CN102442037B - 木质膜复合结构及木质膜复合结构成型方法 - Google Patents

木质膜复合结构及木质膜复合结构成型方法 Download PDF

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CN102442037B
CN102442037B CN201110234075.2A CN201110234075A CN102442037B CN 102442037 B CN102442037 B CN 102442037B CN 201110234075 A CN201110234075 A CN 201110234075A CN 102442037 B CN102442037 B CN 102442037B
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wooden film
composite construction
wooden
film composite
patterning
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CN102442037A (zh
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裴娥贤
孙相益
陈在哲
洪皙贤
朴勋洙
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Samsung Electronics Co Ltd
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Abstract

本发明公开了一种木质膜复合结构及木质膜复合结构成型方法。根据示例实施例，木质膜复合结构包括图案化的木质膜、附着到所述图案化的木质膜的表面上的无纺布以及附着到所述无纺布的表面上的树脂膜。根据示例实施例，成型木质膜复合结构的方法包括将无纺布附着到图案化的木质膜的第一表面上；将树脂膜附着到无纺布的表面上；研磨所述图案化的木质膜的第二表面，以减小所述图案化的木质膜的厚度，从而形成所述木质膜复合结构；通过使用压模对所述木质膜复合结构进行挤压和加热，将所述木质膜复合结构的一部分成型为期望的形状。所述图案化的木质膜的第二表面与所述图案化的木质膜的第一表面相对。

Description

木质膜复合结构及木质膜复合结构成型方法
技术领域
示例实施例涉及一种木质膜复合结构及木质膜复合结构成型方法。
背景技术
近来，电器的设计以及性能已经引起了相当多的关注。因此，形成电器的外观的外壳的材料已经成为确定市场占有率的重要因素。
通常，考虑到产率和耐用性，树脂已经被广泛地用于电器的外壳中。近来，已经提出电器采用木质外壳来满足消费者的不同品味。
然而，由于电器的木质外壳的制造会需要大量的手工操作，难以通过自动工艺制造木质外壳，因此，可能不适于批量生产。
发明内容
根据示例性实施例，木质膜复合结构包括图案化木质膜、附着到图案化的木质膜的表面上的无纺布以及附着到无纺布的表面上的树脂膜。
根据示例性实施例，通过尿烷基粘合剂将无纺布附着到图案化的木质膜上。
根据示例性实施例，树脂膜包括聚碳酸酯膜。
根据示例实施例，树脂膜通过湿固化聚氨酯粘合剂附着到无纺布的表面上。
根据示例性实施例，一种成型木质膜复合结构的方法包括：将无纺布附着到图案化的木质膜的第一表面上；将树脂膜附着到无纺布的表面上；研磨图案化的木质膜的第二表面，以减少所述图案化的木质膜的厚度，从而形成木质膜复合结构；通过使用压模挤压和加热所述木质膜复合结构，将木质膜复合结构的一部分成型为期望的形状。图案化的木质膜的第二表面与图案化的木质膜的第一表面相对。
根据示例性实施例，所述方法还包括：剪切所述木质膜复合结构的所成型的部分。
根据示例性实施例，所述方法还包括：将所剪切的木质膜复合结构插入用于形成电器外壳的注射模具中，在所剪切的木质膜复合结构的树脂膜的第一表面上形成树脂的电器外壳。树脂模的所述第一表面与无纺布相对。
根据示例性实施例，所述方法还包括通过尿烷基粘合剂将所述无纺布附着到图案化的木质膜上。
根据示例性实施例，所述方法还包括提供包括聚碳酸酯膜的树脂膜。
根据示例性实施例，所述方法还包括通过湿固化聚氨酯粘合剂将所述树脂膜附着到无纺布的表面上。
附图说明
通过参照附图对示例性实施例的详细描述，上述和其他特点和优点将会变得更加清楚。附图意图描述示例性实施例，不应该被解释为限制权利要求请求保护的范围。不应该将附图理解为是按照比例绘制的，除非有明确声明。
图1和图2是根据示例性实施例的木质膜复合结构的截面图；
图3至图5是示出根据示例性实施例的使用压模成型木质膜复合结构的方法的示意图；
图6是通过压模将木质膜复合结构的一部分变形/成型为期望的形状的木质膜复合结构的透视图；
图7是变形/成型的木质膜复合结构在通过修剪剪切一部分之后的透视图；
图8是示出其中图7的剪切后的木质膜复合结构被插入到注射模具中的注射成型工艺的示意图。
具体实施方式
这里公开了详细的示例性实施例。然而，这里公开的特定结构和功能性细节仅仅是作为代表用来描述示例性实施例的。然而，示例性实施例可以以各种可替换的形式实现，并且不应该被理解为仅仅局限于这里阐述的实施例。
因此，虽然示例性实施例能够具有各种修改和可选择的形式，但是在附图中以示例的方式示出其实施例，并且将在这里详细描述其实施例。然而，应该理解的是，没有打算将示例性实施例局限于所公开的特定形式，相反，示例性实施例将覆盖落入示例性实施例范围内的所有修改、等同物和替换物。在附图的整个描述中，相同的标号始终指代相同的元件。
应该理解的是，尽管这里可以使用术语第一、第二等来描述各种元件，但是这些元件不应该受这些术语的限制。这些术语仅仅用于将一个元件与另一个元件区分开。例如，第一元件可以被称为第二元件，类似地，在不脱离示例性实施例的范围的情况下，第二元件可以被命名为第一元件。如这里所使用的，术语“和/或”包括所列相关项中的一个或多个的任何和所有组合。应该理解的是，当元件被描述为“连接”或“结合”到另一元件时，该元件可以直接连接或结合到另一元件，或者可存在中间元件。相反，当元件被描述为“直接连接”或“直接结合”到另一元件时，不存在中间元件。用于描述元件之间的关系的其他词语(例如，“位于......之间”与“直接位于......之间”，“相邻”与“直接相邻”等)可以以类似的方式来解释。
这里使用的术语仅仅是为了描述特定实施例，不应该理解为受示例性实施例的限制。如这里使用的，单数形式应该被理解为还包括复数形式，除非上下文有明确的相反指示。还应该理解的是，当在这里使用术语“包括”、“由......组成”、“包含”等时，说明存在所述特征、整体、步骤、操作、元件和/或组件，但是不排除存在或添加一个或多个其他特征、整体、步骤、操作、元件、组件和/或它们所形成的组。
还应该注意的是，在一些可选择的实施方式中，标示出的功能/动作可以不按照附图中标示出的顺序发生。例如，根据所涉及的功能性/动作，连续示出的两幅附图实际上可以基本上同时执行，或者有时候可以按照相反的顺序执行。
如图1所示出的，根据示例实施例的木质膜复合结构10包括由木材制成的图案化的膜11。
如果图案化的木质膜11的厚度小于特定值，则图案化的木质膜11可能会被很小的外力损坏，因此使得难以对木质膜进行处理。因此，尽管需要将图案化的木质膜11设置为大于期望的厚度，但是厚的图案化的木质膜11会具有较弱的柔韧性，因此，导致木质膜复合结构的成型会相对困难。
因此，木质膜复合结构10包括附着到图案化的木质膜11的后表面上的无纺布12。通过利用尿烷基粘合剂(urethane-basedadhesive)将无纺布12附着到图案化的木质膜11上。附着到图案化的木质膜11的后表面上的无纺布12用于加强图案化的木质膜11，防止图案化的木质膜11在形成木质膜复合结构10的过程中受到损坏。
在将无纺布12附着到具有超过期望厚度的图案化的木质膜11的后表面之后，图案化的木质膜11经过研磨，从而减小厚度，如图2所示。以这种方式，可获得具有期望的柔韧性和特定强度的木质膜复合结构10。
木质膜复合结构10包括附着到无纺布12的后表面上的树脂膜13。树脂膜13用于将木质膜复合结构10保持为期望的或设定的形状。在示例性实施例中，考虑到要附着到电器外壳，树脂膜13由聚碳酸酯制成，并且通过使用湿固化聚氨酯(moisture-curablepolyurethane)将树脂膜13附着到无纺布12的后表面上。
当木质膜复合结构10包括图案化的木质膜11、无纺布12和树脂膜13(如上所述)时，可防止图案化的木质膜11在成型过程中遭到损坏，并且可相对容易地将木质膜复合结构10成型为期望的形状。
下面，将描述将具有上面的描述的构造的木质膜复合结构10成型为期望的形状的方法。
首先，通过使用尿烷基粘合剂将无纺布12附着到图案化的木质膜11的后表面上，然后通过利用湿固化聚氨酯粘合剂将树脂膜13附着到无纺布12的后表面上，获得如图1中所示的木质膜复合结构10。
接下来，形成木质膜复合结构10的前表面的图案化的木质膜11经过研磨和/或打磨以减小木质膜复合结构10的厚度，如图2中所示。如上所述，由于无纺布12附着到图案化的木质膜11的后表面上，以加强图案化的木质膜11，因此，可以防止在打磨和/或研磨的过程中外力施加到图案化的木质膜11上时损坏图案化的木质膜11。
通过研磨减小图案化的木质膜11的厚度可增加图案化的木质膜11的柔韧性。因此，在使用如图3中所示的压模20成型木质膜复合结构10时图案化木质膜11不会损坏。
用于成型木质膜复合结构10的压模20包括第一压模21和第二压模23。位置固定的第一压模21包括第一压模表面21a，第一压模表面21a下凹，以与木质膜复合结构10的期望的变形形状对应。第二压模23被安装为可向着第一压模21或远离第一压模21而往复移动。第二压模23包括第二压模表面23a，第二压模表面23a外凸地形成为与下凹的第一压模表面21a对应。清楚的是，第一压模表面21a和第二压模表面23a的形状为设计选择。
压模20还包括支撑模具22，支撑模具22可向着第一压模21或者远离第一压模21而往复运动，从而可根据第一压模21上的木质膜的位置而选择性地支撑第一压模21上的木质膜复合结构10。第一压模21包括第一支撑部分21b，第一支撑部分21b向着支撑模具22突出，以使第一压模21和支撑模具22之间保持期望的距离。支撑模具22包括第二支撑部分22a，第二支撑部分22a向着第一压模21的与下凹的第一压模表面21a相邻的部分突出。在支撑模具22和第一压模21通过第一支撑部分21b相互支撑以在它们之间保持期望的距离的状态下，第二支撑部分22a可移动地支撑木质膜10的外缘部分。
在示例实施例中，第二压模23可往复运动地安装在支撑模具22上，从而从支撑模具22突出出来。因此，第二压模23可沿着支撑模具22往复运动，或者可独立于支撑模具22而被移动，从而进一步从支撑模具22突出出来。
如果在木质膜复合结构10放置在第一压模21上从而覆盖下凹的第一压模表面21a之后向着第一压模21移动支撑模具22，则安装在支撑模具22上而从支撑模具22突出的第二压模23沿着支撑模具22移动，如图4中所示。从而，第二压模23的第二压模表面23a移动进入第一压模表面21a，并进行动作以使木质膜复合结构10的一部分移动进入下凹的第一压模表面21a中。
在移动期望的距离之后，支撑模具22由第一支撑部分21b支撑，从而与第一压模21保持期望的距离。在这种状态下，木质膜复合结构10的外边缘部分由第二支撑部分22a可移动地支撑。
在支撑模具22的移动完成之后，如图5所示，第二压模23向着第一压模21移动，从而第二压模表面23a更深地移动进入凹陷的第一压模表面21a。将第二压模表面23a移动进入下凹的第一压模表面21a可使木质膜复合结构10延展。如上所述，由于木质膜复合结构10的外缘部分由第二支撑部分22a可移动地支撑，所以木质膜复合结构10的外缘部分可部分移动进入下凹的第一压模表面21a中。当木质膜复合结构10在移动进入下凹的第一压模表面21a的同时延展/伸展时，木质膜复合结构10的延展率不大。因此，可防止图案化的木质膜11在使用压模20成型的过程中受到损坏。
尽管在附图中没有示出，但是，压模20可包含加热装置，所述加热装置将热量施加给木质膜复合结构10，从而使得木质膜复合结构10软化，更具体地，使木质膜复合结构10的树脂膜13软化。
以这种方式，在使用压模20成型的过程，木质膜复合结构10可被软化，从而在接收到从加热装置产生的热量时被相对容易地延展/伸展，同时可以变形/成型进入与第一压模表面21a和第二压模表面23a之间的空间对应的空间中。
木质膜复合结构10的树脂膜13由于从压模20的加热装置产生的热量而被临时软化，然后随着温度降低而被硬化。由于硬化的树脂膜13用于保持木质膜复合结构10变形/成型，因此，可完成木质膜复合结构10，其中木质膜复合结构10的一部分变形/成型为如图6所示的期望的形状。
通过剪切(例如，修剪)木质膜复合结构10的变形/成型的部分，以制作如图7所示的所剪切的木质膜复合结构10’。所剪切的木质膜复合结构10’被插入到如图8中所示的注射模具30中，通过注射成型，由树脂制作的电器外壳40形成在所剪切的木质膜复合结构10’的后表面上。以这种方式，制作所剪切的木质膜复合结构10’附着到其表面上的电器外壳40。在这种情况下，由于树脂膜13由相对于上面描述的各种树脂具有超级附着性能的聚碳酸酯制成，因此，所剪切的木质膜复合结构10’稳定地附着到电器外壳40的表面上。
注射模具30包括第一注射模具31和第二注射模具32，第一注射模具31具有与所剪切的木质膜复合结构10’的前表面相应的第一注射模具表面31a，第二注射模具32具有被布置为在距离所剪切的木质膜复合结构10’的后表面期望的距离处与第一注射模具表面31a面对的第二注射模具表面32a。随着融化的树脂被注射到木质膜复合结构10的后表面与第二注射模具表面32a之间的空间中并固化，制作出具有与木质膜复合结构10的后表面和第二注射模具表面32a之间的空间对应的形状的电器外壳40。
通过上面描述清楚的是，在根据示例实施例的木质膜复合结构中，无纺布被附着到图案化的木质膜的后表面上，以加固图案化的木质膜。相应地，图案化的木质膜可以被研磨，以具有减小的厚度，获得增加的柔韧性，结果使得木质膜复合结构被相对容易地成型为与电器外壳的外表面相应的形状。
因此已经描述了示例性实施例，显而易见的是，相同的方式可以以多种方式改变。这些变型不应该被看作是脱离示例实施例的精神和范围，并且对于本领域技术人员来说将会是显而易见的所有这些变型应该被包含在权利要求的范围内。

Claims (6)

1.一种成型用于电器外壳的木质膜复合结构的方法，所述方法依次包括以下步骤：
将无纺布附着到图案化的木质膜的第一表面上；
将树脂膜附着到无纺布的表面上；
研磨图案化的木质膜的第二表面，以减小所述图案化的木质膜的厚度，从而增加图案化的木质膜的柔韧性，并形成木质膜复合结构，所述第二表面与所述第一表面相对；
通过使用压模挤压和加热所述木质膜复合结构，将木质膜复合结构的一部分成型为期望的形状。
2.如权利要求1所述的方法，还包括：剪切所述木质膜复合结构的所成型的部分。
3.如权利要求2所述的方法，还包括：
将所剪切的木质膜复合结构插入用于形成电器外壳的注射模具中，在所剪切的木质膜复合结构的树脂膜的第一表面上形成树脂的电器外壳，所述第一表面与无纺布相对。
4.如权利要求1所述的方法，还包括：
通过脲烷基粘合剂将所述无纺布附着到图案化的木质膜上。
5.如权利要求1所述的方法，还包括：
提供包括聚碳酸酯膜的树脂膜。
6.如权利要求1所述的方法，还包括：
通过湿固化聚氨酯粘合剂将所述树脂膜附着到无纺布的表面上。
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