CN102610592B - 沟槽式mos静电释放结构制造方法以及集成电路 - Google Patents
沟槽式mos静电释放结构制造方法以及集成电路 Download PDFInfo
- Publication number
- CN102610592B CN102610592B CN201210061097.8A CN201210061097A CN102610592B CN 102610592 B CN102610592 B CN 102610592B CN 201210061097 A CN201210061097 A CN 201210061097A CN 102610592 B CN102610592 B CN 102610592B
- Authority
- CN
- China
- Prior art keywords
- groove mos
- static driven
- driven comb
- interlayer dielectric
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210061097.8A CN102610592B (zh) | 2012-03-09 | 2012-03-09 | 沟槽式mos静电释放结构制造方法以及集成电路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210061097.8A CN102610592B (zh) | 2012-03-09 | 2012-03-09 | 沟槽式mos静电释放结构制造方法以及集成电路 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102610592A CN102610592A (zh) | 2012-07-25 |
CN102610592B true CN102610592B (zh) | 2016-11-02 |
Family
ID=46527871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210061097.8A Active CN102610592B (zh) | 2012-03-09 | 2012-03-09 | 沟槽式mos静电释放结构制造方法以及集成电路 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102610592B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109987568A (zh) * | 2017-12-29 | 2019-07-09 | 中芯国际集成电路制造(上海)有限公司 | 薄膜结构的形成方法、声电换能器件及其形成方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6008081A (en) * | 1998-06-06 | 1999-12-28 | United Microelectronics Corp. | Method of forming electrostatic discharge protection structure of dynamic random access memory |
CN101023525A (zh) * | 2004-05-13 | 2007-08-22 | 硅谷实验室公司 | 包括金属网结构的半导体集成电路 |
-
2012
- 2012-03-09 CN CN201210061097.8A patent/CN102610592B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6008081A (en) * | 1998-06-06 | 1999-12-28 | United Microelectronics Corp. | Method of forming electrostatic discharge protection structure of dynamic random access memory |
CN101023525A (zh) * | 2004-05-13 | 2007-08-22 | 硅谷实验室公司 | 包括金属网结构的半导体集成电路 |
Also Published As
Publication number | Publication date |
---|---|
CN102610592A (zh) | 2012-07-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102446733B (zh) | 高压射频横向扩散结构的功率器件及其制造方法 | |
CN204289464U (zh) | 一种高压pmos器件 | |
CN102097480B (zh) | N型超结横向双扩散金属氧化物半导体管 | |
CN104183644A (zh) | 一种超结沟槽金属氧化物半导体场效应管及其制造方法 | |
CN103985746B (zh) | 沟槽型igbt器件及其制造方法 | |
CN103178093A (zh) | 高压结型场效应晶体管的结构及制备方法 | |
US20210175347A1 (en) | Ldmos device and manufacturing method thereof | |
CN101924131A (zh) | 横向扩散mos器件及其制备方法 | |
CN103745988B (zh) | 一种高压驱动电路的隔离结构 | |
CN203617299U (zh) | 一种双扩散金属氧化物半导体 | |
US8211766B2 (en) | Method of fabricating a trench power MOS transistor | |
CN102610592B (zh) | 沟槽式mos静电释放结构制造方法以及集成电路 | |
CN104253050A (zh) | 一种槽型横向mosfet器件的制造方法 | |
CN102097481B (zh) | P型超结横向双扩散金属氧化物半导体管 | |
KR101685572B1 (ko) | 바닥 산화막의 전계를 감소시키는 실리콘 카바이드 모스펫 소자 및 그의 제조 방법 | |
CN105742179B (zh) | 一种igbt器件的制备方法 | |
CN105576022B (zh) | 具有超结结构的半导体器件及其制备方法 | |
CN103779416B (zh) | 一种低vf的功率mosfet器件及其制造方法 | |
CN205863136U (zh) | 沟槽功率器件 | |
CN104064596B (zh) | Nldmos器件及其制造方法 | |
CN103762241B (zh) | 一种梳状栅纵向沟道soi ldmos单元 | |
CN207719217U (zh) | 平面高压mosfet功率晶体管 | |
CN208142188U (zh) | 一种基于倒阱工艺的功率mosfet器件 | |
CN106558557A (zh) | 半导体器件的制作方法 | |
CN105378933A (zh) | 半导体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140425 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140425 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |