fig. 2 to Fig. 6 C, shown that the present invention is used for the slicer structural representation in one embodiment of cutting sapphire silicon ingot.
As shown in Figure 2, be shown as the simplified structure sketch map of the present invention's four roller sapphire slicers, the present invention provides a kind of four roller sapphire slicers, and it is applied to sapphire silicon ingot 90 is carried out cutting operation.Said sapphire silicon ingot 90 is cube, comprises relative end face, bottom surface and four sides between said end face and said bottom surface.In this embodiment; Said four roller sapphire slicers comprise at least: frame 10, cutting swing disc 20, driven wheel 110; First cutting roller 31, second cutting roller 32, the 3rd cutting roller 33, the 4th cutting roller 34; 40, three on Buddha's warrior attendant line send part tool 51,52,53, parts such as the regulating wheel 70 of directive wheel 60, tension force and wire storage tube 80.
Said first cutting roller 31, second cutting roller 32, the 3rd cutting roller 33, the 4th cutting roller 34 are arranged on the said cutting swing disc 20; Wherein, The axle center of said first cutting roller 31 and second cutting roller 32 is positioned on the same horizontal line; The axle center of said the 3rd cutting roller 33 and the 4th cutting roller 34 is positioned on the same horizontal line; Said first cutting roller 31, second cutting roller 32, the 3rd cutting roller 33, the 4th cutting roller 34 together wave (being state as shown in Figure 5) when said cutting swing disc 20 is waved; Said first cutting roller 31, second cutting roller 32, the 3rd cutting roller 33, the axle center of the 4th cutting roller 34 and the center of circle equidistance of said cutting shaking tray; The axial connecting line of said first cutting roller 31, second cutting roller 32, the 3rd cutting roller 33, the 4th cutting roller 34 constitutes two drift angles and is respectively 108 ° (the α angles among Fig. 3), and two base angles are respectively the isosceles trapezoid at 72 ° (the β angles among Fig. 3).
Said Buddha's warrior attendant line 40 be wound in successively said first cutting roller 31, second cutting roller 32, the 3rd cutting roller 33, and the 4th cutting roller 34 on; Said Buddha's warrior attendant line 40 said first, second, third, and the 4th cutting roller 31,32,33, and form four sections lines of cut between 34; When said Buddha's warrior attendant line 40 runs up, simultaneously three sapphire silicon ingots 90 are carried out cutting operation by three sections isometric lines of cut wherein; Form first cut length (not label) between said first cutting roller 31 and second cutting roller 32; Form second cut length (not label) between said second cutting roller 32 and the 3rd cutting roller 33; Form the 3rd cut length (not label) between said the 4th cutting roller 34 and first cutting roller 31; And said first, second, and the 3rd cut length isometric; Because guaranteed to participate in three sections Buddha's warrior attendant lines 40 identical around curvature of cutting, thereby guaranteed to be positioned at simultaneously the sharpnes of cuts of sapphire silicon ingot 90 on three sections lines of cut, the speed of service of said Buddha's warrior attendant line 40 is more than or equal to 720m/min ~ 900m/min; Said Buddha's warrior attendant line 40 tightening forces are tension force; Determined that in this embodiment, the tension force of slicer provided by the invention is 35N/M around the curvature size; Regulating wheel 70 by being arranged on the line of cut transfer path is absorbed in the tension force that produces in the cutting process; Said slicer also comprises two wire storage tubes 80 of directive wheel 60 to form the cutting net and to be used for the said Buddha's warrior attendant line 40 of retractable that are used for said Buddha's warrior attendant line 40 guiding, and said wire storage tube 80 drives said wire storage tube 80 rotations by motor (not shown), and then makes its take-up or unwrapping wire and make said Buddha's warrior attendant line 40 run up.
See also Fig. 4; Be shown as and send part tool structural scheme of mechanism; As shown in the figure, in the said four roller sapphire slicers three send part tool 51,52, and 53 corresponding with said three sections isometric lines of cut respectively, be used for transporting respectively on 90 to three sections isometric lines of cut of said three sapphire silicon ingots and carry out cutting operation.
Said three are sent part tool 51,52, and 53 comprise that correspondence is formed on first of said first and second cutting roller 31, first cut length between 32 and send part tool 51; Correspondence is formed on second of the said second and the 3rd cutting roller 32, second cut length between 33 and send part tool 52, and corresponding the 3rd of the said the 4th and first cutting roller 34, the 3rd cut length between 31 that be formed on sent part tool 53.
Wherein, Said first send part tool 51 to comprise is arranged on the said frame 10, can towards the said first cut length straight line move (as illustrating the direction shown in the vertical arrow) be used to transport said sapphire silicon ingot 90 break away from and/or oppress said line of cut send the part planker.
Said second send part tool the 52, the 3rd to send part tool 53 to comprise respectively: swing arm seat 520,530, and swing arm 522,532, screw mandrel 527,537 send part arm 523,533, screw rodb base 524,534, drive motors 526,536, and driving mechanism.
Be simplified illustration, in the present embodiment, send the structure of part tool 52 and principle to elaborate with said second temporarily.
Said swing arm seat 520 is located on the said frame 10, and said swing arm 522 is coupling in the top of said swing arm seat 520 through a rotating shaft 521, said swing arm 522 can around with the scope of said rotating shaft 521 in predetermined angle in swing; Particularly; The extension arm 5221 that connects is extended in said swing arm 522; Its top is connected with the far end activity of said screw mandrel 527; The far-end of the top of said extension arm 5221 and said screw mandrel 527 is provided with the first screw mandrel reviving joints 528, and disposes first feed screw nut (not label) who in the scope of predetermined angle, rotates in the said first screw mandrel reviving joints 528.
Saidly send part arm 523 to be located in the said swing arm 522 and extend fixing said sapphire silicon ingot 90 towards said line of cut; In the present embodiment; The said bonding medium that has on the part arm 523 in order to the bottom surface of binding sapphire silicon ingot 90 that send; Particularly, said bonding medium can be for example to bind glue, and said bonding glue together binds a glass (not indicating) on the bottom surface of sapphire silicon ingot 90; After slice is accomplished, dissolve bonding glue and separate sapphire silicon ingot 90 and glass with hot water.
Said screw rodb base 520 is located on the crossbeam (diagram) of said frame 10; Said driving mechanism is movably arranged in said screw rodb base 520 and the swing arm 522; At least comprise drive motors 526 and the screw mandrel 527 that drives with the operation of stretching by said drive motors 526; The near-end that said screw mandrel 527 closes on said drive motors 526 is movably connected on the said screw rodb base 524; Far-end and said swing arm 522 away from said drive motors 526 flexibly connect, and the said swing arm 522 of said screw mandrel 527 push-and-pull when flexible is swung so that said swing arm 522 is transported said sapphire silicon ingot 90 disengagings and/or oppressed said line of cut.
The near-end of said screw mandrel 527 and said screw rodb base 524 are provided with the second screw mandrel reviving joints 529, and dispose second feed screw nut (not indicating) who in the scope of predetermined angle, rotates in the said second screw mandrel reviving joints 529.
Said second send part tool 52 also to comprise be arranged on said screw mandrel 527 the top away from the far-end of said drive motors 526, be used to prevent that said screw mandrel 527 breaks away from the error-proof structure that is connected (not shown) with said first feed screw nut.In this embodiment; Said error-proof structure can be catch or the block (not shown) that is attached to the top of screw mandrel 527 far-ends; The size of said catch or block is greater than the diameter (promptly greater than first feed screw nut aperture) of screw mandrel 527, thereby can prevent that screw mandrel 527 breaks away from and being connected of first feed screw nut because of misoperation in rotary course.
In practical application; Screw mandrel 527 runs through first feed screw nut and first feed screw nut in the second screw mandrel reviving joints 529 in the first screw mandrel reviving joints 528; Under the driving of drive motors 526; Screw mandrel 527 produces rotation and makes expanding-contracting action, and 90 disengagings of sapphire silicon ingot and/or compressing line of cut are transported in swing arm 522 thereby push-and-pull swing arm 522 is swung in the scope of predetermined angle.In this embodiment, swing arm 522 can be that 0 degree is to 20 degree around the predetermined angle scope with rotating shaft 521 swings.
In the cutting process of reality; Said sending fixed sapphire silicon ingot 90 on the part arm 523; Swing arm 522 and the extension arm 5221 that extends thereof are certain inclination angle with frame 10; On second feed screw nut that the proximally-located of closing on drive motors 526 in the screw mandrel 527 is joined in the second screw mandrel reviving joints 529, in the screw mandrel 527 away from the far-end of drive motors 526 then with the first screw mandrel reviving joints 528 in first feed screw nut that joins keep being connected.Because swing arm 522 and the extension arm 5221 that extends thereof are certain inclination angle with frame 10; Therefore; In this case; Structure in the driving mechanism, for example first feed screw nut in screw mandrel 527, the first screw mandrel reviving joints 528, second feed screw nut in the second screw mandrel reviving joints 529 and drive motors 526 etc. maintain certain inclination.
Continuation is with reference to figure 4, and under the driving of drive motors 526, screw mandrel 527 produces rotation; Through matching with first feed screw nut, screw mandrel 527 has more section precession first feed screw nut, the extension arm 5221 that progressively furthers swing arm 522 and extend; Make them swing to screw rodb base; Carry out cutting operation thereby transport sapphire silicon ingot 90 approaching second cut length, after accomplishing when cutting operation, the final position of swing arm 522 (comprising extension arm 5221) is horizontal by 90 ° of angles; At this moment; The first screw mandrel reviving joints 528 and the second screw mandrel reviving joints 529 are in same level, the structure in the driving mechanism, and for example first feed screw nut in screw mandrel 527, the first screw mandrel reviving joints 528, second feed screw nut and the drive motors 526 in the second screw mandrel reviving joints 529 flush with horizontal plane.
In the above-mentioned mechanical mechanism; The mode that adopts swing arm 522 small size swings and screw mandrel accurately to control swing arm 522 amplitudes of oscillation is transported the sapphire silicon ingot; Push with respect to supporting plate of the prior art; Realize sending the precision control of part, improved the operation effectiveness that transports precision and follow-up cutting operation thereof of sapphire silicon ingot, produced high-quality silicon on sapphire.
The 3rd send part tool 53 and second to send part tool 52 frame for movements and operation principle identical, so repeat no more at this.
See also Fig. 5 and Fig. 6 A to 6C, Fig. 5 is shown as the mode of the waving sketch map of cutting swing disc, and Fig. 6 A to Fig. 6 C is the incision principle sketch map of the present invention's four roller sapphire slicers.As shown in the figure, in cutting operation, when said Buddha's warrior attendant line 40 runs up; In the said four roller sapphire slicers three send part tool 51,52,53 corresponding with said three sections isometric lines of cut respectively, be used for transporting respectively on 90 to three sections isometric lines of cut of said three sapphire silicon ingots and cut, simultaneously, said driven wheel 110 rotates forward and reverse repeatedly; And then drive said cutting swing disc 20 with its center of circle be the axle center be ± 5 ° of angles (the θ angle in the diagram) wave; Sapphire silicon ingot 90 is the point type way of contact (being the state shown in Fig. 6 A to 6C) with line of cut, carries out inclined cut, and then has significantly reduced the contact-making surface length of Buddha's warrior attendant line 40 with sapphire silicon ingot 90; Promptly weakened the cutting resistance; Also reduce the wearing and tearing of Buddha's warrior attendant line, improved the service life of Buddha's warrior attendant line, simultaneously; Improve cutting power, also improved cutting accuracy.
In sum; Four roller sapphire slicers provided by the present invention; Four cutting rollers are provided, and the axial connecting line of four cutting rollers constitutes two drift angles and is respectively 108 °, and two base angles are respectively 72 ° isosceles trapezoid; Thereby guarantee between four said cutting rollers to form three segment length with around the identical Buddha's warrior attendant line of curvature, thereby guaranteed the accuracy of sapphire silicon ingot.And, can cut three sapphire silicon ingots simultaneously, compared to only providing one section line of cut single only to support the prior art of a sapphire silicon ingot cutting, the present invention can improve the operating efficiency of sapphire silicon ingot cutting greatly.
Moreover; Send the part tool in the present invention's four roller sapphire slicers; Mainly be to adopt swing arm slightly swing and the screw mandrel mode of accurately controlling the swing arm amplitude of oscillation transport the sapphire silicon ingot, push with respect to supporting plate of the prior art, realized sending the precision control of part; Improve the operation effectiveness that transports precision and follow-up cutting operation thereof of sapphire silicon ingot, produced high-quality silicon on sapphire.
Four roller sapphire slicers provided by the present invention, owing to adopt the cutting roller that can back and forth wave, the sapphire silicon ingot is the point type way of contact with the cutting linear array; Significantly reduce the contact-making surface length of Buddha's warrior attendant line and sapphire silicon ingot, promptly weakened the cutting resistance, also reduced the wearing and tearing of Buddha's warrior attendant line; Improved the service life of Buddha's warrior attendant line; Simultaneously, improve cutting power, also improved cutting accuracy.
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any be familiar with this technological personage all can be under spirit of the present invention and category, the foregoing description is modified or is changed.
Claims (10)
1. a roller sapphire slicer is characterized in that, comprises at least:
Frame has the work piece cut district;
The cutting swing disc, axle is located in the work piece cut district of said frame, and its edge is provided with one section arc-shaped rack;
Driven wheel is installed on the said frame, and is meshed with said arc-shaped rack, and when forward and reverse rotation, driving said cutting swing disc is that the axle center is predetermined angle and waves with its center of circle;
First, second, third, fourth cutting roller; Be arranged on the said cutting swing disc and when said cutting swing disc is waved and together wave; The center of circle equidistance of the axle center of above-mentioned four cutting rollers and said cutting shaking tray; The axial connecting line of said first, second, third, fourth cutting roller constitutes two drift angles and is respectively 108 °, and two base angles are respectively 72 ° isosceles trapezoid;
The Buddha's warrior attendant line; Be wound in successively on said the first, second and third, the 4th cutting roller; Said Buddha's warrior attendant line said first, second, third, and the 4th cutting roller between form four sections lines of cut; When said Buddha's warrior attendant line runs up, simultaneously three sapphire silicon ingots are carried out cutting operation by three sections isometric lines of cut wherein; And
Three are sent the part tool, corresponding with said three sections isometric lines of cut respectively, be used for transporting respectively said three sapphire silicon ingots and carry out cutting operation to said three sections isometric lines of cut.
2. four roller sapphire slicers according to claim 1, it is characterized in that: the rocking tendency of said cutting swing disc is ± 5 °.
3. four roller sapphire slicers according to claim 1 is characterized in that: said three send the part tool comprise correspondence be formed on first of first cut length between said first and second cutting roller send part tool, correspondence be formed on said second with the 3rd cutting roller between second cut length second send part tool and corresponding to be formed on the 3rd of the 3rd cut length between the said the 4th and first cutting roller to send the part tool.
4. four roller sapphire slicers according to claim 3; It is characterized in that: said first send the part tool to comprise is arranged on the said frame, can towards the said first cut length straight line move be used to transport said sapphire silicon ingot break away from and/or oppress said line of cut send the part planker.
5. four roller sapphire slicers according to claim 3, it is characterized in that: said second, third send the part tool to comprise respectively:
The swing arm seat is located on the said frame;
Swing arm is coupling in the top of said swing arm seat through a rotating shaft, said swing arm can around with the scope of said rotating shaft in predetermined angle in swing;
Send the part arm, be located in the said swing arm and and extend, fixing said sapphire silicon ingot towards the said second or the 3rd cut length;
Screw rodb base is located on the crossbeam of said frame; And
Driving mechanism; Be movably arranged in said screw rodb base and the swing arm; At least comprise drive motors and by the screw mandrel of said drive motor drives with the operation of stretching; The near-end that said screw mandrel closes on said drive motors is movably connected on the said screw rodb base, and away from the far-end and the said swing arm flexible connection of said drive motors, the said swing arm of said screw mandrel push-and-pull when flexible is swung so that said swing arm is transported said sapphire silicon ingot disengaging and/or oppressed said line of cut.
6. four roller sapphire slicers according to claim 5; It is characterized in that: also comprise by said swing arm and extend the extension arm that connects; Its top is connected with the far end activity of said screw mandrel; The top of said extension arm and the far-end of said screw mandrel are provided with the first screw mandrel reviving joints, and dispose first feed screw nut who in the scope of predetermined angle, rotates in the said first screw mandrel reviving joints.
7. four roller sapphire slicers according to claim 6; It is characterized in that: the near-end of said screw mandrel and said screw rodb base are provided with the second screw mandrel reviving joints, and dispose second feed screw nut who in the scope of predetermined angle, rotates in the said second screw mandrel reviving joints.
8. four roller sapphire slicers according to claim 5 is characterized in that: also comprise the top away from the far-end of said drive motors that is arranged on said screw mandrel, be used to prevent that said screw mandrel breaks away from the error-proof structure that is connected with said first feed screw nut.
9. four roller sapphire slicers according to claim 1, it is characterized in that: the speed of service of said Buddha's warrior attendant line is more than or equal to 720m/min ~ 900m/min.
10. four roller sapphire slicers according to claim 1 is characterized in that: also comprise the directive wheel that is used for said Buddha's warrior attendant line guiding, be used to the wire storage tube that absorbs the regulating wheel of said Buddha's warrior attendant line tension and be used for the said Buddha's warrior attendant line of folding and unfolding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210244796.6A CN102717446B (en) | 2012-07-13 | 2012-07-13 | Four-roller sapphire slicing machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210244796.6A CN102717446B (en) | 2012-07-13 | 2012-07-13 | Four-roller sapphire slicing machine |
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| CN102717446A true CN102717446A (en) | 2012-10-10 |
| CN102717446B CN102717446B (en) | 2014-10-15 |
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| CN201210244796.6A Active CN102717446B (en) | 2012-07-13 | 2012-07-13 | Four-roller sapphire slicing machine |
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| CN (1) | CN102717446B (en) |
Cited By (8)
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| CN102950659A (en) * | 2012-10-18 | 2013-03-06 | 江西赛维Ldk太阳能高科技有限公司 | Silicon block cutting device |
| CN103407009A (en) * | 2013-08-21 | 2013-11-27 | 常州贝斯塔德机械科技有限公司 | Multi-diamond-wire cutting machine |
| CN103640097A (en) * | 2013-11-26 | 2014-03-19 | 浙江上城科技有限公司 | Diamond-wire slicing method for sapphire sheets |
| CN104118070A (en) * | 2014-08-05 | 2014-10-29 | 湖南奥泰克科技有限公司 | Dual-swinging cutting device for sapphires |
| CN104781045A (en) * | 2012-10-15 | 2015-07-15 | 东洋先进机床有限公司 | Wire saw apparatus, and cut-machining method |
| CN113702409A (en) * | 2021-07-28 | 2021-11-26 | 威科赛乐微电子股份有限公司 | Crystal orientation method |
| CN114227960A (en) * | 2021-11-17 | 2022-03-25 | 青岛高测科技股份有限公司 | Discharging four-roller mechanism for diamond wire multi-wire cutting machine |
| WO2024002329A1 (en) * | 2022-06-30 | 2024-01-04 | 青岛高测科技股份有限公司 | Wire saw device, multi-wire cutting apparatus, and control method for multi-wire cutting apparatus |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10202499A (en) * | 1997-01-14 | 1998-08-04 | Tokyo Seimitsu Co Ltd | Wire saw |
| JPH10264143A (en) * | 1997-03-27 | 1998-10-06 | Mitsubishi Materials Shilicon Corp | Wire saw and cutting method for ingot |
| JPH1177510A (en) * | 1997-09-05 | 1999-03-23 | Tokyo Seimitsu Co Ltd | Fixed abrasive grain wire saw and cutting method for its workpiece |
| DE10035590A1 (en) * | 2000-07-21 | 2002-02-07 | Wacker Siltronic Halbleitermat | Wire-saw for cutting semiconductor wafers from single-crystal workpieces, includes supply device for supplying compensating sawing wire to wire guide rollers |
| JP2007210068A (en) * | 2006-02-09 | 2007-08-23 | Takatori Corp | Wire saw |
| JP2008142842A (en) * | 2006-12-11 | 2008-06-26 | Asahi Diamond Industrial Co Ltd | Wafer and method of manufacturing same |
| JP2010023145A (en) * | 2008-07-16 | 2010-02-04 | Asahi Diamond Industrial Co Ltd | Cutter and cutting method |
| CN102039554A (en) * | 2009-10-12 | 2011-05-04 | 上海日进机床有限公司 | Method for grinding solar silicon rod |
| CN102398314A (en) * | 2010-09-17 | 2012-04-04 | 上海日进机床有限公司 | Diamond cutting line slicing machine |
| JP2012106322A (en) * | 2010-11-19 | 2012-06-07 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Ingot cutting method |
| CN202293069U (en) * | 2011-11-02 | 2012-07-04 | 江苏吉星新材料有限公司 | A motor-driven swing mechanism for sapphire slicing |
| CN202826096U (en) * | 2012-07-13 | 2013-03-27 | 上海日进机床有限公司 | Four-roller sapphire slicer |
-
2012
- 2012-07-13 CN CN201210244796.6A patent/CN102717446B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10202499A (en) * | 1997-01-14 | 1998-08-04 | Tokyo Seimitsu Co Ltd | Wire saw |
| JPH10264143A (en) * | 1997-03-27 | 1998-10-06 | Mitsubishi Materials Shilicon Corp | Wire saw and cutting method for ingot |
| JPH1177510A (en) * | 1997-09-05 | 1999-03-23 | Tokyo Seimitsu Co Ltd | Fixed abrasive grain wire saw and cutting method for its workpiece |
| DE10035590A1 (en) * | 2000-07-21 | 2002-02-07 | Wacker Siltronic Halbleitermat | Wire-saw for cutting semiconductor wafers from single-crystal workpieces, includes supply device for supplying compensating sawing wire to wire guide rollers |
| JP2007210068A (en) * | 2006-02-09 | 2007-08-23 | Takatori Corp | Wire saw |
| JP2008142842A (en) * | 2006-12-11 | 2008-06-26 | Asahi Diamond Industrial Co Ltd | Wafer and method of manufacturing same |
| JP2010023145A (en) * | 2008-07-16 | 2010-02-04 | Asahi Diamond Industrial Co Ltd | Cutter and cutting method |
| CN102039554A (en) * | 2009-10-12 | 2011-05-04 | 上海日进机床有限公司 | Method for grinding solar silicon rod |
| CN102398314A (en) * | 2010-09-17 | 2012-04-04 | 上海日进机床有限公司 | Diamond cutting line slicing machine |
| JP2012106322A (en) * | 2010-11-19 | 2012-06-07 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Ingot cutting method |
| CN202293069U (en) * | 2011-11-02 | 2012-07-04 | 江苏吉星新材料有限公司 | A motor-driven swing mechanism for sapphire slicing |
| CN202826096U (en) * | 2012-07-13 | 2013-03-27 | 上海日进机床有限公司 | Four-roller sapphire slicer |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104781045A (en) * | 2012-10-15 | 2015-07-15 | 东洋先进机床有限公司 | Wire saw apparatus, and cut-machining method |
| CN104781045B (en) * | 2012-10-15 | 2018-05-04 | 东洋先进机床有限公司 | Fret saw and cutting off processing method |
| US9969017B2 (en) | 2012-10-15 | 2018-05-15 | Toyo Advanced Technologies Co., Ltd. | Wire saw apparatus and cut-machining method |
| CN102950659A (en) * | 2012-10-18 | 2013-03-06 | 江西赛维Ldk太阳能高科技有限公司 | Silicon block cutting device |
| CN103407009A (en) * | 2013-08-21 | 2013-11-27 | 常州贝斯塔德机械科技有限公司 | Multi-diamond-wire cutting machine |
| CN103407009B (en) * | 2013-08-21 | 2015-11-18 | 常州贝斯塔德机械股份有限公司 | Diamond wire multi-line cutting machine |
| CN103640097A (en) * | 2013-11-26 | 2014-03-19 | 浙江上城科技有限公司 | Diamond-wire slicing method for sapphire sheets |
| CN104118070A (en) * | 2014-08-05 | 2014-10-29 | 湖南奥泰克科技有限公司 | Dual-swinging cutting device for sapphires |
| CN113702409A (en) * | 2021-07-28 | 2021-11-26 | 威科赛乐微电子股份有限公司 | Crystal orientation method |
| CN114227960A (en) * | 2021-11-17 | 2022-03-25 | 青岛高测科技股份有限公司 | Discharging four-roller mechanism for diamond wire multi-wire cutting machine |
| WO2024002329A1 (en) * | 2022-06-30 | 2024-01-04 | 青岛高测科技股份有限公司 | Wire saw device, multi-wire cutting apparatus, and control method for multi-wire cutting apparatus |
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