CN102677000A - Evaporation boat and mould forming method using the same - Google Patents
Evaporation boat and mould forming method using the same Download PDFInfo
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- CN102677000A CN102677000A CN2012100735901A CN201210073590A CN102677000A CN 102677000 A CN102677000 A CN 102677000A CN 2012100735901 A CN2012100735901 A CN 2012100735901A CN 201210073590 A CN201210073590 A CN 201210073590A CN 102677000 A CN102677000 A CN 102677000A
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Abstract
Provided are an evaporation boat and a mould forming method using the same. The evaporation boat can eliminate sprays generated by fusion of material wire rods in air and a material evaporation area can not shrink. The temperature of a material supplying part (9a) on one end (3a) of a pool (2) is lower than a temperature of a material evaporation part (10) connected with on side of the other end (3b) of the material supplying part (9a). A back of the material evaporation part (10) of the pool (2) is provided with a flat part (14) and an inclined part (15a) for connecting the flat part (14) with the material supplying part (9a) which have a same sectional area; the inclined part (15a) forms a sectional area which becomes larger from the end (3a) to the other end (3b) so as to form temperature distribution.
Description
Technical field
The present invention relates to a kind ofly heat thin-film material so that the vapor deposition of its evaporation is used boat.
Background technology
As film forming exemplary process on substrate, vacuum vapour deposition is arranged.
In aforesaid method, be in vacuum state in the covering chamber through making, and make the film forming material high temperature evaporation, thereby on the substrate of being located at covering chamber top, form film in inside.Substrate after the film forming shows the characteristic of this film, thereby capable of using in comprising the various high-performance equipments of semi-conductor.
In the heating unit (evaporation source) of vacuum deposition apparatus, use the device that heats through electrical resistance heating, surge method, induction heating method, but the ubiquity of easy electrical resistance heating is high.
In addition, resistive heating can be divided into spiral, boat type, box, crucible etc. with evaporation source by its shape.Wherein, the vapor deposition of boat type evaporation source has following advantage with the shape of boat: will accommodate thin-film material to have bottom outlet to be arranged on the vapor deposition of thick plate-like of face side very common with boat, thereby needn't select the shape of thin-film material just can satisfy.
In addition, vapor deposition adopts refractory metal and alloy or graphite or pottery etc. with boat, thereby the evaporation source material surface can further be covered by thermolysis SP 1 (PBN) or SP 1 (BN).
Figure 12 is configured in vapor deposition in the vacuum deposition apparatus (not shown) with the example that is provided with of boat.
Be formed with pond 2 as bottom outlet is arranged at the graphite system vapor deposition that is covered with PBN with the surperficial central authorities of boat 1a.Be connected with pair of electrodes 4a, the 4b of the heating that is used to switch on two ends 3a, the 3b of boat at vapor deposition.Figure 13 (a) expression vapor deposition is with the vertical view of boat 1a, and Figure 13 (b) representes sectional view.
The material wire rod of supplying with as thin-film material with the pond of boat 1a 2 from 5 pairs of above-mentioned vapor depositions of material wire rod guide 6.Material wire rod 6 is wound onto on the reel 7, and under the rotation of outlet roller 8, stretches out successively along wire guide spare 5, and the front end of material wire rod 6 arrives reel 2.At this moment, vapor deposition, comes the material in the pond 2 is heated as the compound well heater that the mode with electrode 4a, 4b energising heats with boat 1a thus.Front end through the material wire rod 6 that will stretch out successively is heated in pond 2 more than the fusing point under the regulation vp, thereby the material wire rod of supplying with continuously 6 can be housed in the pond 2 with molten state.Then, proceed to use of the evaporation of the top of boat 1a this moment as evaporation direction with vapor deposition.
Because the film that in above-mentioned vacuum evaporation process, produces is directly related with the performance of equipment, therefore, in order to boost productivity and yield rate, importantly how to produce uniform film effectively, for this reason, special demands are stably supplied with evaporation particle to vapor deposition with boat.
Adopting under the situation of this vapor deposition with boat 1a, almost do not have the temperature difference between material supply unit 9a and the material evaporation part 10, thereby the excessive temperature of material supply unit 9a rises.By this, have following problem: the material wire rod of seeing off from material wire rod guide 56 aloft fuses, and the material wire rod 6 of fusion drops in vapor deposition and can impact even film forming with the spittle that is produced on the boat 1a.
As ways of addressing this issue, the vapor deposition that in patent documentation 1, records Figure 14 (a), Figure 14 (b) is used boat 1b.Above-mentioned vapor deposition with boat 1b in, for the radiogenic heat that reduces material wire rod 6 suppresses material from dripping in the air, be adjacent to be formed with emptying aperture 11a, 11b with pond 2.But this structure does not change the heat from material supply unit 9a as the essential problem that causes the spittle to produce, thereby can not obtain very big effect.
In addition, in patent documentation 2, record the vapor deposition shown in Figure 15 (a), Figure 15 (b) and use boat 1c.Above-mentioned vapor deposition with boat 1c in, 2 middle section forms hot face 12 in the pond, the vapor deposition that the sectional area ratio of this hot face 12 links to each other with electric energy is big with the sectional area of the both ends 3a of boat 1c, 3b, and above-mentioned hot face 12 is given prominence to than the bottom height in pond 12.Treat that fused material wire rod 6 is supplied to hot face 12 at vapor deposition with the middle section of boat 1c, the end of material wire rod 6 is melted because of hot face 12 heatings, thereby flows into the pond 2 of hot face 12 both sides.That is to say that hot face 12 makes other regional resistance of resistance ratio little because of having bigger xsect.Consequently, vapor deposition can be not warmmer than other zone with the wire rod supply area of boat, by this, can avoid the front end fusion very early of material wire rod 6, and then the spittle of the material wire rod 6 that can avoid fusing.
Patent documentation 1: Japanese Patent Laid is opened the 2005-194539 communique
Patent documentation 2: Japanese Patent Laid is opened the 2003-213403 communique
Yet, in the structure of patent documentation 2, form though can prevent the spittle, because hot face 12 is formed on the middle section in pond 2, makes the material evaporation region be heated face 12 and be divided into two, thereby the film forming inequality possibly occur.In addition, the temperature reduction, the material evaporation region that hot face 12 peripheries also occur are dwindled such new technology problem.
Summary of the invention
The object of the present invention is to provide a kind of material evaporation region can not dwindle and can avoid using boat because of the material wire rod fuses the vapor deposition that causes the spittle to produce aloft.
Vapor deposition of the present invention is formed with the pond with boat in the boat main body; Wherein, Thin-film material after above-mentioned pond has the next thin-film material fused material supply unit of the supply of making and supplies fusion is from the material evaporation part of above-mentioned materials supply unit inflow; Through energising between the end of above-mentioned boat main body and the other end is heated to it more than vaporization temperature with the thin-film material of above-mentioned materials evaporation part; It is characterized in that the big jut of sectional area that forms sectional area ratio above-mentioned materials evaporation part in the back side or the side of the above-mentioned materials supply unit in above-mentioned pond.
In addition; Characteristic of the present invention is; The back side or side in the above-mentioned materials evaporation part are provided with par and rake, and wherein, the sectional area of above-mentioned par is equating on an above-mentioned end and the long side direction that the above-mentioned the other end is connected; Above-mentioned rake is connected above-mentioned par with the above-mentioned materials supply unit, and the sectional area of above-mentioned rake is becoming big from an above-mentioned end towards the direction of the above-mentioned the other end.
According to the present invention; Owing to form jut in the boat main body; Therefore, utilize above-mentioned jut, can make the temperature of material supply unit in above-mentioned pond lower than the temperature of material supply unit; The next thin-film material of supply aloft fuses and drops on the spittle on the material supply unit thereby can eliminate from the outside, and can make the thin-film material of the evaporation from the material evaporation part stable.And therefore the back side or side owing to jut being arranged on the material supply unit in above-mentioned pond, the material evaporation region can not occur and dwindle.
In addition, be provided with under the situation of rake, can avoiding the temperature of material evaporation part sharply being reduced because of the temperature reduction of material supply unit.
Description of drawings
Fig. 1 is that the vapor deposition of embodiment 1 of embodiment of the present invention 1 is with the stereographic map of boat.
Fig. 2 is vertical view and the sectional view of the vapor deposition of embodiment 1 with boat.
Fig. 3 is the temperature distributing analog figure as a result of above-mentioned embodiment.
Fig. 4 is vertical view and the sectional view of the vapor deposition of expression comparative example with boat.
Fig. 5 is that the vapor deposition of embodiment 2 of embodiment of the present invention 2 is with the stereographic map of boat.
Fig. 6 is vertical view, sectional view and the side-view of the vapor deposition of above-mentioned embodiment with boat.
Fig. 7 is that the vapor deposition of embodiment 3 of embodiment of the present invention 3 is with the stereographic map of boat.
Fig. 8 is vertical view and the sectional view of the vapor deposition of above-mentioned embodiment with boat.
Fig. 9 is the temperature distributing analog figure as a result of above-mentioned embodiment.
Figure 10 is that the vapor deposition of embodiment 4 of embodiment of the present invention 4 is with the vapor deposition of the sectional view of boat and embodiment 5 vertical view with boat.
Figure 11 is that the vapor deposition of embodiment 6 of embodiment of the present invention 5 is with the vertical view of boat.
Figure 12 is the synoptic diagram of common vacuum deposition apparatus.
Figure 13 is vertical view and the sectional view of the vapor deposition of existing example with boat.
Figure 14 is vertical view and the sectional view of the vapor deposition of another existing example with boat.
Figure 15 is vertical view and the sectional view of the vapor deposition of another existing example with boat.
(nomenclature)
M boat main body
The U upper surface
1d, 1f, 1g, 1h, 1i, 1j vapor deposition are with boat (Japanese: steaming and using ボ one ト)
2 ponds
3a one end
The 3b the other end
6 material wire rods
9a material supply unit
9b material supply unit (the second material supply unit)
10 material evaporation parts
The 13a jut
13b jut (second jut)
13aa, 13ab jut
14 pars
The 15a rake
15aa, 15ab rake
15b rake (second rake)
16 scarp
16aa, 16ab scarp
The T0 melting material evaporates required MIN temperature
The T1 vapor deposition is with the temperature distribution on boat 1d surface
T2 vapor deposition shown in Figure 13 is with the temperature distribution of boat
The vapor deposition of T3 comparative example is with the temperature distribution of boat 1e
The T4 vapor deposition is with the temperature distribution on boat 11g surface
Embodiment
Below, based on Fig. 1～Figure 11 each embodiment of the present invention is described.
(embodiment 1)
The vapor deposition of Fig. 1 and Fig. 2 (a), Fig. 2 (b) expression embodiment of the invention 1 is used boat.
Above-mentioned vapor deposition uses boat 1d on the upper surface U that is extending on the long side direction that main portion is connected with the other end 3b as the end 3a of the boat main body M of graphite system, to be formed with the pond 2 of accumulating the fused thin-film material.Shown in Fig. 2 (b), near the big jut 13a of sectional area that is formed with the above-mentioned the other end 3b of sectional area ratio the above-mentioned end 3a that leans at 2 back sides, pond.Shown in Fig. 2 (b), near the little par 14 of sectional area that is formed with sectional area ratio jut 13a the above-mentioned the other end 3b of leaning at 2 back sides, pond.Shown in Fig. 2 (b), between the jut 13a at 2 back sides, pond and par 14, be formed with rake 15a, the sectional area of this rake 15a is along with becoming big from jut 13a gradually near par 14.At this, shown in Fig. 2 (a), the width of material supply unit 9a, material evaporation part 10, rake 15a is all identical, with vertical of above-mentioned long side direction on sectional area diminish by the order of material supply unit 9a, material evaporation part 10, rake 15a.
In addition, the sectional area of rake 15a is minimum in material supply unit 9a one side, and is along with becoming big near material evaporation part 10, identical at the sectional area of position that connects with material evaporation part 10 and material evaporation part 10.
Above-mentioned vapor deposition is one-body molded by graphite with the boat main body M of boat 1d, and the surface is further covered by thermolysis SP 1 (PBN) or SP 1 (BN) then.The heating of boat main body M is through energising between an end 3a and the other end 3b being utilized electrical resistance heating the thin-film material in pond 2 is heated to it more than vaporization temperature.
The vapor deposition that the temperature distribution T1 of Fig. 3 representes to obtain through the simulation of electricity/heat conduction is with the surperficial temperature distribution of boat 1d.Transverse axis is represented the distance of the 2 one end 3a apart from the pond, longitudinal axis presentation surface temperature.In detail, at one end 3a is formed with and carries out the fused temperature distribution and be in 1200 ℃～1300 ℃ material supply unit 9a be supplied to the material that comes from the outside.Be formed with 1300 ℃～1500 ℃ the material evaporation part 10 of being in that makes the thin-film material evaporation that flows into from material supply unit 9 between material supply unit 9a and the other end 3b.In addition, the sectional area of rake 15a is minimum in material supply unit 9a one side, and is along with becoming big near material evaporation part 10, identical at the sectional area of position that connects with material evaporation part 10 and material evaporation part 10.
At this, suppose and adopt the situation of aluminium as thin-film material, 1400 ℃ the expression temperature T 0 of Fig. 3 to be expressed as to make the required MIN temperature of fused thin-film material evaporation, be in this temperature at vapor deposition with the surface temperature of boat and carry out film forming when above.
Has the trend that the temperature that makes material supply unit 9a is the temperature distribution lower than 1300 ℃～1500 ℃ temperature distribution of material evaporation part 10 by the integrated jut 13a of graphite; Make temperature slope become big with the rake 15a of the adjacent setting of jut 13a from material supply unit 9a to material evaporation part 10; Be suppressed to inferior limit thereby can the temperature of material evaporation part 10 be reduced, and then can prevent dwindling of material evaporation region.On par 14, has the trend of dwindling the effect reduction that makes the material evaporation region that causes because of jut 13a.
The temperature distribution T2 of Fig. 3 is an existing vapor deposition shown in Figure 13 temperature distribution with boat; Temperature distribution T3 is the temperature distribution of the vapor deposition of the comparative example shown in Fig. 4 (a), Fig. 4 (b) with boat 1e; In this comparative example, jut 13a only is set on boat 1a at existing vapor deposition shown in Figure 13.Under arbitrary situation in temperature distribution T1, T2, T3, all be defined as material supply unit 9a and be in apart from the scope of end, pond 0～10mm, the material evaporation part is in apart from the scope of end, pond 10～80mm.
In addition; The sectional area of the jut 13a of the vapor deposition use boat of embodiment 1 is 8.6 with the ratio of the minimum sectional area of rake 15a; The minimum sectional area of rake 15a is 0.48 with the ratio of the sectional area of par 14, and rake 15a is 0.23 with the length ratio of par 14.
Can know from Fig. 3; Be in 1300 ℃ and condition with higher compare with the temperature distribution T2 of boat 1a at material supply unit 9a with existing vapor deposition shown in Figure 13; In the temperature distribution T1 of vapor deposition with boat 1d of this embodiment; The temperature of material supply unit 9a is near 1200 ℃, thereby fully shows the effect that jut 13a is set in bottom surface sections.The risk that the spittle produces in the time of reducing the material supply because of said temperature reduction effect.This is the effect that vapor deposition at comparative example shown in Figure 4 also can be seen in boat 1e, but from the temperature distribution T3 of comparative example, can be that the temperature of material evaporation part 10 reduces because of temperature decreasing effect makes the material evaporation region also.Though can realize like this reducing the risk that the spittle produces, because the material evaporation region of material evaporation part 10 is dwindled, therefore, to compare with boat 1a with vapor deposition shown in Figure 13, the productivity variation is tangible.
Relative therewith; In the temperature distribution T1 of vapor deposition with boat 1a of present embodiment 1; It is big that temperature slope from material supply unit 9a to material evaporation part 10 sharply becomes; Can not narrow down because of jut 13a makes the material evaporation region, therefore, can obtain with known vapor deposition shown in Figure 13 with the equal productivity of boat.
But, since different according to the size of jut 13a, rake 15a, par 14, also possibly can't obtain above effect, therefore should be noted that.For example, the sectional area of jut 13a is the key element of the temperature of decision material supply unit 9a shown in Figure 3 with the ratio of the minimum sectional area of rake 15a.Through aforementioned proportion is in more than 8.0, the temperature of material supply unit 9a and known vapor deposition shown in Figure 13 are compared with boat, expectability is to about temperature decreasing effect more than 100 ℃.The temperature of material supply unit 9a is in more than the fusing point of materials used, but compares with the temperature of material evaporation part 10, low more good more.
In addition, the length ratio of the 15a of rake when of the sectional area of the minimum sectional area of rake 15a and par 14 and par 14 is decision material evaporation part 10 key elements with respect to the relative temperature of rake 15a.If the former ratio less than 0.45 or the latter's ratio greater than 0.3, the resistance value step-down of par 14 then, 15a compares with rake, thermal value reduces.On the contrary, if the former ratio greater than 0.55 or the latter's ratio less than 0.2, then the resistance value of par 14 becomes big, 15a compares with rake, thermal value increases.No matter which kind of situation all can make vapor deposition become big with boat 1d temperature slope on the whole, thereby have the homogeneity variation of thermal value or the possibility that the material evaporation region is dwindled.
Confirm each size though should be noted that above-mentioned this trend; But as long as by above-mentioned simulated conditions; The sectional area that makes jut 13a and the ratio of the minimum sectional area of rake 15a are more than 8.0, the ratio of the minimum sectional area of rake 15a and the sectional area of par 14 is more than 0.45 below 0.55, the length ratio of rake 15a and par 14 is more than 0.2 below 0.3, just can obtain above-mentioned effect.Say from the result; For example the vapor deposition of the comparative example shown in Figure 4 that jut 13a is set for the temperature that reduces the material supply unit with boat 1e in; Owing to the rake 15a that sees among the embodiment 1 is not set, therefore, does not produce the effect that prevents that the material evaporation region from dwindling because of above-mentioned rake; It is about 20% to make material evaporation region expection dwindle, and such structure is not satisfactory.
In addition,, distinguishingly form, also can make temperature distribution near embodiment 1 through shape with jut 13a even if the comparative example that kind shown in the image pattern 4 is not provided with rake 15a except jut 13a, this name a person for a particular job after specify in the embodiment 4 stated.
(embodiment 2)
The vapor deposition of Fig. 5 and Fig. 6 (a), Fig. 6 (b), Fig. 6 (c) expression embodiment of the invention 2 is used boat.
In embodiment 1, the outstanding back side that is formed on pond 2 of jut 13a, but in present embodiment 2, jut 13aa, the outstanding side that is formed on pond 2 of 13ab, this point is different with embodiment 1.
Vapor deposition is made up of pond 2, jut 13aa, 13ab, rake 15aa, 15ab and par 14 with boat 1f; Wherein, Above-mentioned jut 13aa, 13ab are located at the two sides of vapor deposition with boat 1f; Above-mentioned rake 15aa, 15ab and jut 13aa, the adjacent setting of 13ab, above-mentioned par 14 and rake 15aa, the adjacent setting of 15ab.
In order to keep evaporation area; Comparatively it is desirable to, the sectional area that makes jut 13aa, 13ab and the ratio of the minimum sectional area of rake 15aa, 15ab are more than 8.0, the ratio of the minimum sectional area of rake 15aa, 15ab and the sectional area of par 14 is 0.45～0.55, rake 15aa, 15ab are 0.2～0.3 with the length ratio of par 14.
From the effect that is obtained, identical with embodiment 1, but compare with embodiment 1, because vapor deposition is big with the width length change of boat, therefore, in covering chamber, use or use a plurality of comparatively desirable separately with enough width length.
(embodiment 3)
The vapor deposition of Fig. 7 and Fig. 8 (a), Fig. 8 (b) expression embodiment of the invention 3 is used boat.
In the embodiment 1 shown in Fig. 1 and Fig. 2 (a), Fig. 2 (b), only 2 an above-mentioned end 3a one side has formed material supply unit 9a in the pond, but the vapor deposition of present embodiment 3 with boat 1g in, also 2 above-mentioned the other end 3b one side forms material supply unit 9b in the pond.
That is to say; In the pond 2 near clip material evaporation part 10 and above-mentioned the other end 3b, to be connected with material evaporation part 10 the conduct second material supply unit is set material supply unit 9b; And at the jut 13b that leans near conduct second jut that the sectional area of integrally formed sectional area ratio par 14 is big the above-mentioned the other end 3b at 2 back sides, pond; In pond 2, distribute along above-mentioned long side direction formation temperature; The rake 15b as second rake that par 14 is connected with material supply unit 9b is set, and rake 15b is formed sectional area towards becoming big near the direction of an above-mentioned end 3a.
Comparatively it is desirable to, the sectional area that makes jut 13a, 13a and the ratio of the minimum sectional area of rake 15a, 15b are more than 8.0, the ratio of the minimum sectional area of rake 15a, 15b and the sectional area of par 14 is 0.45～0.55, rake 15a, 15b are 0.2～0.3 with the length ratio of par 14.
Above-mentioned vapor deposition with boat 11 in, can material wire rod 6 be sent into material supply unit 9a, 9b respectively and thin-film material is supplied to pond 2 continuously, thereby boost productivity.
Fig. 9 representes the example of vapor deposition with the temperature distribution T4 on boat 11g surface.
Fig. 9 is the same with Fig. 3, and transverse axis representes that apart from the distance of end, pond the longitudinal axis is represented the surface temperature of vapor deposition with boat, and Fig. 9 is through vapor deposition that electricity/the heat conduction analog calculation the goes out distribution plan with the surface temperature of boat.The sectional area that makes jut 13a, 13b is 8.6 with the ratio of the minimum sectional area of rake 15a, 15b, and the minimum sectional area of rake 15a, 15b is 0.48 with the ratio of the sectional area of par 14, and rake 15a, 15b are 0.23 with the length ratio of par 14.In addition,, suppose that vapor deposition uses the material of boat to be graphite, as the state after the aluminium fusing of thin-film material as mimic material condition.T2 is an existing vapor deposition shown in Figure 13 temperature distribution with boat 1a.
Now, being defined as material supply unit 9a is in scope, the material evaporation part 10 that scope, material supply unit 9b apart from end, pond 0～10mm be in apart from end, pond 80～90mm and is in apart from the scope of end, pond 10～80mm.In addition, material evaporation lower limit temperature T0 is made as 1400 ℃, uses the boat surface temperature to evaporate lower limit temperature T0 as material at vapor deposition and carries out film forming when above.
Can know that from Fig. 9 the same with embodiment 1, the temperature that can be implemented in material supply unit 9a, 9b place reduces, and dwindling of material evaporation region can not occur.
(embodiment 4)
The vapor deposition of Figure 10 (a), Figure 10 (b) expression embodiment of the invention 4, embodiment 5 is used boat.
In the embodiment 1 shown in Fig. 1 and Fig. 2 (a), Fig. 2 (b); Through jut 13a, rake 15a, par 14 being arranged on the back side in pond 2; Just can obtain to liken to and be the wide material evaporation region of the temperature distribution of target; But the vapor deposition of the embodiment 4 shown in Figure 10 (a) with boat 1h in, except jut 13a, rake 15a (representing with imaginary line) is not set.
The shape of the jut 13a of present embodiment 4 is different with the shape of the jut 13a of embodiment 1, and it is to form scarp 16 with the mode that 10 sectional areas the closer to the material evaporation part reduce.By this, can realize more approaching the temperature distribution of embodiment 1 than the situation of comparative example shown in Figure 4.
In the embodiment 2 shown in Fig. 5 and Fig. 6 (a)～Fig. 6 (b); Through jut 13aa, 13ab, rake 15aa, 15ab, par 14 being arranged on the side in pond 2; Just can obtain to liken to and be the wide material evaporation region of the temperature distribution of target; But the vapor deposition of the embodiment 5 shown in Figure 10 (b) with boat 1i in, except jut 13aa, 13ab, rake 15aa, 15ab (representing with imaginary line) are not set.
The jut 13aa of the jut 13aa of present embodiment 5, the shape of 13ab and embodiment 2, the shape of 13ab are different, and it is to form scarp 16aa, 16ab with the mode that 10 sectional areas the closer to the material evaporation part reduce.By this, can realize more approaching the temperature distribution of embodiment 1 than the situation of comparative example shown in Figure 4.
(embodiment 5)
Figure 11 representes that the vapor deposition of the embodiment of the invention 6 uses boat.
In the embodiment 2 shown in Fig. 5 and Fig. 6 (a)～Fig. 6 (c); Only the above-mentioned end 3a at boat main body M is provided with material supply unit 9a; But the vapor deposition of embodiment shown in Figure 11 6 with boat 1j in, also the above-mentioned the other end 3b at boat main body M has material supply unit 9b, this point is different.
In embodiment 6; Through forming jut 13aa, 13ab, rake 15aa, 15ab in side by near the pond 2 the end 3a; Also form jut 13ba, 13bb, rake 15ba, 15bb, thereby can realize the temperature distribution identical with embodiment 3 in the side of leaning near the pond 2 the other end 3b.
In the foregoing description 6; Rake 15aa, 15ab except jut 13aa, 13ab, have also been formed; Rake 15ba, 15bb except jut 13ba, 13bb, have also been formed; But the same with the situation of the embodiment 5 shown in Figure 10 (b), through forming the scarp, also can obtain to liken to and be the wide material evaporation region of the temperature distribution of target in jut 13aa, 13ab, 13ba, the last mode that reduces with 10 sectional areas of 13bb the closer to the material evaporation part.
The situation that the sectional area of the par 14 of above-mentioned each embodiment is equated on above-mentioned long side direction is illustrated; Even if but in the par 14 surface form several millimeters with interior concavo-convex and make sectional area on above-mentioned long side direction about equally, also can expect identical effect.
The present invention is not limited to vacuum evaporation, and it also helps the yield rate of the film formation process in various device manufacturing process to improve and productivity improves.
Claims (10)
1. a vapor deposition is used boat; Be formed with the pond in the boat main body; Wherein, said pond has the thin-film material fused material supply unit that makes to supply with and supplies thin-film material after the fusion from the material evaporation part that said material supply unit flows into, through energising between the end of said boat main body and the other end is heated to it more than vaporization temperature with the thin-film material of said material evaporation part; It is characterized in that
The big jut of sectional area that forms the said material of sectional area ratio evaporation part in the back side or the side of the said material supply unit in said pond.
2. vapor deposition as claimed in claim 1 is used boat, it is characterized in that, the shape of said jut is molded into the closer to said material evaporation part sectional area diminishes.
3. vapor deposition as claimed in claim 1 is used boat; It is characterized in that; The back side or side in said material evaporation part are provided with par and rake, and wherein, the sectional area of said par is equating on a said end and the long side direction that the said the other end is connected; Said rake is connected said par with said material supply unit, the sectional area of said rake is becoming big from a said end towards the direction of the said the other end.
4. vapor deposition as claimed in claim 3 is used boat, it is characterized in that, with vertical of the long side direction that a said end is connected with the said the other end on sectional area diminish by the order of said material supply unit, said material evaporation part, said rake.
5. vapor deposition as claimed in claim 4 is used boat, it is characterized in that, the sectional area of said rake is minimum in material supply unit one side, and is along with becoming big near the material evaporation part, identical at the sectional area of position that connects with the material evaporation part and material evaporation part.
6. vapor deposition as claimed in claim 4 is used boat, it is characterized in that, the sectional area of said material supply unit is more than 8.0 with the ratio of the minimum sectional area of said rake.
7. vapor deposition as claimed in claim 4 is used boat, it is characterized in that, at the least part place of said rake, the ratio of the sectional area of said rake and the sectional area of said material evaporation part is more than 0.45 below 0.55.
8. vapor deposition as claimed in claim 4 is used boat, it is characterized in that, the length ratio on the said long side direction of length on the said long side direction of said rake and said material evaporation part is more than 0.20 below 0.30.
9. use boat like each described vapor deposition in the claim 3 to 8, it is characterized in that,
On the upper surface that is formed with said material evaporation part, be provided with the second material supply unit that clips said material evaporation part and be connected with said material evaporation part at the said the other end,
Not at the upper surface that is formed with said material evaporation part, but overleaf or near the lateral big jut of sectional area that forms the said par of sectional area ratio the said the other end that leans on,
Second rake that said par is connected with the said second material supply unit is set, and said second rake is formed sectional area in change on the direction of the said the other end greatly.
10. film; With thin-film material be supplied to each described vapor deposition in the claim 1 to 9 with the material supply unit of boat so that said thin-film material fusion; Said thin-film material after the fusion is guided to the material evaporation part; And make said thin-film material, thereby the film vapor deposition of said thin-film material is arrived by object in the evaporation of place, said material evaporation part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011052268A JP5611086B2 (en) | 2011-03-10 | 2011-03-10 | Deposition boat and film formation method using the same |
| JP2011-052268 | 2011-03-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102677000A true CN102677000A (en) | 2012-09-19 |
| CN102677000B CN102677000B (en) | 2015-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210073590.1A Expired - Fee Related CN102677000B (en) | 2011-03-10 | 2012-03-09 | The film of evaporation boat and this evaporation boat of use |
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| Country | Link |
|---|---|
| JP (1) | JP5611086B2 (en) |
| CN (1) | CN102677000B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2887416B1 (en) * | 2013-12-23 | 2018-02-21 | Novaled GmbH | N-doped semiconducting material comprising phosphine oxide matrix and metal dopant |
| EP3767004B1 (en) * | 2019-07-17 | 2023-09-27 | 3M Innovative Properties Company | Evaporation boat for evaporation of metals |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5943873A (en) * | 1982-09-04 | 1984-03-12 | Konishiroku Photo Ind Co Ltd | Vessel for storing material to be evaporated |
| JPH05230631A (en) * | 1991-12-03 | 1993-09-07 | Leybold Ag | Evaporator boat for apparatus for forming coating film on substrate |
| KR100589937B1 (en) * | 2004-02-20 | 2006-06-19 | 엘지전자 주식회사 | Evaporation source for forming a metal layer |
| EP1967604A1 (en) * | 2007-03-08 | 2008-09-10 | Applied Materials, Inc. | Evaporation crucible and evaporation apparatus with directional evaporation |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07207434A (en) * | 1994-01-18 | 1995-08-08 | Shin Etsu Chem Co Ltd | Vapor deposition boat |
| EP1760169B1 (en) * | 2005-08-03 | 2008-04-16 | Applied Materials GmbH & Co. KG | Evaporator for coating of substrates |
-
2011
- 2011-03-10 JP JP2011052268A patent/JP5611086B2/en not_active Expired - Fee Related
-
2012
- 2012-03-09 CN CN201210073590.1A patent/CN102677000B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5943873A (en) * | 1982-09-04 | 1984-03-12 | Konishiroku Photo Ind Co Ltd | Vessel for storing material to be evaporated |
| JPH05230631A (en) * | 1991-12-03 | 1993-09-07 | Leybold Ag | Evaporator boat for apparatus for forming coating film on substrate |
| KR100589937B1 (en) * | 2004-02-20 | 2006-06-19 | 엘지전자 주식회사 | Evaporation source for forming a metal layer |
| EP1967604A1 (en) * | 2007-03-08 | 2008-09-10 | Applied Materials, Inc. | Evaporation crucible and evaporation apparatus with directional evaporation |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5611086B2 (en) | 2014-10-22 |
| CN102677000B (en) | 2015-11-25 |
| JP2012188692A (en) | 2012-10-04 |
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