CN102574267A - Supporting pad - Google Patents
Supporting pad Download PDFInfo
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- CN102574267A CN102574267A CN200980161122.6A CN200980161122A CN102574267A CN 102574267 A CN102574267 A CN 102574267A CN 200980161122 A CN200980161122 A CN 200980161122A CN 102574267 A CN102574267 A CN 102574267A
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- Prior art keywords
- ethyl formate
- maintenance
- foaming
- pad
- section
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
A supporting pad is provided which has a supporting face with heightened flatness precision and can improve the in-plane evenness of an object to be polished. The supporting pad (10) includes a urethane sheet (2). The urethane sheet (2) has been formed by the wet solidification method and has a supporting face (Sh) for supporting an object to be polished. The urethane sheet (2) has a skin layer (2a) of a microporous structure, and has many cells (3) formed on the inner side of the skin layer (2a) and having such a size that the cells (3) extend over almost the whole thickness of the urethane sheet. In the urethane sheet (2), the bottoms of the cells (3) are located in the range of from the back side (Sr) to a depth of 0.1t therefrom, provided that t is the thickness of the urethane sheet (2). In a lower layer part (Pr) sandwiched between the section which is located 0.1t inward from the back side (Sr) and is parallel to the back side (Sr) and the section which is located 0.4t inward from the back side (Sr) and is parallel to the back side (Sr), the urethane sheet has a porosity, concerning the cells (3), regulated to 75-95%. In polishing, the urethane sheet (2) shows an increased compressive deformation in the lower layer part (Pr).
Description
Technical field
The present invention relates to a kind of maintenance pad, particularly relevant for a kind of possess be formed with the longitudinal type foaming by the wet type freezing method, in order to the maintenance pad of the resin flake of the maintenance face that keeps grinding charge.
Background technology
Semiconductor with Silicon Wafer (WF), flat-panel monitor (FPD) with glass substrate or hard disk surface (machined surface) with various materials (grinding charge) such as substrates; For flatness is promoted, thereby use the grinder of two price fixings that possess the subtend configuration to carry out attrition process.In these a little grinding charges, for example, with WF, owing to be accompanied by the miniaturization of its applied portable machine etc., in order efficient to make substrate well, the grinding charge that therefore is made for attrition process then has the tendency of maximization with semiconductor.In addition, with regard to glass substrate, for maximization that can corresponding FPD itself, thin-walled property also has the tendency of maximization, thin-walled property as the glass substrate of grinding charge with regard to FPD.Even if concerning the grinding charge of this maximization, thin-walled property, also be to increase day by day to the demand degrees of flatness.
With grinding charge, for example to one side wherein when carrying out attrition process, wherein on a side the price fixing, installing grinding pad, and on the opposing party's price fixing at grinder, then be with the grinding charge maintenance be with grinding pad relatively to.When carrying out attrition process, between grinding charge and grinding pad, supply with the slurry that contains polishing particles (abrasive particle), grinding charge is bestowed to grind press (pressing force).For fear of because of contacting between grinding charge and price fixing sustains damage, normally on the price fixing that keeps grinding charge to use, installing keeps pad.That is, keep pad in grinding process, temporarily to keep grinding charge.
Just keep pad, be able to use to possess form, the maintenance pad (for example, see also the spy and open the 2006-62059 communique) of the soft amido Ethyl formate film (resin flake) of tool foaming structure by the wet type freezing method.As far as by the formed amido Ethyl formate of wet type freezing method film, because the surface (maintenance face) of superficial layer (table skin layer) has flatness, so the retentivity of grinding charge is excellent.In addition,, be formed with also on the inboard than table skin layer across the roughly longitudinal type foaming of the size of all thickness.Therefore, the grinding pressure when suffering attrition process and when being compressed, can bring into play resiliency.If resiliency is low excessively, then can press the stress that grinding charge is born to produce the phenomenon of unbalance stress because of grinding, so concentrating, stress is positioned at the protuberance that is absorbed in the grinding charge that keeps the pad side, it is uneven that this stress concentrated part is ground because of overgrinding produces.Opposite, when resiliency improved, the stress that grinding charge bore became and is difficult for producing the phenomenon of unbalance stress, though and then can promote the surface smoothing property of grinding charge, having depression to become big, ground the possibility of cutting and make maintenance advance capital for body have.Thereby, usually in the wet type freezing method, be size or the formation state etc. of adjusting foaming through the selected and various additives of resin.
Summary of the invention
The problem that invention institute desire solves
Yet, in the resulting amido Ethyl formate of the wet type freezing method film of existing convention, because be formed with the longitudinal type foaming, so have the problem that between the resin part between part that forms foaming and foaming, produces density unevenness.Therefore; Form part and resin part in foaming; When attrition process, the compress variation when quilt is bestowed grinding pressure can be different thereupon, still is not the demand that has fully satisfied the desired high-precision flatness of grinding charge of above-mentioned maximization, thin-walled property.That is, because when keeping the density unevenness of pad, the stress intensity that then puts on the grinding charge can produce the difference of locality, is difficult to the region-wide attrition process equably of machined surface so become, and undermines internal homogeneity.If can reduce the inequality of compress variation, and improve the flatness precision of maintenance face, just can satisfy the level that requires for the high-precision internal homogeneity with regard to the grinding charge.
The present invention is because the above-mentioned state of affairs, and so that the flatness that can improve maintenance face precision to be provided, and the maintenance pad that promotes the internal homogeneity of grinding charge is a problem.
The means of dealing with problems
For solving above-mentioned problem; The invention is characterized in: be formed with the longitudinal type foaming by the wet type freezing method possessing; In the maintenance pad in order to the resin flake of the maintenance face that keeps grinding charge; Described resin flake is in the back side to the scope till 10% component of all thickness is extended in the inboard of described maintenance face; Form the bottom of described foaming, and from the described back side to 10% component that extends described all thickness towards the inboard and and the section that parallels of the described back side and towards the inboard extend 40% component and and the section that parallels of the described back side between the voidage of the lower layer part of holding under the arm of wrapping be between more than 70% below 95%.
In the present invention; Because in the rear side of the maintenance face of resin flake; The voidage of lower layer part with certain thickness component is between more than 70% below 95%; So can guarantee resiliency by lower layer part, and let the load that puts on the grinding charge be dispersed, thereby when being compressed along with attrition process; Can alleviate the burden that grinding charge is produced by the foaming shape variation in the lower layer part, can improve the flatness precision of maintenance face whereby and promote the internal homogeneity of grinding charge.
In this case; Resin flake when at self-sustaining face to the section that extends 10% component of all thickness towards the inboard and parallel with maintenance face; The average pore size in the formed hole of foaming is made as A; And in the section that in lower layer part, parallels with maintenance face, when the maximum diameter of hole in the formed hole of foaming was made as B, then ratio B/A was comparatively suitable between the scope person of 20-50.In addition, from the maintenance face of resin flake to 10% component that extends all thickness towards the inboard and and the section that parallels of maintenance face and towards the inboard extend 40% component and and the section that parallels of maintenance face between the voidage of the upper layer part of holding under the arm of wrapping can be between more than 35% below 55%.The voidage of the lower layer part of resin flake is between more than 75% below 90%, and the voidage of upper layer part is comparatively suitable between 50% following person more than 40%.In addition, on the lower layer part of resin flake, in the middle of the section that parallels with maintenance face, the section the when ratio of representing with per unit area by the gross area in the formed hole of foaming is maximum, the maximum of its ratio can be between more than 80% below 95%.Resin flake also can form by polyamine base Ethyl formate resin.Polyamine base Ethyl formate resin between the foaming of resin flake also can form little cellular.At this moment, 100% modulus value of polyamine base Ethyl formate resin is set as comparatively more suitable than the also little person of 20Mpa.On the rear side of resin flake, more can be coated with in order to be installed up to the material that sticks together on the grinder.At this moment, at resin flake and stick together between material, more can fit in order to support the fid that resin flake is used.
The effect of invention
According to the present invention; Because in the rear side of the maintenance face of resin flake; The voidage of lower layer part with certain thickness component is between more than 70% below 95%; So can guarantee resiliency by lower layer part, and let the load that puts on the grinding charge be dispersed, thereby when being compressed along with attrition process; Can alleviate the burden that grinding charge is produced, the effect that can obtain to improve the flatness precision of maintenance face whereby and promote the internal homogeneity of grinding charge by the foaming shape variation in the lower layer part.
Description of drawings
Fig. 1 representes the generalized section of the maintenance pad of suitable example of the present invention.
Fig. 2 representes to constitute the sketch map of the formation state of the foaming in the amido Ethyl formate thin slice of maintenance pad of example, (A) then is illustrated in the sketch map in the formed hole of foaming on the section of the sketch map in the formed hole of foaming on the section of the B-B line segment in (A), C-C line segment that (C) then is illustrated in (A) for profile, (B) of the thickness direction of amido Ethyl formate thin slice.
Fig. 3 representes the generalized section of the maintenance pad of existing convention.
Fig. 4 representes to constitute the sketch map of the formation state of the foaming in the amido Ethyl formate thin slice of maintenance pad of existing convention; (A) be the profile of the thickness direction of amido Ethyl formate thin slice, (B) then be illustrated in the sketch map in the formed hole of foaming on the section of the sketch map in the formed hole of foaming on the section of the B-B line segment in (A), C-C line segment that (C) then is illustrated in (A).
Fig. 5 representes the foam curve map of aperture opening ratio in formed hole of the thickness of starting at respect to the maintenance face of the amido Ethyl formate thin slice that constitute to keep pad certainly, each section in this thickness.
The specific embodiment
Below, will consult graphicly, describe to the example that is suitable for maintenance pad of the present invention.
(formation)
As shown in Figure 1, the maintenance pad 10 of this example possesses the resinous resin flake of polyamine base Ethyl formate and is used as amido Ethyl formate thin slice 2.Polyamine base Ethyl formate thin slice 2 is to form by the wet type freezing method, has in order to keep the maintenance face Sh of grinding charge.
Amido Ethyl formate thin slice 2 is to keep face Sh adjacent to, has across the thickness of number μ m degree and is formed with the table skin layer 2a of fine and close little porous.That is table skin layer 2a has little vesicular structure.On the table skin layer 2a more inboard (inside) than amido Ethyl formate thin slice 2, most foaming 3 are formed with the state that disperses slightly equably.Foaming 3 has the size across the roughly all thickness of amido Ethyl formate thin slice 2, on thickness direction, forms to be lengthwise shape and coniform with round end.Because amido Ethyl formate thin slice 2 has table skin layer 2a, so at the opening that keeps not being formed with on the face Sh foaming 3.In addition, in amido Ethyl formate thin slice 2, the back side of self-sustaining face Sh (below, be called back side Sr.) to the scope till 10% component of all thickness is extended in the inboard, be formed with the bottom of foaming 3.In foaming 3 to each other polyamine base Ethyl formate resins, then be formed with the little porous (not shown) also littler than foaming 3.In amido Ethyl formate thin slice 2, little porous, foaming 3 and the little porous of table skin layer 2a are the mesh shape each other and are communicated with, and foaming is to form to have the continuous foamed structure that is continuous foamed shape.
In amido Ethyl formate thin slice 2, from back side Sr to 10% component that extends all thickness towards the inboard and and the section that parallels of back side Sr and towards the inboard extend all thickness 40% component and and the section that parallels of back side Sr between the voidage of the lower layer part Pr that holds under the arm that wraps can be adjusted to more than 70% below 95%.That is; When the thickness with amido Ethyl formate thin slice 2 is made as t; To towards the section of inboard 0.1t thickness component and towards between the section of inboard 0.4t thickness component, wrap among the lower layer part Pr that holds under the arm, 3 voidages that generated that foam are the scopes between 75-95% from back side Sr.With respect to this, self-sustaining face Sh is to 10% component that extends all thickness towards the inboard and and keep section that face Sh parallels and extend 40% component of all thickness towards the inboard and and keep the voidage of the upper layer part Ph that holds under the arm that wraps between section that face Sh parallels to can be adjusted to more than 35% below 55%.That is self-sustaining face Sh is to towards the section of inboard 0.1t thickness component and towards between the section of inboard 0.4t thickness component, wrap among the upper layer part Ph that holds under the arm, and 3 voidages that generated that foam are the scopes between 35-55%.The voidage of this upper layer part Pb, lower layer part Pr can be through polyamine base Ethyl formate resin selected or wet type freezing method condition enactment and adjust (detailed as then state).
In addition; In amido Ethyl formate thin slice 2, at self-sustaining face Sh to 10% component that extends all thickness towards the inboard and the section parallel, when being made as A by the average pore size in foaming 3 formed holes with keeping face Sh; At lower layer part Pr; In the section that parallels with back side Sr, with in the per unit area by the ratio of the gross area in foaming 3 formed holes (below, be called aperture opening ratio.) when being made as B for the maximum diameter of hole in the formed hole of peaked section, then the ratio B/A of the relative average pore size A of maximum diameter of hole B is the scope that is adjusted into 20-50.That is, have with respect near the 20-50 of the average pore size of formed foaming keeping face Sh doubly the aperture opening ratio that is formed among the lower layer part Pr of the foaming in the foaming aperture of size be on the peaked section.In addition, the maximum of aperture opening ratio can be adjusted to more than 80% below 95%.
In this amido Ethyl formate thin slice 2, with keep near the face Sh with the section that keeps face Sh to parallel on formed hole compare, formed hole is pressed close to each other and is formed near the section that parallels with the back side Sr Sr overleaf.Shown in Fig. 2 (A), be made as the position of self-sustaining face Sh with keeping near the face Sh to 10% component of the thickness t of amido Ethyl formate thin slice 2, that is, towards the position (position of flechette-type symbol B) of inboard 0.1t component; And with being made as from back side Sr near the Sr of the back side to the position (position of flechette-type symbol C) towards inboard 0.1t component.In this case, shown in Fig. 2 (B), keeping near the section of the B-B line segment the face Sh, is estranged each other and form by foaming 3 formed holes.With respect to this, shown in Fig. 2 (C), near the section of the C-C line segment the Sr of the back side, press close to each other by foaming 3 formed holes and form.
In addition, keep pad 10 on the Sr side of the back side of amido Ethyl formate thin slice 2, post as the two-sided tape that sticks together material 7 that will keep pad 10 to be installed up on the grinder.Two-sided tape 7 has not shown base material, and is formed with pressure-sensitive type adhesive layer (not shown) such as acrylic adhesive respectively on the two sides of base material.In base material, for example be able to use PET (below, abbreviate PET as.) system pliability films such as film.Two-sided tape 7 is to fit each other with the adhesive layer and the amido Ethyl formate thin slice 2 of the wherein one side side of base material, the adhesive layer of another side side (opposition side opposite) with amido Ethyl formate thin slice 2, and the surface then is to cover with peeling paper 8.In addition, in this example, but the base material of this two-sided tape 7 also dual-purpose as the fid that supports amido Ethyl formate thin slice 2 usefulness.
(manufacturing)
Keeping pad 10 is with forming by the formed amido Ethyl formate of wet type freezing method thin slice 2 and two-sided tape 7 mutual applying manufacturings.That is, via the preparatory process of preparing polyamine base Ethyl formate resin solution; Becoming coating polyamine base Ethyl formate resin solution on the film base material, and polyamine base Ethyl formate resin solution is solidified and making the step for regeneration that solidifies of polyamine base Ethyl formate resin regeneration; Laminar polyamine base Ethyl formate resin is cleaned, and made its dry cleaning/drying process and make lamination that resulting amido Ethyl formate thin slice 2 and two-sided tape 7 fit etc., and then produce and keep pad 10.Below, describe according to each process sequence.
In preparatory process, the water miscibility organic solvent of polyamine base Ethyl formate resin, solubilized polyamine base Ethyl formate resin and additive are mixed and make polyamine base Ethyl formate resin dissolves.With organic solvent, though can enumerate N, dinethylformamide (below, abbreviate DMF as.) or N, N-dimethylacetylamide (DMAc) etc. is an example, but is to use DMF in this example.Select to use in the resins such as but polyamine base Ethyl formate resin autopolyester is, polyethers is, polycarbonate-based.When considering that desire forms above-mentioned foaming structure; Be directed to and make the resin solution of polyamine base Ethyl formate resin among the DMF with the ratio dissolving of 20 weight %; Can select and use the Type B rotational viscometer, be that resin between the scope of 5～10Pas uses at 25 ℃ of viscositys of being measured down.In addition, it is comparatively suitable that employed polyamine base Ethyl formate resin has 100% modulus value also littler than 20MPa, makes this polyamine base Ethyl formate resin in DMF, dissolve the scope that becomes between 10～30 weight %.In addition, the hydrophobic additive etc. that with regard to additive,, can use pigment such as carbon black, promote the hydrophilic additive of foaming and make polyamine base Ethyl formate regeneration of resin stabilisation in order to control foaming 3 size or amount (number).The solution of gained is carried out deaeration under reduced pressure atmosphere, and obtain polyamine base Ethyl formate resin solution.
In solidifying step for regeneration, will be in preparatory process resulting polyamine base Ethyl formate resin solution, utilize apparatus for coating such as cutter formula coating machine at normal temperatures, on the one-tenth film base material of band shape, slightly be coated with the flakiness shape equably.At this moment, can be through adjustment cutter formula coating machine etc. and the gap (clearance) that becomes between film base material, to adjust the coating thickness (coating weight) of polyamine base Ethyl formate resin solution.Just becoming film base material, though can use resin-made membrane, cloth and silk, adhesive-bonded fabric etc., is to use the PET made membrane in this example.
With the polyamine base Ethyl formate resin solution of coating on the film base material, guiding to continuously for polyamine base Ethyl formate resin is in the solidification liquid (water system solidification liquid) of main component with water for bad solvent.In solidification liquid,,, be to use water in this example though can add the organic solvents such as polarity solvent beyond DMF or the DMF in order to adjust polyamine base Ethyl formate regeneration of resin speed.In solidification liquid, at first, the interface between polyamine base Ethyl formate resin solution and solidification liquid can form epithelium, in the contiguous polyamine base Ethyl formate resin of epithelium, then can form little porous of formation table skin layer 2a.Afterwards, the mediation phenomenon of the immersion of diffusion in the solidification liquid of the DMF in polyamine base Ethyl formate resin solution and the water in the polyamine base Ethyl formate resin, and have the polyamine base Ethyl formate regeneration of resin of continuous foamed structure.At this moment, owing to become the PET made membrane of film base material can't make water (solidification liquid) soak into,, make into the film base material side and form than the also big foaming 3 of table skin layer 2a side so the displacement meeting of DMF and water takes place in table skin layer 2a side.
At this, the foaming that causes to being accompanied by polyamine base Ethyl formate regeneration of resin forms and describes.In polyamine base Ethyl formate resin, because cohesive force becomes big, thus in the contiguous polyamine base Ethyl formate resin of epithelium, regenerate hastily, and then form table skin layer 2a.In this example, being to use 100% modulus value is the polyamine base Ethyl formate resin also littler than 20MPa.In addition, the viscosity of this polyamine base Ethyl formate resin solution is represented the scope between 5-10Pas.Just, use can let the polyamine base Ethyl formate resin dissolves of low modulus become the polyamine base Ethyl formate resin solution of low-viscosity.Therefore, after table skin layer 2a formed, the polyamine base Ethyl formate resin in the polyamine base Ethyl formate resin solution before solidifying can move to table skin layer 2a side and aggegation.Becoming the film base material side, therefore compare the foaming 3 that can form hypertrophyization with table skin layer 2a side then because polyamine base Ethyl formate amount of resin can reduce thereupon.In other words, Ph compares with upper layer part, impels voidage because of 3 hypertrophyizations that foam among the lower layer part Pr and becomes big.In addition, from the desolventizing process of the polyamine base Ethyl formate resin solution of DMF, that is, by the displacement between DMF and water, and forming table skin layer 2a, foaming 3 and little porous, little porous, foaming 3 and the little porous of table skin layer 2a are to be interconnected with being the mesh shape.In addition, because polyamine base Ethyl formate resin is becoming on the film base material and can be reproduced, among the back side Sr that forms so contact, can't be formed with 4 the opening of foaming with the surface of one-tenth film base material.
In clean/drying process, the polyamine base Ethyl formate resin of being regenerated in the step for regeneration is cleaned in detergent removers such as water, after removing the DMF that remains in the polyamine base Ethyl formate resin, make its drying again.About the drying of polyamine base Ethyl formate resin, be to use in this example to possess the drum drier that the cylinder of thermal source is contained in inside.Through with polyamine base Ethyl formate resin along the periphery of cylinder through to carry out drying.Resulting amido Ethyl formate thin slice 2 batched be the rolling strip.
In lamination, the amido Ethyl formate thin slice 2 that utilizes wet type freezing method made is fitted each other with two-sided tape 7.At this moment, let the back side Sr of amido Ethyl formate thin slice 2 and two-sided tape 7 fit each other.Next, cut into required shape such as circle or polygonal, size again after, confirm whether to have damage also or be attached with the inspection of dirty or foreign matter etc. again, keep pad 10 to accomplish.
(effect etc.)
Secondly, describe to the effect of the maintenance pad 10 of this example etc.
For making explanation be convenient to understand, describe to foaming structure by the formed amido Ethyl formate of the wet type freezing method thin slice that has convention now.In the wet type freezing method of existing convention, the polyamine base Ethyl formate resin solution that on one-tenth film base materials such as PET made membrane, is coated with is in solidification liquids such as water, to solidify.Therefore; As shown in Figure 3; In the amido Ethyl formate thin slice 12 of the maintenance pad 20 that constitutes existing convention, than the formed table skin layer 12a of the initial stage when wet type is solidified more on the inboard, most that can be formed with across amido Ethyl formate thin slice 12 all thickness are foamed 13.This foaming 13 is keeping face Sh side more to reduce than the aperture of back side Sr side, and forms in vertical direction along the mode of thickness direction.
In addition; In amido Ethyl formate thin slice 12; Keep near the face Sh and with the section that keeps face Sh to parallel on formed hole, with Sr overleaf near and formed hole on the section that parallels with back side Sr, any one estranged all each other and formation in the hole of these a little kinds.The Sr side becomes bigger because the aperture of foaming 13 is keeping face Sh side to compare overleaf, so estranged each other degree can keep face Sh side to become big.That is, shown in Fig. 4 (A) figure, be made as the position (position of flechette-type symbol B) of self-sustaining face Sh near the face Sh to 10% component of the thickness that extends amido Ethyl formate thin slice 12 towards the inboard with keeping; And with being made as the inboard position (position of flechette-type symbol C) of 10% component that Sr extremely extends the thickness of amido Ethyl formate thin slice 12 towards the inboard from the back side near the Sr of the back side.In this case, shown in Fig. 4 (B), keep near the section of the B-B line segment the face Sh, be estranged each other by foaming 13 formed holes and form.Shown in Fig. 4 (C), near the section of the C-C line segment the Sr of the back side, also be estranged each other by foaming 13 formed holes and form.In the section of C-C line segment in the formed hole; Though formed hole is more pressed close to each other in the section than B-B line segment; But comparing with formed hole near the back side Sr of the amido Ethyl formate thin slice 2 that constitutes above-mentioned maintenance pad 10 the section, then is estranged each other and (seeing also Fig. 2 (C)) that form.In this amido Ethyl formate thin slice 12, when with the identical zone of upper layer part Ph, lower layer part Pr in the above-mentioned amido Ethyl formate thin slice 2, the voidage of upper layer part is the 30-45% degree, and the voidage of lower layer part then is 70% following degree.
With regard to the maintenance pad 20 of the existing convention of using amido Ethyl formate thin slice 12, between part that forms foaming 13 and 13 the resin part of foaming, the density unevenness phenomenon will take place.Therefore, form part and resin part in foaming, when attrition process, the compress variation when bestowing grinding pressure can be different thereupon, thereby become and be difficult to satisfy the demand that is directed against the desired high-precision flatness of grinding charge.That is, with regard to keeping pad 20,, be difficult to the region-wide attrition process equably of carrying out of the machined surface of grinding charge so become because of the stress intensity intersection locality that the phenomenon of density unevenness takes place, make to put on the grinding charge produces difference.Thereby keeping pad 20 still is not fully to have satisfied the above-mentioned semiconductor that maximization, thin-walled property tendency arranged with WF or the FPD demand with the desired high-precision flatness of glass substrate.
With respect to this; In this example and since from the back side Sr of the amido Ethyl formate thin slice 2 that constitute to keep pad 10 to 10% component (0.1t component) that extends thickness t towards the inboard and and the section that parallels of back side Sr and towards the inboard extend 40% component (0.4t component) and and the section that parallels of back side Sr between the voidage of the lower layer part Pr that holds under the arm that wraps can be in adjusting below 95% more than 70%.In addition; Self-sustaining face Sh to 10% component that extends all thickness towards the inboard and with the section that keeps face Sh to parallel in; Average pore size with respect to by foaming 3 formed holes is A; In the middle of the section that parallels at lower layer part Pr and with the back side Sr aperture opening ratio on by peaked section the porose maximum diameter of hole of formation be the ratio B/A of B, then be adjusted into the scope of 20-50.That is, having the doubly foaming in the foaming aperture of size of 20-50 with respect near the average pore size of formed foaming maintenance face Sh, the aperture opening ratio that is formed among the lower layer part Pr is on the peaked section.Therefore, the lower layer part Pr that is formed with soft foaming 3 galore can play the part of the role of air cushioning, can make the pressure (grinding pressure) that is applied on the grinding charge be easy to disperse.In addition; Be accompanied by attrition process and when being compressed; Can let the foaming shape compression of lower layer part Pr corresponding to being applied to pressure on the grinding charge; Mat and cooperate the warpage or the fluctuating of grinding charge can reduce the burden (reversal of stress) with respect to grinding charge, then so can promote the flatness of grinding charge accurately.During the guaranteeing of the compress variation in considering lower layer part Pr, it is comparatively suitable then the voidage of lower layer part Pr to be adjusted between the scope of 75-90%.
In addition, in this example, in the middle of the section that parallels at lower layer part Pr and with back side Sr,, be adjusted into more than 80% below 95% with the maximum of per unit area by the aperture opening ratio of the ratio of the gross area in foaming 3 formed holes.Therefore, lower layer part Pr, particularly near the aperture of the foaming 3 of Sr is hypertrophyization overleaf, and then can guarantee sufficient resiliency.Whereby, because the stress with respect to grinding charge is able to by equalization when attrition process, so can work for to such an extent that flatness promotes.Identical ground with the voidage of lower layer part Pr, when considering the guaranteeing of compress variation, it is comparatively suitable then aperture opening ratio to be adjusted between the scope of 82-90%.
Moreover; In this example; From the maintenance face Sh of amido Ethyl formate thin slice 2 to 10% component (0.1t component) that extends thickness t towards the inboard and and keep section that face Sh parallels and extend 40% component (0.4t component) towards the inboard and and keep the voidage of the upper layer part Ph that holds under the arm that wraps between section that face Sh parallels, be adjusted into more than 35% below 55%.Therefore, Pr compares with lower layer part because the next door of polyamine base Ethyl formate resin is a heavy wall and can guarantee rigidity, so can suppress attrition process the time grinding charge towards the situation that keeps the pad side to cave in.When causing the grinding charge depression to become big, can take place to keep pad (amido Ethyl formate thin slice) itself to be ground the situation of cutting during attrition process when the rigidity deficiency that keeps pad.With respect to this,, cut so amido Ethyl formate thin slice 2 will can not grind, and can proceed attrition process owing to keep pad 10 to be able to suppress the depression of grinding charge.When the voidage of upper layer part Ph less than 35% the time, can uprise though can improve rigidity hardness, be difficult to promote flatness on the contrary.Under considering the viewpoint that promotes flatness and when guaranteeing rigidity, it is comparatively suitable then the voidage of upper layer part Ph to be adjusted between the scope of 40-50%.
In addition; In this example; Because amido Ethyl formate thin slice 2 has above-mentioned foaming structure; So can guarantee to have the required rigidity of depression that suppresses grinding charge at upper layer part Ph, then can guarantee to have at lower layer part Pr, so can rigidity is in harmonious proportion mutually with resiliency by the amido Ethyl formate thin slice 2 of monolithic to the required resiliency of the stress equalization of grinding charge.Though the resin flake of the tool rigidity of also can fitting and the resin flake of tool resiliency constitute, in this case, the situation that two resin flakes are peeled off each other takes place sometimes when attrition process.Thereby to keep pad 10, having both through amido Ethyl formate thin slice 2 has rigidity and resiliency, can work for to such an extent that the flatness of grinding charge promotes.
In addition, in this example, though illustration possess the maintenance pad 10 of the resinous amido Ethyl formate of polyamine base Ethyl formate thin slice 2, the present invention do not receive this limit.In order to replace polyamine base Ethyl formate resin, also can use like resins such as polyethylene, so long as the resin that can form above-mentioned foaming structure by the wet type freezing method gets final product, do not have special restriction.
In addition, in this example, though illustration the maintenance pad 10 that constitutes of a kind of fit amido Ethyl formate thin slice 2 and two-sided tape 7 with base material, the present invention do not receive this limit.Keeping pad, if possess amido Ethyl formate thin slice 2 with in order to be installed up to the material that sticks together of grinder, for example in order to replacement two-sided tape 7, also can be only various adhesive agents be coated amido Ethyl formate thin slice 2 (back side Sr) and get final product.In addition, in this example, though but the base material double as that shows two-sided tape 7 is the example of the fid that keeps pad 10, the present invention do not receive this limit, also can be fitted with other fid 7 of amido Ethyl formate thin slice 2 and two-sided tapes.With this fid, do not have any special restriction, the film of the PET system of can giving an example etc. or adhesive-bonded fabric etc. are example.
Moreover; Though in this example, do not mention especially; But when the uneven thickness by the formed amido Ethyl formate of wet type freezing method thin slice 2 becomes big; For maintenance face Sh and back side Sr can be parallel to each other, it is comparatively suitable that methods such as back side Sr side utilization polishing or section are carried out smoothing person in advance.Thus, the flatness of maintenance face Sh is further promoted.
Embodiment
Secondly, the embodiment to the maintenance pad 10 of accordinging to the manufacturing of this example describes.Be recited as the comparative example that compares with manufacturing in addition, and in the lump.
(embodiment 1)
In embodiment 1; In the making of amido Ethyl formate thin slice 2; Use polyester MDI (methyl diphenylene diisocyanate) the polyamine base Ethyl formate resin of 100% resin mold value as 10MPa; Make its in DMF with after the dissolving of the ratio of 18 weight %; Interpolation is the hydrophilic additive of 1 weight % with respect to polyamine base Ethyl formate resin and is the carbon black of 5 weight % with respect to polyamine base Ethyl formate resin, modulates the polyamine base Ethyl formate resin solution that is determined as the viscosity of tool 3.3Pas with the Type B rotational viscometer.When coating polyamine base Ethyl formate resin solution, set the clearance of apparatus for coating for 0.7mm.After being coated with polyamine base Ethyl formate resin solution on the one-tenth film base material of PET made membrane, flooding to the water (solidification liquid) of 25 ℃ of temperature, and make polyamine base Ethyl formate resin be able to holomorphosis.Cleaning/drying after, the back side Sr side of resulting amido Ethyl formate thin slice 2 is polished, make two-sided tape 7 conform to burnishing surface and produce and keep pad 10.
(embodiment 2)
In embodiment 2; Make the polyamine base Ethyl formate resin identical with embodiment 1; After the ratio dissolving with 20 weight % in DMF; Interpolation is the hydrophilic additive of 1 weight % with respect to polyamine base Ethyl formate resin and is the carbon black of 5 weight % with respect to polyamine base Ethyl formate resin, modulates the polyamine base Ethyl formate resin solution that is determined as the viscosity of tool 5.3Pas with the Type B rotational viscometer.Set the clearance of apparatus for coating for 1.0mm, after becoming to be coated with on the film base material polyamine base Ethyl formate resin solution, flood to the water of 10 ℃ of temperature, and make polyamine base Ethyl formate resin be able to holomorphosis.Cleaning/drying after, the back side Sr side of resulting amido Ethyl formate thin slice 2 is polished, make two-sided tape 7 conform to burnishing surface and produce and keep pad 10.
(embodiment 3)
In embodiment 3; Make the polyamine base Ethyl formate resin identical with embodiment 1; After the ratio dissolving with 21 weight % in DMF; Interpolation is the hydrophilic additive of 3 weight % with respect to polyamine base Ethyl formate resin and is the carbon black of 5 weight % with respect to polyamine base Ethyl formate resin, modulates the polyamine base Ethyl formate resin solution that is determined as the viscosity of tool 8.2Pas with the Type B rotational viscometer.Set the clearance of apparatus for coating for 1.0mm, after becoming to be coated with on the film base material polyamine base Ethyl formate resin solution, flood to the water of 10 ℃ of temperature, and make polyamine base Ethyl formate resin be able to holomorphosis.Cleaning/drying after, the back side Sr side of resulting amido Ethyl formate thin slice 2 is polished, make two-sided tape 7 conform to burnishing surface and produce and keep pad 10.
(embodiment 4)
In embodiment 4; Make the polyamine base Ethyl formate resin identical with embodiment 1; After the ratio dissolving with 21 weight % in DMF; Interpolation is the hydrophilic additive of 5 weight % with respect to polyamine base Ethyl formate resin and is the carbon black of 5 weight % with respect to polyamine base Ethyl formate resin, modulates the polyamine base Ethyl formate resin solution that is determined as the viscosity of tool 7.9Pas with the Type B rotational viscometer.Set the clearance of apparatus for coating for 1.0mm, after becoming to be coated with on the film base material polyamine base Ethyl formate resin solution, flood to the water of 25 ℃ of temperature, and make polyamine base Ethyl formate resin be able to holomorphosis.Cleaning/drying after, the back side Sr side of resulting amido Ethyl formate thin slice 2 is polished, make two-sided tape 7 conform to burnishing surface and produce and keep pad 10.
(embodiment 5)
In embodiment 5; Make the polyamine base Ethyl formate resin identical with embodiment 1; After the ratio dissolving with 21.5 weight % in DMF; Interpolation is the hydrophilic additive of 1 weight % with respect to polyamine base Ethyl formate resin and is the carbon black of 5 weight % with respect to polyamine base Ethyl formate resin, modulates the polyamine base Ethyl formate resin solution of measuring the viscosity with 9.5Pas with the Type B rotational viscometer.Set the clearance of apparatus for coating for 1.2mm, after becoming to be coated with on the film base material polyamine base Ethyl formate resin solution, flood to the water of 10 ℃ of temperature, and make polyamine base Ethyl formate resin be able to holomorphosis.Cleaning/drying after, the back side Sr side of resulting amido Ethyl formate thin slice 2 is polished, make two-sided tape 7 conform to burnishing surface and produce and keep pad 10.
(comparative example 1)
In comparative example 1; Make the polyamine base Ethyl formate resin identical with embodiment 1; After the ratio dissolving with 21 weight % in DMF; Interpolation is the hydrophilic additive of 1 weight % with respect to polyamine base Ethyl formate resin and is the carbon black of 5 weight % with respect to polyamine base Ethyl formate resin, modulates the polyamine base Ethyl formate resin solution of measuring the viscosity with 8.2Pas with the Type B rotational viscometer.Set the clearance of apparatus for coating for 0.7mm, after becoming to be coated with on the film base material polyamine base Ethyl formate resin solution, flood to the water of 25 ℃ of temperature, and make polyamine base Ethyl formate resin be able to holomorphosis.Cleaning/drying after, the back side Sr side of resulting amido Ethyl formate thin slice 12 is polished, make two-sided tape 7 conform to burnishing surface and produce and keep pad 20.That is the maintenance pad 20 of comparative example 1 is the maintenance pad (also can consult Fig. 3) of existing convention.
(estimating 1)
To the amido Ethyl formate thin slice of resulting each embodiment and comparative example 1, the maximum of the voidage of upper layer part Ph and lower layer part Pr, aperture opening ratio and the minimum foaming of expression aperture are measured than (Max/Min) etc. with respect to the foaming aperture of the ratio in maximum foaming aperture.The mensuration of voidage is to carry out like following mode.That is (Yamoto section length of schooling, TDM1000-IS/SP) with the scanning section, and the self-sustaining face Sh of obtaining works the continuous fault image that extends 10 μ m interval to use the three-dimensional measurement X ray CT device.With the fault image of being obtained, carry out image processing with SEM with video recording analysis software " Scandium " (Olympus Soft-Imaging Solutions society system), obtain image whereby respectively with deep or light color range.Has the image of deep or light color range to each; Dense is worked as as peristome; So that concentration range (threshold value) is conformed to visual setting for image,, obtain the ratio of the total aperture area that is occupied in every observation area and be used as aperture opening ratio through splitting oral area integrating in addition.Then, obtain respectively aperture opening ratio that the fault image in the zone of upper layer part Ph, lower layer part Pr tries to achieve and afterwards, again divided by the observation area of upper layer part Ph, lower layer part Pr with after percentage be used as voidage.This voidage; With short-cut method, can be respectively certain thickness component by polishing or section to grind to cut out from the surface of amido Ethyl formate thin slice; Wait to observe to grind through SEM or microscope and cut finished surface, and then it is also feasible to try to achieve the method for voidage.The maximum of aperture opening ratio is to be able to obtain by the aperture opening ratio of being tried to achieve in the mensuration of voidage.Foaming aperture ratio is to obtain like following mode.That is, with the self-sustaining face of being formed on Sh to 10% component that extends all thickness towards the inboard, and with the section that keeps face Sh to parallel in 3.3mm
2The average opening footpath of opening of scope, use " Scandium " to calculate, in order to as minimum foaming aperture.With the zone that is formed on lower layer part Pr, show the 3.3mm in the peaked section of aperture opening ratio
2Scope, and the maximum open footpath in the middle of the opening that will be not join with the border of observation area uses " Scandium " to calculate, in order to as maximum foaming aperture.Obtain the ratio of minimum foaming aperture, be used as foaming aperture ratio with respect to maximum foaming aperture.The aperture is corresponding with above-mentioned average pore size A, maximum diameter of hole B respectively because minimum foaming aperture, maximum foam, so foaming aperture ratio is in order to represent above-mentioned ratio B/A.The mensuration result of the maximum of voidage, aperture opening ratio, the aperture ratio that foams is as shown in table 1 below.
(table 1)
As shown in table 1, in the amido Ethyl formate thin slice of comparative example 1, the voidage of upper layer part Ph is 41.4%, and the voidage of lower layer part Pr then is 68.6%.In addition, can be known by Fig. 5 and to learn that the thickness of starting at from the surface is big more, that is though get over back side Sr, aperture opening ratio becomes bigger and bigger, its aperture opening ratio maximum is 75% degree only.With respect to this, in each amido Ethyl formate thin slice 2 of embodiment 1～embodiment 5, the voidage of upper layer part Ph is between the scope of 38.3%-50.2%, and the voidage of lower layer part Pr is then between the scope of 77.2-88.3%.In addition, in the amido Ethyl formate thin slice 2 of embodiment 1, can know by Fig. 5 and to learn,, and surpass 80% aperture opening ratio continuously at section across the thickness more than the 100 μ m in the thickness area of lower layer part Pr.Hence one can see that, in the amido Ethyl formate thin slice 2 of each embodiment, though the voidage of upper layer part Ph and comparative example 1 are same degree, then bigger in the voidage of lower layer part Pr.Moreover; Mensuration result by foaming aperture ratio can understand and learn in comparative example 1, and the maximum foaming aperture among the lower layer part Pr directly is 18.7 times with respect near the average opening the maintenance face Sh; With respect to this, in each embodiment, then drawn result between 34.0-38.2 size doubly.
(estimating 2)
Use the maintenance pad of each embodiment and comparative example; According to following grinding condition; (attrition process of 470mm * 370mm * 0.7mm) is with according to JIS (JIS B 0601: ' 82) be the method for benchmark, rise and fall from the filtering center and try to achieve flatness a to carry out liquid crystal display glass substrate.In the mensuration of flatness a, (Tokyo Seimitsu Co., Ltd's system surfcom480A), is measured according to following condition determination to use the surface roughness form measuring instrument.From the concavo-convex mensuration curve that obtain of cause at substrate surface, calculate the width W between adjacent protuberance (mountain portion) and protuberance, and the height S between protuberance and recess (paddy portion), and to make with the width W be transverse axis, height S is the scatter diagram of the longitudinal axis.Obtain the near linear of simple equation S=aW from scatter diagram, gradient a is made as the final flatness a after the attrition process.Because of flatness is high more, then width W becomes big more, and height S becomes more little, so get over hour the apparent more excellence of flatness then as gradient a.
(grinding condition)
Use grinder: the OSCAR grinder (SPEEDFAM society system, SP-1200)
Grinding rate (rotation number): 61rpm
Tonnage: 76gf/cm
2
Slurry: cerium slurry
Milling time: 30min
(filtering center fluctuating condition determination)
Evaluation length: 90mm
Finding speed: 3.0mm/s
Cutoff: 0.8～8.0mm
Filtering kind: 2RC
Measurement range: ± 40.0 μ m
Slope compensation: smoothed curve
As shown in table 1, in the attrition process that the maintenance pad 20 that uses comparative example 1 carries out, the flatness a of the glass substrate after the processing shows 0.0007 result.With respect to this, in the attrition process that each the maintenance pad 10 that uses embodiment 1～embodiment 5 carries out, flatness a then shows the result into 0.0003-0.0005, and no matter what person has all drawn the result more more excellent than comparative example 1.Thereby; Can know and learn to use to possess by the formed foaming 3 of wet type freezing method; Voidage at upper layer Ph is the scope that forms between 35-55%; Voidage at lower layer Pr then is that formation can make the flatness precision of maintenance face Sh improve between the maintenance pad 10 of the amido Ethyl formate thin slice 2 of the scope of 70-95%, and the internal homogeneity of grinding charge is promoted.
Utilize possibility on the industry
The present invention is owing to provide a kind of flatness precision that can improve maintenance face, and promotes the invention of maintenance pad of the internal homogeneity of grinding charge, so in the manufacturing that keeps filling up, peddle and have contribution, so have the possibility of utilizing on the industry.
Claims (10)
1. one kind keeps pad; It is characterized in that: possess and be formed with the longitudinal type foaming by the wet type freezing method; In the maintenance pad in order to the resin flake of the maintenance face that keeps grinding charge; Described resin flake is in the back side to the scope till 10% component of all thickness is extended in the inboard of described maintenance face; Form the bottom of described foaming, and from the described back side to 10% component that extends described all thickness towards the inboard and and the section that parallels of the described back side and towards the inboard extend 40% component and and the section that parallels of the described back side between the voidage of the lower layer part of holding under the arm of wrapping be between more than 70% below 95%.
2. maintenance pad as claimed in claim 1; It is characterized in that: described resin flake when from described maintenance face to the section that extends 10% component of described all thickness towards the inboard and parallel with described maintenance face; The average pore size in the formed hole of described foaming is made as A; And on the section that in described lower layer part, parallels with described maintenance face, when the maximum diameter of hole in the formed hole of described foaming was made as B, then ratio B/A was the scope between 20-50.
3. maintenance pad as claimed in claim 2; It is characterized in that: described resin flake, be from described maintenance face to 10% component that extends described all thickness towards the inboard and and the section that parallels of described maintenance face and towards the inboard extend 40% component and and the section that parallels of described maintenance face between the voidage of the upper layer part of holding under the arm of wrapping be between more than 35% below 55%.
4. maintenance pad as claimed in claim 3 is characterized in that: in the described resin flake, the voidage of described lower layer part is between more than 75% below 90%, and the voidage of described upper layer part is between more than 40% below 50%.
5. maintenance pad as claimed in claim 2; It is characterized in that: in the described lower layer part of described resin flake; In the section parallel with described maintenance face; With the section when the ratio of the gross area in the formed hole of described foaming is maximum in the per unit area, the maximum of its described ratio is between more than 80% below 95%.
6. maintenance pad as claimed in claim 3 is characterized in that: described resin flake is formed with polyamine base Ethyl formate resin.
7. maintenance pad as claimed in claim 6 is characterized in that: in the described resin flake, the polyamine base Ethyl formate resin-shaped between described foaming becomes little cellular.
8. maintenance pad as claimed in claim 7 is characterized in that: 100% modulus value of described polyamine base Ethyl formate resin is also littler than 20MPa.
9. maintenance pad as claimed in claim 1 is characterized in that: on the described rear side of described resin flake, coating is in order to be installed up to the material that sticks together on the grinder.
10. maintenance pad as claimed in claim 9 is characterized in that: described resin flake and described sticking together between material, fit in order to support the fid of described resin flake.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-204004 | 2009-09-03 | ||
| JP2009204004A JP5587576B2 (en) | 2009-09-03 | 2009-09-03 | Holding pad |
| PCT/JP2009/004792 WO2011027412A1 (en) | 2009-09-03 | 2009-09-24 | Supporting pad |
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| Publication Number | Publication Date |
|---|---|
| CN102574267A true CN102574267A (en) | 2012-07-11 |
| CN102574267B CN102574267B (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980161122.6A Active CN102574267B (en) | 2009-09-03 | 2009-09-24 | Supporting pad |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5587576B2 (en) |
| KR (1) | KR101595149B1 (en) |
| CN (1) | CN102574267B (en) |
| TW (1) | TWI490085B (en) |
| WO (1) | WO2011027412A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104889883A (en) * | 2014-03-04 | 2015-09-09 | 大元化成株式会社 | Holding pad having enhanced durability |
| CN105269451A (en) * | 2014-07-02 | 2016-01-27 | 大元化成株式会社 | Maintaining pad having high-precision flatness |
| CN111051002A (en) * | 2017-10-10 | 2020-04-21 | 富士纺控股株式会社 | Holding pad and method for manufacturing the same |
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| JP2011235385A (en) * | 2010-05-10 | 2011-11-24 | Teijin Cordley Ltd | Suction pad |
| JP6231185B2 (en) * | 2013-03-19 | 2017-11-15 | エルジー・ケム・リミテッド | Method for producing polyurethane support pad |
| JP6311186B2 (en) * | 2014-04-04 | 2018-04-18 | 富士紡ホールディングス株式会社 | Polishing pad and manufacturing method thereof |
| JP7323401B2 (en) * | 2019-09-25 | 2023-08-08 | 富士紡ホールディングス株式会社 | Polishing pad, method for producing same, and method for producing abrasive product |
| JP7474087B2 (en) | 2020-03-19 | 2024-04-24 | 富士紡ホールディングス株式会社 | Holding pad, manufacturing method thereof, and manufacturing method of polished product |
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| JPS6458475A (en) * | 1987-08-25 | 1989-03-06 | Rodeele Nitta Kk | Grinding pad |
| JP3149340B2 (en) * | 1995-08-22 | 2001-03-26 | ロデール・ニッタ株式会社 | Polishing pad |
| JP4373152B2 (en) * | 2003-07-17 | 2009-11-25 | 東レコーテックス株式会社 | Polishing sheet |
| JP2005224888A (en) * | 2004-02-12 | 2005-08-25 | Nitta Haas Inc | Holding material of polishing workpiece |
| JP4566660B2 (en) * | 2004-08-30 | 2010-10-20 | 富士紡ホールディングス株式会社 | Polishing cloth for finish polishing and method for manufacturing polishing cloth |
| JP4455230B2 (en) * | 2004-08-30 | 2010-04-21 | 富士紡ホールディングス株式会社 | Holding pad and method of manufacturing the holding pad |
| US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
| JP5004429B2 (en) * | 2005-03-17 | 2012-08-22 | 富士紡ホールディングス株式会社 | Retainer |
| JP4034320B2 (en) * | 2005-05-24 | 2008-01-16 | 富士紡ホールディングス株式会社 | Holding pad |
| JP4562598B2 (en) * | 2005-07-04 | 2010-10-13 | 富士紡ホールディングス株式会社 | Polishing cloth |
| US20070141312A1 (en) * | 2005-12-21 | 2007-06-21 | James David B | Multilayered polishing pads having improved defectivity and methods of manufacture |
| TWI350565B (en) * | 2007-04-30 | 2011-10-11 | San Fang Chemical Industry Co | Composite sheet for mounting a workpiece and the method for making the same |
| JP5501561B2 (en) * | 2007-11-12 | 2014-05-21 | 富士紡ホールディングス株式会社 | Holding pad |
-
2009
- 2009-09-03 JP JP2009204004A patent/JP5587576B2/en active Active
- 2009-09-23 TW TW098132165A patent/TWI490085B/en active
- 2009-09-24 KR KR1020127004057A patent/KR101595149B1/en active IP Right Grant
- 2009-09-24 CN CN200980161122.6A patent/CN102574267B/en active Active
- 2009-09-24 WO PCT/JP2009/004792 patent/WO2011027412A1/en active Application Filing
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104889883A (en) * | 2014-03-04 | 2015-09-09 | 大元化成株式会社 | Holding pad having enhanced durability |
| CN104889883B (en) * | 2014-03-04 | 2017-06-16 | 大元化成株式会社 | Improve the holding pad of durability |
| CN105269451A (en) * | 2014-07-02 | 2016-01-27 | 大元化成株式会社 | Maintaining pad having high-precision flatness |
| CN111051002A (en) * | 2017-10-10 | 2020-04-21 | 富士纺控股株式会社 | Holding pad and method for manufacturing the same |
| CN111051002B (en) * | 2017-10-10 | 2021-10-26 | 富士纺控股株式会社 | Holding pad and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011051075A (en) | 2011-03-17 |
| TWI490085B (en) | 2015-07-01 |
| WO2011027412A1 (en) | 2011-03-10 |
| TW201109119A (en) | 2011-03-16 |
| KR20120073200A (en) | 2012-07-04 |
| KR101595149B1 (en) | 2016-02-17 |
| CN102574267B (en) | 2015-03-25 |
| JP5587576B2 (en) | 2014-09-10 |
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