CN102683229A - Packaging technology of video card packaging production line - Google Patents
Packaging technology of video card packaging production line Download PDFInfo
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- CN102683229A CN102683229A CN2012101526180A CN201210152618A CN102683229A CN 102683229 A CN102683229 A CN 102683229A CN 2012101526180 A CN2012101526180 A CN 2012101526180A CN 201210152618 A CN201210152618 A CN 201210152618A CN 102683229 A CN102683229 A CN 102683229A
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- video card
- packaging
- technology
- polybutadiene rubber
- liquid polybutadiene
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Abstract
The invention relates to a packaging technology of a video card packaging production line, which belongs to the technical field of electronic information. A plastic ball gird array (PBGA) packaging technology is adopted, a carbo-xyl-termianted liquid polybutadiene rubber/graphene mixture is taken as a sealing material, the moisture influence is effectively reduced while the heat dissipation performance is increased, and the packaging air tightness and reliability are improved.
Description
Technical field
The present invention relates to electronic information technical field, be specially a kind of packaging technology of video card packing producing line.
Background technology
The effect that connects internal integrated circuit chip bonding point and external electrical establishment is not only played in the encapsulation of semiconductor electronic components and parts, also for integrated circuit provides a reliable and stable operational environment, IC chip is played the effect of machinery or environmental protection.Therefore, the good and bad relation of the overall performance of the quality of package quality and integrated circuit is very big.PBGA encapsulation (Plastic Ball Grid Array Package) is a kind of main flow encapsulation technology that present video card production is adopted; Its general resin/glass laminated sheet that adopts is as substrate; As encapsulant, soldered ball is an eutectic solder with plastics epoxy moulding mixture.The hot matching of this encapsulation technology is good, cost is low, electrical property is good, but often to moisture-sensitive, and not being suitable for has air-tightness to require and the encapsulation of the device that reliability requirement is high.The carboxyl terminated liquid polybutadiene rubber that the present invention adopted/Graphene mixture has good waterproof performance, characteristics that air-tightness is high.The plastics epoxy moulding mixture that is adopted on the market at present is to moisture-sensitive, and air-tightness is not high enough, is unfavorable for the stability of video card capabilities.
Summary of the invention
The packaging technology that the purpose of this invention is to provide a kind of video card packing producing line; Solve existing video card electricity packing producing line because of adopting the encapsulation of plastics epoxy moulding mixture; Existence is to moisture-sensitive; Air-tightness is not high enough, is unfavorable for improving video card capabilities stability and reliability, thereby influences end product life-span and maintenance cost.Through the present invention, guaranteeing to help reducing stability and the reliability that improves video card under the heat dispersion good premise, reduce maintenance cost, improve the business economic benefit.
The objective of the invention is to realize that through following technical scheme a kind of packaging technology of video card packing producing line is characterized in that, as encapsulant, its mass ratio is 100:1-10:1 with carboxyl terminated liquid polybutadiene rubber/Graphene mixture.
The present invention utilizes mass ratio for carboxyl terminated liquid polybutadiene rubber/Graphene mixture of 100:1-10:1 wraps up chip as encapsulant, is different from plastics epoxy moulding mixture.The former has better waterproof can; The latter is to moisture-sensitive, and air-tightness is not high enough, is unfavorable for improving video card capabilities stability and reliability.The present invention reduces maintenance cost guaranteeing to help reducing stability and the reliability that improves video card under the heat dispersion good premise, improves the business economic benefit.
Embodiment
In conjunction with embodiment the present invention is further specified; The present invention is with carboxyl terminated liquid polybutadiene rubber/Graphene mixture replacing plastics epoxy moulding mixture; Be applicable to the chip of PBGA technology encapsulation; Adopt the resin/glass laminated sheet as substrate, as encapsulant, soldered ball is an eutectic solder with carboxyl terminated liquid polybutadiene rubber/Graphene mixture.
Embodiment 1
Video card according to the invention adopts the encapsulation of PBGA technology, and as substrate, as encapsulant, soldered ball is an eutectic solder with carboxyl terminated liquid polybutadiene rubber/Graphene mixture with the resin/glass laminated sheet.Carboxyl terminated liquid polybutadiene rubber/Graphene mixture quality is than being 100:1, and the Graphene that is adopted is the single-layer graphene powder.
Embodiment 2
Video card according to the invention adopts the encapsulation of PBGA technology, and as substrate, as encapsulant, soldered ball is an eutectic solder with carboxyl terminated liquid polybutadiene rubber/Graphene mixture with the resin/glass laminated sheet.Carboxyl terminated liquid polybutadiene rubber/Graphene mixture quality is than being 10:1, and the Graphene that is adopted is the single-layer graphene powder.
Embodiment 3
Video card according to the invention adopts the encapsulation of PBGA technology, and as substrate, as encapsulant, soldered ball is an eutectic solder with carboxyl terminated liquid polybutadiene rubber/Graphene mixture with the resin/glass laminated sheet.Carboxyl terminated liquid polybutadiene rubber/Graphene mixture quality is than being 100:3, and the Graphene that is adopted is the single-layer graphene powder.
Embodiment 4
Video card according to the invention adopts the encapsulation of PBGA technology, and as substrate, as encapsulant, soldered ball is an eutectic solder with carboxyl terminated liquid polybutadiene rubber/Graphene mixture with the resin/glass laminated sheet.Carboxyl terminated liquid polybutadiene rubber/Graphene mixture quality is than being 100:8, and the Graphene that is adopted is the single-layer graphene powder.
Claims (1)
1. the packaging technology of a video card packing producing line, the encapsulant to the PBGA encapsulation technology is adopted is characterized in that, as encapsulant, its mass ratio is 100:1-10:1 with carboxyl terminated liquid polybutadiene rubber/Graphene mixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101526180A CN102683229A (en) | 2012-05-17 | 2012-05-17 | Packaging technology of video card packaging production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101526180A CN102683229A (en) | 2012-05-17 | 2012-05-17 | Packaging technology of video card packaging production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102683229A true CN102683229A (en) | 2012-09-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101526180A Pending CN102683229A (en) | 2012-05-17 | 2012-05-17 | Packaging technology of video card packaging production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102683229A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020161100A1 (en) * | 2001-02-21 | 2002-10-31 | Ngk Spark Plug Co., Ltd. | Embedding resin, wiring substrate using same and process for producing wiring substrate using same |
| CN101558457A (en) * | 2006-10-06 | 2009-10-14 | 普林斯顿大学理事会 | Functional graphene-polymer nanocomposites for gas barrier applications |
-
2012
- 2012-05-17 CN CN2012101526180A patent/CN102683229A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020161100A1 (en) * | 2001-02-21 | 2002-10-31 | Ngk Spark Plug Co., Ltd. | Embedding resin, wiring substrate using same and process for producing wiring substrate using same |
| CN101558457A (en) * | 2006-10-06 | 2009-10-14 | 普林斯顿大学理事会 | Functional graphene-polymer nanocomposites for gas barrier applications |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120919 |