CN102639281B - 利用分束器进行激光剥离方法的方法和装置 - Google Patents

利用分束器进行激光剥离方法的方法和装置 Download PDF

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Publication number
CN102639281B
CN102639281B CN201080055854.XA CN201080055854A CN102639281B CN 102639281 B CN102639281 B CN 102639281B CN 201080055854 A CN201080055854 A CN 201080055854A CN 102639281 B CN102639281 B CN 102639281B
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China
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beamlets
carrier
beams
sub
laser beam
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Expired - Fee Related
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CN201080055854.XA
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English (en)
Chinese (zh)
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CN102639281A (zh
Inventor
R.瓦格纳
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
CN201080055854.XA 2009-12-09 2010-10-21 利用分束器进行激光剥离方法的方法和装置 Expired - Fee Related CN102639281B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009057566A DE102009057566A1 (de) 2009-12-09 2009-12-09 Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren
DE102009057566.9 2009-12-09
PCT/EP2010/065891 WO2011069735A1 (de) 2009-12-09 2010-10-21 Verfahren und vorrichtung für ein laserabhebeverfahren mit einem strahlteiler

Publications (2)

Publication Number Publication Date
CN102639281A CN102639281A (zh) 2012-08-15
CN102639281B true CN102639281B (zh) 2015-02-25

Family

ID=43416867

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080055854.XA Expired - Fee Related CN102639281B (zh) 2009-12-09 2010-10-21 利用分束器进行激光剥离方法的方法和装置

Country Status (8)

Country Link
US (1) US8946098B2 (cg-RX-API-DMAC7.html)
EP (1) EP2509741B9 (cg-RX-API-DMAC7.html)
JP (1) JP5635123B2 (cg-RX-API-DMAC7.html)
KR (1) KR20120101707A (cg-RX-API-DMAC7.html)
CN (1) CN102639281B (cg-RX-API-DMAC7.html)
DE (1) DE102009057566A1 (cg-RX-API-DMAC7.html)
TW (1) TW201143952A (cg-RX-API-DMAC7.html)
WO (1) WO2011069735A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109623155A (zh) * 2018-11-14 2019-04-16 吉林大学 利用多光子激发进行近4π立体角飞秒激光直写加工的方法及应用

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010030358B4 (de) 2010-06-22 2014-05-22 Osram Opto Semiconductors Gmbh Verfahren zum Abtrennen einer Substratscheibe
US20140251533A1 (en) * 2013-03-11 2014-09-11 Samsung Display Co., Ltd. Substrate peeling device, method for peeling substrate, and method for fabricating flexible display device
GB2519088B (en) * 2013-10-08 2015-09-16 M Solv Ltd Laser scanning system for laser release
US9610651B2 (en) 2014-02-26 2017-04-04 Nlight, Inc. Square pulse laser lift off
CN104158067B (zh) * 2014-08-22 2016-06-22 苏州大学 一种导线外皮的激光剥离方法
KR20160049382A (ko) 2014-10-27 2016-05-09 삼성디스플레이 주식회사 레이저 박리 장치 및 표시 장치의 제조 방법
CN104297926A (zh) * 2014-11-12 2015-01-21 核工业理化工程研究院 高功率激光分光光纤装置
GB201509766D0 (en) * 2015-06-05 2015-07-22 Element Six Technologies Ltd Method of fabricating diamond-semiconductor composite substrates
DE102016201418A1 (de) 2016-01-29 2017-08-03 Kjellberg-Stiftung Vorrichtung und Verfahren zur thermischen Bearbeitung
DE102018200036B3 (de) * 2018-01-03 2019-01-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optische Anordnung zur direkten Laserinterferenzstrukturierung
WO2020254639A1 (de) * 2019-06-21 2020-12-24 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und vorrichtung zum bearbeiten eines werkstücks mit zusammensetzung des bearbeitungsstrahles aus mindestens zwei strahlprofilen
CN110491811B (zh) * 2019-09-19 2024-06-14 北京大学东莞光电研究院 一种可调节光强型激光剥离装置
DE102022114646A1 (de) 2022-06-10 2023-12-21 Trumpf Laser Gmbh Verfahren und Vorrichtung zum Verarbeiten mindestens eines Teilbereichs eines Schichtsystems
DE102022114637A1 (de) 2022-06-10 2023-12-21 Trumpf Laser Gmbh Verfahren und Vorrichtung zum Verarbeiten mindestens eines Teilbereichs eines Schichtsystems
DE102023201553A1 (de) * 2023-02-22 2024-08-22 3D-Micromac Ag Verfahren und System zur Herstellung mikroelektronischer Komponenten mit Schichtaufbau
GB2637284A (en) * 2023-10-13 2025-07-23 Pulse Investments Uk Ltd Method and system for surface layer removal

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5786560A (en) * 1995-03-31 1998-07-28 Panasonic Technologies, Inc. 3-dimensional micromachining with femtosecond laser pulses
CN2432001Y (zh) * 2000-06-21 2001-05-30 中国科学院光电技术研究所 一种激光干涉光刻系统
CN1745483A (zh) * 2003-01-31 2006-03-08 奥斯兰姆奥普托半导体有限责任公司 用于制造一个半导体元器件的方法
CN101434005A (zh) * 2008-11-20 2009-05-20 武汉凌云光电科技有限责任公司 多通道非晶硅太阳能板激光刻膜机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06296597A (ja) 1992-08-19 1994-10-25 D F C:Kk 脳波分析方法及びその装置
US5798867A (en) * 1997-02-04 1998-08-25 Miyachi Technos Corporation Laser beam-splitting apparatus
US6210479B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Product and process for forming a semiconductor structure on a host substrate
US6169631B1 (en) * 1998-05-19 2001-01-02 Seagate Technology Llc Laser-texturing data zone on a magnetic disk surface by using degenerative two wave mixing
TWI226139B (en) 2002-01-31 2005-01-01 Osram Opto Semiconductors Gmbh Method to manufacture a semiconductor-component
JP4423465B2 (ja) 2004-02-12 2010-03-03 住友重機械工業株式会社 レーザ加工方法及びレーザ加工装置
DE602006004913D1 (de) 2005-04-28 2009-03-12 Semiconductor Energy Lab Verfahren und Vorrichtung zur Herstellung von Halbleitern mittels Laserstrahlung
US7829909B2 (en) 2005-11-15 2010-11-09 Verticle, Inc. Light emitting diodes and fabrication methods thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5786560A (en) * 1995-03-31 1998-07-28 Panasonic Technologies, Inc. 3-dimensional micromachining with femtosecond laser pulses
CN2432001Y (zh) * 2000-06-21 2001-05-30 中国科学院光电技术研究所 一种激光干涉光刻系统
CN1745483A (zh) * 2003-01-31 2006-03-08 奥斯兰姆奥普托半导体有限责任公司 用于制造一个半导体元器件的方法
CN101434005A (zh) * 2008-11-20 2009-05-20 武汉凌云光电科技有限责任公司 多通道非晶硅太阳能板激光刻膜机

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109623155A (zh) * 2018-11-14 2019-04-16 吉林大学 利用多光子激发进行近4π立体角飞秒激光直写加工的方法及应用

Also Published As

Publication number Publication date
TW201143952A (en) 2011-12-16
WO2011069735A1 (de) 2011-06-16
DE102009057566A1 (de) 2011-06-16
KR20120101707A (ko) 2012-09-14
EP2509741B9 (de) 2015-02-25
US8946098B2 (en) 2015-02-03
EP2509741A1 (de) 2012-10-17
JP2013513487A (ja) 2013-04-22
JP5635123B2 (ja) 2014-12-03
CN102639281A (zh) 2012-08-15
US20120258605A1 (en) 2012-10-11
EP2509741B1 (de) 2014-12-03

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