CN102522346A - Direct welding processing method of electronic label - Google Patents
Direct welding processing method of electronic label Download PDFInfo
- Publication number
- CN102522346A CN102522346A CN201110436567XA CN201110436567A CN102522346A CN 102522346 A CN102522346 A CN 102522346A CN 201110436567X A CN201110436567X A CN 201110436567XA CN 201110436567 A CN201110436567 A CN 201110436567A CN 102522346 A CN102522346 A CN 102522346A
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- Prior art keywords
- metal
- chip
- glue
- antenna
- processing method
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention provides a direct welding processing method of an electronic label, which comprises a metal electrode 51, an integrated circuit chip bare chip 59, a protruding outer wiring terminal 57 arranged on the integrated circuit chip bare chip 59, a metal antenna 58 and dripping glue 62 for protection. The metal antenna 58 is placed above the protruding outer wiring terminal 57 arranged on the chip bare chip, and the metal electrode 51 with a bottom area divided into two poles 53 and 54 is adopted to exert a certain downward pressure on the metal antenna 58. When a certain instant voltage is loaded on the two poles 53 and 54 of the electrode, the two poles 53 and 54 of the electrode generate momentary discharge, the discharge causes a metal material 56 in an area contacted with the metal electrode to melt, soften in a short time and be in melting connection with the protruding outer wiring terminal 57 which is arranged on the chip and contacted with the bottom of the metal material, thereby achieving conducting connection between the metal antenna 58 and the integrated circuit chip bare chip 59. The dripping glue 62 for protection is adopted to protect all relevant portions combined with direct welding and the peripheries of the relevant portions, and solidification processing needs to be performed to the dripping glue.
Description
Technical field
The present invention relates to RFID (radio frequency identification) electronic tag, particularly relate to a kind of electronic tag and directly weld processing method, with the electronic tag that it processes, the package dimension of its chip is little, and very high warping resistance and shock proof ability and advantage are arranged.
Background technology
In the processing of the Chip Packaging of electronic tag, relatively more commonly used is adopts Flip Chip (fall encapsulation) technology, COB (Chip Packaging on the hardboard) technology, COF (Chip Packaging on soft board) and SOP (standard chips encapsulation) technology.Adopt reverse packaging process and COB and COF packaging technology, the chip of its encapsulation can not resist repeatedly high strength bending, can not the external force resistance bump.Adopt the encapsulation of SOP technology, it can stand external force collision, but it need adopt SMT (surface mount process) to carry out the installation of chip paster, and the processing cost of the electronic tag that it is total is higher relatively.
Involved in the present invention is that a kind of electronic tag directly welds processing method, this processing method and reverse packaging process, COB and COF technology, and the comparison information of SOP technology as shown in the table:
Involved in the present invention is that a kind of electronic tag directly welds processing method, and it can process the little chip of package dimension with the mode of low cost side, and when being used in it in the electronic tag, it can resist label bending and certain external force collision power.
Summary of the invention
The purpose of this invention is to provide a kind of electronic tag and directly weld processing method, its processing is prone to, and the characteristics that package dimension is little are used in it in the electronic tag, and it can stand the advantage of label bending and certain external force collision power.
Technical scheme of the present invention: electronic tag directly welds processing method, it is characterized in that comprising: metal electrode; The IC chip nude film; Protrusion external connection terminal on the IC chip nude film; Metal antenna; Be positioned over metal antenna directly over the protrusion external connection terminal on the chip nude film, and contact with it, adopt metal electrode to give the certain downward pressure of metal antenna; Metal electrode is separated into the two poles of the earth at its bottom section; And in the two poles of the earth, have the space, when when metal electrode loads a certain size transient voltage, the two poles of the earth of metal electrode produce and spark; Discharge causes the dielectric film or the oxide-film moment thawing on metal antenna surface; The metal material in the zone that metal antenna contacts with metal electrode melts deliquescing in a short period of time, and fuses mutually with protrusion external connection terminal on the IC chip nude film of its pig, thereby the conduction that realizes metal antenna and IC chip nude film is connected; And the glue that drips of protecting usefulness, a glue of protection usefulness is to combine all region of interest and to adopt a glue to protect on every side straight the weldering, dripping glue is to be cured processing.
Among the present invention, described IC chip nude film is the chip of RFID (radio frequency identification) chip or band RFID function.
Among the present invention, the protrusion external connection terminal on the described IC chip nude film is a metal material.
Among the present invention, described metal antenna is copper coil or aluminium matter coil or metal etch antenna or tinsel antenna.
Among the present invention, described metal antenna is that dielectric film or naked film are arranged.
Among the present invention, described metal electrode, it is separated into two utmost points in the zone with the metal antenna contact portion.
Among the present invention, described metal electrode, it adds man-hour in straight weldering, needs toward being no more than 20 grams for the certain pressure of metal antenna, pressure size downwards.
Among the present invention, described metal electrode, it adds man-hour in straight weldering, and the voltage of loading but is not higher than 800V greater than 100V it on.
Among the present invention, described metal electrode, when it discharged, be no more than 0.1 second its discharge time.
Among the present invention, a glue of described protection usefulness, it is epoxide-resin glue or UV glue, or the glue that can solidify of other type.
Among the present invention, described cured is baking-curing, ultraviolet curing or chemosetting voluntarily.
What the present invention had produces effect: according to the present invention, can encapsulate the undersized chip of excess of export, adopt the electronic tag of the chip of this encapsulation, can stand high-intensity bending and a certain size external force collision.
Description of drawings
Fig. 1 is a flow process chart of the present invention.
Fig. 2 is a straight weldering processing sketch map of the present invention.
Fig. 3 is the pad figure of the straight postwelding of the present invention.
Fig. 4 is the A-A face generalized section of the pad figure after the present invention processes.
Fig. 5 is that the present invention adopts the sketch map that drips after glue is protected.
Embodiment
This structure is to adopt the metal antenna of copper coil form, and adopts high frequency chip, carries out the encapsulation process of electronic tag to adopt the present invention.
Fig. 1 is a flow process chart of the present invention.
Earlier fix the position of IC chip nude film 59.
The welding position of metal antenna (copper coil) 58 just in time be positioned over protrusion external connection terminal 57 on the IC chip nude film 59 directly over.
Carry out the label function test, whether successful fuse with affirmation.
After fusing successfully, drip glue protection 63.
After dripping glue, adopt the mode of toasting let and drip an adhesive curing, live welding position and chip with thorough protection, to prevent that the welding position from getting loose or chip sustains damage.
After the curing, carry out the label function test, confirm that whole flow process completes successfully.
Fig. 2 is the sketch map of straight weldering processing.
As shown in Figure 2, metal antenna 58 is that employing copper core 56 diameters are the copper coil of 0.08mm, and dielectric film 55 is arranged outside it.
IC chip nude film 59 as shown in Figure 2 is the ICODE II chip nude films that adopt NPX company.
As shown in Figure 2, the pressure 71 that is carried on the metal electrode 51 is 12 grams.
The transient voltage that is carried on the metal electrode 51 as shown in Figure 2 is to be 0.022 second the 400V making alive time.
Fig. 3 is that the pad figure of the straight postwelding of embodiments of the invention 61 is welding positions of metal electrode wherein, and the width of the pad of its straight postwelding can be controlled at 1.2 times to 1.5 times line footpath width.
As shown in Figure 3, the pad of the straight postwelding of present embodiment, the tensile test value of its welding surpasses 13 grams, much larger than the tensile test requirement of 5 grams of COB and COF encapsulation.The outward appearance of its welding and function yield are greater than 99.5%.
Fig. 4 is the A-A face generalized section of the pad figure after the present invention processes; After the welding; The joint portion of the protrusion external connection terminal 57 on metal antenna (wire coil) and IC chip nude film; Produced metal and fused 62, thereby let the protrusion external connection terminal of copper coil and chip realize conducting.
Fig. 5 is the sketch map that has added after the glue protection.Dripping glue is need be the position of straight weldering; Comprise the coil of welding position, the protrusion external connection terminal on the IC chip nude film, and the binding site peripheral region of chip and its protrusion external connection terminal; It will all adopt and drip the glue protection; After dripping glue, adopt heated baking to solidify the glue that drips of protection usefulness.
After more than accomplishing, electronic tag of the present invention directly welds processing method, and the properties of product after the processing are stable, and can anti-high strength bend, and the external force collision of certain intensity.
In sum; More than be merely preferred embodiment of the present invention; Be not the scope that is used for limiting enforcement of the present invention, all equalizations of doing according to the described shape of claim scope of the present invention, structure, characteristic and spirit change and modify, and all should be included in the claim scope of the present invention.
Claims (10)
1. electronic tag directly welds processing method, it is characterized in that comprising:
Metal electrode;
The IC chip nude film;
Protrusion external connection terminal on the IC chip nude film;
Metal antenna; Be positioned over metal antenna directly over the protrusion external connection terminal on the chip nude film, and contact with it, adopt metal electrode to give the certain downward pressure of metal antenna; Metal electrode is separated into the two poles of the earth at its bottom section; And in the two poles of the earth, have the space, when the two poles of the earth at metal electrode loaded a certain size transient voltage, metal electrode produced and sparks; Discharge causes the dielectric film or the oxide-film moment thawing on metal antenna surface; The metal material in the zone that metal antenna contacts with metal electrode melts deliquescing in a short period of time, and fuses mutually with protrusion external connection terminal on the IC chip nude film of its pig, thereby the conduction that realizes metal antenna and IC chip is connected; And the glue that drips of protecting usefulness, a glue of protection usefulness is to combine all region of interest and to adopt a glue to protect on every side straight the weldering, dripping glue is to be cured processing.
2. electronic tag according to claim 1 directly welds processing method, it is characterized in that, described IC chip nude film is the chip of RFID (radio frequency identification) chip or band RFID function.
3. electronic tag according to claim 1 directly welds processing method, it is characterized in that, the protrusion external connection terminal on the described IC chip nude film is a metal material.
4. electronic tag according to claim 1 directly welds processing method, it is characterized in that, described metal antenna is copper coil or aluminium matter coil or metal etch antenna or tinsel antenna.
5. electronic tag according to claim 1 directly welds processing method, it is characterized in that, described metal antenna is that dielectric film or naked film are arranged.
6. electronic tag according to claim 1 directly welds processing method, it is characterized in that, and described metal electrode, it is separated into two utmost points in the zone with the metal antenna contact portion.
7. electronic tag according to claim 1 directly welds processing method, it is characterized in that, and described metal electrode, it adds man-hour in straight weldering, needs toward being no more than 20 grams for the certain pressure of metal antenna, pressure size downwards.
8. electronic tag according to claim 1 directly welds processing method, it is characterized in that, and described metal electrode, it adds man-hour in straight weldering, and the voltage of loading but is not higher than 800V greater than 100V it on, and be no more than 0.1 second its conduction time.
9. a glue of protection usefulness according to claim 1, it is epoxide-resin glue or UV glue, or the glue that can solidify of other type.
10. the curing of dripping glue of protection usefulness according to claim 9 is baking-curing, ultraviolet curing or chemosetting voluntarily.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110436567XA CN102522346A (en) | 2011-12-23 | 2011-12-23 | Direct welding processing method of electronic label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110436567XA CN102522346A (en) | 2011-12-23 | 2011-12-23 | Direct welding processing method of electronic label |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102522346A true CN102522346A (en) | 2012-06-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110436567XA Pending CN102522346A (en) | 2011-12-23 | 2011-12-23 | Direct welding processing method of electronic label |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102522346A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111950683A (en) * | 2020-08-07 | 2020-11-17 | 江苏军一物联网股份有限公司 | Anti-interference RFID (radio frequency identification) electronic tag bearing structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1658476A (en) * | 2005-01-21 | 2005-08-24 | 程浩川 | Application of electronic spot-welding technology for connecting coil winding lead of chip vibrating electric machine |
| US20060201571A1 (en) * | 2005-03-07 | 2006-09-14 | Astra Gesellschaft Fur Asset Management Mbh & Co., Kg | Textile information carrier and method for producing a textile information carrier |
| CN201369060Y (en) * | 2009-01-09 | 2009-12-23 | 东莞市凌信电子科技有限公司 | Dismounting prevention electronic tag |
| CN101905373A (en) * | 2009-06-08 | 2010-12-08 | 刘百生 | Spot-weld machine |
| JP2011248818A (en) * | 2010-05-31 | 2011-12-08 | Toppan Printing Co Ltd | Non-contact type communication medium and manufacturing method thereof |
-
2011
- 2011-12-23 CN CN201110436567XA patent/CN102522346A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1658476A (en) * | 2005-01-21 | 2005-08-24 | 程浩川 | Application of electronic spot-welding technology for connecting coil winding lead of chip vibrating electric machine |
| US20060201571A1 (en) * | 2005-03-07 | 2006-09-14 | Astra Gesellschaft Fur Asset Management Mbh & Co., Kg | Textile information carrier and method for producing a textile information carrier |
| CN201369060Y (en) * | 2009-01-09 | 2009-12-23 | 东莞市凌信电子科技有限公司 | Dismounting prevention electronic tag |
| CN101905373A (en) * | 2009-06-08 | 2010-12-08 | 刘百生 | Spot-weld machine |
| JP2011248818A (en) * | 2010-05-31 | 2011-12-08 | Toppan Printing Co Ltd | Non-contact type communication medium and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111950683A (en) * | 2020-08-07 | 2020-11-17 | 江苏军一物联网股份有限公司 | Anti-interference RFID (radio frequency identification) electronic tag bearing structure |
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Application publication date: 20120627 |
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| WD01 | Invention patent application deemed withdrawn after publication |