CN102496671A - LED and slurry planar coating process of LED - Google Patents
LED and slurry planar coating process of LED Download PDFInfo
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- CN102496671A CN102496671A CN2011103624304A CN201110362430A CN102496671A CN 102496671 A CN102496671 A CN 102496671A CN 2011103624304 A CN2011103624304 A CN 2011103624304A CN 201110362430 A CN201110362430 A CN 201110362430A CN 102496671 A CN102496671 A CN 102496671A
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Abstract
The invention discloses an LED and a slurry planar coating process of the LED. The slurry planar coating process sequentially includes the steps of A) controlling the shape of a fluorescent powder layer, B) preparing the fluorescent powder layer, C) primarily removing an electrode shielding portion, D) controlling the shape of a protecting rubber body layer, E) coating the protecting rubber body layer, and F) secondly removing an electrode shielding portion. By means of the slurry planar coating process, drawbacks of a powder layer in structure and shape in a traditional encapsulation process are overcome, fluorescent powder is mixed and dispersed into transparent photo-sensitive resists, and the shape, the thickness and the uniformity of the fluorescent powder layer are effectively controlled, so that chrominance consistency among devices is enhanced.
Description
[technical field]
The present invention relates to electronic devices and components, relate in particular to the improvement of LED and powder thereof slurry coating processes.
[background technology]
What domestic PC LED industry mainly adopted at present is traditional dosing technology; Directly in chip surface spot printing phosphor gel; Be about to phosphor powder and mix according to a certain ratio, process the powder slurry, stir with colloid (like silica gel or epoxy resin etc.); With fine needle head kind tool it is coated on chip surface then, ideal situation forms the coating of similar spherical crown shape down.But there are tangible fault of construction in this method and coating, this fluorescent coating, except that the center to edge structural non-homogeneous; In practical operation;, no matter manually or machine operation between same batch the LED pipe, phosphor powder layer all can have certain difference in shape; Be difficult to control uniformity and consistency, thereby cause colourity difference bigger between device; Simultaneously,, when beam projecting, will form the inhomogeneous of white light color, cause local yellow partially or blue partially inhomogeneities hot spot to occur because coating adhesive drips the uneven of actual microscopic surface.
[summary of the invention]
The object of the invention solves the problems of the prior art exactly, proposes the powder slurry flat coated technology of a kind of LED and LED, can effectively control shape, thickness and the uniformity of fluorescent coating, thereby improve the colourity consistency between device.
For realizing above-mentioned purpose; The present invention proposes a kind of LED; Comprise substrate, led chip and reflector, said led chip is encapsulated on the substrate, and led chip is equipped with reflector outward; Be coated with the phosphor powder layer of rectangle outside the upper surface of said led chip and four sides, the external packets of said phosphor powder layer is covered with the transparency protected colloid layer of rectangle.
As preferably, the thickness of said phosphor powder layer is 2mm, and the thickness of transparency protected colloid layer is 3mm, has both satisfied quality requirement, practices thrift cost again.
For realizing above-mentioned purpose, the invention allows for the powder slurry flat coated technology of a kind of LED, may further comprise the steps successively:
A) phosphor powder layer shape control: after being encapsulated in led chip on the substrate, led chip top electrode part is sheltered from through the sensitization colloid, form the electrode shield portions, only stay the chip light emitting zone that needs fluorescent material to cover;
B) preparation phosphor powder layer: the chip light emitting zone of on led chip, not blocking is prepared into consistency of thickness and uniform phosphor powder layer;
C) first remove the electrode shield portions: after spending 80～100 minutes the electrode shield portions is removed, obtained the phosphor powder layer of solid shape;
D) protecting colloid layer shape control: led chip top electrode part is blocked formation electrode shield portions through the sensitization colloid, expose established phosphor powder layer, and reserve the thickness space of protecting colloid layer;
E) apply the protecting colloid layer: the uniform transparency protected colloid layer of coating thickness in the outside thickness space of the phosphor powder layer that exposes;
F) second remove the electrode shield portions: after spending 170～190 minutes the electrode shield portions is removed, obtained being wrapped in the outside transparency protected colloid layer of phosphor powder layer, accomplish powder slurry flat coated technology.
The thickness of the phosphor powder layer that as preferably, said B) prepares in the step is 2mm; The thickness of the transparency protected colloid layer that E) applies in the step is 3mm, has both satisfied quality requirement, practices thrift cost again.
As preferably, said C) the electrode shield portions is removed after spending 90 minutes in the step; F) after 180 minutes the electrode shield portions is removed excessively in the step, both satisfied quality requirement, raise the efficiency again.
Beneficial effect of the present invention: the present invention adopts powder slurry flat coated technology; Overcome traditional embedding gluing process in bisque structure, in shape drawback; With the fluorescent material mixed and dispersed in the transparent feel optical cement; Shape, thickness and even performance to fluorescent coating are effectively controlled, thereby have improved the colourity consistency between device.
Characteristic of the present invention and advantage will combine accompanying drawing to be elaborated through embodiment.
[description of drawings]
Fig. 1 is the structural representation of a kind of LED among the present invention;
Fig. 2 is the flow chart of the powder slurry flat coated technology of a kind of LED among the present invention.
[embodiment]
As shown in Figure 1; LED; Comprise substrate 1, led chip 2 and reflector 3, said led chip 2 is encapsulated on the substrate 1, the led chip 2 outer reflectors 3 that are equipped with; Be coated with the phosphor powder layer 4 of rectangle outside the upper surface of said led chip 2 and four sides, the external packets of said phosphor powder layer 4 is covered with the transparency protected colloid layer 5 of rectangle.
As shown in Figure 2, the powder slurry flat coated technology of LED may further comprise the steps successively:
A) phosphor powder layer 4 shapes control: after being encapsulated in led chip 2 on the substrate 1, led chip 2 top electrodes part is sheltered from through the sensitization colloid, form the electrode shield portions, only stay the chip light emitting zone that needs fluorescent material to cover;
B) preparation phosphor powder layer 4: the chip light emitting zone of on led chip 2, not blocking is prepared into consistency of thickness and uniform phosphor powder layer 4; The thickness of phosphor powder layer 4 is 2mm, and the thickness on all directions equates, to keep even.
C) first remove the electrode shield portions: after spending 80～100 minutes the electrode shield portions is removed, obtained the phosphor powder layer 4 of solid shape; After generally spending 90 minutes the electrode shield portions is removed.
D) protecting colloid layer shape control: led chip 2 top electrodes part is blocked formation electrode shield portions through the sensitization colloid, expose established phosphor powder layer 4, and reserve the thickness space of protecting colloid layer;
E) apply the protecting colloid layer: the uniform transparency protected colloid layer 5 of coating thickness in the thickness space of the phosphor powder layer that exposes 4 outsides; The thickness of transparency protected colloid layer 5 is 3mm, and the thickness on all directions equates, to keep even.
F) second remove the electrode shield portions: after spending 170～190 minutes the electrode shield portions is removed, obtained being wrapped in the transparency protected colloid layer 5 of phosphor powder layer 4 outsides, accomplish powder slurry flat coated technology; After generally spending 180 minutes the electrode shield portions is removed.
Structure by the present invention's preparation is processed the LED device with its encapsulation, the spectral characteristic of test component and hot spot uniformity, and the result shows; Adopting the produced device chromaticity coordinates of this new technology is (0.321; 0.314), colour temperature is 6827K relatively, corresponding dominant wavelength is 475nm; Chromaticity coordinates and colour temperature all reach the white light category, and the hot spot uniformity improves significantly.This method has overcome existing LED main flow embedding gluing process in bisque structure, in shape drawback, fluorescent coating shape, thickness and even performance are effectively controlled, thereby improved the colourity consistency between device, and technology is simple, and cost is low.
The foregoing description is to explanation of the present invention, is not to qualification of the present invention, any scheme after the simple transformation of the present invention is all belonged to protection scope of the present invention.
Claims (5)
1. LED; Comprise substrate, led chip and reflector; Said led chip is encapsulated on the substrate; Led chip is equipped with reflector outward, it is characterized in that: be coated with the phosphor powder layer of rectangle outside the upper surface of said led chip and four sides, the external packets of said phosphor powder layer is covered with the transparency protected colloid layer of rectangle.
2. a kind of LED as claimed in claim 1 is characterized in that: the thickness of said phosphor powder layer is 2mm, and the thickness of transparency protected colloid layer is 3mm.
3. the powder of a LED is starched flat coated technology, it is characterized in that: may further comprise the steps successively:
A) phosphor powder layer shape control: after being encapsulated in led chip on the substrate, led chip top electrode part is sheltered from through the sensitization colloid, form the electrode shield portions, only stay the chip light emitting zone that needs fluorescent material to cover;
B) preparation phosphor powder layer: the chip light emitting zone of on led chip, not blocking is prepared into consistency of thickness and uniform phosphor powder layer;
C) first remove the electrode shield portions: after spending 80～100 minutes the electrode shield portions is removed, obtained the phosphor powder layer of solid shape;
D) protecting colloid layer shape control: led chip top electrode part is blocked formation electrode shield portions through the sensitization colloid, expose established phosphor powder layer, and reserve the thickness space of protecting colloid layer;
E) apply the protecting colloid layer: the uniform transparency protected colloid layer of coating thickness in the outside thickness space of the phosphor powder layer that exposes;
F) second remove the electrode shield portions: after spending 170～190 minutes the electrode shield portions is removed, obtained being wrapped in the outside transparency protected colloid layer of phosphor powder layer, accomplish powder slurry flat coated technology.
4. the powder of a kind of LED as claimed in claim 3 is starched flat coated technology, and it is characterized in that: the thickness of the phosphor powder layer that said B) prepares in the step is 2mm; The thickness of the transparency protected colloid layer that E) applies in the step is 3mm.
5. like the powder slurry flat coated technology of claim 3 or 4 described a kind of LED, it is characterized in that: after said C) spending 90 minutes in the step electrode shield portions is removed; F) after 180 minutes the electrode shield portions is removed excessively in the step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103624304A CN102496671A (en) | 2011-11-15 | 2011-11-15 | LED and slurry planar coating process of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103624304A CN102496671A (en) | 2011-11-15 | 2011-11-15 | LED and slurry planar coating process of LED |
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| Publication Number | Publication Date |
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| CN102496671A true CN102496671A (en) | 2012-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2011103624304A Pending CN102496671A (en) | 2011-11-15 | 2011-11-15 | LED and slurry planar coating process of LED |
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| CN (1) | CN102496671A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020025055A1 (en) * | 2018-08-03 | 2020-02-06 | 海迪科（南通）光电科技有限公司 | Led light source, surface light source display module, and preparation method for led light source |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1690133A (en) * | 2004-04-29 | 2005-11-02 | 东元奈米应材股份有限公司 | Developing type luminescent powder paint and method for anode luminescent powder layer by using same |
| CN101101946A (en) * | 2007-07-05 | 2008-01-09 | 电子科技大学 | A method for making fluorescent powder film layer on the surface of LED Chip |
| CN101550334A (en) * | 2009-05-12 | 2009-10-07 | 奇瑞汽车股份有限公司 | Fluorescent powder coating method of white light-emitting diode |
| US20100219430A1 (en) * | 2006-06-08 | 2010-09-02 | Hong-Yuan Technology Co., Ltd | Light emitting system, light emitting apparatus and forming method thereof |
| CN102218391A (en) * | 2011-06-27 | 2011-10-19 | 中外合资江苏稳润光电有限公司 | Plane coating method of fluorescent glue in package of white-light LED |
-
2011
- 2011-11-15 CN CN2011103624304A patent/CN102496671A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1690133A (en) * | 2004-04-29 | 2005-11-02 | 东元奈米应材股份有限公司 | Developing type luminescent powder paint and method for anode luminescent powder layer by using same |
| US20100219430A1 (en) * | 2006-06-08 | 2010-09-02 | Hong-Yuan Technology Co., Ltd | Light emitting system, light emitting apparatus and forming method thereof |
| CN101101946A (en) * | 2007-07-05 | 2008-01-09 | 电子科技大学 | A method for making fluorescent powder film layer on the surface of LED Chip |
| CN101550334A (en) * | 2009-05-12 | 2009-10-07 | 奇瑞汽车股份有限公司 | Fluorescent powder coating method of white light-emitting diode |
| CN102218391A (en) * | 2011-06-27 | 2011-10-19 | 中外合资江苏稳润光电有限公司 | Plane coating method of fluorescent glue in package of white-light LED |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020025055A1 (en) * | 2018-08-03 | 2020-02-06 | 海迪科（南通）光电科技有限公司 | Led light source, surface light source display module, and preparation method for led light source |
| US11605764B2 (en) | 2018-08-03 | 2023-03-14 | Dura-Chip (Nantong) Limited | LED light source, surface light source display module, and preparation method for LED light source |
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Application publication date: 20120613 |