CN102717203B - Low-silver lead-free solder paste soldering flux with high ductility - Google Patents
Low-silver lead-free solder paste soldering flux with high ductility Download PDFInfo
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- CN102717203B CN102717203B CN201210229494.1A CN201210229494A CN102717203B CN 102717203 B CN102717203 B CN 102717203B CN 201210229494 A CN201210229494 A CN 201210229494A CN 102717203 B CN102717203 B CN 102717203B
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Abstract
The invention discloses a low-silver lead-free solder paste soldering flux with high ductility, the main ingredients of the soldering flux comprise tin, silver, copper, scandium, tantalum and ruthenium, wherein silver accounts for 0.3%, copper accounts for 0.7%, scandium accounts for 1-5%, tantalum accounts for 2-5%, and ruthenium accounts for 2-5%. A rare earth metal adding method is adopted, so the cracking phenomenon is obviously improved, the product stability is increased, and moreover, the corrosion resistance and thermostable performance of the soldering flux are obviously improved.
Description
Technical field
The present invention relates to welding material, particularly for the low-silver lead-free tin cream solder of wiring board welding.
Background technology
The low-silver lead-free tin cream solder adopted during welding circuit board is for main component with tin, silver and copper, this solder has certain ductility, but ductility not enough, particularly under high-temperature condition, the stability of solder is poor, intensity is wretched insufficiency also, is easy to the phenomenon causing sealing-off and cracking.
Summary of the invention
The invention provides a kind of high-temperature solder adding rare earth metal, solve the technical problem of solder instability under the condition of high temperature in prior art.
The present invention, for solve the problems of the technologies described above and the main component of this high-temperature solder provided comprises tin, the silver of 0.3% and the copper of 0.7%, also includes scandium in this solder main constituents.Scandium element has Grain Refinement Effect and improves the characteristic of recrystallization temperature, can improve the ductility of solder, thus can improve the resistance to elevated temperatures of solder.
Further improvement of the present invention is: also include tantalum further in this solder main constituents.Tantalum element has high-melting-point, high strength and erosion-resisting characteristic, improves the fastness of welding, resistance to elevated temperatures and corrosion resistance.
Further improvement of the present invention is: also include ruthenium further in this solder main constituents, plays invigoration effect under utilizing ruthenium high temperature action to solder, provides the intensity of solder further.
The present invention adds scandium, tantalum and ruthenium, utilizes the high-melting-point of the Grain Refinement Effect of scandium element and tantalum and ruthenium element, high strength and erosion-resisting characteristic, improves the ductility of solder, meanwhile, improves the fastness of welding, resistance to elevated temperatures and corrosion resistance.
The present invention adopts the method for adding rare earth metal, and significantly improve the phenomenon of be full of cracks, improve the stability of product, meanwhile, anticorrosion and the resistance to elevated temperatures of solder significantly improve.
Detailed description of the invention
Specific embodiments of the invention are described below in detail.
This low-silver lead-free tin cream solder with high ductibility, this solder main constituents comprises tin, the silver of 0.3% and the copper of 0.7%, also includes scandium, tantalum and ruthenium in this solder main constituents.Inventor is engaged in solder research for many years, find in production practices for many years, in welding circuit board process, low-silver lead-free tin cream solder at high operating temperatures, solder is not very temperature, intensity is wretched insufficiency also, solder there will be and snaps and crack performance, although this be full of cracks is very tiny, very large impact is created for product quality, inventor carries out statistics and finds, snap and the quality problems caused that chap account for about 60% of problems of welded quality, therefore, the ductility improving solder becomes the key of dealing with problems.The present inventor starts with from interpolation rare earth metal, has carried out test for many years, and here is inventor through the be full of cracks situation statistical form of Test Summary for many years:
Can find out from list above, silver accounts for 0.3%, and copper accounts for 0.7%, and scandium accounts for 1 ~ 5%, and tantalum accounts for 2 ~ 5%, and ruthenium accounts for 2 ~ 5%.Under this proportioning, intensity enhancing, crack performance all makes moderate progress, but along with increase and the minimizing of proportioning, the effect that crack performance improves is different, wherein in preferred version, silver accounts for 0.3%, and copper accounts for 0.7%, and scandium accounts for 2 ~ 4%, tantalum accounts for 2 ~ 3%, and ruthenium accounts in the ratio range of 3 ~ 4%, and intensity obviously increases, and be full of cracks improves also obvious, just can observe be full of cracks with common magnifying glass obviously to reduce, from the result of Metallographic Analysis, also demonstrate that this point.
Above content is in conjunction with concrete preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (1)
1. one kind has the low-silver lead-free tin cream solder of high ductibility, this solder main constituents comprises tin, the silver of 0.3% and the copper of 0.7%, it is characterized in that: also include in this solder main constituents the scandium of 2 ~ 4%, the tantalum of 2 ~ 3% and 3 ~ 4% ruthenium, surplus is tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210229494.1A CN102717203B (en) | 2012-07-04 | 2012-07-04 | Low-silver lead-free solder paste soldering flux with high ductility |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210229494.1A CN102717203B (en) | 2012-07-04 | 2012-07-04 | Low-silver lead-free solder paste soldering flux with high ductility |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102717203A CN102717203A (en) | 2012-10-10 |
| CN102717203B true CN102717203B (en) | 2015-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210229494.1A Active CN102717203B (en) | 2012-07-04 | 2012-07-04 | Low-silver lead-free solder paste soldering flux with high ductility |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110102931A (en) * | 2019-05-29 | 2019-08-09 | 华南理工大学 | A kind of improved microelectronics Packaging low silver Sn-Ag-Cu solder and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2448738A1 (en) * | 1974-10-12 | 1976-04-15 | Heraeus Gmbh W C | Production of a composite - by coating a metal powder with another metal applying onto a carrier with a binder and sintering |
| CN101007373A (en) * | 2006-12-04 | 2007-08-01 | 云南锡业集团（控股）有限责任公司 | Lead-free welding flux alloy |
| CN101569965A (en) * | 2007-05-25 | 2009-11-04 | 韩国生产技术研究院 | Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In |
| CN101209516B (en) * | 2005-12-27 | 2010-10-13 | 株式会社东芝 | Lead-free solder, welding joining product and electronic component |
| TW201042052A (en) * | 2009-04-14 | 2010-12-01 | Nippon Steel Materials Co Ltd | Lead-free solder alloy, solder ball, and electronic member comprising solder bump |
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2012
- 2012-07-04 CN CN201210229494.1A patent/CN102717203B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2448738A1 (en) * | 1974-10-12 | 1976-04-15 | Heraeus Gmbh W C | Production of a composite - by coating a metal powder with another metal applying onto a carrier with a binder and sintering |
| CN101209516B (en) * | 2005-12-27 | 2010-10-13 | 株式会社东芝 | Lead-free solder, welding joining product and electronic component |
| CN101007373A (en) * | 2006-12-04 | 2007-08-01 | 云南锡业集团（控股）有限责任公司 | Lead-free welding flux alloy |
| CN101569965A (en) * | 2007-05-25 | 2009-11-04 | 韩国生产技术研究院 | Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In |
| TW201042052A (en) * | 2009-04-14 | 2010-12-01 | Nippon Steel Materials Co Ltd | Lead-free solder alloy, solder ball, and electronic member comprising solder bump |
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| CN102717203A (en) | 2012-10-10 |
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