CN102585222A - 一种热塑性聚酰亚胺材料及用此材料制备挠性覆铜板的方法 - Google Patents
一种热塑性聚酰亚胺材料及用此材料制备挠性覆铜板的方法 Download PDFInfo
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- CN102585222A CN102585222A CN2012100501788A CN201210050178A CN102585222A CN 102585222 A CN102585222 A CN 102585222A CN 2012100501788 A CN2012100501788 A CN 2012100501788A CN 201210050178 A CN201210050178 A CN 201210050178A CN 102585222 A CN102585222 A CN 102585222A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 title claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 21
- 239000010949 copper Substances 0.000 title claims abstract description 21
- 229920006259 thermoplastic polyimide Polymers 0.000 title abstract description 54
- 229920001721 polyimide Polymers 0.000 claims abstract description 31
- 239000000843 powder Substances 0.000 claims abstract description 24
- 238000006243 chemical reaction Methods 0.000 claims abstract description 18
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 150000004985 diamines Chemical class 0.000 claims abstract description 9
- 238000002360 preparation method Methods 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 4
- 239000004642 Polyimide Substances 0.000 claims description 25
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 24
- 239000000178 monomer Substances 0.000 claims description 23
- 239000012528 membrane Substances 0.000 claims description 22
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 18
- 239000005357 flat glass Substances 0.000 claims description 18
- 238000001291 vacuum drying Methods 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 15
- 229920005575 poly(amic acid) Polymers 0.000 claims description 15
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 13
- 239000012046 mixed solvent Substances 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical group CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 238000011010 flushing procedure Methods 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- YVNRUPSDZZZUQJ-UHFFFAOYSA-N [O].NC1=CC=CC=C1 Chemical compound [O].NC1=CC=CC=C1 YVNRUPSDZZZUQJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 4
- 239000001273 butane Substances 0.000 claims description 4
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 4
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- -1 4-ethoxybiphenyl phenol-3,5-diaminobenzoic acid ester Chemical class 0.000 claims description 3
- 125000003983 fluorenyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 3
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 claims description 2
- RDMFEHLCCOQUMH-UHFFFAOYSA-N 2,4'-Diphenyldiamine Chemical group C1=CC(N)=CC=C1C1=CC=CC=C1N RDMFEHLCCOQUMH-UHFFFAOYSA-N 0.000 claims 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 5
- 229920001577 copolymer Polymers 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract description 2
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- BEKFRNOZJSYWKZ-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound C1=CC(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C=C1 BEKFRNOZJSYWKZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004952 Polyamide Substances 0.000 abstract 1
- 229920002647 polyamide Polymers 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- QRYTXFUBAZNNBP-UHFFFAOYSA-N 1-ethoxy-4-phenylbenzene Chemical group C1=CC(OCC)=CC=C1C1=CC=CC=C1 QRYTXFUBAZNNBP-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
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Landscapes
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
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CN201210050178.8A CN102585222B (zh) | 2012-02-25 | 2012-02-25 | 一种热塑性聚酰亚胺材料及用此材料制备挠性覆铜板的方法 |
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CN201210050178.8A CN102585222B (zh) | 2012-02-25 | 2012-02-25 | 一种热塑性聚酰亚胺材料及用此材料制备挠性覆铜板的方法 |
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CN102585222A true CN102585222A (zh) | 2012-07-18 |
CN102585222B CN102585222B (zh) | 2014-05-07 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102993748A (zh) * | 2012-10-19 | 2013-03-27 | 南京理工大学 | 聚酰亚胺薄膜及利用该薄膜制备两层柔性覆铜板的方法 |
CN103192563A (zh) * | 2013-04-24 | 2013-07-10 | 昆山翰辉电子科技有限公司 | 软性印刷电路板用复合式双面铜箔基板 |
CN103739842A (zh) * | 2013-12-20 | 2014-04-23 | 深圳瑞华泰薄膜科技有限公司 | 一种热塑性聚酰亚胺及用其制备挠性覆铜板的方法 |
CN106139936A (zh) * | 2016-06-29 | 2016-11-23 | 常州市阳光药业有限公司 | 聚酰亚胺气体分离膜及其制备方法和应用 |
CN106519685A (zh) * | 2016-11-08 | 2017-03-22 | 南京中鸿润宁新材料科技有限公司 | 一种聚酰亚胺材料、其制备方法和应用 |
WO2018058342A1 (en) * | 2016-09-28 | 2018-04-05 | Dow Global Technologies Llc | Solvent systems for synthesis of poly(amic acid) and polyimide polymers |
CN109438702A (zh) * | 2018-09-29 | 2019-03-08 | 苏州市新广益电子有限公司 | 一种用于fpc行业的tpi薄膜及其制备和加工方法 |
CN109651631A (zh) * | 2018-01-18 | 2019-04-19 | 深圳瑞华泰薄膜科技股份有限公司 | 一种低介质损耗的聚酰亚胺薄膜 |
CN109803995A (zh) * | 2017-01-31 | 2019-05-24 | 株式会社Lg化学 | 聚酰亚胺和由其制备的用于柔性显示器的聚酰亚胺膜 |
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CN1306025A (zh) * | 1999-12-10 | 2001-08-01 | 日东电工株式会社 | 聚酰胺酸、由其制备的聚酰亚胺树脂和其在电路板中的用途 |
CN101007951A (zh) * | 2007-01-18 | 2007-08-01 | 四川大学 | 一种聚酰亚胺液晶垂直取向剂的制备方法 |
JP2008087254A (ja) * | 2006-09-29 | 2008-04-17 | Nippon Steel Chem Co Ltd | フレキシブル銅張積層板及びキャリア付フレキシブル銅張積層板 |
CN101289543A (zh) * | 2008-06-06 | 2008-10-22 | 东华大学 | 柔性覆铜板用1,4-双(2,4-二氨基苯氧基)苯型聚酰亚胺薄膜的制备方法 |
CN101423609A (zh) * | 2008-10-21 | 2009-05-06 | 东华大学 | 一种含活性乙烯基聚酰亚胺粉末的制备方法 |
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CN101786354A (zh) * | 2009-12-24 | 2010-07-28 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板及其制作方法 |
CN102009515A (zh) * | 2010-07-21 | 2011-04-13 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板的制作方法及该二层法双面挠性覆铜板 |
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CN1306025A (zh) * | 1999-12-10 | 2001-08-01 | 日东电工株式会社 | 聚酰胺酸、由其制备的聚酰亚胺树脂和其在电路板中的用途 |
JP2008087254A (ja) * | 2006-09-29 | 2008-04-17 | Nippon Steel Chem Co Ltd | フレキシブル銅張積層板及びキャリア付フレキシブル銅張積層板 |
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CN101423609A (zh) * | 2008-10-21 | 2009-05-06 | 东华大学 | 一种含活性乙烯基聚酰亚胺粉末的制备方法 |
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CN102009515A (zh) * | 2010-07-21 | 2011-04-13 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板的制作方法及该二层法双面挠性覆铜板 |
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李晓瑜等: "基于4-辛氧基联苯酚-3,5-二氨基苯甲酸酯的聚酰亚胺的合成及性能研究", 《液晶与显示》 * |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102993748A (zh) * | 2012-10-19 | 2013-03-27 | 南京理工大学 | 聚酰亚胺薄膜及利用该薄膜制备两层柔性覆铜板的方法 |
CN102993748B (zh) * | 2012-10-19 | 2014-10-08 | 南京理工大学 | 聚酰亚胺薄膜及利用该薄膜制备两层柔性覆铜板的方法 |
CN103192563A (zh) * | 2013-04-24 | 2013-07-10 | 昆山翰辉电子科技有限公司 | 软性印刷电路板用复合式双面铜箔基板 |
CN103739842A (zh) * | 2013-12-20 | 2014-04-23 | 深圳瑞华泰薄膜科技有限公司 | 一种热塑性聚酰亚胺及用其制备挠性覆铜板的方法 |
CN103739842B (zh) * | 2013-12-20 | 2016-08-31 | 深圳瑞华泰薄膜科技有限公司 | 一种热塑性聚酰亚胺及用其制备挠性覆铜板的方法 |
CN106139936B (zh) * | 2016-06-29 | 2018-09-11 | 常州市阳光药业有限公司 | 聚酰亚胺气体分离膜及其制备方法和应用 |
CN106139936A (zh) * | 2016-06-29 | 2016-11-23 | 常州市阳光药业有限公司 | 聚酰亚胺气体分离膜及其制备方法和应用 |
WO2018058342A1 (en) * | 2016-09-28 | 2018-04-05 | Dow Global Technologies Llc | Solvent systems for synthesis of poly(amic acid) and polyimide polymers |
CN109790382A (zh) * | 2016-09-28 | 2019-05-21 | 陶氏环球技术有限责任公司 | 用于合成聚(酰胺酸)和聚酰亚胺聚合物的溶剂体系 |
JP2019529660A (ja) * | 2016-09-28 | 2019-10-17 | ダウ グローバル テクノロジーズ エルエルシー | ポリ(アミド酸)ポリマーおよびポリイミドポリマーの合成のための溶媒系 |
US10982047B2 (en) | 2016-09-28 | 2021-04-20 | Dow Global Technologies Llc | Solvent systems for synthesis of poly(amic acid) and polyimide polymers |
CN106519685A (zh) * | 2016-11-08 | 2017-03-22 | 南京中鸿润宁新材料科技有限公司 | 一种聚酰亚胺材料、其制备方法和应用 |
CN106519685B (zh) * | 2016-11-08 | 2019-06-04 | 南京中鸿润宁新材料科技有限公司 | 一种聚酰亚胺材料、其制备方法和应用 |
CN109803995A (zh) * | 2017-01-31 | 2019-05-24 | 株式会社Lg化学 | 聚酰亚胺和由其制备的用于柔性显示器的聚酰亚胺膜 |
JP2019529616A (ja) * | 2017-01-31 | 2019-10-17 | エルジー・ケム・リミテッド | ポリイミド及びこれより製造されたフレキシブルディスプレイ用ポリイミドフィルム |
US11319409B2 (en) | 2017-01-31 | 2022-05-03 | Lg Chem, Ltd. | Polyimide and polyimide film, prepared therefrom, for flexible display |
CN109651631A (zh) * | 2018-01-18 | 2019-04-19 | 深圳瑞华泰薄膜科技股份有限公司 | 一种低介质损耗的聚酰亚胺薄膜 |
CN109438702A (zh) * | 2018-09-29 | 2019-03-08 | 苏州市新广益电子有限公司 | 一种用于fpc行业的tpi薄膜及其制备和加工方法 |
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