CN102717202B - There is the corrosion-proof high-temp solder of high ductibility - Google Patents
There is the corrosion-proof high-temp solder of high ductibility Download PDFInfo
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- CN102717202B CN102717202B CN201210229477.8A CN201210229477A CN102717202B CN 102717202 B CN102717202 B CN 102717202B CN 201210229477 A CN201210229477 A CN 201210229477A CN 102717202 B CN102717202 B CN 102717202B
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Abstract
The corrosion-proof high-temp solder main constituents with high ductibility comprises tin, antimony, scandium and a niobium, and wherein antimony accounts for 1 ~ 20%, and scandium accounts for 1 ~ 5%, and niobium accounts for 2 ~ 5%.The present invention adopts the method for adding rare earth metal, and significantly improve the phenomenon of be full of cracks, improve the stability of product, meanwhile, anticorrosion and the resistance to elevated temperatures of solder significantly improve.
Description
Technical field
The present invention relates to welding material, particularly for the high-temperature solder of circuit board double welding.
Background technology
All generally adopt first to carry out single-sided welding during welding circuit board, and then carry out the welding of one side in addition, so, two sides can not adopt the solder of same fusing point, and current high-temperature solder due to tin and antimony for main component, at high operating temperatures, solder is not very stable, ductility is poor, is easy to the phenomenon causing sealing-off and cracking.
Summary of the invention
The invention provides a kind of high-temperature solder adding rare earth metal, solve the technical problem of solder instability under the condition of high temperature in prior art.
The present invention is for solve the problems of the technologies described above and the main component of this high-temperature solder provided comprises tin, antimony and scandium.Scandium element has Grain Refinement Effect and improves the characteristic of recrystallization temperature, can improve the ductility of solder, thus can improve the resistance to elevated temperatures of solder.
Further improvement of the present invention is: also include niobium further in this solder main constituents.Niobium element has high-melting-point, high strength and erosion-resisting characteristic, improves the fastness of welding, resistance to elevated temperatures and corrosion resistance.
The present invention adds scandium and niobium, utilizes the high-melting-point of the Grain Refinement Effect of scandium element and niobium element, high strength and erosion-resisting characteristic, improves the ductility of solder, meanwhile, improves the fastness of welding, resistance to elevated temperatures and corrosion resistance.
The present invention adopts the method for adding rare earth metal, and significantly improve the phenomenon of be full of cracks, improve the stability of product, meanwhile, anticorrosion and the resistance to elevated temperatures of solder significantly improve.
Detailed description of the invention
Specific embodiments of the invention are described below in detail.
This to have in the main component of the corrosion-proof high-temp solder of high ductibility except comprising tin and antimony, also includes scandium and niobium.Inventor is engaged in solder research for many years, finds, in production practices for many years in welding circuit board process, after one side adopts high-temperature solder welding, when welding in addition one side, high-temperature solder there will be crack performance, although this be full of cracks is very tiny, but, create very large impact for product quality, inventor carries out statistics and finds, the quality problems caused that chap account for about 20% of problems of welded quality, therefore, the ductility improving solder becomes the key of dealing with problems.The present inventor starts with from interpolation rare earth metal, has carried out test for many years, and here is inventor through the be full of cracks situation statistical form of Test Summary for many years:
Can find out from list above, antimony accounts for 1 ~ 20%, and scandium accounts for 1 ~ 5%, niobium accounts for 2 ~ 5%, and under this proportioning, crack performance all makes moderate progress, but along with increase and the minimizing of proportioning, the effect that crack performance improves is different, wherein in preferred version, antimony accounts for 5 ~ 10%, and scandium accounts for 2 ~ 4%, and niobium accounts in the ratio range of 2 ~ 3%, be full of cracks improves obvious, just can observe be full of cracks with common magnifying glass obviously to reduce, from the result of Metallographic Analysis, also demonstrate that this point.
Above content is in conjunction with concrete preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (1)
1. have a corrosion-proof high-temp solder for high ductibility, this solder main constituents comprises tin and antimony, it is characterized in that: also include scandium and niobium in this solder main constituents, and in this solder main constituents, antimony accounts for 16%, and scandium accounts for 6%, and niobium accounts for 5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210229477.8A CN102717202B (en) | 2012-07-04 | 2012-07-04 | There is the corrosion-proof high-temp solder of high ductibility |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210229477.8A CN102717202B (en) | 2012-07-04 | 2012-07-04 | There is the corrosion-proof high-temp solder of high ductibility |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102717202A CN102717202A (en) | 2012-10-10 |
| CN102717202B true CN102717202B (en) | 2015-09-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210229477.8A Active CN102717202B (en) | 2012-07-04 | 2012-07-04 | There is the corrosion-proof high-temp solder of high ductibility |
Country Status (1)
| Country | Link |
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| CN (1) | CN102717202B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH582909B5 (en) * | 1971-07-06 | 1976-12-15 | Iwaki Glass Co Ltd | |
| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN101700605A (en) * | 2009-11-13 | 2010-05-05 | 苏州优诺电子材料科技有限公司 | Low melting point lead-free welding material alloy |
-
2012
- 2012-07-04 CN CN201210229477.8A patent/CN102717202B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH582909B5 (en) * | 1971-07-06 | 1976-12-15 | Iwaki Glass Co Ltd | |
| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN101700605A (en) * | 2009-11-13 | 2010-05-05 | 苏州优诺电子材料科技有限公司 | Low melting point lead-free welding material alloy |
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| Publication number | Publication date |
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| CN102717202A (en) | 2012-10-10 |
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Address after: 518000 38 road two, Baocheng 76 District, Shenzhen, Guangdong, Baoan District Patentee after: SHENZHEN YIK SHING TAT INDUSTRIAL Co.,Ltd. Patentee after: Guangdong Steiner New Material Co.,Ltd. Address before: 518000 38 road two, Baocheng 76 District, Shenzhen, Guangdong, Baoan District Patentee before: SHENZHEN YIK SHING TAT INDUSTRIAL Co.,Ltd. Patentee before: SHENZHEN SITENA NEW MATERIALS Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 38 road two, Baocheng 76 District, Shenzhen, Guangdong, Baoan District Patentee after: YIK SHING TAT INDUSTRIAL Co.,Ltd. Patentee after: Guangdong Steiner New Material Co.,Ltd. Address before: 518000 38 road two, Baocheng 76 District, Shenzhen, Guangdong, Baoan District Patentee before: YIK SHING TAT INDUSTRIAL Co.,Ltd. Patentee before: SHENZHEN SITENA NEW MATERIALS Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |