CN102519294B - 一种换热单元 - Google Patents
一种换热单元 Download PDFInfo
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- CN102519294B CN102519294B CN 201210013582 CN201210013582A CN102519294B CN 102519294 B CN102519294 B CN 102519294B CN 201210013582 CN201210013582 CN 201210013582 CN 201210013582 A CN201210013582 A CN 201210013582A CN 102519294 B CN102519294 B CN 102519294B
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Abstract
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CN 201210013582 CN102519294B (zh) | 2012-01-17 | 2012-01-17 | 一种换热单元 |
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CN 201210013582 CN102519294B (zh) | 2012-01-17 | 2012-01-17 | 一种换热单元 |
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CN102519294A CN102519294A (zh) | 2012-06-27 |
CN102519294B true CN102519294B (zh) | 2013-05-22 |
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CN 201210013582 Active CN102519294B (zh) | 2012-01-17 | 2012-01-17 | 一种换热单元 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102706203A (zh) * | 2012-07-03 | 2012-10-03 | 苏州图卡节能科技有限公司 | 一种针式换热单元 |
CN103063071B (zh) * | 2013-02-01 | 2015-08-12 | 陈黎清 | 一种用于强化换热的弹簧体及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5358032A (en) * | 1992-02-05 | 1994-10-25 | Hitachi, Ltd. | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted |
CN2244712Y (zh) * | 1994-09-25 | 1997-01-08 | 孙绳 | 网状结构表面换热芯片 |
CN2324637Y (zh) * | 1997-12-05 | 1999-06-16 | 徐美华 | 散热网片结构 |
CN101100017A (zh) * | 2006-07-05 | 2008-01-09 | 奇鋐科技股份有限公司 | 应用超音波焊接的平板式热管制造方法 |
CN202420273U (zh) * | 2012-01-17 | 2012-09-05 | 魏辉 | 换热单元 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5983830A (ja) * | 1982-11-05 | 1984-05-15 | Honda Motor Co Ltd | しゆう動体 |
JPH05280882A (ja) * | 1992-03-31 | 1993-10-29 | Toshiba Corp | 放熱フィン |
IL173373A0 (en) * | 2006-01-26 | 2006-09-05 | Nuclear Res Ct Negev | Thermal energy storage apparatus |
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2012
- 2012-01-17 CN CN 201210013582 patent/CN102519294B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5358032A (en) * | 1992-02-05 | 1994-10-25 | Hitachi, Ltd. | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted |
CN2244712Y (zh) * | 1994-09-25 | 1997-01-08 | 孙绳 | 网状结构表面换热芯片 |
CN2324637Y (zh) * | 1997-12-05 | 1999-06-16 | 徐美华 | 散热网片结构 |
CN101100017A (zh) * | 2006-07-05 | 2008-01-09 | 奇鋐科技股份有限公司 | 应用超音波焊接的平板式热管制造方法 |
CN202420273U (zh) * | 2012-01-17 | 2012-09-05 | 魏辉 | 换热单元 |
Non-Patent Citations (2)
Title |
---|
JP昭59-83830A 1984.05.15 |
JP特开平5-280882A 1993.10.29 |
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CN102519294A (zh) | 2012-06-27 |
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Effective date of registration: 20151216 Address after: 215021 international science and Technology Park, 1355 Jinji Lake Avenue, Suzhou Industrial Park, Jiangsu, E101-6 Patentee after: Suzhou entropy energy saving Technology Co.,Ltd. Address before: 215021 Green garden, 203 Tower Road, New District, Jiangsu, Suzhou 8-403, China Patentee before: Wei Hui |
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Effective date of registration: 20220706 Address after: Room 1004, building 1, Xinghong building, No. 225, Suhong Middle Road, Suzhou Industrial Park, Jiangsu 215000 Patentee after: Suzhou zhiyiyun Consulting Co.,Ltd. Address before: 215021 e101-6, International Science Park, No. 1355, Jinjihu Avenue, Suzhou Industrial Park, Jiangsu Province Patentee before: Suzhou entropy energy saving Technology Co.,Ltd. |