CN102468258A - 具有嵌套成排的接点的半导体器件 - Google Patents

具有嵌套成排的接点的半导体器件 Download PDF

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Publication number
CN102468258A
CN102468258A CN2010105395663A CN201010539566A CN102468258A CN 102468258 A CN102468258 A CN 102468258A CN 2010105395663 A CN2010105395663 A CN 2010105395663A CN 201010539566 A CN201010539566 A CN 201010539566A CN 102468258 A CN102468258 A CN 102468258A
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electric contacts
zigzag
row
semiconductor device
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CN2010105395663A
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刘强
贺青春
田兆君
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NXP USA Inc
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Freescale Semiconductor Inc
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Priority to CN2010105395663A priority Critical patent/CN102468258A/zh
Priority to US13/210,393 priority patent/US20120112333A1/en
Publication of CN102468258A publication Critical patent/CN102468258A/zh
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Abstract

本发明涉及具有嵌套成排的接点的半导体器件，其中模制表面安装半导体器件具有被设置成在半导体器件的有源面的相对边缘附近且大体上与之平行地延伸的一组成对的锯齿状排的电接触元件。成对的排中的每一个包括被嵌套在电接触元件的外锯齿状排内部的电接触元件的内锯齿状排。所述内和外锯齿状排的电接触元件部分地呈交叉指状排列。在制造器件时使用的引线框还具有位于所述一组成对的锯齿状排内部的管芯焊盘，和位于所述一组成对的锯齿状排外部的外框元件，并且其分别支撑内和外锯齿状排的电接触元件。

Description

具有嵌套成排的接点的半导体器件
技术领域
本发明涉及具有嵌套成排的接点的半导体器件和制造此类半导体器件的方法。
背景技术
诸如集成电路的半导体器件包括在具有暴露的电接触表面的封装中的半导体管芯(或芯片)。完成的器件可以被安装在具有电连接体的支撑体上，诸如印刷电路板(‘PCB’)。使用表面安装技术，可以将封装的电接触表面直接焊接到支撑体上的相应焊盘，提供机械附着以及电连接。
完成的表面安装器件通常包括密封半导体管芯的电绝缘模制材料，以便器件呈现一般为矩形或正方形的顶面和底部有源面、以及横向延伸的边缘。模制化合物可以完整地封装半导体器件，或者可以限定用陶瓷或橡胶盖密封的空气腔。通常，所述器件还具有在器件的有源面的相对侧上的一对电接触表面组(‘双列直插式封装’)或在器件的有源面的各侧上的正交的两对电引线组(‘四方封装(quadpackage)’)。
通常，每组电接触表面包括在器件的有源面的各边缘处或相邻于各边缘成排地间隔开地并排设置的离散元件(引线指)用于焊接到支撑体的电连接件。为了增加可用接触表面的数目，可以在器件的各侧上的每组中提供多于一排的电接触表面。器件的每一各个侧的相邻排被嵌套，相互平行地且与器件的相邻侧平行地延伸，内排比外排距离器件的相邻侧更远。
可以在与电接触表面相同的材料的焊盘或旗标(flag)上将半导体管芯安装在器件中，所述材料通常为诸如铜的金属，金属可以被镀覆。管芯焊盘在器件的底面处被暴露，以辅助冷却管芯，称为暴露的焊盘封装。或者，可以省略管芯焊盘，称为非暴露的焊盘封装。在非暴露的焊盘封装中，可以将管芯直接安装在离散电接触元件上。在每种情况下，管芯和电接触元件及任何管芯焊盘被密封模制材料机械地保持在一起。可以用适应管芯和封装材料的不同热膨胀的例如金、铜或铝的键合引线将器件的电接触元件电连接到管芯上的电接触焊盘。
在制造此类表面安装器件时使用的普遍技术包括通过蚀刻和/或冲压以通常为金属的导电材料的条或片形成引线框的阵列。每个引线框具有形成为相邻引线框所共用的框元件的系棒(tie bars)。该系棒以阵列方式支撑成组的离散电接触部分，这些电接触部分将在切单(singulation)之后形成完成后的器件的电接点组，和用于安装管芯的任何芯片焊盘。引线框阵列可以是单个条，但通常包括二维阵列，完整阵列的支撑框结构包括在阵列的外边缘上的围绕系棒和为相邻引线框所共用的交叉中间系棒。
在使用引线框的典型表面安装半导体器件封装工艺中，半导体管芯被安装在各个引线框上并被电连接到各个引线框。然后，在空气腔封装的情况下可能用盖体在引线框条或片之上和周围模制密封材料，从而密封集成电路管芯、电接触表面元件和每个引线框的键合连接导线。然后用切单工艺来分离单独的器件，在该工艺中将引线框条或片切割开。切单可以是锯切操作(saw operation)或冲切操作(punchoperation)。如果需要，锯切成单使得能够在整个阵列上施加模制化合物，随后在切单工艺期间将其切割。在锯切成单期间，锯刃沿着在相邻引线框的电接触表面元件之间延伸的‘锯衢(saw streets)’前进，从而从引线框的电接触表面部分切掉引线框的支撑框结构并将单独的器件相互分离。在冲切成单期间，在向单独的期间施加模制化合物之后，使用冲切工具来沿着相邻器件之间的线来切单器件。
针对器件的底部有源面中的单独电接触表面的尺寸和相邻电接触表面之间的间距(节距)指定最小值。此类规格使得需要器件的底部有源面的总体尺寸与单独电接触表面的数目之间的折衷。期望的是在保持或增加单独电接触表面的数目的同时减小封装尺寸，尤其是由于半导体管芯的不断小型化使得可以增加其包含的电子系统的复杂性，这趋向于对于给定管芯尺寸而言增加输入端和输出端的数目。
附图说明
以示例的方式来说明本发明且本发明不限于附图所示的实施例，在附图中类似的附图标记指示类似的元件。图中的元件是出于简化和明了的目的而示出的且不一定按比例绘制。
图1是制造半导体器件的已知方法中的模制之前的阶段的引线框的顶视图；
图2是依照本发明的一个实施例的制造半导体器件的方法中的模制之前的阶段的引线框的顶视图；
图3是依照本发明的一个实施例的图2的引线框的示例的详图；
图4是上带(taping)、安装半导体管芯和引线键合之后的来自图2的线4-4的引线框的剖视图；
图5是在模制、除带(de-taping)和切单之后的依照本发明的实施例的半导体器件的示例的类似于图4的剖视图；
图6是图5的半导体器件的底视图；以及
图7是图解组装在图2至6中示出的半导体器件的方法的流程图。
具体实施方式
在一个实施例中，本发明涉及一种半导体器件，半导体器件包括半导体管芯、与半导体管芯单独地连接的电接触元件、以及覆盖并密封半导体管芯和电接触元件使得器件呈现顶面、其中暴露了所述电接触元件的底部有源面、以及横向延伸边缘的模制材料。电接触元件被设置在一组成对的锯齿形排中，所述一组成对的锯齿形排在所述有源面的相对边缘处或与所述有源面的相对边缘相邻地延伸且大体上平行于所述有源面的相对边缘，所述对中的每一个包括电接触元件的内锯齿形排，所述电接触元件的内锯齿形排被嵌套在电接触元件的外锯齿形排内部，所述内锯齿形排和所述外锯齿形排的所述电接触元件部分地呈交叉指状排列。
现在参照图1，示出了在制造四方封装半导体器件的已知方法中使用的引线框的二维阵列中的单个引线框100。引线框100包括包围引线框100的矩形(在这个例子中为方形)框结构102。与器件的每侧相邻，引线框100包括第一、直排的电接触元件104和第二、直排的电接触元件106。第一排的电接触元件104是内排，位于比作为外排的第二排距离器件的相邻侧更远的位置。第一、内排的电接触元件104被设置为与第二、外排的电接触元件106相对且直接与之对准。
第一、内排的电接触元件104最初由可以是管芯焊盘的一部分的内框元件107通过连接棒108的中介物来支撑。第二、外排的电接触元件106直接由外框元件102来支撑。连接棒108和框元件102和107机械地与电接触元件104和106相连并支撑它们，并且也将它们电连接。一旦由器件的其它结构、特别是模制化合物来支撑电接触元件104和106，则必须切割电接触元件104和106的这些电连接。在模制和除带之后，通过沿着衢110进行锯切或冲切，在器件的正常锯切或冲切成单期间框元件102可以被切割，并且所述衢中的模制化合物被同时切割。然而，当沿着衢112切割连接棒108时，锯仅通过引线框的金属从器件的底部有源面切割且尽可能少地穿透模制化合物。或者，引线框的金属可以通过沿着衢112蚀刻连接棒108来切割，而不蚀刻模制化合物。
图2～7图解依照本发明的实施例的示例制造半导体器件、在此类方法中使用的引线框200、以及图5和6所示的半导体器件500的方法。
在本示例中，在制造半导体器件500时使用引线框阵列，半导体器件500的每个分别呈现顶面504、底部有源面506、以及横向延伸边缘508。阵列的每个引线框200包括设置成一组成对的锯齿形排的电接触元件202和204，其在所述有源面的相对边缘508处或相邻于相对边缘508且大体上与相对边缘508平行地延伸，每对包括电接触元件202的内锯齿形排206，电接触元件202的内锯齿形排206被嵌套在电接触元件204的外锯齿形排208内部，所述内锯齿形排和所述外锯齿形排的电接触元件202和204部分地呈交叉指状排列。每个引线框200还包括可以是设置在成对的锯齿状排的组的内部的管芯焊盘的内框元件214、和设置在成对的锯齿状排的组的外面的外框元件210。内和外框元件214和210分别与内和外锯齿状排206和208的电接触元件202和204相连并对电接触元件202和204进行支撑。阵列的相邻引线框200的外框元件208为相邻引线框所共用。
在本示例中，半导体器件500包括半导体管芯402、单独地与半导体管芯402电连接的电接触元件202和204、以及密封半导体管芯和电接触元件的电绝缘模制材料502。器件500呈现出顶面504、其中暴露出电接触元件202和204的底部有源面506、以及横向延伸边缘508。电接触元件202和204被设置成在有源面504的相对边缘508处或相邻于相对边缘508且大体上与相对边缘508平行地延伸的一组成对的锯齿状排，所述对中的每一个包括电接触元件的内锯齿状排206，电接触元件的内锯齿状排206被嵌套在电接触元件的外锯齿状排208的内部，内锯齿状排206和外锯齿状排208的电接触元件部分地呈交叉指状排列。
图2至7图解在器件的四边中的每一个处组装具有电接触元件202和204的成对的锯齿状排206和208的四方封装器件的方法。应认识到该方法可以适合于仅在器件的两个相对边处产生具有电接触元件的第一和第二对锯齿状排的直插式封装。图2至7图解组装暴露管芯焊盘半导体器件500的方法。应认识到该方法可以适合于产生非暴露管芯焊盘半导体器件。
更详细地，图2至4示出例如通过冲压(stamping)和/或蚀刻形成的类似引线框的二维阵列的单引线框200的示例。每个引线框200包括正交的两组成对的锯齿状排206和208，成对的锯齿状排被设置在引线框的各侧边附近，并且半导体器件500(参见图5和6)形成四方封装。如图3的详图中所示，电接触元件的内锯齿状排206相邻于有源面504的边缘508且与有源面504的边缘508大体上平行地延伸，如点划中线300所示。类似地，电接触元件的外锯齿状排208在有源面504的边缘508处或相邻于有源面504的边缘508且大体上与有源面504的边缘508平行地延伸，如点划中线302所示。
单独电接触元件202和204在各内或外排206或208的中线300或302的相对侧交替地偏移或交错。与同一锯齿状排206或208的相邻电接触元件的中心连结的线与该排的长度形成偏斜角，如双点划线304和306所示。选择偏斜角以实现沿与有源面506的相邻边缘508平行的x方向的电接触元件202和204的减小节距与沿与有源面506的相邻边缘508垂直的y方向的封装尺寸的相应增加之间的折衷。
该偏移对于沿x方向的减小节距而言是足够的以使得与图1的结构相比能够增加引线框200的每一侧上的电接触元件202或204的数目。然而，该偏移足够小使得同一排206或208的相邻偏移电接触元件202或204的y维度部分地重叠。电接触元件的内锯齿状排206被嵌套在电接触元件的外锯齿状排208内部，并且内锯齿状排206和外锯齿状排208的电接触元件部分地呈交叉指状排列，使得y方向尺寸增加受限。由于内锯齿状排206和外锯齿状排208的电接触元件部分地呈交叉指状排列，所以更接近于器件的边缘508的内排206的电接触元件202的y维度部分地与距离器件的边缘508更远的外排208的电接触元件204的y维度重叠。
在一个示例中，具有尺寸7mm乘7mm的图1所示的种类的封装具有76个电接触元件202和204。具有30°偏斜角的图2所示种类的封装具有92个电接触元件202和204，对于封装尺寸的小得多的增加而言，增加了约20％。在本示例中，用30°的偏斜角，同一锯齿状排206或208的相邻接触元件的中心之间的距离是0.44mm且沿x方向的减小的节距是0.38mm。在本示例中，同一锯齿状排206或208的接触元件的偏移在封装尺寸上增加两倍0.22mm，这代表着与图1所示的种类的封装的尺寸7mm乘7mm相比每侧约6％，并且与20％更多焊盘相比，在封装面积上增加13％。
在本发明的实施例的本示例中，每个引线框的电接触元件的成对的锯齿状排的组具有四个拐角区域209。每个拐角区域包括仅外锯齿状排208的电接触元件204且无内锯齿状排206的电接触元件202。外锯齿状排的偏移几何结构使得能够在每个拐角区域209中设置四个电接触元件204，两个更接近于器件的有源面506的边缘508而两个距离更远。
如在图2和3中看到的，在模制之前的引线框200中，由围绕引线框200的大体上为矩形的外框元件210来支撑外锯齿状排208的接触元件204。外框元件210的部件为引线框的阵列的相邻引线框所共用。外锯齿状排208的接触元件204具有圆形形状且被链接件212机械地连接到框元件210。链接件212跨越切单衢110延伸，从而在器件500的切单时被切断并将接触元件204与框元件210分离。与接触元件204中的距离框元件210更远的那些接触元件相连的更长链接件212比接触元件204的宽度窄，从而保持在链接件212与接触元件204中的更接近于框元件210的那些接触元件之间的最小x方向间距。
在本示例中，引线框200中的每一个包括各自管芯焊盘214，居中地设置在电接触元件202的内锯齿状排206之间，并且还充当支撑电接触元件202的内框元件。内锯齿状排206的接触元件202具有与接触元件204类似的圆形形状并被链接件216机械地连接到管芯焊盘214。链接件216跨越以阴影示出的衢112延伸，从而在模制之后被切断并将接触元件202与管芯焊盘分离。在其中器件是非暴露的焊盘器件的另一示例中，在模制之前由具有与框元件210类似形状但更小的内框元件(未示出)来支撑电接触元件202的内锯齿状排206。内框元件在模制之前在引线框中再次被链接件216连接到电接触元件202的内锯齿状排206，所述链接件跨越衢112而延伸。在每种情况下，接触元件202中的与距离管芯焊盘214或内框元件更远的那些接触元件相连的链接件216比接触元件202的宽度窄，从而保持链接件216与接触元件202中的更接近于管芯焊盘214或内框元件的那些接触元件之间的沿x方向的最小间距。
在图4、5和6中示出依照本发明的实施例的半导体器件500的制造中的其它阶段的示例。如图4所示，通过将引线框200的阵列安装在粘合带404的片层上并将半导体管芯402安装在引线框200上来产生组件400。或者，可以在将引线框的阵列安装在粘合带404的片层上之前将半导体管芯402安装在引线框200上。
在本示例中，每个引线框200的电接触元件202和204呈现顶面，导线406(例如金、铜或铝)被键合到该顶面。导线406将电接触元件单独地连接到半导体管芯402上的接点，导线也被键合到这些接点。电接触元件202和204的底表面将在半导体管芯402的周界周围的成品器件的底部有源面中被暴露，以便连接到外部器件。
在下一步骤中，在粘合带404的片层上使用模制化合物502来密封组件400。如果将通过锯切来切单器件，则可以在引线框200的阵列和各组件400上均匀地施加模制化合物502。如果将通过冲切来切单器件，则可以在引线框200和各组件400上单独地施加模制化合物502。
然后去除该粘合带404的片层。通过用例如锯切或掩模蚀刻沿着列和行衢112来部分地切割引线框200的阵列的厚度、从而切割链接件216来从管芯焊盘214或内框元件分离电接触元件202的内锯齿状排206。然后通过沿着列和行衢110进行锯切或冲切来切单密封组件400以产生半导体器件500。用切单工艺来切割链接件212，从而将电接触元件204的外排208与被去除的外框元件210分离。模制化合物502使电接触元件202和204的内和外锯齿状排206和208在相邻于各半导体器件500的有源面506的各侧边508被暴露。
图7是制造如上文参照图2至6所述的半导体器件的方法700的概述。该方法包括提供半导体器件402、提供电接触元件202和204、将电接触元件与半导体管芯电连接。施加电绝缘模制材料502，其密封半导体管芯和电接触元件使得器件呈现顶面504、电接触元件在其中被暴露的底部有源面506、以及横向延伸的边缘508。电接触元件被设置成一组成对的锯齿形排206和208，其在所述有源506面的相对边缘508处或相邻于相对边缘508且大体上与相对边缘508平行地延伸。所述对中的每一个包括电接触元件204的内锯齿形排206，电接触元件204的内锯齿形排206被嵌套在电接触元件204的外锯齿形排208内部，所述内锯齿形排206和所述外锯齿形排208的电接触元件部分地呈交叉指状排列。
更详细地，方法700在702处通过产生具有电接触元件202和204的引线框200的阵列开始，所述电接触元件202和204在有源面506的相对边缘508处或相邻于相对边缘508采取各组成对的锯齿状排206和208的形式。在704处，将引线框200的阵列安装在粘合带404的片层上。通过将半导体管芯402安装在引线框200的每一个上在706处产生各组件400。
在708处，通过引线键合将半导体管芯402电连接到电接触元件202和204。然后，在710处使用模制化合物502来密封各组件400。在712处，从密封组件400上去除粘合带404。在714处通过用例如锯切或掩模蚀刻沿着列和行衢112部分地切割阵列的厚度、从而切割链接件216来从管芯焊盘214或内框元件分离电接触元件202的内锯齿状排206。然后在716处切单各组件400以产生半导体器件500。
在前述说明书中，已参照本发明的实施例的特定示例描述了本发明。然而，显而易见的是在不脱离如随附权利要求所阐述的本发明的广泛精神和范围的情况下可以对其进行各种修改和变更。
例如，本文所述的半导体器件可以包括任何半导体材料或材料的组合，诸如砷化镓、硅锗、绝缘体上硅(SOI)、硅、单晶硅等，以及以上各项的组合。
说明书和权利要求书中的术语“前”、“后”、“顶部”、“底部”、“上”、“下”等(如果有的话)用于描述的目的且不一定用于描述永久性的相对位置。应理解的是这样使用的术语根据适当的情况是可互换的，使得本文所述的本发明的实施例例如能够以本文图解或描述的取向之外的取向进行操作。
实现相同功能的组件的任何布置被有效地“关联”，从而实现期望的功能。因此，可以将被组合以实现特定功能的本文中的任何两个组件视为被相互“关联”，从而实现期望的功能，无论架构或中间组件如何。类似地，还可以将这样关联的任何两个组件视为被相互“可操作地连接”或“可操作地耦合”以实现期望的功能。
此外，本领域的技术人员应认识到上述操作之间的界限仅仅是说明性的。可以将多个操作组合成单个操作，可以在附加操作中分布单个操作，并且可以至少部分地以时间重叠的方式来执行操作。此外，替换实施例可以包括特定操作的多个实例，并且在各种其它实施例中可以改变操作的任何顺序。
并且，例如，在一个实施例中，可以将所说明的实例实现为位于半导体器件的单个完整封装内的单个集成电路上的电路。或者，可以将该示例实现为在半导体器件的单个完整封装内以适当的方式彼此互连的多于一个的单独集成电路或单独器件。然而，还可以由其它修改、变更和替换。因此，将以说明性而非限制性的意义来看待本说明书和附图。
在权利要求中，词语“包括”不排除除了在权利要求中列出的那些之外的其它元件或步骤的存在。本文所使用的用词“a”或“an”被定义为一个或多于一个。并且，应将权利要求中的诸如“至少一个”和“一个或多个”等介绍性短语的使用理解为意指用不定冠词“a”或“an”介绍的另一权利要求要素使包含这样介绍的权利要求要素的任何特定权利要求局限于仅包含一个此类要素的发明，即使当同一权利要求包括介绍性短语“一个或多个”或“至少一个”及诸如“a”或“an”的不定冠词时。这同样适用于定冠词的使用。除非另外说明，诸如“第一”和“第二”等术语用来随意地在此类术语所描述的要素之间进行区别。因此，这些术语不一定意图指示此类要素的时间或其它优先次序。仅仅在相互不同的权利要求中叙述了某些措施这一事实并不指示不能使用这些措施的组合来获得优点。

Claims (14)

1.一种半导体器件，包括：
半导体管芯；
电接触元件，其单独地与所述半导体管芯相连；以及
电绝缘模制材料，其密封所述半导体管芯和所述电接触元件，使得所述器件呈现顶面、所述电接触元件在其中被暴露的底部有源面、以及横向地延伸的边缘；
其中，所述电接触元件被设置成一组成对的锯齿形排，所述一组成对的锯齿形排在所述有源面的相对边缘处或与所述有源面的相对边缘相邻地延伸且大体上平行于所述有源面的相对边缘，所述对中的每一个包括电接触元件的内锯齿形排，所述电接触元件的内锯齿形排被嵌套在电接触元件的外锯齿形排内部，所述内锯齿形排和所述外锯齿形排的所述电接触元件部分地呈交叉指状排列。
2.根据权利要求1的半导体器件，其中，所述半导体管芯被安装于在电接触元件的所述一组成对的锯齿状排之间设置的管芯焊盘上。
3.根据权利要求2的半导体器件，其中，所述模制材料使所述管芯焊盘在所述半导体器件的所述有源面中被暴露。
4.根据权利要求1的半导体器件，其中，所述电接触元件被设置在所述成对的锯齿状排的两个正交的组中，所述半导体器件形成四方封装。
5.根据权利要求1的半导体器件，其中，电接触元件的所述一组成对的锯齿状排具有四个拐角区域，并且其中，每个拐角区域包括仅所述外锯齿状排的电接触元件。
6.一种用于半导体器件的引线框阵列，每个半导体器件分别呈现顶面、底部有源面、以及横向延伸的边缘，所述阵列中的每个引线框包括：
电接触元件，其被设置成一组成对的锯齿形排，所述一组成对的锯齿形排在所述有源面的相对边缘处或与所述有源面的相对边缘相邻地延伸且大体上平行于所述有源面的相对边缘，每个对包括电接触元件的内锯齿形排，所述电接触元件的内锯齿形排被嵌套在电接触元件的外锯齿形排内部，所述内锯齿形排和所述外锯齿形排的所述电接触元件部分地呈交叉指状排列；以及
被设置在所述一组成对的锯齿状排内部的内框元件，和被设置在所述一组成对的锯齿状排外部的外框元件，所述内框元件和外框元件分别与所述内锯齿状排和外锯齿状排的所述电接触元件相连并对所述电接触元件进行支撑，并且所述阵列的相邻引线框的所述外框元件为所述相邻引线框所共用。
7.根据权利要求6的引线框阵列，其中，所述内框元件包括设置在电接触元件的所述一组成对的锯齿状排之间的用于安装所述半导体管芯的管芯焊盘。
8.根据权利要求6的引线框阵列，其中，所述电接触元件被设置在两组正交的所述成对的锯齿状排中，从而形成用于所述半导体器件的四方封装。
9.根据权利要求6的引线框阵列，其中，每个引线框具有四个拐角区域，并且其中，每个拐角区域包括仅所述外锯齿状排的电接触元件。
10.一种制造半导体器件的方法，包括以下步骤：
提供半导体管芯；
提供电接触元件；
将所述电接触元件与所述半导体管芯电连接；以及
用模制材料来密封所述半导体管芯和所述电接触元件，使得所述器件呈现顶面、所述电接触元件在其中被暴露的底部有源面、以及横向地延伸的边缘；
其中，所述电接触元件被设置成一组成对的锯齿形排，所述一组成对的锯齿形排在所述有源面的相对边缘处或与所述有源面的相对边缘相邻地延伸且大体上平行于所述有源面的相对边缘，所述对中的每一个包括电接触元件的内锯齿形排，所述电接触元件的内锯齿形排被嵌套在电接触元件的外锯齿形排内部，所述内锯齿形排和所述外锯齿形排的所述电接触元件部分地呈交叉指状排列。
11.根据权利要求10的制造半导体器件的方法，还包括以下步骤：
提供引线框，所述引线框包括所述电接触元件、设置在所述一组成对的锯齿状排内部的内框元件、以及设置在所述一组成对的锯齿状排外部的外框元件，所述内框元件和外框元件分别与所述内锯齿状排和外锯齿状排的所述电接触元件相连并对所述电接触元件进行支撑；以及
将所述内锯齿状排和外锯齿状排的所述电接触元件从所述内框元件和外框元件分离。
12.一种依照权利要求11的方法制造多个半导体器件的方法，其中，所述引线框被提供为引线框阵列的一部分，所述引线框阵列包括电接触元件的各组成对的所述内锯齿状排和外锯齿状排、以及设置在所述一组成对的锯齿状排内部的各内框元件、和设置在所述一组成对的锯齿状排外部的外框元件，所述外框元件为所述阵列的相邻引线框所共用；并且，将所述内锯齿状排和外锯齿状排的所述电接触元件从所述内框元件和外框元件分离的步骤包括对所述多个半导体器件切单。
13.根据权利要求12的制造半导体器件的方法，其中，将所述内锯齿状排的所述电接触元件从所述内框元件分离包括在施加所述模制材料之后切断所述引线框的所述内框元件与所述内锯齿状排的所述电接触元件之间的连接。
14.根据权利要求10的制造半导体器件的方法，其中，所述电接触元件被设置成正交的两组所述成对的锯齿状排，所述半导体器件形成四方封装。
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Application publication date: 20120523