CN105269451A - Maintaining pad having high-precision flatness - Google Patents
Maintaining pad having high-precision flatness Download PDFInfo
- Publication number
- CN105269451A CN105269451A CN201410538867.2A CN201410538867A CN105269451A CN 105269451 A CN105269451 A CN 105269451A CN 201410538867 A CN201410538867 A CN 201410538867A CN 105269451 A CN105269451 A CN 105269451A
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- China
- Prior art keywords
- foaming
- upper support
- pad
- polyurethane foam
- support layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to a maintaining pad for supporting and fixing a polished product on a platform when the flat-plate polished product such as a glass substrate and a wafer is polished. The maintaining pad is characterized in that an upper supporting layer (3) in which small expanding foams (4) with small diameters are distributed is formed by crossing 50% area of a polyurethane pad, and a lower buffer layer (5) located at the area within the range from 60% to 90% of the thickness of the polyurethane pad has huge expanding foams (6) of which the diameters are relatively dozens of times larger than the diameters of the small expanding foams (4) of the upper supporting layer (3), thus the integral compressibility and compress recovery ratio can be improved, therefore, high-precision flatness is achieved.
Description
Technical field
The present invention relates to and when carrying out polishing to the plate polished product of such as glass substrate, wafer etc., polished product to be supported and to be fixed to the supporting pad on platform.
Background technology
Because as the high accuracy for the product needed thickness of the glass substrate, semiconductor wafer etc. of LCD, so usually use polishing pad or polishing cloth to carry out precise polished to its surface.As mentioned above, when carrying out surface finish to polished product, use the supporting pad be bearing in by polished product on the platform of burnishing device.This supporting pad requires to have high-precision flatness to carry out high-precision surface polishing to polished product.
As disclosed in patent document 1 below, traditional supporting pad is usually in a thickness direction across integrally forming foaming.In this case, in order to improve resiliency increase the size of foaming time, the large young pathbreaker of foaming is expanded near surface, thus result in intensity reduce.When resiliency is low, the change of the bearing stress of polished thing will become greatly, thus make the polished amount for polished surface uneven, consequently leads to polished product polished after in uneven thickness, that is, cause the problem that the flatness of product is bad.
On the contrary, when resiliency height, although the problem that the polished amount on the surface of polished product is partly uneven can be solved because the change of the bearing stress of polished thing is little, but because intensity and wearability are departed from by worsening with result in supporting pad own partial, therefore finally result in the flatness on surface by the problem worsened.
Prior art document
Patent document
Patent document 1:KR10-1277296B1
Summary of the invention
For this reason, the present invention proposes in order to the problem solved existing for above-mentioned traditional supporting pad, its object is to provide the distribution by improving foamed shape and foaming layer and the supporting pad with high-precision flatness.
The present invention for realizing above-mentioned purpose relates to and has by the supporting pad of wet type freezing method to the shaping polyurethane foam pad of polyurethane composition, it is characterized in that, described polyurethane foam pad comprises upper support layer and lower buffer layer, wherein said upper support layer is distributed with small foaming and supports polished thing, the bottom and being distributed with that described lower support layer is positioned at described upper support layer has than the large several times of the diameter of small foaming to the huge foaming of the diameter of hundreds of times, described upper support layer be arranged on from the superficial layer of polyurethane foam pad to integral thickness less than 50% region, described lower buffer layer is configured to the region of 60 to 90% of integral thickness across described polyurethane foam pad in the bottom of described upper support layer.
Supporting pad of the present invention makes the average diameter of the huge foaming of described lower buffer layer be 10 to 100 for the ratio of the average diameter of the small foaming of described upper support layer by surperficial epithelium setting rate being adjusted to relatively faster than the hardening of resin speed of bottom when wet type is solidified.
In addition, in supporting pad of the present invention, polyurethane resin constituent is polymerized the arrangement easily to regulate inner hard section and soft section by prepolymer polymerization method.
According to the present invention as constituted above, the upper support layer being distributed with the foaming of minute diameter is formed the region of 50% of thickness across urethane pad, therefore relatively increase the intensity of upper support layer and wearability thus outstanding flatness can be maintained, meanwhile, there is in lower buffer layer the huge foaming of the diameter relatively large number ten times than the small foaming of upper support layer, thus improve reduced overall and the compressive recovery rate of supporting pad.
In addition, in the present invention, because surperficial epithelium setting rate compares, bottom epithelium setting rate is fast, so relatively rapidly form the displacement of the organic solvent (DMF) in water and resin combination in superficial layer, thus make small foaming be effectively formed in upper support layer, on the contrary, the organic solvent of the residual resin combination of not replacing with water in superficial layer is sharply replaced with water once being laid particular stress on to the lower side padded, thus form the huge huge foaming of diameter, thereby is achieved outstanding cushion.
In addition, the present invention uses the resin be polymerized by prepolymer method, therefore, it is possible to quick adjustment surface epithelium setting rate, thus can easily the upper support layer of small foaming be realized in the region within 50% of thickness.
Accompanying drawing explanation
Fig. 1 is the resin that is polymerized by prepolymer method according to the use of the first embodiment of the present invention by the section electron micrograph of the shaping supporting pad of wet type freezing method;
Fig. 2 is the cross sectional photograph of the supporting pad according to the first comparative example;
Fig. 3 is the cross sectional photograph of supporting pad according to a second embodiment of the present invention; And
Fig. 4 is the cross sectional photograph of the supporting pad according to the second comparative example.
Detailed description of the invention
Below, with reference to the accompanying drawings the preferred embodiment of supporting pad according to the present invention is described in detail.
Fig. 1 is the section electron micrograph according to supporting pad of the present invention.As shown in Figure 1, supporting pad of the present invention comprises polyurethane foam pad 1.Polyurethane foam pad 1 has the upper support layer 3 polished thing being bearing in top and the lower buffer layer 5 being formed in described upper support layer bottom.
Be distributed with the small foaming 4 of minute diameter in described upper support layer 3 equably, the upper support layer 3 being formed with this small foaming is formed in the region from the surface of polyurethane foam pad 1 to less than 50% of integral thickness.Described lower buffer layer 5 has huge foaming 6, and huge foaming 6 has the average diameter of 10 to 100 times of the average diameter of small foaming 4.In addition, this lower buffer layer 5 is formed in the region from the lower end of described upper support layer 3 to 60 to 90% of the integral thickness of foam pad 1.
The resin combination of polyurethane foam pad 1 comprise be mixed with the high ethoxylated polyhydric alcohol of hydrophily ester-ether polyol to accelerate surface solidification speed.Compared to ester class, ethers has hydrophily therefore, it is possible to accelerate setting rate.
The resin combination of described polyurethane foam pad 1 comprises by prepolymer polymerization method polymer resin easily to regulate the arrangement of inner hard section and soft section.Therefore, by soft section of urethane bonds inside and hard section are adjusted to interim location, in the initial stage surface solidification by carrying out hard section during wet type freezing method cured resin rapidly, thus make small foaming 4 be formed in upper support layer 3, and residual soft section that makes not solidify in the early stage solidifies and extends to bottom thus form huge foaming 6, forms lower buffer layer 5 thus.
Because the resin-phase in the top layer of polyurethane foam pad 1 is to solidifying rapidly, the displacement of water and organic solvent (such as, DMF) therefore promptly occurs, and its result, small foaming 4 is promptly formed in top layer.On the contrary, the organic solvent of not replacing with water is in time by the bottom of laying particular stress on to the resin do not contacted with water, therefore replace rapidly carrying out solidifying Shi Yushui from top layer towards bottom, thus the huge foaming making diameter relatively large is formed in the bottom of polyurethane foam pad 1, forms lower buffer layer 5 thus.
In addition, foamed shape can be regulated when the water of trace being added to organic solvent.
embodiment 1
According to methylenediphenyl diisocyanates (MethyleneDiphenylDiisocyanate; MDI) relative to the compressive recovery rate of the polyurethane foam pad of the content ratio of polyalcohol
Use increase MDI in resin combination relative to the resin combination of the content ratio of polyalcohol polyurethane foam pad shaping after, measure its compression ratio and compressive recovery rate respectively.
Its result is as shown in table 1, and along with MDI increases relative to the content of polyalcohol, compression ratio significantly reduces but compressive recovery rate then increases.
Table 1:
| MDI/ polyalcohol (%) | 20 | 25 | 30 |
| Compression ratio | 42 | 37 | 34 |
| Compressive recovery rate | 87 | 88 | 89 |
embodiment 2
Use the resin of the prepolymer method polymerization of the content of the hard section by increasing polymer resin and make the surface solidification speed of resin and make polyurethane foam pad 1 shaping.Its result, within small foaming is formed on 50% of the integral thickness of polyurethane foam pad 1, and huge foaming is formed on (Fig. 1) in the region of 60 to 90% of integral thickness.
On the contrary, use and show foamed shape as shown in Figure 2 and arrangement by the polyurethane foam pad of resin forming of a step foaming polymerization.
embodiment 3
Water within by 2% adds in resin combination, show porosity as shown in Figure 3.In contrast to this, the second comparative example of general hydrophilic interface activating agent is used then to show foamed shape as shown in Figure 4.
The explanation of symbol
1: supporting pad
3: upper support layer
4: small foaming
5: lower buffer layer
6: huge foaming
Claims (3)
1. a supporting pad, described supporting pad has by the wet type freezing method polyurethane foam pad shaping to polyurethane composition, and it is characterized in that, described polyurethane foam pad comprises:
Upper support layer, is distributed with small foaming, and supports polished thing; And
Lower buffer layer, is positioned at the bottom of described upper support layer, and is distributed with the large several times of diameter that have than described small foaming to the huge foaming of the diameter of hundreds of times,
Wherein, described upper support layer be arranged on from the superficial layer of described polyurethane foam pad to integral thickness less than 50% region, described lower buffer layer is configured to the region of 60 to 90% of integral thickness across described polyurethane foam pad in the bottom of described upper support layer.
2. supporting pad as claimed in claim 1, is characterized in that,
The average diameter of the huge foaming of described lower buffer layer is in the scope of 10 to 100 for the ratio of the average diameter of the small foaming of described upper support layer, and the average diameter of described huge foaming is obtain by surperficial epithelium setting rate being adjusted to relatively faster than the hardening of resin speed of bottom when wet type is solidified for the ratio of the average diameter of described small foaming.
3. supporting pad as claimed in claim 1, is characterized in that,
The resin combination of described polyurethane foam pad comprises the resin that is polymerized by prepolymer polymerization method easily to regulate the arrangement of inner hard section and soft section.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0082379 | 2014-07-02 | ||
| KR20140082379 | 2014-07-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105269451A true CN105269451A (en) | 2016-01-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410538867.2A Pending CN105269451A (en) | 2014-07-02 | 2014-10-13 | Maintaining pad having high-precision flatness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105269451A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005224888A (en) * | 2004-02-12 | 2005-08-25 | Nitta Haas Inc | Holding material of polishing workpiece |
| CN101402187A (en) * | 2007-10-03 | 2009-04-08 | 富士纺控股公司 | Polishing pad |
| CN102481679A (en) * | 2009-09-03 | 2012-05-30 | 富士纺控股公司 | Supporting pad |
| CN102574267A (en) * | 2009-09-03 | 2012-07-11 | 富士纺控股公司 | Supporting pad |
| US20130018118A1 (en) * | 2011-07-15 | 2013-01-17 | Lg Chem, Ltd. | Poly-urethane resin and poly-urethane absorbing pad using the same |
| CN103890096A (en) * | 2011-08-17 | 2014-06-25 | 株式会社Lg化学 | Polyurethane resin composition for support pad and polyurethane support pad using same |
-
2014
- 2014-10-13 CN CN201410538867.2A patent/CN105269451A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005224888A (en) * | 2004-02-12 | 2005-08-25 | Nitta Haas Inc | Holding material of polishing workpiece |
| CN101402187A (en) * | 2007-10-03 | 2009-04-08 | 富士纺控股公司 | Polishing pad |
| CN102481679A (en) * | 2009-09-03 | 2012-05-30 | 富士纺控股公司 | Supporting pad |
| CN102574267A (en) * | 2009-09-03 | 2012-07-11 | 富士纺控股公司 | Supporting pad |
| US20130018118A1 (en) * | 2011-07-15 | 2013-01-17 | Lg Chem, Ltd. | Poly-urethane resin and poly-urethane absorbing pad using the same |
| CN103890096A (en) * | 2011-08-17 | 2014-06-25 | 株式会社Lg化学 | Polyurethane resin composition for support pad and polyurethane support pad using same |
Non-Patent Citations (1)
| Title |
|---|
| 区英鸿: "《塑料手册》", 28 February 1991, 兵器工业出版社 * |
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Application publication date: 20160127 |