CN102689517B - 用于印刷头的高密度多层互连 - Google Patents
用于印刷头的高密度多层互连 Download PDFInfo
- Publication number
- CN102689517B CN102689517B CN201210090475.5A CN201210090475A CN102689517B CN 102689517 B CN102689517 B CN 102689517B CN 201210090475 A CN201210090475 A CN 201210090475A CN 102689517 B CN102689517 B CN 102689517B
- Authority
- CN
- China
- Prior art keywords
- piezoelectric element
- barrier film
- shim
- electric mark
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims abstract description 55
- 230000004888 barrier function Effects 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 18
- 230000005611 electricity Effects 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000000059 patterning Methods 0.000 claims description 10
- 238000007641 inkjet printing Methods 0.000 claims description 9
- 238000002161 passivation Methods 0.000 claims description 9
- 238000002679 ablation Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 9
- 238000000608 laser ablation Methods 0.000 abstract description 5
- 238000000206 photolithography Methods 0.000 abstract description 4
- 238000004891 communication Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- 238000002347 injection Methods 0.000 description 15
- 239000007924 injection Substances 0.000 description 15
- 238000007639 printing Methods 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 11
- 239000007921 spray Substances 0.000 description 10
- 238000013461 design Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 239000013598 vector Substances 0.000 description 6
- 230000006399 behavior Effects 0.000 description 5
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000003491 array Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 150000001725 carbon group compounds Chemical class 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/053,968 US8585183B2 (en) | 2011-03-22 | 2011-03-22 | High density multilayer interconnect for print head |
| US13/053,968 | 2011-03-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102689517A CN102689517A (zh) | 2012-09-26 |
| CN102689517B true CN102689517B (zh) | 2015-07-22 |
Family
ID=46855316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210090475.5A Expired - Fee Related CN102689517B (zh) | 2011-03-22 | 2012-03-21 | 用于印刷头的高密度多层互连 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8585183B2 (enExample) |
| JP (1) | JP5793095B2 (enExample) |
| KR (1) | KR101819882B1 (enExample) |
| CN (1) | CN102689517B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8727508B2 (en) * | 2011-11-10 | 2014-05-20 | Xerox Corporation | Bonded silicon structure for high density print head |
| US8826539B2 (en) * | 2012-05-16 | 2014-09-09 | Xerox Corporation | Method for flex circuit bonding without solder mask for high density electrical interconnect |
| US10607642B2 (en) * | 2013-03-18 | 2020-03-31 | Magnecomp Corporation | Multi-layer PZT microactuator with active PZT constraining layers for a DSA suspension |
| US9802408B2 (en) * | 2015-02-24 | 2017-10-31 | Xerox Corporation | Raised fluid pass-through structure in print heads |
| US9643408B1 (en) | 2016-02-09 | 2017-05-09 | Xerox Corporation | Joint quantization of drop probability functions in multi-size drop inkjet printers |
| US10166777B2 (en) * | 2016-04-21 | 2019-01-01 | Xerox Corporation | Method of forming piezo driver electrodes |
| US10654270B2 (en) | 2016-07-12 | 2020-05-19 | Hewlett-Packard Development Company, L.P. | Printhead comprising a thin film passivation layer |
| CN111216452B (zh) * | 2018-11-27 | 2021-08-17 | 西安增材制造国家研究院有限公司 | 一种压电式mems喷墨打印头及制作方法 |
| JP2021136248A (ja) * | 2020-02-21 | 2021-09-13 | 株式会社ディスコ | デバイスウェーハの加工方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1364106A (zh) * | 2000-01-31 | 2002-08-14 | 皮科杰特公司 | 微观流体器件和超声波焊接过程 |
| CN101274523A (zh) * | 2007-03-28 | 2008-10-01 | 施乐公司 | 用于喷墨打印头的自对准端口孔开口工艺 |
| CN101557939A (zh) * | 2006-12-12 | 2009-10-14 | 伊斯曼柯达公司 | 具有改进的液体腔室的液滴喷射器 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007290238A (ja) * | 2006-04-25 | 2007-11-08 | Fuji Xerox Co Ltd | 液滴吐出ヘッドの製造方法及び液滴吐出ヘッド |
| US8082641B2 (en) * | 2007-06-01 | 2011-12-27 | Xerox Corporation | Method of manufacturing a ductile polymer-piezoelectric material composite |
| JP2009177149A (ja) * | 2007-12-26 | 2009-08-06 | Konica Minolta Holdings Inc | 金属酸化物半導体とその製造方法および薄膜トランジスタ |
| WO2009143354A2 (en) * | 2008-05-23 | 2009-11-26 | Fujifilm Corporation | Insulated film use in a mems device |
| US8360557B2 (en) * | 2008-12-05 | 2013-01-29 | Xerox Corporation | Method for laser drilling fluid ports in multiple layers |
| JP5321832B2 (ja) * | 2009-03-26 | 2013-10-23 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置、並びにアクチュエーター装置 |
-
2011
- 2011-03-22 US US13/053,968 patent/US8585183B2/en active Active
-
2012
- 2012-02-28 JP JP2012042539A patent/JP5793095B2/ja not_active Expired - Fee Related
- 2012-03-21 KR KR1020120028622A patent/KR101819882B1/ko not_active Expired - Fee Related
- 2012-03-21 CN CN201210090475.5A patent/CN102689517B/zh not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1364106A (zh) * | 2000-01-31 | 2002-08-14 | 皮科杰特公司 | 微观流体器件和超声波焊接过程 |
| CN101557939A (zh) * | 2006-12-12 | 2009-10-14 | 伊斯曼柯达公司 | 具有改进的液体腔室的液滴喷射器 |
| CN101274523A (zh) * | 2007-03-28 | 2008-10-01 | 施乐公司 | 用于喷墨打印头的自对准端口孔开口工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101819882B1 (ko) | 2018-01-19 |
| US20120242756A1 (en) | 2012-09-27 |
| JP2012196960A (ja) | 2012-10-18 |
| CN102689517A (zh) | 2012-09-26 |
| KR20120107870A (ko) | 2012-10-04 |
| JP5793095B2 (ja) | 2015-10-14 |
| US8585183B2 (en) | 2013-11-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150722 Termination date: 20210321 |