CN102569219A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN102569219A CN102569219A CN2010105915475A CN201010591547A CN102569219A CN 102569219 A CN102569219 A CN 102569219A CN 2010105915475 A CN2010105915475 A CN 2010105915475A CN 201010591547 A CN201010591547 A CN 201010591547A CN 102569219 A CN102569219 A CN 102569219A
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- CN
- China
- Prior art keywords
- radiator
- substrate
- fins
- pedestal
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a radiator which comprises a base, a first radiator body and a second radiator body, wherein the first radiator body comprises a first base plate and a plurality of fins extending upwards from the first base plate, the bottom of the first base plate is connected with the base, the second radiator body comprises a second base plate which is connected with the top of the fins of the first radiator body and a plurality of fins extending from the second base plate. According to the radiator, the sum of the height of the fins of the first radiator body and the height of the fins of the second radiator body is more than 90mm, so that the radiator is beneficial to the radiation of high-power CPU (Central Processing Unit).
Description
Technical field
The present invention relates to a kind of radiator.
Background technology
The aluminium extruded radiator is individual layer at present, and its extrudable fin maximum height is 90mm, has limited the cooling surface area of such radiator.And the power of CPU is improving constantly in recent years, is increased to 130W from 95W at present.Even use the fan heat radiation, existing radiator still possibly can't satisfy the radiating requirements of high power CPU, causes system's frequency reducing or system fan to continue high speed rotating on the contrary, produces noise.
Summary of the invention
In view of above content, be necessary the radiator that provides a kind of radiating efficiency high.
A kind of radiator; It comprises a pedestal, one first radiator and one second radiator; Said first radiator comprises first substrate and some fins that is extended upward out by said first substrate; The bottom of said first substrate links to each other with said pedestal, and said second radiator comprises that one is connected in second substrate at fin top of said first radiator and some by the extended fin of said second substrate.
Compare prior art, the height of the fin of first radiator of radiator of the present invention adds that the height of the fin of second radiator can help high-power CPU heat radiation greater than 90mm.
Description of drawings
Combine embodiment that the present invention is further described with reference to accompanying drawing below.
Fig. 1 is the stereogram of radiator preferred embodiments of the present invention.
Fig. 2 is the front view of Fig. 1.
The main element symbol description
Embodiment
See also Fig. 1 and Fig. 2, radiator preferred embodiments of the present invention is to adopt the molding mode of aluminium extruded one-body molded, and this radiator comprises a pedestal 10, one first radiator 20 and one second radiator 30.
This first radiator 20 comprises one first substrate 21 and some fins 22 that is extended upward out by first substrate 21.First substrate 21 is roughly V-shaped, and its bottom joins with pedestal 10.Extend to form some fins 24 between the both sides of first substrate 21 and the pedestal 10.
This second radiator 30 comprises second substrate 32 on fin 22 tops that are connected in first radiator 20 and the some fins 34 that extended upward out by second substrate 32.In this enforcement, second substrate 32 is roughly V-shaped.
The height of the fin 22 of first radiator 20 of radiator of the present invention adds that the height of the fin 34 of second radiator 30 can help high-power CPU heat radiation greater than 90mm.
Claims (5)
1. radiator; It comprises a pedestal, one first radiator and one second radiator; Said first radiator comprises first substrate and some fins that is extended upward out by said first substrate; The bottom of said first substrate links to each other with said pedestal, and said second radiator comprises that one is connected in second substrate at fin top of said first radiator and some by the extended fin of said second substrate.
2. radiator as claimed in claim 1 is characterized in that: first substrate is roughly V-shaped.
3. radiator as claimed in claim 2 is characterized in that: extend to form some fins between the both sides of first substrate and the pedestal.
4. radiator as claimed in claim 1 is characterized in that: second substrate is roughly V-shaped.
5. radiator as claimed in claim 1 is characterized in that: said pedestal, first radiator and second radiator are to adopt the molding mode of aluminium extruded one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105915475A CN102569219A (en) | 2010-12-16 | 2010-12-16 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105915475A CN102569219A (en) | 2010-12-16 | 2010-12-16 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102569219A true CN102569219A (en) | 2012-07-11 |
Family
ID=46414275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105915475A Pending CN102569219A (en) | 2010-12-16 | 2010-12-16 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102569219A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6009938A (en) * | 1997-12-11 | 2000-01-04 | Eastman Kodak Company | Extruded, tiered high fin density heat sinks and method of manufacture |
| CN2590175Y (en) * | 2002-12-31 | 2003-12-03 | 旭扬热导股份有限公司 | Laminated heat radiating device |
| CN101060763A (en) * | 2006-04-19 | 2007-10-24 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
-
2010
- 2010-12-16 CN CN2010105915475A patent/CN102569219A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6009938A (en) * | 1997-12-11 | 2000-01-04 | Eastman Kodak Company | Extruded, tiered high fin density heat sinks and method of manufacture |
| CN2590175Y (en) * | 2002-12-31 | 2003-12-03 | 旭扬热导股份有限公司 | Laminated heat radiating device |
| CN101060763A (en) * | 2006-04-19 | 2007-10-24 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |