CN102589759B - Bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination - Google Patents
Bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination Download PDFInfo
- Publication number
- CN102589759B CN102589759B CN 201210037651 CN201210037651A CN102589759B CN 102589759 B CN102589759 B CN 102589759B CN 201210037651 CN201210037651 CN 201210037651 CN 201210037651 A CN201210037651 A CN 201210037651A CN 102589759 B CN102589759 B CN 102589759B
- Authority
- CN
- China
- Prior art keywords
- layer
- electrode
- pdms
- capacitance
- conductive rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011664 nicotinic acid Substances 0.000 title claims abstract description 16
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 54
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 54
- 229920001971 elastomer Polymers 0.000 claims abstract description 45
- 239000005060 rubber Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 40
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 52
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 51
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 51
- 239000003990 capacitor Substances 0.000 claims description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 6
- 230000003068 static effect Effects 0.000 abstract description 7
- 239000011159 matrix material Substances 0.000 abstract description 6
- -1 Polydimethylsiloxane Polymers 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000001052 transient effect Effects 0.000 abstract 1
- 210000003491 skin Anatomy 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 12
- 238000004321 preservation Methods 0.000 description 12
- 238000007711 solidification Methods 0.000 description 12
- 230000008023 solidification Effects 0.000 description 12
- 230000008447 perception Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000004528 spin coating Methods 0.000 description 10
- 210000004027 cell Anatomy 0.000 description 7
- 210000000412 mechanoreceptor Anatomy 0.000 description 7
- 238000000813 microcontact printing Methods 0.000 description 7
- 230000007704 transition Effects 0.000 description 7
- 238000005266 casting Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 239000011370 conductive nanoparticle Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035807 sensation Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000002615 epidermis Anatomy 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000678 plasma activation Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 108010081750 Reticulin Proteins 0.000 description 1
- 210000001789 adipocyte Anatomy 0.000 description 1
- 238000002266 amputation Methods 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 210000004177 elastic tissue Anatomy 0.000 description 1
- 210000000981 epithelium Anatomy 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 210000002510 keratinocyte Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000008058 pain sensation Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 210000001519 tissue Anatomy 0.000 description 1
Images
Landscapes
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention discloses a bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination. The bionic flexible touch sense sensing array is successively composed of a flexible substrate layer, a capacitance layer, a piezoresistive layer and a surface packaging layer from bottom to top. The sensing array is simultaneously integrated with two types of touch sense force sensitive components based on the piezoresistive type and the capacitance type; a piezoresistive type force sensitive layer is overlaid on a capacitance-type force sensitive layer; the resolution of a piezoresistive layer space is 1mm; the resolution of a capacitance layer space is 2mm; a piezoresistive type force sensitive layer circuit is a matrix circuit; each node of the matrix circuit is provided with a semilunar electrode and a bar-shaped electrode; the two electrodes are connected by PDMS (Polydimethylsiloxane) conducting rubber; a capacitance-type force sensitive layer circuit is a matrix circuit; the lower layer of the matrix circuit forms a capacitance lower polar plate; the upper layer of the matrix circuit forms a capacitance upper polar plate; a PDMS dielectric layer with surface patterns is arranged between the two polar plates; the piezoresistive layer and the capacitance layer respectively measure static force and transient force; and the comprehensive performance of the bionic flexible touch sense sensing array can be improved.
Description
Technical field
The present invention relates to a kind of Bionic flexible tactile sensing array, especially relate to a kind of Bionic flexible tactile sensing array based on pressure resistance type and condenser type combination.
Technical background
Skin is the organ of human body maximum, and area is about 1.2 ~ 2 m
2, approximately 16% of percentage of liveweight, consisted of by hypodermis, corium and epidermis.Hypodermis is positioned at corium below, links to each other with the tissue such as sarolemma, by a large amount of adipocytes and thick connective fiber Shu Zucheng; Corium is positioned at the epidermal area below, is comprised of collagenous fibres, elastic fibers, reticular fibre and matrix, cell etc.; Epidermis is positioned at the outside of skin, is the stratified squamous epithelium of angling, and the overwhelming majority is keratinocyte.Can find out, skin is a complication system that is made of Multi-level Organization Structure, many constituents, and its biomechanical property mainly is the decisions such as content by the institutional framework of collagenous fibres in the corium and snapback fibre and moisture and protein.
Have four kinds of mechanical stimulus perceptrons in the human body skin, be respectively Merkel's disk (Merkel Disk), Meissner corpuscle (Meissner ' s Corpusde), Ruffini corpuscle (Ruffini Ending), corpuscula lamellosa (Pacinian Corpusde).These four kinds of mechanical stimulus perception cells are responsive to different types of power, and Merkel's disk and Meissner corpuscle are positioned at the skin corium shallow-layer, and are responsive to static force and transition power respectively; Ruffini corpuscle is arranged in the darker place of skin corium, and is only responsive to the tangential force that is parallel to skin; Corpuscula lamellosa is positioned at the deep layer of skin corium, and very responsive with vibration to transition power, its degree to transition power and vibration sensing is higher than Meissner corpuscle.And the distribution density of these four kinds of mechanical stimulus perception cells is also different, their descending being respectively of distribution density relation: Meissner corpuscle, Merkel's disk, Ruffini corpuscle, corpuscula lamellosa.
The electrical integrated artificial limb of life can make patients with amputation realize the self-care of daily life, has the good interaction capabilities with the external world in order to make the artificial limb, must realize reinventing of perceptional function.Perceptional function comprises sense of touch, temperature sensing, pain sensation etc.Wherein sense of touch is the important sensation of human body when contacting with external environment, is the comprehensive of polyesthesia, comprises the perception information that light touch, pressure sensation, seismesthesia etc. are abundant.If tactile data is reduced accurately, allow the artificial limb have " sensation ", this will be a much progress of human motion reconstruction.
In addition, along with the development of Robotics, tactilely-perceptible is to realize its intelligentized basis.The tactilely-perceptible of robot is to come the multiple physical message of recognition target object or object by the tactile sensing member, such as the size of contact force, flexibility, hardness, elasticity, roughness, material etc.In recent years, " robot flexibility tactile sensing skin " has become the new study hotspot of intelligent robot tactile sensing technical field, has perception
The robot flexibility tactile sensing skin of function can strengthen it and finish ability meticulous, complex job under various environment, improve level of operation and the intelligent level of robot system, all will produce important impact to the little drive machines people of accurate operation under high-level service robot, robot for space and the hazardous environment etc.
In biologic medical, surgical operation robot can have been finished the operation of the vitals such as human heart and brain.But surgical operation robot system also increases day by day to the detection of multidimensional contact force information and the demand of perception except having micro-amplification and vision monitoring.
Summary of the invention
The object of the present invention is to provide a kind of Bionic flexible tactile sensing array based on pressure resistance type and condenser type combination, have all good characteristics of nature static and dynamic.
The technical solution used in the present invention is:
Bionic flexible tactile sensing array of the present invention is from bottom to up successively by flexible base layer, capacitor layers, piezoresistance layer and surface encapsulation layer, four-layer structure formation stacked together; Its structure of every layer is as follows:
(a) flexible base layer: from bottom to up successively by silicon chip, PDMS(dimethyl silicone polymer) flexible substrates and PDMS conductive rubber screen layer stack formation;
(b) capacitor layers: from bottom to up successively by the PI electrode substrate of its upper surface with the Ti/Au capacitor lower electrode, patterned the 2nd PI electrode substrate of having Ti/Au electric capacity upper electrode plate for rectangular pyramid dielectric layer and its upper surface of rectangular pyramid zonule of its upper surface stacks formation, Ti/Au electric capacity upper electrode plate electrode and the Ti/Au capacitor lower electrode plate electrode direction that is orthogonal is arranged, on every pair of relative Ti/Au electric capacity, form an electric capacity between bottom crown, rectangular pyramid zonule as capacitance dielectric layer is all arranged between each electric capacity, each electric capacity is a sensing unit, and all capacitance sensing unit form capacitor array;
(c) piezoresistance layer: stacked with band through hole the 4th PI electrode substrate of the alternate semilune electrod-array that forms and strip electrode array and PDMS protective seam with the 3rd PI electrode substrate that is bar shaped distribution Ti/Au piezoresistance layer lower electrode, semisphere conductive rubber layer, its upper surface by PDMS conductive rubber screen layer, its upper surface successively from bottom to up and consist of; The semilune electrode is followed Ti/Au piezoresistance layer lower electrode electrical communication by the PI through hole on the 4th PI electrode substrate; Semisphere conductive rubber on the semisphere conductive rubber layer covers respectively on separately the semilune electrode and strip electrode, make every row strip electrode all with separately semilune electrode electrical communication; Each conductive rubber in the semisphere conductive rubber layer is a sensing unit, and all semisphere conductive rubbers form pressure resistance type conductive rubber array;
(d) surface encapsulation layer: be that upper surface is the miniature boss of PDMS and one deck patterned film of being made into PDMS.
Described capacitor layers is 2:1 with the ratio of piezoresistance layer spatial resolution, and namely the ratio of the sensing unit quantity of capacitor layers and piezoresistance layer sensing unit quantity is 1:4 under equal area.
The combination of having adhered to semilune electrode and strip electrode on the 4th PI electrode substrate in the described piezoresistance layer.
The beneficial effect that the present invention has is:
(1) based on the theory of simplification design, the present invention has selected perception cell corpuscula lamellosa and Merkel's disk as bionical object.Capacitor layers is mainly imitated is corpuscula lamellosa in the human body skin, and this perception cell is to transition power and the most responsive cell of vibration in the human body skin; Be Merkel's disk and the conductive rubber piezoresistance layer mainly imitates, it is characterized in that static force responsive and insensitive to transition power.This tactile sensing array is being suitable for measuring the pressure resistance type conductive rubber of static force, is integrated in the tactile sensing array with the electric capacity that is suitable for measuring transition power and microvibration, can satisfy static force and the requirement of transition force measurement, has good combination property.
(2) used the micro-contact printing technology in the manufacture process of this bionical tactile sensing array, the micro-contact printing technology has its unique advantage at printing minute metallic circuit and manufacturing micro-nano three-dimensional structure, the high efficiency production of large tracts of land can be realized, and the circuit on the printing curved surface can be used for.
(3) distribution density and the distributed depth of imitation perception cell corpuscula lamellosa and Merkel's disk, capacitor layers place piezoresistance layer below, and the spatial resolution of capacitor layers is 1:2 with the ratio of the spatial resolution of piezoresistance layer, such design more can be brought into play bionic advantage, for the optimization of tactile sensing array provides guidance.
(4) use the method for micro-contact printing to make picture on surface on the PDMS of capacitor layers dielectric layer surface, the deformability of electric capacity is strengthened greatly, strengthened its sensitivity.
(5) piezoresistance layer of this softness haptic perception sensor array and capacitor layers adopt separation circuit control, can reduce to disturb, and capacitor layers are surrounded by PDMS conductive rubber screen layer, can reduce to greatest extent its interference of piezoresistance layer and outer bound pair.
Description of drawings
Fig. 1 is that hierarchy of the present invention splits stereographic map;
Fig. 2 is the flexible base layer sectional view of band silicon base of the present invention;
Fig. 3 is that capacitor layers hierarchy of the present invention splits stereographic map;
Fig. 4 is that piezoresistance layer hierarchy of the present invention splits stereographic map;
Fig. 5 is piezoresistance layer upper electrode PI substrate plane figure of the present invention;
Fig. 6 is piezoresistance layer upper electrode layer plane figure of the present invention;
Fig. 7 is the hemispherical conductive rubber mounting structure of PDMS of the present invention schematic diagram;
Fig. 8 is surface encapsulation planimetric map of the present invention;
Fig. 9 is softness haptic perception sensor array stereographic map of the present invention.
Among the figure: 1; flexible base layer, 2; capacitor layers, 3; piezoresistance layer; 4; the surface encapsulation layer, 5; silicon chip, 6; the PDMS flexible substrates; 7; PDMS conductive rubber screen layer, 8; the one PI electrode substrate, 9; Ti/Au electric capacity bottom crown; 10; the rectangular pyramid dielectric layer; 11; the 2nd PI electrode substrate, 12; Ti/Au electric capacity top crown, 13; PDMS conductive rubber screen layer; 14; the 3rd PI electrode substrate; 15; Ti/Au piezoresistance layer lower electrode, 16; the 4th PI electrode substrate, 17; strip electrode; 18; the semilune electrode; 19; the semisphere conductive rubber layer, 20; the PDMS protective seam, 21; the PI through hole; 22; the rectangular pyramid zonule, 23; top layer PDMS micro-boss.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
As shown in Figure 1, be that hierarchy of the present invention splits stereographic map, the Bionic flexible tactile sensing array is from bottom to up successively by flexible base layer 1, capacitor layers 2, piezoresistance layer 3 and surface encapsulation layer 4, four-layer structure formation stacked together; Its structure of every layer is as follows:
(a) flexible base layer 1 as shown in Figure 2: stacked by silicon chip 5, PDMS flexible substrates 6 and PDMS conductive rubber screen layer 7 successively from bottom to up and consist of.
(b) capacitor layers 2 as shown in Figure 3: stacked with patterned the 2nd PI electrode substrate 12 of having a Ti/Au electric capacity upper electrode plate 12 for the rectangular pyramid dielectric layer 10 of rectangular pyramid zonule 22 and its upper surface of a PI electrode substrate 8, its upper surface of Ti/Au capacitor lower electrode 9 by its upper surface successively from bottom to up and consist of; Ti/Au electric capacity upper electrode plate 12 electrodes and the Ti/Au capacitor lower electrode plate 9 electrodes direction that is orthogonal is arranged, form an electric capacity between every pair of relative upper and lower pole plate of Ti/Au electric capacity, rectangular pyramid zonule 22 as capacitance dielectric layer is all arranged between each electric capacity, each electric capacity is a sensing unit, and all capacitance sensing unit form capacitor array.
(c) piezoresistance layer 3 as shown in Figure 4: from bottom to up successively by PDMS conductive rubber screen layer 13, its upper surface with the 3rd PI electrode substrate 14 that is bar shaped distribution Ti/Au piezoresistance layer lower electrode 15, semisphere conductive rubber layer 19, its upper surface with band through hole the 4th PI electrode substrate 16(of alternate semilune electrode 18 arrays that form and strip electrode 17 arrays (as shown in Figure 6) as shown in Figure 5) and PDMS protective seam 20 stack formation; Semilune electrode 18 is followed Ti/Au piezoresistance layer lower electrode 15 electrical communication by the PI through hole 21 on the 4th PI electrode substrate 16; As shown in Figure 7, the semisphere conductive rubber on the semisphere conductive rubber layer 19 covers respectively on separately the semilune electrode 18 and strip electrode 17, make every row strip electrode 17 all with separately semilune electrode 18 electrical communication; Each conductive rubber in the semisphere conductive rubber layer 19 is a sensing unit, and all semisphere conductive rubbers form pressure resistance type conductive rubber array.
(d) surface encapsulation layer 4 as shown in Figure 8: be that upper surface is the miniature boss 23 of PDMS and one deck patterned film of being made into PDMS.
Described capacitor layers 2 is 2:1 with the ratio of piezoresistance layer 3 spatial resolutions, and namely under equal area, the sensing unit quantity of capacitor layers is 1:4 with the ratio of piezoresistance layer sensing unit quantity.
Adhered to the combination of semilune electrode 18 with strip electrode 17 on the 4th PI electrode substrate 16 in the described piezoresistance layer 3.
Sensor array of the present invention is that gross thickness is about 0.5mm, the length of side is the rectangle of 10mm, wherein capacitor layers comprises 5 * 5 of sensing units, piezoresistance layer comprises 10 * 10 of sensing units, be that the capacitor layers spatial resolution is 2mm, the piezoresistance layer spatial resolution is 1mm, and this resolution can satisfy artificial limb's bionics skin requirement fully.The making step of finishing this pressure resistance type and condenser type assembled bionic softness haptic perception sensor array is as follows:
(1) prepares common single silicon chip 5 of throwing as the rigid carrier of flexible device; With Sylgard 184 PDMS prepolymers and hardening agent with the 10:1(mass ratio) mix, stir evenly, vacuumize the removal bubble, apply the PDMS flexible substrates 6 of 50 μ m at rigidity silicon chip 5 with the method for spin coating, with hot plate or heating furnace heat preservation solidification.
(2) Sylgard 184 PDMS prepolymers are mixed by a certain percentage with hardening agent, add the conductive nano particle, mix, stir evenly, vacuumize the removal bubble, apply the above-mentioned PDMS with conductive particle of 10 μ m with the method for spin coating in PDMS flexible substrates 6, form conductive rubber screen layer 7 with hot plate or heating furnace heat preservation solidification.
(3) the PI electrode substrate 8 of spin coating thick layer 10 μ m on conductive rubber screen layer 7 is with hot plate or heating furnace heat preservation solidification; At the Ti of a PI electrode substrate 8 deposition 10nm and the Au of 200nm, use based on the micro-contact printing method of the soft seal of PDMS and make Ti/Au electric capacity bottom crown 9; Then spin coating a layer thickness is that the PI of 4 μ m is as protective seam, with hot plate or heating furnace heat preservation solidification on electrode.
(4) watering PDMS solution with the silicon mould of rectangular pyramid dielectric layer 10 complementations, tip upside down on silicon chip 5 related whole sensor arrays conversely on the silicon mould, apply certain pressure and use the heating furnace heat preservation solidification, then peel off, form the structure of rectangular pyramid dielectric layer 10.
(5) elder generation's spin coating a layer thickness on the new silicon chip of another piece is the 2nd PI electrode substrate 11 of 10 μ m, with stripping silicon chip after hot plate or the heating furnace heat preservation solidification, the oxygen plasma activation processing is carried out on the 2nd PI electrode substrate 11 surfaces, then cover on the rectangular pyramid dielectric layer 10, as the support of Ti/Au electric capacity top crown 12.
(6) at the Ti of the 2nd PI electrode substrate 11 deposition 10nm and the Au of 200nm, use based on the micro-contact printing method of the soft seal of PDMS and make Ti/Au electric capacity top crown 12; Then spin coating a layer thickness is that the PI of 4 μ m is as protective seam on electrode.
(7) Sylgard 184 PDMS prepolymers are mixed by a certain percentage with hardening agent; add the conductive nano particle; mix, stir evenly, vacuumize the removal bubble; apply the above-mentioned PDMS with conductive particle of 10 μ m with the method for spin coating at the PI protective seam in the 6th step, form conductive rubber screen layer 13 with hot plate or heating furnace heat preservation solidification.
(8) the 3rd PI electrode substrate 14 of spin coating thick layer 10 μ m on conductive rubber screen layer 13 is with hot plate or heating furnace heat preservation solidification; At the Ti of the 3rd PI electrode substrate 14 deposition 10nm and the Au of 200nm, use based on the micro-contact printing method of the soft seal of PDMS and make Ti/Au piezoresistance layer lower electrode 15.
(9) the 4th PI electrode substrate 16 of spin coating one deck 4 μ m on Ti/Au piezoresistance layer lower electrode 15, with beating PI through hole 21 with the carbon dioxide laser instrument in the 4th PI electrode substrate 16 after hot plate or the heating furnace heat preservation solidification, so that the part (throughhole portions) of Ti/Au piezoresistance layer lower electrode 15 comes out.
(10) at the Ti of the 4th PI electrode substrate 16 deposition 10nm and the Au of 200nm, utilization is made strip electrode 17 and semilune electrode 18 based on the micro-contact printing method of the soft seal of PDMS, wherein half semilune electrode 18 and Ti/Au piezoresistance layer lower electrode 15 electrical communication.
(11) Sylgard 184 PDMS prepolymers are mixed by a certain percentage with hardening agent, add the conductive nano particle, be mixed with pressure-sensitive PDMS conductive rubber solution; Use point gum machine to make hemispheric PDMS conductive rubber layer 19 at strip electrode 17, semilune electrode 18; Carry out with hot plate or heating furnace heat preservation solidification.
(12) at semisphere conductive rubber layer 19 top casting PDMS solution, conductive rubber is covered, thickness can not exceed conductive rubber top 4 μ m.In order to reach the target of this 4 μ m; can in casting PDMS solution, not exclusively cover conductive rubber; continue up to cover PDMS with the method for spin coating again Deng the casting part afterwards with hot plate or heating furnace heat preservation solidification; accurately control the height of PDMS by the rotational speed of control sol evenning machine, finally form PDMS protective seam 20.
(13) make structure with pothole at silicon mould; the PDMS solution of casting in the above; with peeling off after hot plate or the heating furnace heat preservation solidification; make the PDMS surface encapsulation 4 with top layer PDMS micro-boss 23, PDMS surface encapsulation 4 lower surfaces are carried out being bonded on the PDMS protective seam 20 after the oxygen plasma activation.
As long as sensor array is peeled off from silicon plate 5, whole sensor array is just made and has been finished, as shown in Figure 9.Like this, produced sensor array has good static and dynamic performance, no matter is for the touching of moment or continues stressed extruding, and sensor array all can be obtained tactile data well.
Claims (3)
1. Bionic flexible tactile sensing array based on the combination of pressure resistance type and condenser type, it is characterized in that: the Bionic flexible tactile sensing array is from bottom to up successively by flexible base layer (1), capacitor layers (2), piezoresistance layer (3) and surface encapsulation layer (4), four-layer structure formation stacked together; Its structure of every layer is as follows:
(a) flexible base layer (1): stack formation by silicon chip (5), PDMS flexible substrates (6) and PDMS conductive rubber screen layer (7) successively from bottom to up;
(b) capacitor layers (2): stack formation by its upper surface with patterned the 2nd PI electrode substrate (12) of having a Ti/Au electric capacity upper electrode plate (12) for the rectangular pyramid dielectric layer (10) of rectangular pyramid zonule (22) and its upper surface of a PI electrode substrate (8), its upper surface of Ti/Au capacitor lower electrode (9) successively from bottom to up; Ti/Au electric capacity upper electrode plate (12) electrode and Ti/Au capacitor lower electrode plate (9) the electrode direction that is orthogonal is arranged, form an electric capacity between every pair of relative upper and lower pole plate of Ti/Au electric capacity, rectangular pyramid zonule (22) as capacitance dielectric layer is all arranged between each electric capacity, each electric capacity is a sensing unit, and all capacitance sensing unit form capacitor array;
(c) piezoresistance layer (3): from bottom to up successively by PDMS conductive rubber screen layer (13), its upper surface is with the 3rd PI electrode substrate (14) that is bar shaped distribution Ti/Au piezoresistance layer lower electrode (15), its upper surface is with semilune electrode (18) array of alternate composition and band through hole the 4th PI electrode substrate (16) of strip electrode (17) array, semisphere conductive rubber layer (19) and PDMS protective seam (20) stack formation; Semilune electrode (18) is followed Ti/Au piezoresistance layer lower electrode (15) electrical communication by the PI through hole (21) on the 4th PI electrode substrate (16); Semisphere conductive rubber on the semisphere conductive rubber layer (19) covers respectively on separately the semilune electrode (18) and strip electrode (17), make every row strip electrode (17) all with separately semilune electrode (18) electrical communication; Each conductive rubber in the semisphere conductive rubber layer (19) is a sensing unit, and all semisphere conductive rubbers form pressure resistance type conductive rubber array;
(d) surface encapsulation layer (4): be that upper surface is the miniature boss of PDMS (23) and one deck patterned film of being made into PDMS.
2. a kind of Bionic flexible tactile sensing array based on the combination of pressure resistance type and condenser type according to claim 1, it is characterized in that: described capacitor layers (2) is 2:1 with the ratio of piezoresistance layer (3) spatial resolution, namely under equal area, the sensing unit quantity of capacitor layers is 1:4 with the ratio of piezoresistance layer sensing unit quantity.
3. a kind of Bionic flexible tactile sensing array based on pressure resistance type and condenser type combination according to claim 1 is characterized in that: adhered to the combination of semilune electrode (18) with strip electrode (17) on the 4th PI electrode substrate (16) in the described piezoresistance layer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210037651 CN102589759B (en) | 2012-02-20 | 2012-02-20 | Bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210037651 CN102589759B (en) | 2012-02-20 | 2012-02-20 | Bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102589759A CN102589759A (en) | 2012-07-18 |
| CN102589759B true CN102589759B (en) | 2013-10-23 |
Family
ID=46478719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210037651 Expired - Fee Related CN102589759B (en) | 2012-02-20 | 2012-02-20 | Bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102589759B (en) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2809404A4 (en) * | 2012-01-31 | 2016-02-24 | Smart Skin Technologies Inc | Pressure mapping and orientation sensing system |
| CN103083007A (en) * | 2013-01-29 | 2013-05-08 | 中国科学院苏州纳米技术与纳米仿生研究所 | Piezoresistive electronic skin and preparation method thereof |
| CN103759867B (en) * | 2013-12-31 | 2016-01-20 | 东北大学 | Convex type flexible pressure sensitive element and method of production thereof |
| CN103743503B (en) * | 2013-12-31 | 2015-08-19 | 浙江大学 | Based on the flexible 3 D force-touch sensor of pressure resistance type and capacitive combination |
| CN103943360B (en) * | 2014-05-04 | 2017-01-25 | 广东小天才科技有限公司 | Variable capacitor and production method thereof |
| CN104034451B (en) * | 2014-06-05 | 2016-08-24 | 浙江大学 | Distribution capacity formula softness haptic perception sensor array based on helix |
| CN104266788A (en) * | 2014-09-04 | 2015-01-07 | 上海工程技术大学 | Flexible capacitive pressure sensing device |
| CN104215363B (en) * | 2014-09-05 | 2016-12-07 | 浙江大学 | Flexible tactile and slip sense composite sensing array based on pressure-sensitive conductive rubber |
| CN104316224B (en) * | 2014-11-04 | 2016-06-29 | 浙江大学 | The three-dimensional force tactile sensing unit combined based on electric capacity with pressure sensitive elastomer |
| CN104764481B (en) * | 2015-04-08 | 2017-01-25 | 合肥工业大学 | Full-compliancy capacitance and resistance dual mode proximate sense transducer |
| CN106153219B (en) * | 2015-04-15 | 2019-01-22 | 北京纳米能源与系统研究所 | A kind of strain gauge, preparation method and electronic skin |
| CN104897316B (en) * | 2015-06-16 | 2017-09-26 | 青岛大学 | A kind of condenser type ultrathin flexible strain gauge and preparation method thereof |
| CN104897317B (en) * | 2015-06-18 | 2018-03-06 | 西安电子科技大学 | Flexible contact pressing based on biomimetic features feels sensor |
| CN105387957B (en) * | 2015-10-16 | 2018-05-04 | 北京印刷学院 | Stretchable pressure sensor based on printing transparent electrodes and preparation method thereof |
| FI127245B (en) | 2016-07-11 | 2018-02-15 | Forciot Oy | Force and / or pressure sensor |
| CN106289594A (en) * | 2016-11-02 | 2017-01-04 | 吉林大学 | Three-dimension deformation-quantity and the sensor array of three-dimensional pressure high-precise synchronization measurement can be realized |
| CN106706176A (en) * | 2016-11-23 | 2017-05-24 | 浙江大学 | Capacitive touch sensor having patterned microstructure array |
| US10883827B2 (en) | 2016-12-20 | 2021-01-05 | Smart Skin Technologies Inc. | Packaging device for measuring motion in manufacture |
| CN107765686B (en) * | 2017-09-04 | 2020-09-01 | 浙江大学 | Sensing device for safe interaction between human and robot |
| CN110118621A (en) * | 2018-02-06 | 2019-08-13 | 中国科学院深圳先进技术研究院 | A kind of selfreparing pliable pressure sensor and preparation method thereof |
| CN108461624B (en) * | 2018-02-06 | 2021-09-24 | 山东科技大学 | Silica gel bionic fingertip touch-pressure sensation sensitive device |
| CN108178121B (en) * | 2018-02-07 | 2024-05-03 | 北京先通康桥医药科技有限公司 | Palpation probe and manufacturing method thereof |
| JP6995324B2 (en) * | 2018-02-26 | 2022-01-14 | Ａｇｃ株式会社 | Tempered glass evaluation device, tempered glass evaluation method, tempered glass manufacturing method, tempered glass |
| CN108645733B (en) * | 2018-05-14 | 2021-09-14 | 南京邮电大学 | Touch sensor for measuring elastic modulus of biological tissue |
| CN109855776B (en) * | 2019-01-31 | 2021-05-18 | 京东方科技集团股份有限公司 | Pressure sensor, pressure detection system and wearable equipment |
| CN109916292B (en) * | 2019-02-25 | 2021-05-04 | 武汉工程大学 | Preparation method of multilayer capacitive flexible intelligent wearable sensing device |
| CN110039533A (en) * | 2019-04-17 | 2019-07-23 | 苏州柔性智能科技有限公司 | For detecting the multi-functional software manipulator of fruit maturity |
| US20220236120A1 (en) * | 2019-06-24 | 2022-07-28 | Albert-Ludwigs-Universität Freiburg | Tactile Sensor and Method for Operating a Tactile Sensor |
| CN110243396A (en) * | 2019-06-24 | 2019-09-17 | 广州市香港科大霍英东研究院 | Bimodulus sensing unit and dual mode transducer |
| CN110411615B (en) * | 2019-07-01 | 2021-08-03 | 杭州电子科技大学 | High-sensitivity MEMS (micro-electromechanical systems) touch sensor structure |
| CN110595647B (en) * | 2019-09-09 | 2021-07-27 | 中南大学 | Multifunctional flexible strain-pressure sensor and preparation method thereof |
| CN110579295A (en) * | 2019-09-16 | 2019-12-17 | 深圳先进技术研究院 | Pressure sensor and method for manufacturing the same |
| CN110954251A (en) * | 2019-12-24 | 2020-04-03 | 哈尔滨工业大学 | Pressure-capacitance and piezoresistive coupling proximity sensing and contact force sensor |
| CN111307345A (en) * | 2020-03-30 | 2020-06-19 | 天津大学 | Resistance-capacitance series flexible sensor for measuring contact force |
| CN111504521B (en) * | 2020-05-07 | 2021-09-03 | 腾讯科技（深圳）有限公司 | Flexible capacitor array, preparation method thereof and capacitor array detection system |
| CN111551294B (en) * | 2020-05-21 | 2021-03-30 | 浙江大学 | Flexible pressure sensor based on liquid metal photocuring printing technology |
| CN111829697B (en) * | 2020-06-17 | 2022-07-05 | 华中科技大学 | Flexible pressure sensor with convex hemispherical structure and preparation method thereof |
| CN111829698A (en) * | 2020-06-18 | 2020-10-27 | 东南大学 | Double-layer touch sensor based on bionic mechanism |
| CN112025750A (en) * | 2020-09-02 | 2020-12-04 | 温州大学 | Piezoelectric piezoresistive composite humanoid tactile finger and preparation method thereof |
| CN112729625B (en) * | 2020-12-25 | 2022-02-08 | 厦门大学 | Laser texture bionic capacitive flexible pressure sensor and preparation method thereof |
| CN113155344B (en) * | 2021-01-25 | 2022-10-18 | 电子科技大学 | Flexible electronic skin device with touch information perception function |
| CN113124746B (en) * | 2021-04-20 | 2022-06-03 | 哈尔滨工业大学（威海） | Wearable flexible capacitive sensor based on redundant sensor and self-calibration method |
| CN113103259B (en) * | 2021-05-17 | 2022-08-30 | 浙江大学 | Interactive flexible robot skin of extensible |
| CN114356150A (en) * | 2021-12-02 | 2022-04-15 | 上海航天控制技术研究所 | Three-degree-of-freedom flexible touch sensing array |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6571638B2 (en) * | 2000-06-30 | 2003-06-03 | Sawtek, Inc. | Surface-acoustic-wave pressure sensor and associated methods |
| US7082835B2 (en) * | 2003-06-18 | 2006-08-01 | Honeywell International Inc. | Pressure sensor apparatus and method |
| CN1328758C (en) * | 2005-05-26 | 2007-07-25 | 西安交通大学 | Manufacturing method of multifunction integrated sensor chip |
| CN100436306C (en) * | 2006-11-23 | 2008-11-26 | 西北工业大学 | Touch sensor and its manufacture method |
| CN202442824U (en) * | 2012-02-20 | 2012-09-19 | 浙江大学 | Bionic flexible tactile sensor array based on combination of piezoresistive type and capacitive type |
-
2012
- 2012-02-20 CN CN 201210037651 patent/CN102589759B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN102589759A (en) | 2012-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102589759B (en) | Bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination | |
| CN202442824U (en) | Bionic flexible tactile sensor array based on combination of piezoresistive type and capacitive type | |
| Ma et al. | Robust flexible pressure sensors made from conductive micropyramids for manipulation tasks | |
| Liu et al. | Nature-inspired structural materials for flexible electronic devices | |
| Nie et al. | High-performance piezoresistive electronic skin with bionic hierarchical microstructure and microcracks | |
| Chun et al. | Self-powered pressure-and vibration-sensitive tactile sensors for learning technique-based neural finger skin | |
| Ji et al. | Synergistic optimization toward the sensitivity and linearity of flexible pressure sensor via double conductive layer and porous microdome array | |
| Zhu et al. | Hierarchically structured vertical gold nanowire array-based wearable pressure sensors for wireless health monitoring | |
| CN105203244B (en) | It is a kind of that there is micro- prominent electronic skin of irregular surface and preparation method thereof | |
| Xiao et al. | Multilayer double-sided microstructured flexible iontronic pressure sensor with a record-wide linear working range | |
| Ji et al. | Facile preparation of hybrid structure based on mesodome and micropillar arrays as flexible electronic skin with tunable sensitivity and detection range | |
| Guo et al. | Highly sensitive and wide-range flexible bionic tactile sensors inspired by the octopus sucker structure | |
| Nguyen et al. | Recent development of flexible tactile sensors and their applications | |
| CN109406012A (en) | A kind of threedimensional haptic sensor array of flexible piezoelectric formula and preparation method thereof | |
| CN206192550U (en) | Capacitanc tactile sensor with patterning micro -structure array | |
| Tan et al. | Flexible pressure sensors based on bionic microstructures: from plants to animals | |
| Du et al. | Biocompatible and breathable all-fiber-based piezoresistive sensor with high sensitivity for human physiological movements monitoring | |
| CN106908176A (en) | Multiphase dielectric layer capacitance pressure transducer, and its preparation method with micro-structural | |
| CN111609953B (en) | Full-flexible capacitive three-dimensional force touch sensor based on spherical surface electrode | |
| Wang et al. | Multidimensional force sensors based on triboelectric nanogenerators for electronic skin | |
| Zhang et al. | Flexible pressure sensors with combined spraying and self-diffusion of carbon nanotubes | |
| CN110031135A (en) | Tactile/sliding feeling sensor and preparation method thereof, electronic equipment, braille identify equipment, robot | |
| Li et al. | Laser-induced corrugated graphene films for integrated multimodal sensors | |
| CN209117220U (en) | A kind of threedimensional haptic sensor array of flexible piezoelectric formula | |
| Zhao et al. | Washable patches with gold nanowires/textiles in wearable sensors for health monitoring |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131023 Termination date: 20150220 |
|
| EXPY | Termination of patent right or utility model |