CN102549180A - 电子材料用Cu－Ni－Si－Co系铜合金和其制造方法 - Google Patents

电子材料用Cu－Ni－Si－Co系铜合金和其制造方法 Download PDF

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Publication number
CN102549180A
CN102549180A CN2009801616889A CN200980161688A CN102549180A CN 102549180 A CN102549180 A CN 102549180A CN 2009801616889 A CN2009801616889 A CN 2009801616889A CN 200980161688 A CN200980161688 A CN 200980161688A CN 102549180 A CN102549180 A CN 102549180A
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CN
China
Prior art keywords
copper alloy
quality
crystal grain
grain diameter
alloy
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Pending
Application number
CN2009801616889A
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English (en)
Chinese (zh)
Inventor
桑垣宽
江良尚彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN102549180A publication Critical patent/CN102549180A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
CN2009801616889A 2009-09-28 2009-09-28 电子材料用Cu－Ni－Si－Co系铜合金和其制造方法 Pending CN102549180A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/066794 WO2011036804A1 (ja) 2009-09-28 2009-09-28 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法

Publications (1)

Publication Number Publication Date
CN102549180A true CN102549180A (zh) 2012-07-04

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Family Applications (1)

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CN2009801616889A Pending CN102549180A (zh) 2009-09-28 2009-09-28 电子材料用Cu－Ni－Si－Co系铜合金和其制造方法

Country Status (5)

Country Link
EP (1) EP2484787B1 (ja)
JP (1) JP5506806B2 (ja)
KR (1) KR20120054099A (ja)
CN (1) CN102549180A (ja)
WO (1) WO2011036804A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106244849A (zh) * 2016-10-13 2016-12-21 龙岩学院 一种超声波强化高性能铜合金的制备方法
CN108642419A (zh) * 2018-05-31 2018-10-12 太原晋西春雷铜业有限公司 一种折弯性优良的铜镍硅合金带材及其制备方法
CN110195166A (zh) * 2019-04-17 2019-09-03 宁波兴业盛泰集团有限公司 一种引线框架用抗折弯CuNiCoSi系合金及其制造方法
CN112410646A (zh) * 2020-10-16 2021-02-26 扬州千裕电气有限公司 一种电子复合材料

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US8821477B2 (en) 2007-08-06 2014-09-02 Boston Scientific Scimed, Inc. Alternative micromachined structures
US8795254B2 (en) 2008-12-10 2014-08-05 Boston Scientific Scimed, Inc. Medical devices with a slotted tubular member having improved stress distribution
US8551021B2 (en) 2010-03-31 2013-10-08 Boston Scientific Scimed, Inc. Guidewire with an improved flexural rigidity profile
JP6246454B2 (ja) * 2011-11-02 2017-12-13 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP5770113B2 (ja) * 2012-01-13 2015-08-26 Jx日鉱日石金属株式会社 金属箔複合体、並びに成形体及びその製造方法
US9901706B2 (en) 2014-04-11 2018-02-27 Boston Scientific Scimed, Inc. Catheters and catheter shafts
JP6310004B2 (ja) * 2016-05-27 2018-04-11 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
JP7451964B2 (ja) 2019-01-16 2024-03-19 株式会社プロテリアル Ｃｕ合金板およびその製造方法
CN113234958A (zh) * 2021-04-25 2021-08-10 江苏青益金属科技股份有限公司 适用于石油输送管道恒温包套的合金线材及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01122264A (ja) 1987-11-05 1989-05-15 Nec Corp 画像出力装置
JP3408021B2 (ja) 1995-06-30 2003-05-19 古河電気工業株式会社 電子電気部品用銅合金およびその製造方法
US7182823B2 (en) 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
WO2006101172A1 (ja) 2005-03-24 2006-09-28 Nippon Mining & Metals Co., Ltd. 電子材料用銅合金
JP4068626B2 (ja) * 2005-03-31 2008-03-26 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP5156317B2 (ja) * 2006-09-27 2013-03-06 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造法
US9034123B2 (en) * 2007-02-13 2015-05-19 Dowa Metaltech Co., Ltd. Cu—Ni—Si-based copper alloy sheet material and method of manufacturing same
JP5170881B2 (ja) * 2007-03-26 2013-03-27 古河電気工業株式会社 電気・電子機器用銅合金材およびその製造方法
JP4981748B2 (ja) * 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
JP4596490B2 (ja) * 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106244849A (zh) * 2016-10-13 2016-12-21 龙岩学院 一种超声波强化高性能铜合金的制备方法
CN108642419A (zh) * 2018-05-31 2018-10-12 太原晋西春雷铜业有限公司 一种折弯性优良的铜镍硅合金带材及其制备方法
CN110195166A (zh) * 2019-04-17 2019-09-03 宁波兴业盛泰集团有限公司 一种引线框架用抗折弯CuNiCoSi系合金及其制造方法
CN112410646A (zh) * 2020-10-16 2021-02-26 扬州千裕电气有限公司 一种电子复合材料

Also Published As

Publication number Publication date
WO2011036804A1 (ja) 2011-03-31
EP2484787B1 (en) 2015-01-07
KR20120054099A (ko) 2012-05-29
JPWO2011036804A1 (ja) 2013-02-14
JP5506806B2 (ja) 2014-05-28
EP2484787A1 (en) 2012-08-08
EP2484787A4 (en) 2013-06-05

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Application publication date: 20120704