CN102681354B - 决定方法和计算机 - Google Patents

决定方法和计算机 Download PDF

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Publication number
CN102681354B
CN102681354B CN201210061014.5A CN201210061014A CN102681354B CN 102681354 B CN102681354 B CN 102681354B CN 201210061014 A CN201210061014 A CN 201210061014A CN 102681354 B CN102681354 B CN 102681354B
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CN
China
Prior art keywords
value
exposure
cost
optical system
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210061014.5A
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English (en)
Chinese (zh)
Other versions
CN102681354A (zh
Inventor
行田裕一
辻田好一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102681354A publication Critical patent/CN102681354A/zh
Application granted granted Critical
Publication of CN102681354B publication Critical patent/CN102681354B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/44—Arrangements for executing specific programs
    • G06F9/445—Program loading or initiating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70125—Use of illumination settings tailored to particular mask patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G03F7/70441—Optical proximity correction [OPC]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201210061014.5A 2011-03-10 2012-03-09 决定方法和计算机 Expired - Fee Related CN102681354B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011053556A JP5728259B2 (ja) 2011-03-10 2011-03-10 プログラム及び決定方法
JP2011-053556 2011-03-10

Publications (2)

Publication Number Publication Date
CN102681354A CN102681354A (zh) 2012-09-19
CN102681354B true CN102681354B (zh) 2014-09-10

Family

ID=46797206

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210061014.5A Expired - Fee Related CN102681354B (zh) 2011-03-10 2012-03-09 决定方法和计算机

Country Status (4)

Country Link
US (1) US8584055B2 (https=)
JP (1) JP5728259B2 (https=)
KR (1) KR101390586B1 (https=)
CN (1) CN102681354B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5835968B2 (ja) * 2011-07-05 2015-12-24 キヤノン株式会社 決定方法、プログラム及び露光方法
JP5784657B2 (ja) 2013-02-26 2015-09-24 株式会社東芝 フォーカス位置調整装置、レチクル、フォーカス位置調整プログラムおよび半導体装置の製造方法
US10678143B2 (en) 2016-06-09 2020-06-09 Asml Netherlands B.V. Projection system modelling method
CN116068864B (zh) * 2023-01-17 2026-02-24 智腾科技股份有限公司 可提升光刻图形清晰度的次分辨率辅助特征图形生成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1998361A1 (en) * 2006-02-17 2008-12-03 Nikon Corporation Adjusting method, substrate treating method, substrate treating device, exposure device, inspection device, measurement inspection system, treating device, computer system, program, and information recording medium

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6563566B2 (en) * 2001-01-29 2003-05-13 International Business Machines Corporation System and method for printing semiconductor patterns using an optimized illumination and reticle
JP3910032B2 (ja) * 2001-09-25 2007-04-25 大日本スクリーン製造株式会社 基板現像装置
WO2004099874A1 (ja) * 2003-04-16 2004-11-18 Nikon Corporation パターン決定方法及びシステム、マスクの製造方法、結像性能調整方法、露光方法及び装置、並びにプログラム及び情報記録媒体
JP2005136364A (ja) * 2003-10-08 2005-05-26 Zao Nikon Co Ltd 基板搬送装置、露光装置、並びにデバイス製造方法
JP4778685B2 (ja) * 2004-03-10 2011-09-21 株式会社日立ハイテクノロジーズ 半導体デバイスのパターン形状評価方法及びその装置
US8134681B2 (en) * 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
JP5235322B2 (ja) 2006-07-12 2013-07-10 キヤノン株式会社 原版データ作成方法及び原版データ作成プログラム
US20080158529A1 (en) * 2006-12-28 2008-07-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5217442B2 (ja) 2008-01-08 2013-06-19 富士通セミコンダクター株式会社 露光データ作成方法及び露光方法
JP2010045309A (ja) * 2008-08-18 2010-02-25 Fujitsu Microelectronics Ltd 露光方法及び半導体装置の製造方法
US8739079B2 (en) * 2009-10-30 2014-05-27 Canon Kabushiki Kaisha Recording medium and determination method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1998361A1 (en) * 2006-02-17 2008-12-03 Nikon Corporation Adjusting method, substrate treating method, substrate treating device, exposure device, inspection device, measurement inspection system, treating device, computer system, program, and information recording medium

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2003-100597A 2003.04.04
JP特开2005-259830A 2005.09.22

Also Published As

Publication number Publication date
JP2012191018A (ja) 2012-10-04
KR20120104497A (ko) 2012-09-21
CN102681354A (zh) 2012-09-19
JP5728259B2 (ja) 2015-06-03
US8584055B2 (en) 2013-11-12
KR101390586B1 (ko) 2014-04-30
US20120233574A1 (en) 2012-09-13

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