CN102433537A - 镀膜件及其制作方法 - Google Patents
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Abstract
本发明提供一种镀膜件及该镀膜件的制作方法。该镀膜件包括一基体及一形成于基体表面的抗指纹层，该抗指纹层包括一第一抗指纹层及一第二抗指纹层，该第一抗指纹层形成于基体的表面，该第二抗指纹层形成于第一抗指纹层的表面，该第一抗指纹层为聚四氟乙烯层，该第二抗指纹层为聚四氟乙烯与铝氧氮的混合物层。该镀膜件的制作方法包括如下步骤：提供一基体；采用真空溅镀法在该基体的表面溅镀聚四氟乙烯层以形成一第一抗指纹层；采用真空溅镀法在该第一抗指纹层的表面溅镀聚四氟乙烯与铝氧氮的混合物层以形成一第二抗指纹层。
Description
技术领域
本发明涉及一种镀膜件及其制作方法，尤其涉及一种具有抗指纹功能的镀膜件及该镀膜件的制作方法。
背景技术
传统技术中，早期抗指纹化处理一般是采用在镀锌层上形成铬酸盐层及特殊的树脂层。该方法需要使用铬酸盐处理，环境污染严重且工序复杂，对基材的要求也高。
随着技术的发展，目前通常将具有抗指纹性能的涂料或溶液涂覆于基材的表面来实现抗指纹功能。该具有抗指纹性能的涂料或溶液通常含有毒的有机物，对环境及人体健康不利，且所述的有机物一般来说结构复杂，难以制备。
为了避免上述问题，现有技术中有提出以真空蒸镀的方式在塑料板材上镀覆聚四氟乙烯层以实现抗指纹的功能。然而，该聚四氟乙烯层的耐磨性很差，使用过程中很容易被磨损，而导致抗指纹功能的失效。
发明内容
鉴于此，有必要提供一种环保的、且具有持久抗指纹功能的镀膜件。
另外，还有必要提供一种上述镀膜件的制作方法。
一种镀膜件，其包括一基体及一形成于基体表面的抗指纹层，该抗指纹层包括一第一抗指纹层及一第二抗指纹层，该第一抗指纹层形成于基体的表面，该第二抗指纹层形成于第一抗指纹层的表面，该第一抗指纹层为聚四氟乙烯层，该第二抗指纹层为聚四氟乙烯与铝氧氮的混合物层。
一种镀膜件的制作方法，其包括如下步骤：
提供一基体；
采用真空溅镀法在该基体的表面溅镀聚四氟乙烯层以形成一第一抗指纹层；
采用真空溅镀法在该第一抗指纹层的表面溅镀聚四氟乙烯与铝氧氮的混合物层以形成一第二抗指纹层。
相较于现有技术，所述的镀膜件采用真空溅镀的方法在基体表面依次形成一聚四氟乙烯层及一聚四氟乙烯与铝氧氮的混合物层得以实现良好的抗指纹的功能，且该聚四氟乙烯与铝氧氮的混合物层具有较高的硬度及较好的耐磨性，可防止所述抗指纹层被磨损，使得所述的镀膜件的抗指纹功能更持久。
附图说明
图1是本发明一较佳实施方式的镀膜件的剖视示意图。
主要元件符号说明
镀膜件 10
基体 11
抗指纹层 13
第一抗指纹层 131
第二抗指纹层 133
具体实施方式
请参阅图1，本发明一较佳实施方式的镀膜件10包括基体11及形成于基体11表面的抗指纹层13。该抗指纹层13包括一第一抗指纹层131及一第二抗指纹层133。
基体11可由金属材料或塑料制成。
第一抗指纹层131为一聚四氟乙烯层，其可以真空溅镀的方式形成于基体11的表面。
第二抗指纹层133为一聚四氟乙烯与铝氧氮(AlON)的混合物层，其可以真空溅镀的方式形成于第一抗指纹层131的表面。
所述第一抗指纹层131与第二抗指纹层133的总厚度可为1μm以下，优选为0.1～0.5μm。该第一抗指纹层131与第二抗指纹层133均为透明状。
本发明一较佳实施方式的制作上述镀膜件10的方法包括如下步骤：
提供一基体11，并对该基体11进行前处理。该前处理可包括以下步骤：
将基体11放入盛装有乙醇及/或丙酮溶液的超声波清洗器中进行超声波清洗，以除去基体11表面的杂质和油污等。
对经超声波清洗后的基体11的表面进行等离子体清洗，以进一步去除基体11表面的脏污，以及改善基体11表面与后续涂层的结合力。将基体11放入一真空溅镀机(图未示)的镀膜室中，抽真空该镀膜室至真空度为4.0×10-3Pa，然后通入流量为300～500sccm(标准毫升每分)的工作气体氩气(纯度为99.999％)，对基体11施加-300～-500V的偏压，使镀膜室中产生高频电压，使所述氩气发生离子化而产生氩气等离子体对基体11的表面进行物理轰击，而达到对基体11表面等离子体清洗的目的。所述等离子体清洗的时间可为3～10min。
所述等离子体清洗完成后，继续在所述镀膜室中以真空溅镀法在基体11的表面溅镀抗指纹层13，溅镀该抗指纹层13包括分别溅镀第一抗指纹层131及第二抗指纹层133的步骤。
溅镀该第一抗指纹层131时，加热所述镀膜室的温度至20～300℃(即溅镀温度为20～300℃)，以聚四氟乙烯为靶材，并对基体11施加-100～-300V的偏压，调节镀膜室中氩气的流量至5～150sccm，并通入流量为5～70sccm的氮气及5～60sccm的乙炔气体，开启靶材的电源，于基体11的表面沉积所述第一抗指纹层131。沉积该第一抗指纹层131的时间可为20～60分钟。
沉积所述第一抗指纹层131后，停止通入乙炔气体，向所述镀膜室中再通入流量为10～60sccm的反应气体氧气，同时开启聚四氟乙烯靶材及铝靶材的电源，以继续于所述第一抗指纹层131的表面溅镀一第二抗指纹层133。该第二抗指纹层133为聚四氟乙烯与铝氧氮的混合物层。溅镀该第二抗指纹层133的时间可为20～60分钟。
对所述镀膜件10进行了辉光放电发射光谱(GD-OES)测试，由所述第二抗指纹层133的表面向第一抗指纹层131的方向读谱，发现第二抗指纹层133中的Al、O、N各元素的分布较均匀。
使用ACCU牌(产地：美国)的达因笔对所述抗指纹层13的抗指纹性能进行了测试。结果表明该抗指纹层13的表面张力小于30达因，具有较好的抗指纹功能。
相较于现有技术，所述的镀膜件10采用真空溅镀的方法在基体11表面依次形成一聚四氟乙烯层及一聚四氟乙烯与铝氧氮的混合物层得以实现良好的抗指纹的功能，且该聚四氟乙烯与铝氧氮的混合物层具有较高的硬度及较好的耐磨性，可防止所述抗指纹层13被磨损，使得所述的镀膜件10的抗指纹功能更持久。
Claims (10)
1.一种镀膜件，其包括一基体及一形成于基体表面的抗指纹层，其特征在于：该抗指纹层包括一第一抗指纹层及一第二抗指纹层，该第一抗指纹层形成于基体的表面，该第二抗指纹层形成于第一抗指纹层的表面，该第一抗指纹层为聚四氟乙烯层，该第二抗指纹层为聚四氟乙烯与铝氧氮的混合物层。
2.如权利要求1所述的镀膜件，其特征在于：所述第一抗指纹层与第二抗指纹层的总厚度为1μm以下。
3.如权利要求2所述的镀膜件，其特征在于：所述第一抗指纹层与第二抗指纹层的总厚度为0.1～0.5μm。
4.如权利要求1所述的镀膜件，其特征在于：所述第一抗指纹层与第二抗指纹层均以真空溅镀的方式制成。
5.如权利要求1所述的镀膜件，其特征在于：所述基体由金属材料或塑料制成。
6.一种镀膜件的制作方法，其包括如下步骤：
提供一基体；
采用真空溅镀法在该基体的表面溅镀聚四氟乙烯层以形成一第一抗指纹层；
采用真空溅镀法在该第一抗指纹层的表面溅镀一聚四氟乙烯与铝氧氮的混合物层以形成一第二抗指纹层。
7.如权利要求6所述的镀膜件的制作方法，其特征在于：溅镀所述第一抗指纹层以聚四氟乙烯为靶材，对基体设置-100～-300V的偏压，溅镀温度为20～300℃，通入的氩气的流量为5～150sccm，氮气的流量为5～70sccm，乙炔的流量为5～60sccm，溅镀时间为20～60分钟。
8.如权利要求6所述的镀膜件的制作方法，其特征在于：溅镀所述第二抗指纹层同时开启聚四氟乙烯靶材及铝靶材，对基体设置-100～-300V的偏压，溅镀温度为20～300℃，通入的氩气的流量为5～150sccm，氮气的流量为5～70sccm，氧气的流量为10～60sccm，溅镀时间为20～60分钟。
9.如权利要求6所述的镀膜件的制作方法，其特征在于：所述制作方法还包括在溅镀第一抗指纹层前对基体进行进行超声波清洗及等离子体清洗的步骤。
10.如权利要求6所述的镀膜件的制作方法，其特征在于：所述基体由金属材料或塑料制成。
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| KR20140142123A (ko) * | 2013-05-31 | 2014-12-11 | 삼성전자주식회사 | 다층박막의 제조방법, 다층박막이 형성된 부재, 및 이를 포함하는 전자제품. |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101113512A (zh) * | 2007-07-06 | 2008-01-30 | 青岛大学 | 一种氟碳高分子/纳米氧化锌杂化材料的制备方法 |
| CN101349769A (zh) * | 2008-09-11 | 2009-01-21 | 北京有色金属研究总院 | 光学元件用AlON保护膜的制备方法 |
| CN101508192A (zh) * | 2009-03-30 | 2009-08-19 | 天津美泰真空技术有限公司 | 手机保护屏用聚合板材抗手指纹膜及其制备方法 |
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| US20040229051A1 (en) * | 2003-05-15 | 2004-11-18 | General Electric Company | Multilayer coating package on flexible substrates for electro-optical devices |
| CN101369467B (zh) * | 2007-08-13 | 2013-01-09 | 鸿富锦精密工业（深圳）有限公司 | 保护屏制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101113512A (zh) * | 2007-07-06 | 2008-01-30 | 青岛大学 | 一种氟碳高分子/纳米氧化锌杂化材料的制备方法 |
| CN101349769A (zh) * | 2008-09-11 | 2009-01-21 | 北京有色金属研究总院 | 光学元件用AlON保护膜的制备方法 |
| CN101508192A (zh) * | 2009-03-30 | 2009-08-19 | 天津美泰真空技术有限公司 | 手机保护屏用聚合板材抗手指纹膜及其制备方法 |
Non-Patent Citations (1)
| Title |
|---|
| 牛永平 等: "纳米氧化铝改性聚四氟乙烯的摩擦磨损性能研究", 《工程塑料应用》, vol. 38, no. 2, 10 February 2010 (2010-02-10), pages 59 - 62 * |
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