CN102612419B - 激光加工装置 - Google Patents
激光加工装置 Download PDFInfo
- Publication number
- CN102612419B CN102612419B CN201080003896.9A CN201080003896A CN102612419B CN 102612419 B CN102612419 B CN 102612419B CN 201080003896 A CN201080003896 A CN 201080003896A CN 102612419 B CN102612419 B CN 102612419B
- Authority
- CN
- China
- Prior art keywords
- laser
- workpiece
- light
- unit
- focusing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005286 illumination Methods 0.000 claims abstract description 25
- 230000009471 action Effects 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 7
- 230000003287 optical effect Effects 0.000 claims description 69
- 201000009310 astigmatism Diseases 0.000 claims description 11
- 230000011218 segmentation Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 230000004048 modification Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 230000008859 change Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 230000033228 biological regulation Effects 0.000 description 5
- 239000007924 injection Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000012887 quadratic function Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 231100000241 scar Toxicity 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2010/066560 WO2012039057A1 (ja) | 2010-09-24 | 2010-09-24 | レーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102612419A CN102612419A (zh) | 2012-07-25 |
CN102612419B true CN102612419B (zh) | 2016-01-06 |
Family
ID=44946858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080003896.9A Expired - Fee Related CN102612419B (zh) | 2010-09-24 | 2010-09-24 | 激光加工装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4803566B1 (zh) |
CN (1) | CN102612419B (zh) |
WO (1) | WO2012039057A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10029396B2 (en) * | 2014-10-30 | 2018-07-24 | Shachihata Inc. | Seal carving apparatus and thermal carving machine |
US10807191B2 (en) * | 2015-06-01 | 2020-10-20 | Panasonic Intellectual Property Management Co., Ltd. | Laser welding method, laser welding conditions determining method, and laser welding system |
JP6594680B2 (ja) * | 2015-07-07 | 2019-10-23 | 日立オートモティブシステムズ株式会社 | 中空複合磁性部材の製造方法及び製造装置並びに燃料噴射弁 |
JP6202694B2 (ja) * | 2016-08-10 | 2017-09-27 | 国立大学法人埼玉大学 | 基板加工方法及び基板加工装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06190578A (ja) * | 1992-12-25 | 1994-07-12 | Isuzu Motors Ltd | レーザー加工装置 |
JPH08250021A (ja) * | 1995-03-13 | 1996-09-27 | Canon Inc | レーザー光を用いた表面伝導型電子放出素子の製造方法及び製造装置 |
CN101522360A (zh) * | 2006-10-02 | 2009-09-02 | 浜松光子学株式会社 | 激光加工装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5199789B2 (ja) * | 2008-08-25 | 2013-05-15 | 株式会社ディスコ | レーザー加工装置及びレーザー加工方法 |
-
2010
- 2010-09-24 JP JP2011517708A patent/JP4803566B1/ja not_active Expired - Fee Related
- 2010-09-24 WO PCT/JP2010/066560 patent/WO2012039057A1/ja active Application Filing
- 2010-09-24 CN CN201080003896.9A patent/CN102612419B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06190578A (ja) * | 1992-12-25 | 1994-07-12 | Isuzu Motors Ltd | レーザー加工装置 |
JPH08250021A (ja) * | 1995-03-13 | 1996-09-27 | Canon Inc | レーザー光を用いた表面伝導型電子放出素子の製造方法及び製造装置 |
CN101522360A (zh) * | 2006-10-02 | 2009-09-02 | 浜松光子学株式会社 | 激光加工装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2012039057A1 (ja) | 2012-03-29 |
CN102612419A (zh) | 2012-07-25 |
JPWO2012039057A1 (ja) | 2014-02-03 |
JP4803566B1 (ja) | 2011-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder |
Address after: Tokyo, Japan Co-patentee after: PIONEER FA Corp. Patentee after: PIONEER Corp. Address before: Kanagawa Co-patentee before: Pioneer Fa Corp. Patentee before: PIONEER Corp. |
|
CP02 | Change in the address of a patent holder | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Co-patentee after: PFA Co. Patentee after: PIONEER Corp. Address before: Tokyo, Japan Co-patentee before: Pioneer Fa Corp. Patentee before: PIONEER Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180829 Address after: Saitama Prefecture, Japan Co-patentee after: SHINKAWA Ltd. Patentee after: PFA Co. Address before: Tokyo, Japan Co-patentee before: PFA Co. Patentee before: PIONEER Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160106 Termination date: 20190924 |