TW201224386A - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
TW201224386A
TW201224386A TW099144017A TW99144017A TW201224386A TW 201224386 A TW201224386 A TW 201224386A TW 099144017 A TW099144017 A TW 099144017A TW 99144017 A TW99144017 A TW 99144017A TW 201224386 A TW201224386 A TW 201224386A
Authority
TW
Taiwan
Prior art keywords
heat sink
substrate
heat dissipation
fins
base
Prior art date
Application number
TW099144017A
Other languages
Chinese (zh)
Inventor
Meng-Hsien Lin
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW099144017A priority Critical patent/TW201224386A/en
Priority to US12/977,087 priority patent/US20120152509A1/en
Publication of TW201224386A publication Critical patent/TW201224386A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink includes a seat, a first heat dissipation body and a second heat dissipation body. The first heat dissipation body includes a first base plate attached to the seat, and a plurality of cooling fins extending from the first base plate. The second heat dissipation body includes a second base plate attached to top portions of cooling fins of the first heat dissipation body and a plurality of cooling fins extending from the second base plate.

Description

201224386 • 六、發明說明： 【發明所屬之技術領威】 [0001] 本發明涉及一種散熱器。 [先前技術] [0002] 目前鋁擠散熱器均為單層，其可擠出的鰭片最高高度為 90mm，限制了該類散熱器的散熱表面積。而近年來CPU的 功率在不斷提高，目前已經從95W增加到130W。即使使用 風扇散熱，習知散熱器仍可能無法滿足高功率CPU的散熱 需求，反而導致系統降頻或系統風扇持續高速轉動，產 0 生噪音。 【發明内容】 [0003] 鑒於以上内容’有必要提供一種散熱效率高的散熱器。 [00〇4] —種散熱器，其包括一基座、一第一散熱體及一第二散 熱體’該第一散熱體包括第一基板以及複數由該第一基 板向上延伸出的鰭片，該第一基板的底部與該基座相連 ，該第二散熱體包括一連接於該第一散熱體的鰭片頂部 Q 的第二基板及複數由該第二基板延伸出的鰭片。 [0005]相較習知技術’本發明散熱器的第一散熱體的鰭片的高 度加上第二散熱體的鰭片的高度可大於9〇m]n，有利於大 功率CPU散熱。 【實施方式】 [0006]請參閱圖1及圖2，本發明散熱器較佳實施方式是採用鋁 擠的成型方式一體成型，該散熱器包括一基座1〇、一第 一散熱體20及一第二散熱體3〇。 0992076171-0 099144017 表單編號A0101 第3頁/共8頁 201224386 [㈤07] 該第一散熱體20包括一第一基板21以及複數由第一基板 21向上延伸出的鰭片22。第一基板21大致呈V形，其底部 與基座10相接。第一基板21的兩侧與基座10之間延伸形 成複數鰭片24。 [0008] 該第二散熱體30包括連接於第一散熱體20的鰭片22頂端 的第二基板32及由第二基板32向上延伸出的複數鰭片34 。本實施中，第二基板32大致呈V形。 [0009] 本發明散熱器的第一散熱體20的鰭片22的高度加上第二 散熱體30的鰭片34的高度可大於9〇ιβπι，有利於大功率 CPU散熱。 [0010] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之如申請專利範圍内。 【圖式簡單說明】 [0011] 圖1為本發明散熱器較佳實方式的立體圖。 [0012] 圖2為圖1的前視圖。 【主要元件符號說明】 [0013] 基座：10 [0014] 第一散熱體：20 [0015] 第一基板：21 [0016] 鰭片：22、24、34 [0017] 第二散熱體：30 099144017 表單編號A0101 0992076171-0 32 201224386 [0018] 第二基板201224386 • VI. Description of the Invention: [Technical Leadership of the Invention] [0001] The present invention relates to a heat sink. [Prior Art] [0002] At present, aluminum extruded heat sinks are all single layers, and the extrudable fins have a maximum height of 90 mm, which limits the heat dissipation surface area of such heat sinks. In recent years, the power of the CPU has been increasing, and has now increased from 95W to 130W. Even with fan cooling, conventional heat sinks may not be able to meet the heat dissipation requirements of high-power CPUs, which in turn may cause system down-conversion or system fans to continue to rotate at high speeds, producing zero noise. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a heat sink with high heat dissipation efficiency. [0014] A heat sink includes a base, a first heat sink, and a second heat sink. The first heat sink includes a first substrate and a plurality of fins extending upward from the first substrate. The bottom of the first substrate is connected to the base. The second heat sink includes a second substrate connected to the top portion Q of the fin of the first heat sink and a plurality of fins extending from the second substrate. [0005] Compared with the prior art, the height of the fin of the first heat sink of the heat sink of the present invention plus the height of the fin of the second heat sink may be greater than 9 〇 m] n, which is advantageous for heat dissipation of the high power CPU. [0006] Referring to FIG. 1 and FIG. 2, a preferred embodiment of the heat sink of the present invention is integrally formed by an aluminum extrusion molding method, and the heat sink includes a base 1 and a first heat sink 20 and A second heat sink 3〇. 0992076171-0 099144017 Form No. A0101 Page 3 of 8 201224386 [(5) 07] The first heat sink 20 includes a first substrate 21 and a plurality of fins 22 extending upward from the first substrate 21. The first substrate 21 has a substantially V shape, and its bottom portion is in contact with the susceptor 10. A plurality of fins 24 are formed extending between both sides of the first substrate 21 and the susceptor 10. The second heat sink 30 includes a second substrate 32 connected to the top end of the fin 22 of the first heat sink 20 and a plurality of fins 34 extending upward from the second substrate 32. In the present embodiment, the second substrate 32 is substantially V-shaped. The height of the fins 22 of the first heat sink 20 of the heat sink of the present invention plus the height of the fins 34 of the second heat sink 30 may be greater than 9 〇ββπ, which is advantageous for heat dissipation of the high-power CPU. [0010] In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0011] FIG. 1 is a perspective view of a preferred embodiment of a heat sink of the present invention. 2 is a front view of FIG. 1. [Main Component Symbol Description] [0013] Base: 10 [0014] First heat sink: 20 [0015] First substrate: 21 [0016] Fins: 22, 24, 34 [0017] Second heat sink: 30 099144017 Form No. A0101 0992076171-0 32 201224386 [0018] Second substrate

099144017 表單編號A0101 第5頁/共8頁 0992076171-0099144017 Form No. A0101 Page 5 of 8 0992076171-0

Claims (1)

201224386 七、申請專利範圍： 1 . 一種散熱器，其包括一基座、一第一散熱體及一第二散熱 體，該第一散熱體包括第一基板以及複數由該第一基板向 上延伸出的鰭片，該第一基板的底部與該基座相連，該第 二散熱體包括一連接於該第一散熱體的鰭片頂部的第二基 板及複數由該第二基板延伸出的鰭片。 2 .如申請專利範圍第1項所述之散熱器，其中該第一基板大 致呈V形。 3 .如申請專利範圍第2項所述之散熱器，其中該第一基板的 兩側與基座之間延伸形成複數鰭片。 4 .如申請專利範圍第1項所述之散熱器，其中該第二基板大 致呈V形。 5.如申請專利範圍第1項所述之散熱器，其中該基座、第一 散熱體及第二散熱體是採用鋁擠的成型方式一體成型。 099144017 表單編號A0101 第6頁/共8頁 0992076171-0201224386 VII. Patent application scope: 1. A heat sink comprising a base, a first heat sink and a second heat sink, the first heat sink comprising a first substrate and a plurality of upwardly extending from the first substrate a fin, the bottom of the first substrate is connected to the base, the second heat sink includes a second substrate connected to the top of the fin of the first heat sink, and a plurality of fins extending from the second substrate . 2. The heat sink of claim 1, wherein the first substrate is substantially V-shaped. 3. The heat sink according to claim 2, wherein a plurality of fins are formed between the two sides of the first substrate and the base. 4. The heat sink of claim 1, wherein the second substrate is substantially V-shaped. 5. The heat sink of claim 1, wherein the base, the first heat sink and the second heat sink are integrally formed by aluminum extrusion molding. 099144017 Form No. A0101 Page 6 of 8 0992076171-0
TW099144017A 2010-12-15 2010-12-15 Heat sink TW201224386A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW099144017A TW201224386A (en) 2010-12-15 2010-12-15 Heat sink
US12/977,087 US20120152509A1 (en) 2010-12-15 2010-12-23 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099144017A TW201224386A (en) 2010-12-15 2010-12-15 Heat sink

Publications (1)

Publication Number Publication Date
TW201224386A true TW201224386A (en) 2012-06-16

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TW099144017A TW201224386A (en) 2010-12-15 2010-12-15 Heat sink

Country Status (2)

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US (1) US20120152509A1 (en)
TW (1) TW201224386A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9898056B2 (en) 2013-06-19 2018-02-20 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
TWI626529B (en) * 2013-06-19 2018-06-11 桑迪士克科技有限責任公司 Electronic system with heat extraction and method of manufacture thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108845652A (en) * 2018-07-03 2018-11-20 合肥科塑信息科技有限公司 A kind of computer hardware overtemperature protection system
USD892753S1 (en) * 2018-10-31 2020-08-11 Bitmain Technologies Inc. Heat sink

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
US6189601B1 (en) * 1999-05-05 2001-02-20 Intel Corporation Heat sink with a heat pipe for spreading of heat
US7198096B2 (en) * 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
JP2006319142A (en) * 2005-05-12 2006-11-24 Sanyo Denki Co Ltd Heat generating body cooling apparatus and heat sink
CN101060763B (en) * 2006-04-19 2011-08-24 鸿富锦精密工业（深圳）有限公司 Heat radiator
US7365975B2 (en) * 2006-05-02 2008-04-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan holder for attachment of a fan

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9898056B2 (en) 2013-06-19 2018-02-20 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
TWI626529B (en) * 2013-06-19 2018-06-11 桑迪士克科技有限責任公司 Electronic system with heat extraction and method of manufacture thereof

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Publication number Publication date
US20120152509A1 (en) 2012-06-21

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