CN102477536A - 壳体及其制造方法 - Google Patents
壳体及其制造方法 Download PDFInfo
- Publication number
- CN102477536A CN102477536A CN2010105537838A CN201010553783A CN102477536A CN 102477536 A CN102477536 A CN 102477536A CN 2010105537838 A CN2010105537838 A CN 2010105537838A CN 201010553783 A CN201010553783 A CN 201010553783A CN 102477536 A CN102477536 A CN 102477536A
- Authority
- CN
- China
- Prior art keywords
- magnesium
- magnetron sputtering
- housing
- alloy substrate
- magnesium alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 229910000861 Mg alloy Inorganic materials 0.000 claims abstract description 74
- 239000011777 magnesium Substances 0.000 claims abstract description 69
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 61
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000000576 coating method Methods 0.000 claims abstract description 38
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 229910052742 iron Inorganic materials 0.000 claims abstract description 8
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 8
- 239000011701 zinc Substances 0.000 claims abstract description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 32
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 18
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052786 argon Inorganic materials 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 4
- 150000002680 magnesium Chemical class 0.000 claims description 3
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 8
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 230000003628 erosive effect Effects 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- -1 metals ion Chemical class 0.000 description 1
- 238000005649 metathesis reaction Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12785—Group IIB metal-base component
- Y10T428/12792—Zn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12951—Fe-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明提供了一种壳体，由镁或镁合金基体、依次形成于镁或镁合金基体上的磁控溅射层及电镀层构成，所述磁控溅射层为金属层，该金属选自为锌、铁、铜及镍中的任一种。所述壳体具有较好的耐腐蚀性。本发明还提供一种上述壳体的制造方法，于镁或镁合金基体上依次形成磁控溅射层及电镀层。所述壳体的制造方法采用磁控溅射镀膜法代替传统电镀前的化学镀处理，大大降低了对环境及人体的危害，且该制造方法简单易行、良率较高。
Description
技术领域
本发明涉及一种壳体及其制造方法，特别涉及一种镁或镁合金壳体及其制造方法。
背景技术
镁及镁合金由于质量轻、散热性佳、电磁屏蔽性好等优点，广泛应用于3C产品的壳体、汽车及航空等领域。但镁及镁合金最明显的缺点是耐腐蚀差，暴露于自然环境中会引起表面快速腐蚀。
提高镁及镁合金耐腐蚀性的方法通常是在其表面形成保护性的涂层。传统的电镀法由于镀层的沉积速度快、镀层致密性佳、镀层厚度控制范围广及产能高等优点而广泛应用于镁及镁合金的表面处理。但由于镁及镁合金化学性质活泼，氧化镁会在其表面迅速形成，且镁及镁合金在电镀液中容易与其他金属离子发生置换反应，导致形成的电镀层疏松、与镁或镁合金表面结合力不强。为了解决上述问题，现有技术通常在对镁及镁合金表面或已镀覆有铝或铝合金、镁或镁合金的镁及镁合金表面进行电镀处理前先进行化学镀处理，然，化学镀处理工序的增加使得镁及镁合金表面处理方法的工序复杂、环境污染大且良率较低。
磁控溅射技术近年来被应用于镁或镁合金表面形成保护性涂层。然而，由于磁控溅射技术本身的特点，以该方法形成的保护性涂层无法完全填充镁及镁合金基材表面的裂纹、孔洞等，因而对镁及镁合金表面耐腐蚀性能的提高也很有限。
发明内容
鉴于此，有必要提供一种具有较好的耐腐蚀性的镁或镁合金的壳体。
另外，还有必要提供一种上述壳体的制造方法。
一种壳体，由镁或镁合金基体、依次形成于镁或镁合金基体上的磁控溅射层及电镀层构成，所述磁控溅射层为金属层，该金属选自为锌、铁、铜及镍中的任一种。
一种壳体的制造方法，其包括如下步骤：
提供镁或镁合金基体；
选择锌、铁、铜及镍中的任一种为靶材，于所述镁或镁合金基体上形成磁控溅射层；
于磁控溅射层上形成电镀层。
本发明壳体的制造方法在镁或镁合金基体上先形成磁控溅射层，再于该磁控溅射层上形成电镀层。所述磁控溅射层与镁或镁合金基体、电镀层之间具有较好的结合力，无需通过形成过渡层以增强上述三者之间的结合力，如此简化了该壳体的制造工序。
由于形成磁控溅射层的金属与镁的电极电位相当，在偏酸性/碱性的电镀液中所述磁控溅射层不易与镁或镁合金基体发生电偶腐蚀，从而提高了所述壳体的耐腐蚀性。此外，所述磁控溅射层与电镀层形成的复合膜层，有效提高了所述壳体表面的致密性，从而进一步提高了所述壳体的耐腐蚀性。
所述壳体的制造方法采用磁控溅射镀膜法代替传统电镀前的化学镀处理，大大降低了对环境及人体的危害，且提高了制造所述壳体的良率。
附图说明
图1是本发明较佳实施方式壳体的剖视示意图。
主要元件符号说明
壳体 10
镁或镁合金基体 11
磁控溅射层 12
电镀层 13
具体实施方式
请参阅图1，本发明一较佳实施例的壳体10包括镁或镁合金基体11、磁控溅射层12及电镀层13。所述磁控溅射层12形成于该镁或镁合金基体11上，所述电镀层13形成于该磁控溅射层12上。
所述磁控溅射层12为金属层，该金属选自锌(Zn)、铁(Fe)、铜(Cu)及镍(Ni)中的任一种，上述金属与镁或镁合金基体11的电极电位相当。所述磁控溅射层12的厚度为2.0～3.0μm。
所述电镀层13为铬层，其厚度为5.0～10μm。
所述壳体10的制造方法包括如下步骤：
提供镁或镁合金基体11，该镁或镁合金基体11可以通过冲压成型得到，其具有待制得的壳体10的结构。将所述镁或镁合金基体11放入盛装有乙醇及/或丙酮溶液的超声波清洗器中进行震动清洗，以除去镁或镁合金基体11表面的杂质和油污。清洗完毕后烘干备用。
再对镁或镁合金基体11的表面进行氩气等离子体清洗，进一步去除镁或镁合金基体11表面的油污，以改善镁或镁合金基体11表面与后续涂层的结合力。对镁或镁合金基体11的表面进行氩气等离子体体清洗的方法包括如下步骤：将镁或镁合金基体11放入磁控溅射镀膜机的镀膜室内的工件架上，抽真空至真空度为8.0×10-3Pa，以300～600sccm(标准状态毫升/分钟)的流量向镀膜室内通入纯度为99.999％的氩气，于镁或镁合金基体11上施加-300～-800V的偏压，在所述镀膜室中形成高频电压，使所述氩气发生离子化而产生氩气等离子体体对镁或镁合金基体11的表面进行物理轰击，而达到对镁或镁合金基体11表面清洗的目的。所述氩气等离子体清洗的时间为3～10min。
在所述等离子体清洗完成后，采用磁控溅射的方式在镁或镁合金基体11上形成磁控溅射层12。该磁控溅射层12为金属层，该金属选自锌(Zn)、铁(Fe)、铜(Cu)及镍(Ni)中的任一种，上述金属与镁或镁合金基体11的电极电位相当。形成该磁控溅射层12的具体操作方法及工艺参数为：
以氩气为工作气体，调节其流量为150～300s ccm，设置占空比为30％～70％，加热该镀膜室至50～150(即溅射温度为50～150)，并设置工件架的公转转速为0.5～3.0rpm；选择Zn、Fe、Cu及Ni中的任一种为靶材，设定其电源功率为5～10kw，保持所述真空室为50～150℃(即溅射温度为50～150℃)，沉积所述磁控溅射层12，沉积该磁控溅射层12的时间为20～60min。
关闭负偏压及铬靶电源，停止通入氩气，待所述磁控溅射层12冷却后，向镀膜室内通入空气，打开该镀膜室门，取出镀覆有磁控溅射层12的镁或镁合金基体11。
所述磁控溅射层12的形成，可代替传统电镀前的化学镀层，提高所述镁或镁合金基体11与后续沉积的电镀层13之间的结合力，同时还可使电镀层13具有良好致密性。更重要的是，一方面，由于镁的电极电位与Zn、Fe、Cu及Ni相当，在后续电镀过程中所述磁控溅射层12不易与镁或镁合金基体11发生电偶腐蚀；另一方面，所述磁控溅射层12可阻挡腐蚀性气体和/或液体进入镁或镁合金基体11的表面，从而减缓所述镁或镁合金基体11的腐蚀现象的发生。
于磁控溅射层12上电镀一电镀层13。该电镀层13为铬层。电镀该电镀层13的具体操作方法及工艺参数为：将形成有磁控溅射层12的镁或镁合金基体11与电源负极连接，提供一铬金属板，将铬金属板与电源正极连接，将形成有磁控溅射层12的镁或镁合金基体11与电镀液接触，设置电镀温度为40～60℃、电流密度为2.0～8.0A/dm2，对所述镁或镁合金基体11进行电镀。电镀该电镀层13的时间为10～60min。所述电镀液为水溶液，其含有：100～200g/L的铬酐，1～2g/L硫酸，1.5～2.5g/L的氨基乙酸。
所述电镀层13的形成增加了所述镁或镁合金基体11上的镀层厚度及致密性，如此可大大地提高所述镁或镁合金基体11的耐腐蚀性；此外，铬的电镀层13还可为镁或镁合金基体11表面提供良好的装饰效果。
本发明较佳实施方式壳体10的制造方法在镁或镁合金基体11上先形成磁控溅射层12，再于该磁控溅射层12上形成电镀层13。所述磁控溅射层12与镁或镁合金基体11、电镀层13之间具有较好的结合力，无需通过形成过渡层以增强上述三者之间的结合力，如此简化了该壳体10的制造工序。
由于形成磁控溅射层12的金属与镁的电极电位相当，在偏酸性/碱性的电镀液中所述磁控溅射层12不易与镁或镁合金基体11发生电偶腐，从而提高了所述壳体10的耐腐蚀性。此外，所述磁控溅射层12与电镀层13形成的复合膜层，有效提高了所述壳体10表面的致密性，从而进一步提高了所述壳体10的耐腐蚀性。
所述壳体10的制造方法采用磁控溅射镀膜法代替传统电镀前的化学镀处理，大大降低了对环境及人体的危害，且提高了制造所述壳体10的良率。
Claims (10)
1.一种壳体，其特征在于：该壳体由镁或镁合金基体、依次形成于镁或镁合金基体上的磁控溅射层及电镀层构成，所述磁控溅射层为金属层，该金属选自为锌、铁、铜及镍中的任一种。
2.如权利要求1所述的壳体，其特征在于：所述磁控溅射层的厚度为2.0～3.0μm。
3.如权利要求1所述的壳体，其特征在于：所述电镀层为铬层。
4.如权利要求3所述的壳体，其特征在于：所述电镀层的厚度为5.0～10μm。
5.一种壳体的制造方法，其包括如下步骤：
提供镁或镁合金基体；
选择锌、铁、铜及镍中的任一种为靶材，于所述镁或镁合金基体上形成磁控溅射层；
于磁控溅射层上形成电镀层。
6.如权利要求5所述的壳体的制造方法，其特征在于：形成所述磁控溅射层的工艺参数为：采用磁控溅射镀膜机，以氩气为工作气体，其流量为150～300sccm，设置占空比为30％～70％，选择锌、铁、铜及镍中的任一种为靶材，设定其电源功率为5～10kw，溅射温度为50～150℃。
7.如权利要求6所述的壳体的制造方法，其特征在于：沉积所述磁控溅射层的时间为20～60min。
8.如权利要求5所述的壳体的制造方法，其特征在于：形成所述电镀层的步骤如下：将形成有磁控溅射层的镁及镁合金基体与电源负极连接，提供一铬金属板，将铬金属板与电源正极连接，将形成有磁控溅射层的镁及镁合金基体与电镀液接触，设置电镀温度为40～60℃、电流密度为2.0～8.0A/dm2，以对该镁及镁合金基体进行电镀，电镀时间为10～60min。
9.如权利要求8所述的壳体的制造方法，其特征在于：所述电镀液为水溶液，其含有：100～200g/L的铬酐，1～2g/L硫酸，1.5～2.5g/L的氨基乙酸。
10.如权利要求5所述的壳体的制造方法，其特征在于：所述壳体的制造方法还包括在形成所述磁控溅射层之前对镁或镁合金基体进行等离子体清洗的步骤。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105537838A CN102477536A (zh) | 2010-11-22 | 2010-11-22 | 壳体及其制造方法 |
| US13/091,285 US20120129004A1 (en) | 2010-11-22 | 2011-04-21 | Housing and method for manufacturing housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105537838A CN102477536A (zh) | 2010-11-22 | 2010-11-22 | 壳体及其制造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102477536A true CN102477536A (zh) | 2012-05-30 |
Family
ID=46064630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105537838A Pending CN102477536A (zh) | 2010-11-22 | 2010-11-22 | 壳体及其制造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120129004A1 (zh) |
| CN (1) | CN102477536A (zh) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105543919A (zh) * | 2015-12-18 | 2016-05-04 | 沈阳理工大学 | 镁合金表面通过物理气相沉积形成电镀用导电涂层的方法 |
| CN114107904A (zh) * | 2020-08-25 | 2022-03-01 | 荣耀终端有限公司 | 一种结构件的制备方法、结构件及电子设备 |
| CN115295934A (zh) * | 2022-08-08 | 2022-11-04 | 常州长盈精密技术有限公司 | 圆柱电池壳、圆柱电池及其制造工艺 |
| CN115652303A (zh) * | 2022-10-26 | 2023-01-31 | 歌尔科技有限公司 | 镁锂合金件及其制备方法、复合增强涂层及头戴设备 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023523331A (ja) * | 2020-04-27 | 2023-06-02 | ウェスティングハウス エレクトリック カンパニー エルエルシー | めっきされた金属基材及びその製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE688485C (zh) * | 1937-11-19 | 1940-10-14 | ||
| JPS4990232A (zh) * | 1972-12-28 | 1974-08-28 | ||
| US5156919A (en) * | 1990-04-03 | 1992-10-20 | Segate Technology, Inc. | Fluorocarbon coated magnesium alloy carriage and method of coating a magnesium alloy shaped part |
| JPH0990232A (ja) * | 1995-09-25 | 1997-04-04 | Olympus Optical Co Ltd | 顕微鏡用照明装置 |
| US20060251917A1 (en) * | 2004-10-12 | 2006-11-09 | Southwest Research Institute | Method for magnetron sputter deposition |
| CN101476108A (zh) * | 2007-12-31 | 2009-07-08 | 比亚迪股份有限公司 | 一种镁合金复合材料及其制备方法 |
| CN101845629A (zh) * | 2010-04-14 | 2010-09-29 | 江苏时代华宜电子科技有限公司 | 钼片复合镀钌工艺 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101270465A (zh) * | 2007-03-20 | 2008-09-24 | 中国航天科技集团公司第五研究院第五一○研究所 | 空间飞行器活动件上固体润滑薄膜的制备方法 |
-
2010
- 2010-11-22 CN CN2010105537838A patent/CN102477536A/zh active Pending
-
2011
- 2011-04-21 US US13/091,285 patent/US20120129004A1/en not_active Abandoned
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE688485C (zh) * | 1937-11-19 | 1940-10-14 | ||
| JPS4990232A (zh) * | 1972-12-28 | 1974-08-28 | ||
| US5156919A (en) * | 1990-04-03 | 1992-10-20 | Segate Technology, Inc. | Fluorocarbon coated magnesium alloy carriage and method of coating a magnesium alloy shaped part |
| JPH0990232A (ja) * | 1995-09-25 | 1997-04-04 | Olympus Optical Co Ltd | 顕微鏡用照明装置 |
| US20060251917A1 (en) * | 2004-10-12 | 2006-11-09 | Southwest Research Institute | Method for magnetron sputter deposition |
| CN101476108A (zh) * | 2007-12-31 | 2009-07-08 | 比亚迪股份有限公司 | 一种镁合金复合材料及其制备方法 |
| CN101845629A (zh) * | 2010-04-14 | 2010-09-29 | 江苏时代华宜电子科技有限公司 | 钼片复合镀钌工艺 |
Non-Patent Citations (1)
| Title |
|---|
| P. HAGANS, ET AL.: "Laser Induced Surface Modification of Non-Ferrous Alloys", 《SPIE PROCEEDINGS》, vol. 0459, 31 December 1984 (1984-12-31) * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105543919A (zh) * | 2015-12-18 | 2016-05-04 | 沈阳理工大学 | 镁合金表面通过物理气相沉积形成电镀用导电涂层的方法 |
| CN114107904A (zh) * | 2020-08-25 | 2022-03-01 | 荣耀终端有限公司 | 一种结构件的制备方法、结构件及电子设备 |
| CN114107904B (zh) * | 2020-08-25 | 2024-03-12 | 荣耀终端有限公司 | 一种结构件的制备方法、结构件及电子设备 |
| CN115295934A (zh) * | 2022-08-08 | 2022-11-04 | 常州长盈精密技术有限公司 | 圆柱电池壳、圆柱电池及其制造工艺 |
| CN115295934B (zh) * | 2022-08-08 | 2024-04-26 | 常州长盈精密技术有限公司 | 圆柱电池壳、圆柱电池及其制造工艺 |
| CN115652303A (zh) * | 2022-10-26 | 2023-01-31 | 歌尔科技有限公司 | 镁锂合金件及其制备方法、复合增强涂层及头戴设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120129004A1 (en) | 2012-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102728529B (zh) | 一种金属合金的仿六价铬颜色的高耐蚀干式表面处理方法 | |
| CN102477536A (zh) | 壳体及其制造方法 | |
| CN106048517B (zh) | 一种具有金属质感的壳体及其制作方法、电子产品 | |
| CN103590082B (zh) | 一种无磷、无六价铬环保型塑胶电镀方法 | |
| CN108060398A (zh) | 一种燃料电池复合纳米涂层及其镀制方法 | |
| CN102373472A (zh) | 铝或铝合金的表面处理方法及由铝或铝合金制得的壳体 | |
| CN102899622A (zh) | 镀膜件及其制备方法 | |
| CN102477532A (zh) | 镀膜件及其制作方法 | |
| CN102345089A (zh) | 镀膜件及其制作方法 | |
| CN102400091B (zh) | 铝合金的表面处理方法及由铝合金制得的壳体 | |
| CN102465255A (zh) | 壳体及其制造方法 | |
| CN102487590A (zh) | 壳体及其制造方法 | |
| CN102534489A (zh) | 镀膜件及其制造方法 | |
| CN210163518U (zh) | 一种铜合金镀层 | |
| CN105543919B (zh) | 镁合金表面通过物理气相沉积形成电镀用导电涂层的方法 | |
| CN102453853A (zh) | 壳体及其制造方法 | |
| CN104498877A (zh) | 锌镁合金镀层及其制备方法 | |
| CN102400097A (zh) | 壳体及其制造方法 | |
| TWI472633B (zh) | 殼體及其製造方法 | |
| CN102586730A (zh) | 镀膜件及其制备方法 | |
| CN102534480A (zh) | 镀膜件及其制备方法 | |
| CN102560342A (zh) | 镀膜件及其制备方法 | |
| CN101413103B (zh) | 一种在锆表面渗镀铂薄膜的方法 | |
| CN102337507B (zh) | 镀膜件及其制作方法 | |
| CN103806043A (zh) | 非柱状晶组织铱涂层的熔盐电镀制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120530 |