CN102674840A - 一种金刚石-硅材料的快速烧结制备方法 - Google Patents
一种金刚石-硅材料的快速烧结制备方法 Download PDFInfo
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- CN102674840A CN102674840A CN2012101880743A CN201210188074A CN102674840A CN 102674840 A CN102674840 A CN 102674840A CN 2012101880743 A CN2012101880743 A CN 2012101880743A CN 201210188074 A CN201210188074 A CN 201210188074A CN 102674840 A CN102674840 A CN 102674840A
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- sintering
- diamond
- discharge plasma
- temperature
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- 238000005245 sintering Methods 0.000 title claims abstract description 78
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000002210 silicon-based material Substances 0.000 title claims abstract description 8
- 239000010432 diamond Substances 0.000 claims abstract description 27
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 8
- 239000010439 graphite Substances 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000011261 inert gas Substances 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 229910017083 AlN Inorganic materials 0.000 claims description 25
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 239000004411 aluminium Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 235000013312 flour Nutrition 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011863 silicon-based powder Substances 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 9
- 238000004100 electronic packaging Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000002490 spark plasma sintering Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- -1 Al2O3 Chemical class 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 229910002555 FeNi Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002153 silicon-carbon composite material Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 210000001170 unmyelinated nerve fiber Anatomy 0.000 description 1
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- Ceramic Products (AREA)
Abstract
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CN 201210188074 CN102674840B (zh) | 2012-06-08 | 2012-06-08 | 一种金刚石-硅材料的快速烧结制备方法 |
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CN 201210188074 CN102674840B (zh) | 2012-06-08 | 2012-06-08 | 一种金刚石-硅材料的快速烧结制备方法 |
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CN102674840A true CN102674840A (zh) | 2012-09-19 |
CN102674840B CN102674840B (zh) | 2013-12-18 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102709258A (zh) * | 2012-06-12 | 2012-10-03 | 徐亚红 | 一种金刚石-硅复合材料 |
CN105439620A (zh) * | 2014-09-28 | 2016-03-30 | 盐城工学院 | 放电等离子烧结制备多孔氮化硅的方法 |
CN111730054A (zh) * | 2020-06-30 | 2020-10-02 | 湖南大学 | 一种碳化硅包覆金刚石复合粉末的低温合成方法及应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1260733A (zh) * | 1997-04-17 | 2000-07-19 | 德比尔斯工业钻石部门有限公司 | 用于金刚石和金刚石生长的烧结方法 |
CN1944698A (zh) * | 2006-10-24 | 2007-04-11 | 北京科技大学 | 一种超高导热、低热膨胀系数的复合材料及其制备方法 |
CN101728279A (zh) * | 2009-11-27 | 2010-06-09 | 北京科技大学 | 一种高性能金刚石强化Al基电子封装复合材料的制备方法 |
-
2012
- 2012-06-08 CN CN 201210188074 patent/CN102674840B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1260733A (zh) * | 1997-04-17 | 2000-07-19 | 德比尔斯工业钻石部门有限公司 | 用于金刚石和金刚石生长的烧结方法 |
CN1944698A (zh) * | 2006-10-24 | 2007-04-11 | 北京科技大学 | 一种超高导热、低热膨胀系数的复合材料及其制备方法 |
CN101728279A (zh) * | 2009-11-27 | 2010-06-09 | 北京科技大学 | 一种高性能金刚石强化Al基电子封装复合材料的制备方法 |
Non-Patent Citations (2)
Title |
---|
CONGXU ZHU ET.AL.: "Thermal properties of Si(Al)/diamond composites prepared by in situ reactive sintering", 《MATERIALS AND DESIGN》 * |
SERGEY V. KIDALOV ET.AL.: "Thermal Conductivity of Diamond Composites", 《MATERIALS》 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102709258A (zh) * | 2012-06-12 | 2012-10-03 | 徐亚红 | 一种金刚石-硅复合材料 |
CN105439620A (zh) * | 2014-09-28 | 2016-03-30 | 盐城工学院 | 放电等离子烧结制备多孔氮化硅的方法 |
CN111730054A (zh) * | 2020-06-30 | 2020-10-02 | 湖南大学 | 一种碳化硅包覆金刚石复合粉末的低温合成方法及应用 |
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CN102674840B (zh) | 2013-12-18 |
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Inventor after: Wang Yuan Inventor after: Wu Weina Inventor after: Cai Hongxin Inventor after: Jia Lei Inventor after: Yan Lingling Inventor after: Xu Jun Inventor before: Li Chao |
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Free format text: CORRECT: INVENTOR; FROM: LI CHAO TO: WANG YUAN WU WEINA CAI HONGXIN JIA LEI YAN LINGLING XU JUN Free format text: CORRECT: ADDRESS; FROM: 314311 JIAXING, ZHEJIANG PROVINCE TO: 454000 JIAOZUO, HENAN PROVINCE |
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Effective date of registration: 20131113 Address after: 454000 Century Avenue, Jiaozuo high tech Zone, Henan, No. 2001 Applicant after: Henan Polytechnic University Address before: Dang Zhen Jiaxing Haiyan County in Zhejiang province 314311 city Shen Yong Qing Cun Wu Jia Yan No. 32 Applicant before: Li Chao |
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