CN102548925B - 用于形成包括玻璃熔料的盖板以及形成包括该盖板的玻璃封装体的方法 - Google Patents

用于形成包括玻璃熔料的盖板以及形成包括该盖板的玻璃封装体的方法 Download PDF

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Publication number
CN102548925B
CN102548925B CN201080038109.4A CN201080038109A CN102548925B CN 102548925 B CN102548925 B CN 102548925B CN 201080038109 A CN201080038109 A CN 201080038109A CN 102548925 B CN102548925 B CN 102548925B
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CN
China
Prior art keywords
frit
substrate
bead
seal
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080038109.4A
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English (en)
Chinese (zh)
Other versions
CN102548925A (zh
Inventor
D·L·布格斯
E·J·赛威
B·P·斯郡思
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Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Priority to CN201410490570.3A priority Critical patent/CN104591526B/zh
Publication of CN102548925A publication Critical patent/CN102548925A/zh
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Publication of CN102548925B publication Critical patent/CN102548925B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/001—General methods for coating; Devices therefor
    • C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
    • C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24421—Silicon containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Surface Treatment Of Glass (AREA)
  • Joining Of Glass To Other Materials (AREA)
CN201080038109.4A 2009-07-17 2010-07-15 用于形成包括玻璃熔料的盖板以及形成包括该盖板的玻璃封装体的方法 Expired - Fee Related CN102548925B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410490570.3A CN104591526B (zh) 2009-07-17 2010-07-15 用于密封玻璃封装体的熔接盖板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22634209P 2009-07-17 2009-07-17
US61/226,342 2009-07-17
PCT/US2010/042058 WO2011008909A1 (en) 2009-07-17 2010-07-15 Methods for forming cover sheets comprising a glass frit and glass packages comprising the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201410490570.3A Division CN104591526B (zh) 2009-07-17 2010-07-15 用于密封玻璃封装体的熔接盖板

Publications (2)

Publication Number Publication Date
CN102548925A CN102548925A (zh) 2012-07-04
CN102548925B true CN102548925B (zh) 2014-12-31

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN201080038109.4A Expired - Fee Related CN102548925B (zh) 2009-07-17 2010-07-15 用于形成包括玻璃熔料的盖板以及形成包括该盖板的玻璃封装体的方法
CN201410490570.3A Expired - Fee Related CN104591526B (zh) 2009-07-17 2010-07-15 用于密封玻璃封装体的熔接盖板

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410490570.3A Expired - Fee Related CN104591526B (zh) 2009-07-17 2010-07-15 用于密封玻璃封装体的熔接盖板

Country Status (7)

Country Link
US (1) US8505337B2 (https=)
EP (1) EP2454213A1 (https=)
JP (1) JP5730870B2 (https=)
KR (1) KR101590058B1 (https=)
CN (2) CN102548925B (https=)
TW (1) TWI530465B (https=)
WO (1) WO2011008909A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8860305B2 (en) * 2009-07-09 2014-10-14 Corning Incorporated Methods for forming fritted cover sheets with masks and glass packages comprising the same
US20120214017A1 (en) * 2011-02-22 2012-08-23 Pourin Welding Engineering Co., Ltd. Weld Overlay Structure and a Method of Providing a Weld Overlay Structure
JP5947098B2 (ja) * 2011-05-13 2016-07-06 株式会社半導体エネルギー研究所 ガラス封止体の作製方法および発光装置の作製方法
JP5628123B2 (ja) * 2011-09-21 2014-11-19 株式会社日立製作所 ペースト塗布装置およびペースト塗布方法
US9362522B2 (en) * 2012-10-26 2016-06-07 Semiconductor Energy Laboratory Co., Ltd. Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting device
KR102160829B1 (ko) 2012-11-02 2020-09-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 밀봉체 및 밀봉체의 제작 방법
CN105047690B (zh) * 2015-08-27 2020-12-04 京东方科技集团股份有限公司 一种玻璃胶、光电封装器件及其封装方法、显示装置
KR102426268B1 (ko) * 2017-09-15 2022-07-27 엘지디스플레이 주식회사 표시장치와 그의 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080033619A (ko) * 2006-10-12 2008-04-17 삼성에스디아이 주식회사 플라즈마 디스플레이 패널

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JP2001307633A (ja) * 2000-04-20 2001-11-02 Mitsubishi Electric Corp フラットディスプレイパネル、フラットディスプレイ装置およびフラットディスプレイパネルの製造方法
KR100429771B1 (ko) * 2000-06-13 2004-05-03 권상직 보조열선을 이용한 평판표시소자의 저온 진공 인-라인프릿 실장방법
TW517356B (en) * 2001-10-09 2003-01-11 Delta Optoelectronics Inc Package structure of display device and its packaging method
KR100865284B1 (ko) * 2001-10-31 2008-10-27 엘지디스플레이 주식회사 액정패널의 실링구조
TW515062B (en) * 2001-12-28 2002-12-21 Delta Optoelectronics Inc Package structure with multiple glue layers
KR100819864B1 (ko) * 2001-12-28 2008-04-07 엘지.필립스 엘시디 주식회사 유기전기발광소자
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20050238803A1 (en) * 2003-11-12 2005-10-27 Tremel James D Method for adhering getter material to a surface for use in electronic devices
KR20060113710A (ko) 2003-11-12 2006-11-02 이 아이 듀폰 디 네모아 앤드 캄파니 전자 장치용 캡슐화 어셈블리
US20070172971A1 (en) * 2006-01-20 2007-07-26 Eastman Kodak Company Desiccant sealing arrangement for OLED devices
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
US7800303B2 (en) * 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
TW200836580A (en) * 2007-02-28 2008-09-01 Corning Inc Seal for light emitting display device and method
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Also Published As

Publication number Publication date
TW201103872A (en) 2011-02-01
CN104591526B (zh) 2017-07-28
CN102548925A (zh) 2012-07-04
CN104591526A (zh) 2015-05-06
US8505337B2 (en) 2013-08-13
KR101590058B1 (ko) 2016-01-29
WO2011008909A1 (en) 2011-01-20
TWI530465B (zh) 2016-04-21
JP2012533505A (ja) 2012-12-27
US20110014427A1 (en) 2011-01-20
KR20120089242A (ko) 2012-08-09
EP2454213A1 (en) 2012-05-23
JP5730870B2 (ja) 2015-06-10

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Granted publication date: 20141231

Termination date: 20190715

CF01 Termination of patent right due to non-payment of annual fee