CN102589759A - Bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination - Google Patents
Bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination Download PDFInfo
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Abstract
The invention discloses a bionic flexible touch sense sensing array based on piezoresistive type and capacitance type combination. The bionic flexible touch sense sensing array is successively composed of a flexible substrate layer, a capacitance layer, a piezoresistive layer and a surface packaging layer from bottom to top. The sensing array is simultaneously integrated with two types of touch sense force sensitive components based on the piezoresistive type and the capacitance type; a piezoresistive type force sensitive layer is overlaid on a capacitance-type force sensitive layer; the resolution of a piezoresistive layer space is 1mm; the resolution of a capacitance layer space is 2mm; a piezoresistive type force sensitive layer circuit is a matrix circuit; each node of the matrix circuit is provided with a semilunar electrode and a bar-shaped electrode; the two electrodes are connected by PDMS (Polydimethylsiloxane) conducting rubber; a capacitance-type force sensitive layer circuit is a matrix circuit; the lower layer of the matrix circuit forms a capacitance lower polar plate; the upper layer of the matrix circuit forms a capacitance upper polar plate; a PDMS dielectric layer with surface patterns is arranged between the two polar plates; the piezoresistive layer and the capacitance layer respectively measure static force and transient force; and the comprehensive performance of the bionic flexible touch sense sensing array can be improved.
Description
Technical field
The present invention relates to a kind of bionical flexible tactile sensing array, especially relate to a kind of bionical flexible tactile sensing array based on pressure resistance type and condenser type combination.
Technical background
Skin is the maximum organ of human body, and area is about 1.2 ~ 2 m
2, 16% of about percentage of liveweight is made up of hypodermis, corium and epidermis.Hypodermis is positioned at corium below, links to each other with tissue such as sarolemma, by great amount of fat cell and thick connective fiber Shu Zucheng; Corium is positioned at the epidermal area below, is made up of collagenous fibres, elastic fibers, reticular fibre and matrix, cell etc.; Epidermis is positioned at the outside of skin, is the stratified squamous epithelium of angling, and the overwhelming majority is a keratinocyte.Can find out that skin is a complication system that is made up of multilayer tissue's structure, many constituents, its biomechanical property mainly is by decisions such as the institutional framework of collagenous fibres in the corium and snapback fibre and moisture and Protein content.
Have four kinds of mechanical stimulus perceptrons in the human body skin, be respectively Merkel's disk (Merkel Disk), Meissner corpuscle (Meissner ' s Corpusde), Ruffini corpuscle (Ruffini Ending), corpuscula lamellosa (Pacinian Corpusde).These four kinds of mechanical stimulus perception cells are responsive to different types of power, and Merkel's disk and Meissner corpuscle are positioned at the skin corium shallow-layer, and are responsive to static force and transition power respectively; Ruffini corpuscle is arranged in the darker place of skin corium, and is only responsive to the tangential force that is parallel to skin; Corpuscula lamellosa is positioned at the deep layer of skin corium, and very responsive to transition power and vibration, its degree to transition power and vibration sensing is higher than Meissner corpuscle.And the distribution density of these four kinds of mechanical stimulus perception cells is also different, their descending being respectively of distribution density relation: Meissner corpuscle, Merkel's disk, Ruffini corpuscle, corpuscula lamellosa.
The electrical integrated artificial limb of life can make patients with amputation realize the self-care of daily life, has and extraneous well interaction capabilities in order to make the artificial limb, must realize reinventing of perceptional function.Perceptional function comprises sense of touch, temperature perception, pain sensation or the like.Wherein sense of touch is the important sensation of human body when contacting with external environment, is the comprehensive of polyesthesia, comprises the perception information that light touch, pressure sensation, seismesthesia etc. are abundant.If can reduce tactile data accurately, let the artificial limb have " sensation ", this will be a much progress of human motion reconstruction.
In addition, along with the development of Robotics, tactilely-perceptible is to realize its intelligentized basis.The tactilely-perceptible of robot is the multiple physical message of coming recognition target object or object through the tactile sensing member, like the size of contact force, flexibility, hardness, elasticity, roughness, material etc.In recent years, " robot flexibility tactile sensing skin " has become the new research focus of intelligent robot tactile sensing technical field, has perception
The robot flexibility tactile sensing skin of function can strengthen it and under various environment, accomplish ability meticulous, complex job; Improve the level of operation and the intelligent level of robot system, all will produce significant effects the little drive machines people of accurate operation under high-level service robot, robot for space and the hazardous environment etc.
In biologic medical, surgical operation robot can have been accomplished the operation of vitals such as human heart and brain.But surgical operation robot system also increases the detection of multidimensional contact force information and the demand of perception except having micro-amplification and vision monitoring day by day.
Summary of the invention
The object of the present invention is to provide a kind of bionical flexible tactile sensing array, have all good characteristics of nature static and dynamic based on pressure resistance type and condenser type combination.
The technical scheme that the present invention adopts is:
Bionical flexible tactile sensing array of the present invention is from bottom to up successively by flexible base layer, capacitor layers, piezoresistance layer and surface encapsulation layer, four-layer structure formation stacked together; Its structure of every layer is following:
(a) flexible base layer: stack formation by silicon chip, PDMS (dimethyl silicone polymer) flexible substrates and PDMS conductive rubber screen layer successively from bottom to up;
(b) capacitor layers: stack with patterned the 2nd PI electrode substrate of having a Ti/Au electric capacity upper electrode plate for the rectangular pyramid dielectric layer of rectangular pyramid zonule and its upper surface of a PI electrode substrate, its upper surface of Ti/Au capacitor lower electrode by its upper surface successively from bottom to up and constitute; Ti/Au electric capacity upper electrode plate electrode and the Ti/Au capacitor lower electrode plate electrode direction that is orthogonal is arranged; Form an electric capacity between every pair of relative upper and lower pole plate of Ti/Au electric capacity; Rectangular pyramid zonule as capacitance dielectric layer is all arranged between each electric capacity; Each electric capacity is a sensing unit, and all capacitance sensing unit form capacitor array;
(c) piezoresistance layer: stack with band through hole the 4th PI electrode substrate of alternate semilune electrod-array of forming and strip electrode array and PDMS protective seam with the 3rd PI electrode substrate that is bar shaped distribution Ti/Au piezoresistance layer lower electrode, semisphere conductive rubber layer, its upper surface by PDMS conductive rubber screen layer, its upper surface successively from bottom to up and constitute; The semilune electrode is followed Ti/Au piezoresistance layer lower electrode electrical communication through the PI through hole on the 4th PI electrode substrate; Semisphere conductive rubber on the semisphere conductive rubber layer covers respectively on the semilune electrode and strip electrode separately, make every row strip electrode all with separately semilune electrode electrical communication; Each conductive rubber in the semisphere conductive rubber layer is a sensing unit, and all semisphere conductive rubbers form pressure resistance type conductive rubber array;
(d) surface encapsulation layer: be that upper surface is the miniature boss of PDMS and one deck patterned film of being made into PDMS.
Described capacitor layers is 2:1 with the ratio of piezoresistance layer spatial resolution, and promptly the ratio of the sensing unit quantity of capacitor layers and piezoresistance layer sensing unit quantity is 1:4 under equal area.
The combination of having adhered to semilune electrode and strip electrode on the 4th PI electrode substrate in the said piezoresistance layer.
The beneficial effect that the present invention has is:
(1) based on the theory of simplification design, the present invention has selected perception cell corpuscula lamellosa and Merkel's disk as bionical object.What capacitor layers was mainly imitated is the corpuscula lamellosa in the human body skin, and this perception cell is to transition power and the most responsive cell of vibration in the human body skin; And the conductive rubber piezoresistance layer mainly imitates is Merkel's disk, it is characterized in that static force responsive and insensitive to transition power.This tactile sensing array is being suitable for the pressure resistance type conductive rubber of measure static power, is integrated in the tactile sensing array with the electric capacity that is suitable for measuring transition power and microvibration, can satisfy static force and the requirement of transition force measurement, has good comprehensive performances.
(2) used the micro-contact printing technology in the manufacture process of this bionical tactile sensing array; The micro-contact printing technology has its special advantages on printing minute metallic circuit and manufacturing micro-nano three-dimensional structure; The high efficiency production of large tracts of land can be realized, and the circuit on the curved surface can be used to print.
(3) distribution density and the distributed depth of imitation perception cell corpuscula lamellosa and Merkel's disk; Capacitor layers place piezoresistance layer below; And the spatial resolution of capacitor layers is 1:2 with the ratio of the spatial resolution of piezoresistance layer; Such design more can be brought into play bionic advantage, for the optimization of tactile sensing array provides guidance.
(4) used the method for micro-contact printing to make picture on surface, the deformability of electric capacity is strengthened greatly, strengthened its sensitivity on the PDMS of capacitor layers dielectric layer surface.
(5) piezoresistance layer of this flexibility tactile sensing array and capacitor layers adopt separation circuit control, can reduce to disturb, and capacitor layers are surrounded by PDMS conductive rubber screen layer, can reduce its interference of piezoresistance layer and outer bound pair to greatest extent.
Description of drawings
Fig. 1 is that hierarchy of the present invention splits stereographic map;
Fig. 2 is the flexible base layer sectional view of band silicon base of the present invention;
Fig. 3 is that capacitor layers hierarchy of the present invention splits stereographic map;
Fig. 4 is that piezoresistance layer hierarchy of the present invention splits stereographic map;
Fig. 5 is piezoresistance layer upper electrode PI substrate plane figure of the present invention;
Fig. 6 is piezoresistance layer upper electrode layer plane figure of the present invention;
Fig. 7 is the hemispherical conductive rubber mounting structure of a PDMS of the present invention synoptic diagram;
Fig. 8 is a surface encapsulation planimetric map of the present invention;
Fig. 9 is a flexible tactile sensing array stereographic map of the present invention.
Among the figure: 1, flexible base layer, 2, capacitor layers, 3, piezoresistance layer, 4, the surface encapsulation layer, 5, silicon chip; 6, PDMS flexible substrates, 7, PDMS conductive rubber screen layer, the 8, the one PI electrode substrate, 9, Ti/Au electric capacity bottom crown, 10, the rectangular pyramid dielectric layer; 11, the 2nd PI electrode substrate, 12, Ti/Au electric capacity top crown, 13, PDMS conductive rubber screen layer, the 14, the 3rd PI electrode substrate, 15, Ti/Au piezoresistance layer lower electrode; 16, the 4th PI electrode substrate, 17, strip electrode, 18, the semilune electrode, 19, the semisphere conductive rubber layer; 20, PDMS protective seam, 21, the PI through hole, 22, the rectangular pyramid zonule, 23, top layer PDMS micro-boss.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is described further.
As shown in Figure 1, be that hierarchy of the present invention splits stereographic map, bionical flexible tactile sensing array is from bottom to up successively by flexible base layer 1, capacitor layers 2, piezoresistance layer 3 and surface encapsulation layer 4, four-layer structure formation stacked together; Its structure of every layer is following:
(a) flexible base layer 1 as shown in Figure 2: stack by silicon chip 5, PDMS flexible substrates 6 and PDMS conductive rubber screen layer 7 successively from bottom to up and constitute.
(b) capacitor layers 2 as shown in Figure 3: stack with patterned the 2nd PI electrode substrate 12 of having a Ti/Au electric capacity upper electrode plate 12 for the rectangular pyramid dielectric layer 10 of rectangular pyramid zonule 22 and its upper surface of a PI electrode substrate 8, its upper surface of Ti/Au capacitor lower electrode 9 by its upper surface successively from bottom to up and constitute; Ti/Au electric capacity upper electrode plate 12 electrodes and the Ti/Au capacitor lower electrode plate 9 electrodes direction that is orthogonal is arranged; Form an electric capacity between every pair of relative upper and lower pole plate of Ti/Au electric capacity; Rectangular pyramid zonule 22 as capacitance dielectric layer is all arranged between each electric capacity; Each electric capacity is a sensing unit, and all capacitance sensing unit form capacitor array.
(c) piezoresistance layer 3 as shown in Figure 4: stack formation with the 3rd PI electrode substrate 14, semisphere conductive rubber layer 19, its upper surface of being bar shaped distribution Ti/Au piezoresistance layer lower electrode 15 with band through hole the 4th PI electrode substrate 16 (as shown in Figure 5) and the PDMS protective seam 20 of alternate semilune electrode 18 arrays of forming and strip electrode 17 arrays (as shown in Figure 6) by PDMS conductive rubber screen layer 13, its upper surface successively from bottom to up; Semilune electrode 18 is followed Ti/Au piezoresistance layer lower electrode 15 electrical communication through the PI through hole on the 4th PI electrode substrate 16 21; As shown in Figure 7, the semisphere conductive rubber on the semisphere conductive rubber layer 19 covers respectively on the semilune electrode 18 and strip electrode 17 separately, make every row strip electrode 17 all with separately semilune electrode 18 electrical communication; Each conductive rubber in the semisphere conductive rubber layer 19 is a sensing unit, and all semisphere conductive rubbers form pressure resistance type conductive rubber array.
(d) surface encapsulation layer 4 as shown in Figure 8: be that upper surface is the miniature boss 23 of PDMS and one deck patterned film of being made into PDMS.
Described capacitor layers 2 is 2:1 with the ratio of piezoresistance layer 3 spatial resolutions, and promptly under equal area, the sensing unit quantity of capacitor layers is 1:4 with the ratio of piezoresistance layer sensing unit quantity.
Adhered to the combination of semilune electrode 18 on the 4th PI electrode substrate 16 in the said piezoresistance layer 3 with strip electrode 17.
Sensor array of the present invention is that gross thickness is about 0.5mm, the length of side is the rectangle of 10mm; Wherein capacitor layers comprises 5 * 5 of sensing units; Piezoresistance layer comprises 10 * 10 of sensing units; Be that the capacitor layers spatial resolution is 2mm, the piezoresistance layer spatial resolution is 1mm, and this resolution can satisfy artificial limb's bionics skin requirement fully.The making step of accomplishing the flexible tactile sensing array of this pressure resistance type and condenser type assembled bionic is following:
(1) prepares common single rigid carrier of throwing silicon chip 5 as flexible device; Sylgard 184 PDMS prepolymers are mixed, stir, vacuumize the removal bubble with hardening agent with 10:1 (mass ratio), on rigidity silicon chip 5, apply the PDMS flexible substrates 6 of 50 μ m with the method for spin coating, with hot plate or heating furnace heat preservation solidification.
(2) Sylgard 184 PDMS prepolymers are mixed with hardening agent by a certain percentage; Add the conductive nano particle; Mix, stir, vacuumize the removal bubble; On PDMS flexible substrates 6, apply the PDMS of the above-mentioned band conductive particle of 10 μ m with the method for spin coating, form conductive rubber screen layer 7 with hot plate or heating furnace heat preservation solidification.
(3) the PI electrode substrate 8 of spin coating one bed thickness 10 μ m on conductive rubber screen layer 7 is with hot plate or heating furnace heat preservation solidification; The Ti of deposition 10nm and the Au of 200nm on a PI electrode substrate 8, utilization is made Ti/Au electric capacity bottom crown 9 based on the micro-contact printing method of the soft seal of PDMS; Spin coating one layer thickness is that the PI of 4 μ m is as protective seam, with hot plate or heating furnace heat preservation solidification on electrode then.
(4) with the complementary silicon mould of rectangular pyramid dielectric layer 10 on water PDMS solution; Tip upside down on silicon chip 5 related whole sensor arrays on the silicon mould conversely; Apply certain pressure and use the heating furnace heat preservation solidification, peel off then, form the structure of rectangular pyramid dielectric layer 10.
(5) elder generation's spin coating one layer thickness on the new silicon chip of another piece is the 2nd PI electrode substrate 11 of 10 μ m; With peeling off silicon chip after hot plate or the heating furnace heat preservation solidification; The oxygen plasma activation processing is carried out on the 2nd PI electrode substrate 11 surfaces; Cover then on the rectangular pyramid dielectric layer 10, as the support of Ti/Au electric capacity top crown 12.
(6) Ti of deposition 10nm and the Au of 200nm on the 2nd PI electrode substrate 11, utilization is made Ti/Au electric capacity top crown 12 based on the micro-contact printing method of the soft seal of PDMS; Spin coating one layer thickness is that the PI of 4 μ m is as protective seam on electrode then.
(7) Sylgard 184 PDMS prepolymers are mixed with hardening agent by a certain percentage; Add the conductive nano particle; Mix, stir, vacuumize the removal bubble; On the PI protective seam in the 6th step, apply the PDMS of the above-mentioned band conductive particle of 10 μ m with the method for spin coating, form conductive rubber screen layer 13 with hot plate or heating furnace heat preservation solidification.
(8) the 3rd PI electrode substrate 14 of spin coating one bed thickness 10 μ m on conductive rubber screen layer 13 is with hot plate or heating furnace heat preservation solidification; The Ti of deposition 10nm and the Au of 200nm on the 3rd PI electrode substrate 14, utilization is made Ti/Au piezoresistance layer lower electrode 15 based on the micro-contact printing method of the soft seal of PDMS.
(9) the 4th PI electrode substrate 16 of spin coating one deck 4 μ m on Ti/Au piezoresistance layer lower electrode 15; With on the 4th PI electrode substrate 16, beating PI through hole 21 with the carbon dioxide laser appearance after hot plate or the heating furnace heat preservation solidification, make the part (throughhole portions) of Ti/Au piezoresistance layer lower electrode 15 come out.
(10) Ti of deposition 10nm and the Au of 200nm on the 4th PI electrode substrate 16; Utilization is made strip electrode 17 and semilune electrode 18 based on the micro-contact printing method of the soft seal of PDMS, wherein half semilune electrode 18 and Ti/Au piezoresistance layer lower electrode 15 electrical communication.
(11) Sylgard 184 PDMS prepolymers are mixed with hardening agent by a certain percentage, add the conductive nano particle, be mixed with pressure-sensitive PDMS conductive rubber solution; Use point gum machine on strip electrode 17, semilune electrode 18, to make hemispheric PDMS conductive rubber layer 19; Carry out with hot plate or heating furnace heat preservation solidification.
(12) at semisphere conductive rubber layer 19 top casting PDMS solution, cover conductive rubber, thickness can not exceed conductive rubber top 4 μ m.In order to reach the target of this 4 μ m; Can in casting PDMS solution, not exclusively cover conductive rubber; Continue up to cover PDMS with the method for spin coating again Deng the casting part afterwards with hot plate or heating furnace heat preservation solidification; Rotational speed through the control sol evenning machine is accurately controlled the height of PDMS, finally forms PDMS protective seam 20.
(13) on silicon mould, make the structure that has pothole; The PDMS solution of casting in the above; With peeling off after hot plate or the heating furnace heat preservation solidification; Process the PDMS surface encapsulation 4 that has top layer PDMS micro-boss 23, PDMS surface encapsulation 4 lower surfaces are carried out being bonded on the PDMS protective seam 20 after the oxygen plasma activation.
As long as peel off sensor array from silicon plate 5, whole sensor array is just made and accomplished, and is as shown in Figure 9.Like this, produced sensor array has good static and dynamic performance, no matter is touching or the lasting stressed extruding for moment, and sensor array all can be obtained tactile data well.
Claims (3)
1. bionical flexible tactile sensing array based on the combination of pressure resistance type and condenser type; It is characterized in that: bionical flexible tactile sensing array is from bottom to up successively by flexible base layer (1), capacitor layers (2), piezoresistance layer (3) and surface encapsulation layer (4), four-layer structure formation stacked together; Its structure of every layer is following:
(a) flexible base layer (1): stack formation by silicon chip (5), PDMS flexible substrates (6) and PDMS conductive rubber screen layer (7) successively from bottom to up;
(b) capacitor layers (2): stack formation by its upper surface with patterned the 2nd PI electrode substrate (12) of having a Ti/Au electric capacity upper electrode plate (12) for the rectangular pyramid dielectric layer (10) of rectangular pyramid zonule (22) and its upper surface of a PI electrode substrate (8), its upper surface of Ti/Au capacitor lower electrode (9) successively from bottom to up; Ti/Au electric capacity upper electrode plate (12) electrode and Ti/Au capacitor lower electrode plate (9) the electrode direction that is orthogonal is arranged; Form an electric capacity between every pair of relative upper and lower pole plate of Ti/Au electric capacity; Rectangular pyramid zonule (22) as capacitance dielectric layer is all arranged between each electric capacity; Each electric capacity is a sensing unit, and all capacitance sensing unit form capacitor array;
(c) piezoresistance layer (3): stack formation with the 3rd PI electrode substrate (14) that is bar shaped distribution Ti/Au piezoresistance layer lower electrode (15), semisphere conductive rubber layer (19), its upper surface with band through hole the 4th PI electrode substrate (16) and the PDMS protective seam (20) of alternate semilune electrode (18) array of forming and strip electrode (17) array by PDMS conductive rubber screen layer (13), its upper surface successively from bottom to up; Semilune electrode (18) is followed Ti/Au piezoresistance layer lower electrode (15) electrical communication through the PI through hole (21) on the 4th PI electrode substrate (16); Semisphere conductive rubber on the semisphere conductive rubber layer (19) covers respectively on the semilune electrode (18) and strip electrode (17) separately, make every row strip electrode (17) all with separately semilune electrode (18) electrical communication; Each conductive rubber in the semisphere conductive rubber layer (19) is a sensing unit, and all semisphere conductive rubbers form pressure resistance type conductive rubber array;
(d) surface encapsulation layer (4): be that upper surface is the miniature boss of PDMS (23) and one deck patterned film of being made into PDMS.
2. a kind of bionical flexible tactile sensing array according to claim 1 based on pressure resistance type and condenser type combination; It is characterized in that: described capacitor layers (2) is 2:1 with the ratio of piezoresistance layer (3) spatial resolution; Promptly under equal area, the sensing unit quantity of capacitor layers is 1:4 with the ratio of piezoresistance layer sensing unit quantity.
3. a kind of bionical flexible tactile sensing array based on pressure resistance type and condenser type combination according to claim 1 is characterized in that: adhered to the combination of semilune electrode (18) with strip electrode (17) on the 4th PI electrode substrate (16) in the said piezoresistance layer (3).
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