CN102602159A - Thin-film type thermo-sensitive printing head and manufacturing method thereof - Google Patents
Thin-film type thermo-sensitive printing head and manufacturing method thereof Download PDFInfo
- Publication number
- CN102602159A CN102602159A CN2011100287421A CN201110028742A CN102602159A CN 102602159 A CN102602159 A CN 102602159A CN 2011100287421 A CN2011100287421 A CN 2011100287421A CN 201110028742 A CN201110028742 A CN 201110028742A CN 102602159 A CN102602159 A CN 102602159A
- Authority
- CN
- China
- Prior art keywords
- layer
- thickness
- conductor layer
- heater
- common electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a thin-film type thermo-sensitive printing head, comprising a base plate, a glaze layer, a resistor layer, a conductor layer and a protection layer, which are overlapped in sequence, wherein the conductor layer comprises an independent electrode and a common electrode, which are oppositely arranged at interval; one part of the resistor layer, which is arranged at the interval part of the independent electrode and the common electrode, is a heating body, and the thickness of the parts of the independent electrode and the common electrode, which are close to the heating body, is less than the thickness of the parts which are far away from the heating body. The invention further discloses a manufacturing method for producing the thin-film type thermo-sensitive printing head. The thin-film type thermo-sensitive printing head disclosed by the invention has strong wear resistance, and the service life of the thin-film type thermo-sensitive printing head can be prolonged.
Description
Technical field
The present invention relates to a kind of film-type thermal printing head and manufacturing approach thereof.
Background technology
Common film-type thermal printing header structure is as shown in Figure 1; On the ceramic substrate 1 ' of thermal printing head, be provided with glaze layer 2 ' along its length; Glaze layer 2 ' cross section has a convexity, on glaze layer 2 ', is coated with the uniform resistive layer of thickness 3 ', conductor layer 4 ', and protective layer 5 '; Wherein conductor layer 4 ' breaks off at glaze layer high spot at interval, and the exposed portions serve resistive layer forms heater 31 '.Conductor layer 4 ' comprises a plurality of absolute electrodes 41 ' and common electrode 42 ' that interval heater 31 ' is oppositely arranged; When absolute electrode 41 ' is switched on common electrode 42 '; There is electric current to pass through on the therebetween heater 31 '; Produce heat, see through protective layer 5 ' and act on the print media, implement to print.
Because the uniform conductor layer of thickness has formed two bust steps when breaking off at the heater place; Therefore; The protective layer that evenly covers on conductor layer and the heater forms two steps thereupon; Impact that the protective layer at step place receives when printing and frictional force can sharply increase, and the wearing and tearing of acceleration protection layer cause print head longevity to reduce.
Summary of the invention
The problem that exists to film-type thermal printing head in the background technology and propose the present invention, for this reason, main purpose of the present invention provides a kind of printhead wearability that can improve, thereby improves the film-type thermal printing head of print head longevity.
To achieve these goals, according to an aspect of the present invention, a kind of film-type thermal printing head is provided.
According to film-type thermal printing head provided by the invention; Comprise the substrate, glaze layer, resistive layer, conductor layer and the protective layer that are cascading; Wherein, said conductor layer comprises absolute electrode and the common electrode that relative spacing is provided with, and the part that said resistive layer is positioned at said absolute electrode and said common electrode interval is a heater; Wherein, said absolute electrode and said common electrode near the thickness of the part of said heater less than thickness away from the part of heater.
Further, said absolute electrode and said common electrode are 0.1 μ m～0.6 μ m at the thickness near the part of said heater, are 0.6 μ m～1.5 μ m at the thickness away from the part of said heater.
To achieve these goals, according to a further aspect in the invention, a kind of manufacturing approach of film-type thermal printing head is provided.Comprise: on substrate, form the glaze layer; On said glaze layer, form resistive layer; On said resistive layer, form the conductor layer of uneven gauge; Said conductor layer comprises absolute electrode and the common electrode that relative spacing is provided with; The part that said resistive layer is positioned at said absolute electrode and said common electrode interval is a heater, said absolute electrode and said common electrode near the thickness of the part of said heater less than thickness away from the part of heater; On said conductor layer, form protective layer.
Further; The concrete grammar that on said resistive layer, forms conductor layer in uneven thickness does, above the desired location of said resistive layer, is provided with shelter, adopts the method for evaporation or sputter to form said conductor layer; Wherein, said desired location is said heater position.
Further, adjust the thickness of said conductor layer through the size of adjusting said shelter.
Further, through adjusting the thickness of the said conductor layer of distance adjustment between said shelter and the said resistive layer.
Further, the concrete grammar of the said glaze layer of formation forms said glaze layer for the method that adopts printing to fire on substrate on said substrate.
Further, on said glaze layer, form the said resistive layer of the concrete grammar of said resistive layer for the method formation film like of employing sputter.
Further, the concrete grammar of the said protective layer of formation forms said protective layer for the method that adopts sputter or chemical vapor deposition on said conductor layer.
Further, on said resistive layer, form conductor layer in uneven thickness concrete grammar can also for, at first form the ground floor conductor layer of first thickness on said resistive layer surface; Then form the second layer conductor layer of second thickness on said ground floor conductor layer surface, wherein first thickness is greater than second thickness.
Except top described purpose, characteristic and advantage, other purpose, characteristic and advantage that the present invention has are with combining accompanying drawing to do further detailed explanation.
Description of drawings
Constitute this specification a part, be used for further understanding accompanying drawing of the present invention and show the preferred embodiments of the present invention, and be used for explaining principle of the present invention with specification.Among the figure:
Fig. 1 is common film printhead schematic cross-section;
Fig. 2 is the first embodiment schematic cross-section of film-type thermal printing provided by the invention;
Fig. 3 is a thermal printing head shown in Figure 2 stereogram when not covered by the protective layer;
Fig. 4 is the film-type thermal printing method for making head first embodiment sketch map provided by the invention;
Fig. 5 is the film-type thermal printing method for making head second embodiment step 1 sketch map provided by the invention;
Fig. 6 is the film-type thermal printing method for making head second embodiment step 2 sketch map provided by the invention;
Fig. 7 is the film-type thermal printing head schematic cross-section of producing according to film-type thermal printing method for making head second embodiment provided by the invention.
The specific embodiment
Below in conjunction with accompanying drawing embodiments of the invention are elaborated, but the multitude of different ways that the present invention can be defined by the claims and cover is implemented.
Fig. 2 is that the present invention provides the film-type thermal printing first embodiment schematic cross-section, and Fig. 3 is a thermal printing head shown in Figure 2 stereogram when not covered by the protective layer.As shown in the figure, the film-type thermal printing head comprises substrate 1, glaze layer 2, resistive layer 3 and the conductor layer 4 that is cascading, and protective layer 5.
Wherein, substrate 1 is made up of insulating materials such as potteries, is the tabular structure of rectangle; Glaze layer 2 covers on the substrate 1, and glaze layer 2 can have two kinds of forms, and a kind of is comprehensive glaze, covers whole base plate 1 surface; Another kind is local glaze, and along the part of substrate 1 length direction covered substrate 1, glaze layer 2 is local glaze in the present embodiment, and shape of cross section is a peak-like convex; Glaze layer 2 is provided with the resistive layer 3 of the uniform film like of a layer thickness, and resistive layer 3 is the peak-like convex of courverte layer 2 at least; Resistive layer 3 is provided with the conductor layer 4 of one deck film like in uneven thickness; Conductor layer 4 is made up of conductive material; Comprise a plurality of absolute electrodes 41 and the common electrode 42 opposite with absolute electrode 41 bearing of trends; Absolute electrode 41 is oppositely arranged with common electrode 42, forms the interval with preset distance between the two.The part that resistive layer 3 is positioned at absolute electrode 41 and common electrode 42 intervals is a heater 31.Absolute electrode 41 and common electrode 42 near the thickness of the part of heater 31 less than thickness away from the part of heater 31.Absolute electrode 41 is provided with the convex top relative spacing of common electrode 42 at glaze layer 2 in the present embodiment, and heater 31 is positioned at the interval of absolute electrode 41 and common electrode 42 of the convex top of glaze layer 2.Absolute electrode 41 and common electrode 42 from the protruding two side direction heater 31 of glaze layer near the time; With the increase of the protruding gradient, the thickness of absolute electrode 41 and common electrode 42 all reduces gradually, and is preferred; Absolute electrode 41 and common electrode are 0.6 μ m～1.5 μ m at the thickness away from the mild place of heater 31; Thickness locating near the slope of heater 31 is decreased to 0.1 μ m～0.6 μ m gradually, therefore, has reduced the shoulder height that conductor layer 4 produces at heater 31 places.
Since absolute electrode 41 and common electrode 42 near the thickness of the part of heater 31 less than thickness away from the part of heater 31; Therefore; Absolute electrode 41, common electrode 42 and heater 31 threes are connected the coating layer thickness that the back forms tends towards stability, and therefore, the shoulder height that the protective layer 5 that on conductor layer 4 and heater 31, evenly covers produces at heater 31 places is corresponding to be reduced or eliminate; In the printhead course of work; Print media reduces the impulsive force of protective layer is also corresponding with frictional force at the step place, and the protective layer rate of wear reduces, thereby has improved the wearability of printhead.
The absolute electrode 41 and the conducting of drive IC (not shown) of conductor layer 4; Common electrode 42 and power turn-on; According to the print data content, select corresponding absolute electrode 41 and common electrode 42 conductings through drive IC control, make electric current flow through the corresponding heater between absolute electrode and the common electrode; The heat that heater produces sees through protective layer 5 and acts on the print media, prints corresponding pattern.
Introduce the preparation method of the film-type thermal printing head of conductor layer below with uneven gauge.
Fig. 4 is the film-type thermal printing method for making head first embodiment sketch map provided by the invention.
As shown in the figure, the method that at first adopts printing to fire forms glaze layer 2 on substrate 1, on glaze layer 2, adopts the resistive layer 3 of method generation film like such as sputter then.
Then, setting and the suitable shelter 6 of heater 31 width above the desired location of resistive layer 3 adopt methods such as evaporation or sputter to form conductor layer 4, and at this moment, owing to blocking of shelter 6, diffraction forms thin conductor layer below shelter 6.Then, technologies such as employing photoetching are removed the setting section of conductor layer 4, in the present embodiment; Shelter 6 is positioned at the top of glaze layer 2 protruding position, and the setting section of conductor layer 4 is positioned at the part of shelter 6 belows, i.e. glaze layer high spot; After the setting section removal with conductor layer 4; Expose resistive layer 3, form heater 31, make conductor layer 4 form absolute electrode 41 and common electrode 42 that relative heater 31 is provided with at interval simultaneously.In actual manufacture process; Can be through the width of adjustment shelter 6 and/or the distance between shelter 6 and the resistive layer 3; The thickness of the conductor layers 4 that form below the control shelter 6 and the area size that forms reduced thickness make near the conductor layer thickness that close on the heater 31 be about 0.1 μ m～0.6 μ m.
After accomplishing above-mentioned operation, adopt methods such as sputter or chemical vapor deposition above conductor layer 4 and heater 31, to form protective layer 5.
Present embodiment conductor layer 4 is because metallic atom diffraction is piled up formation in the part near heater 31; The shoulder height that forms when therefore conductor layer forms absolute electrode 41 with common electrode 42 here reduces relatively, and correspondingly, the shoulder height that protective layer 5 produces herein reduces; In the printhead course of work; Impulsive force and frictional force to protective layer reduces print media greatly at the step place, and the protective layer rate of wear reduces, and has improved the wearability of printhead.
The manufacturing approach of the thermal printing head that present embodiment provides only need increase a shelter just can realize conductor layer in the thickness attenuation near the heater place, and technology is simple, low cost of manufacture.
Fig. 5 is the film-type thermal printing method for making head second embodiment step 1 sketch map provided by the invention, and Fig. 6 is the film-type thermal printing method for making head second embodiment step 2 sketch map provided by the invention.A present embodiment and a last embodiment difference are, adopt the method for twice plated film to form conductor layer in uneven thickness in the present embodiment.
Particularly; As shown in Figure 5, at first adopt methods such as evaporation or sputter to form ground floor conductor layer 4a on resistive layer 3 surfaces, ground floor conductor layer 4a thickness is about 0.5 μ m～0.9 μ m; Adopt technology such as photoetching that the setting section of ground floor conductor layer 4a is removed then; Expose resistive layer 3, this setting section width is preferably 1mm～3mm, and the resistive layer width that promptly exposes is preferably 1mm～3mm.Because what adopt is local glaze, therefore, the setting section of ground floor conductor layer 4a is the part that is positioned at the convexity of local glaze in the present embodiment.Simultaneously, ground floor conductor layer 4a is divided into absolute electrode 41a and common electrode 42a.
As shown in Figure 6, after accomplishing above-mentioned steps, on ground floor conductor layer 4a, continue to adopt methods such as evaporation or sputter to form second layer conductor layer 4b; Second layer conductor layer 4b thickness is about 0.1～0.6 μ m; The setting section that adopts technology such as photoetching will cover the second layer conductor layer 4b of heater 31 tops is then removed, and the width of this setting section is preferably 0.10mm～0.15mm, exposes resistive layer; Form heater 31; The width that is heater 31 is preferably 0.10mm～0.15mm, and simultaneously, the second conductor layer 4b is divided into absolute electrode 41b and common electrode 42b.At this moment, because the setting section width of ground floor conductor layer 4a is greater than the setting section width of second layer conductor layer 4b, therefore; Conductor layer 4 has only one deck plated film near heater 31, i.e. second layer conductor layer 4b, therefore; Near the shoulder height that conductor layer produces heater 31 reduces, because conductor layer just reduces at the thickness of heater vicinity, other parts of conductor layer still are two-layer conductor layer simultaneously; Thickness is bigger; Significant change does not appear in the resistance value of conductor layer, therefore can not influence the electric current that heater 31 passes through, and just can not influence the heater caloric value.
After accomplishing above-mentioned operation, adopt methods such as sputter or chemical vapor deposition above conductor layer 4 and heater 31, to form protective layer 5.As shown in Figure 7, at this moment, because the shoulder height that conductor layer 4 produces at heater 31 places reduces; Correspondingly; The step that protective layer 5 produces at this place is step-down also, and in the printhead course of work, impulsive force and the frictional force to protective layer also correspondingly reduces print media greatly at the step place; The protective layer rate of wear reduces, and has improved the printhead wearability.
Present embodiment control the shoulder height of protective layer 5, so manufacturing process is more accurate through the thickness of second layer conductor layer 4b is set.
More than be merely the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various changes and variation.All within spirit of the present invention and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. film-type thermal printing head; Comprise the substrate, glaze layer, resistive layer, conductor layer and the protective layer that are cascading; Wherein said conductor layer comprises absolute electrode and the common electrode that relative spacing is provided with; The part that said resistive layer is positioned at said absolute electrode and said common electrode interval is a heater, it is characterized in that
Said absolute electrode and said common electrode near the thickness of the part of said heater less than thickness away from the part of heater.
2. film-type thermal printing head according to claim 1 is characterized in that,
Said absolute electrode and said common electrode are 0.1 μ m～0.6 μ m near the thickness of the part of said heater;
Said absolute electrode and said common electrode are 0.6 μ m～1.5 μ m away from the thickness of the part of said heater.
3. the manufacturing approach of a film-type thermal printing head according to claim 1 is characterized in that, comprising:
On substrate, form the glaze layer;
On said glaze layer, form resistive layer;
On said resistive layer, form conductor layer in uneven thickness; Said conductor layer comprises absolute electrode and the common electrode that relative spacing is provided with; The part that said resistive layer is positioned at said absolute electrode and said common electrode interval is a heater, said absolute electrode and said common electrode near the thickness of the part of said heater less than thickness away from the part of heater;
On said conductor layer, form protective layer.
4. printhead production method according to claim 3 is characterized in that,
The concrete grammar that on said resistive layer, forms conductor layer in uneven thickness does,
Above the desired location of said resistive layer, be provided with shelter, adopt the method for evaporation or sputter to form said conductor layer, wherein, said desired location is said heater position.
5. printhead production method according to claim 3 is characterized in that,
Adjust the thickness of said conductor layer through the size of adjusting said shelter.
6. printhead production method according to claim 3 is characterized in that,
Through adjusting the thickness of the said conductor layer of distance adjustment between said shelter and the said resistive layer.
7. printhead production method according to claim 3 is characterized in that,
The concrete grammar that on said substrate, forms said glaze layer forms said glaze layer for the method that adopts printing to fire on said substrate.
8. printhead production method according to claim 3 is characterized in that,
The concrete grammar that on said glaze layer, forms said resistive layer forms the said resistive layer of film like for the method that adopts sputter.
9. printhead production method according to claim 3 is characterized in that,
The concrete grammar that on said conductor layer, forms said protective layer forms said protective layer for the method that adopts sputter or chemical vapor deposition.
10. printhead production method according to claim 3 is characterized in that,
The concrete grammar that on said resistive layer, forms conductor layer in uneven thickness does,
At first form the ground floor conductor layer of first thickness on said resistive layer surface; Then form the second layer conductor layer of second thickness on said ground floor conductor layer surface, wherein first thickness is greater than second thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100287421A CN102602159A (en) | 2011-01-24 | 2011-01-24 | Thin-film type thermo-sensitive printing head and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100287421A CN102602159A (en) | 2011-01-24 | 2011-01-24 | Thin-film type thermo-sensitive printing head and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102602159A true CN102602159A (en) | 2012-07-25 |
Family
ID=46520105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100287421A Pending CN102602159A (en) | 2011-01-24 | 2011-01-24 | Thin-film type thermo-sensitive printing head and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102602159A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105196555A (en) * | 2015-09-01 | 2015-12-30 | 上海悦瑞电子科技有限公司 | Selective micro hot melting forming equipment with thin film thermal printing head |
| CN106079904A (en) * | 2016-08-24 | 2016-11-09 | 大连佳盈半导体技术有限公司 | A kind of new heating element structure thermal printing head |
| CN107284053A (en) * | 2016-04-13 | 2017-10-24 | 山东新北洋信息技术股份有限公司 | Slow down the method and device of printer port of printer abrasion |
| CN110014750A (en) * | 2019-05-10 | 2019-07-16 | 武汉晖印半导体有限公司 | A kind of film thermal printing head that thickness membrane process combines |
| JP2020151903A (en) * | 2019-03-19 | 2020-09-24 | ローム株式会社 | Thermal print head and manufacturing method of the same |
| JPWO2020196349A1 (en) * | 2019-03-26 | 2020-10-01 | ||
| CN112622450A (en) * | 2018-02-26 | 2021-04-09 | 罗姆股份有限公司 | Thermal print head |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877569A (en) * | 1981-10-30 | 1983-05-10 | Matsushita Electric Works Ltd | Production of product with interference pattern |
| JPH05131666A (en) * | 1991-05-16 | 1993-05-28 | Rohm Co Ltd | Method for manufacture of thermal head |
| CN1113468A (en) * | 1994-05-12 | 1995-12-20 | 阿鲁普斯电气株式会社 | Thermal head |
| JP2004155160A (en) * | 2002-11-08 | 2004-06-03 | Alps Electric Co Ltd | Thermal head and its manufacturing process |
| CN1599941A (en) * | 2001-12-06 | 2005-03-23 | 先锋株式会社 | Electron emitting device and method of manufacturing the same and display apparatus using the same |
| JP2005319697A (en) * | 2004-05-10 | 2005-11-17 | Tdk Corp | Thermal head and printing apparatus |
| CN1899958A (en) * | 2005-07-22 | 2007-01-24 | 清华大学 | Method for making carbon nano tube array |
| CN101193754A (en) * | 2005-06-13 | 2008-06-04 | 罗妈股份有限公司 | Thermal print head |
| CN101629277A (en) * | 2008-07-18 | 2010-01-20 | 比亚迪股份有限公司 | Vacuum coating method, vacuum coating equipment and coated element and shell |
-
2011
- 2011-01-24 CN CN2011100287421A patent/CN102602159A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877569A (en) * | 1981-10-30 | 1983-05-10 | Matsushita Electric Works Ltd | Production of product with interference pattern |
| JPH05131666A (en) * | 1991-05-16 | 1993-05-28 | Rohm Co Ltd | Method for manufacture of thermal head |
| CN1113468A (en) * | 1994-05-12 | 1995-12-20 | 阿鲁普斯电气株式会社 | Thermal head |
| CN1599941A (en) * | 2001-12-06 | 2005-03-23 | 先锋株式会社 | Electron emitting device and method of manufacturing the same and display apparatus using the same |
| JP2004155160A (en) * | 2002-11-08 | 2004-06-03 | Alps Electric Co Ltd | Thermal head and its manufacturing process |
| JP2005319697A (en) * | 2004-05-10 | 2005-11-17 | Tdk Corp | Thermal head and printing apparatus |
| CN101193754A (en) * | 2005-06-13 | 2008-06-04 | 罗妈股份有限公司 | Thermal print head |
| CN1899958A (en) * | 2005-07-22 | 2007-01-24 | 清华大学 | Method for making carbon nano tube array |
| CN101629277A (en) * | 2008-07-18 | 2010-01-20 | 比亚迪股份有限公司 | Vacuum coating method, vacuum coating equipment and coated element and shell |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105196555A (en) * | 2015-09-01 | 2015-12-30 | 上海悦瑞电子科技有限公司 | Selective micro hot melting forming equipment with thin film thermal printing head |
| CN107284053A (en) * | 2016-04-13 | 2017-10-24 | 山东新北洋信息技术股份有限公司 | Slow down the method and device of printer port of printer abrasion |
| CN106079904A (en) * | 2016-08-24 | 2016-11-09 | 大连佳盈半导体技术有限公司 | A kind of new heating element structure thermal printing head |
| CN112622450B (en) * | 2018-02-26 | 2022-06-03 | 罗姆股份有限公司 | Thermal print head |
| CN112622450A (en) * | 2018-02-26 | 2021-04-09 | 罗姆股份有限公司 | Thermal print head |
| CN111716917A (en) * | 2019-03-19 | 2020-09-29 | 罗姆股份有限公司 | Thermal print head and method of manufacturing thermal print head |
| JP2020151903A (en) * | 2019-03-19 | 2020-09-24 | ローム株式会社 | Thermal print head and manufacturing method of the same |
| JP7245684B2 (en) | 2019-03-19 | 2023-03-24 | ローム株式会社 | Thermal printhead and method for manufacturing thermal printhead |
| JPWO2020196349A1 (en) * | 2019-03-26 | 2020-10-01 | ||
| WO2020196349A1 (en) * | 2019-03-26 | 2020-10-01 | 京セラ株式会社 | Thermal head and thermal printer |
| CN113597373A (en) * | 2019-03-26 | 2021-11-02 | 京瓷株式会社 | Thermal head and thermal printer |
| JP7122460B2 (en) | 2019-03-26 | 2022-08-19 | 京セラ株式会社 | Thermal head and thermal printer |
| CN110014750B (en) * | 2019-05-10 | 2020-07-10 | 沈阳晖印电子科技有限公司 | Thin film thermal printing head combined with thick film process |
| CN110014750A (en) * | 2019-05-10 | 2019-07-16 | 武汉晖印半导体有限公司 | A kind of film thermal printing head that thickness membrane process combines |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102602159A (en) | Thin-film type thermo-sensitive printing head and manufacturing method thereof | |
| US8901464B2 (en) | Variable watt density layered heater | |
| CN1997519B (en) | Micro-fluid ejection device having high resistance heater film | |
| KR20090023490A (en) | Layered heater system having conductive overlays | |
| CN1090568C (en) | Thermal head | |
| US10279597B2 (en) | Thermal print head | |
| CN102555515A (en) | Thermal print head and method of manufacturing the same | |
| US20170182794A1 (en) | Thermal print head | |
| CN105163943B (en) | Fluid discharge apparatus | |
| WO2008109289A1 (en) | Method for manufacturing an improved resistive structure | |
| CN100500442C (en) | Thermal printhead and method for manufacturing same | |
| JP4336593B2 (en) | Thermal head | |
| CN108656757A (en) | Thermal printing head | |
| CN101412323A (en) | Thermal print head and method for manufacturing the same | |
| US6501497B2 (en) | Thermal head with small size of steps of protective layer formed on heating portion and manufacturing method thereof | |
| CN205416764U (en) | Thermal printing head | |
| CN211222593U (en) | Heat-sensitive printing head heating substrate with continuous high printing performance | |
| JP2008187018A (en) | Manufacturing method of chip resistor, and chip resistor | |
| JP2021100826A (en) | Thermal print head | |
| CN206406615U (en) | A kind of high-quality thermal printing head | |
| JP2001113738A (en) | Thick film type thermal head | |
| CN110884261A (en) | Thin film thermal sensitive printing head and manufacturing method thereof | |
| CN1161017A (en) | Method of forming auxiliary electrode layer for common electrode pattern in thermal head | |
| JPH0582303B2 (en) | ||
| CN113386469B (en) | Thermal print head and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 264203 Kunlun Road, Huancui District, Shandong City, No. 126 Weihai Road Applicant after: Xiubeiyang Information Technology Co., Ltd., Shandong Address before: 264209 Torch Road 169, hi tech District, Shandong, Weihai Applicant before: Xiubeiyang Information Technology Co., Ltd., Shandong |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120725 |