CN102418691B - Novel method for fully automatically detecting pump failure - Google Patents
Novel method for fully automatically detecting pump failure Download PDFInfo
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- CN102418691B CN102418691B CN201110194146.0A CN201110194146A CN102418691B CN 102418691 B CN102418691 B CN 102418691B CN 201110194146 A CN201110194146 A CN 201110194146A CN 102418691 B CN102418691 B CN 102418691B
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Abstract
The invention discloses a novel method for fully automatically detecting a pump failure. In the method, silicon chips are conveyed into a process cavity in sequence for manufacturing, and a pump is used for vacuumizing the process cavity by a certain vacuum degree. The method is characterized in that: a step for detecting the bottom pressure of the pump is added for detecting the bottom pressure state of the pump in a process period after a precious silicon chip is manufactured in the process cavity and before a next silicon chip enters the process cavity. In the novel method for fully automatically detecting a pump failure, a step for setting specific conditions is added for automatically detecting the bottom pressure of the pump before a process formula is completed, so that full automatic detection of the bottom pressure of the pump is realized effectively, and silicon chip discarding caused by particles produced due to the pump failure is prevented. According to the method, resource consumption and waste of machine hour caused by manual machine halt and manual detection are avoided, and the yield risk caused by ultralow frequency of the conventional detection method is avoided simultaneously.
Description
Technical field
The present invention relates to a kind of technical field of manufacturing semiconductors, relate in particular to a kind of for pump being carried out to the full-automatic method losing efficacy that detects.
Background technique
Pump is for processing chamber provides certain degree of vacuum, makes thereby make silicon chip be able to carry out technique under the certain vacuum environment of processing chamber.If pump lost efficacy, for example pumping speed is inadequate, and can cause has residual gas in processing chamber and silicon chip is produced to particle impact; Time of serious failure, can make processing chamber reverse flowing of air flows, cause silicon chip to be scrapped thereby the silicon chip in technique is produced to serious particle contaminant.The detecting method of the pump that industry is general is at present manually to shut down manual detection, but frequency mostly is once a day most.Waste when the human resources consumption that traditional method can be brought and machine, and detection frequency far can not cover the silicon chip risk that production capacity is brought.
Fig. 1 is a kind of schematic diagram of process cycle process, shown in Figure 1.In the existing one-time process cycle 1, by carrying out, one-time process is manufactured menu (wafer process recipe) and a chamber clean menu (chamber clean recipe) carries out working process.And then continue to carry out process cycle 2 next time.
Summary of the invention
The invention provides a kind of method that full-automatic testing pump lost efficacy; set specific condition step by increasing before existing technique formula finishes; be used for the base pressure of automatic testing pump; thereby the waste while avoiding manually shutting down resource consumption that manual detection brings and machine, also solves too low the brought production capacity risk of frequency of traditional detecting method simultaneously.
To achieve these goals, the technological scheme that the present invention takes is:
A kind of method that full-automatic testing pump lost efficacy, wherein, silicon chip is to be sent to successively in processing chamber to carry out manufacture process, and pump is used to processing chamber and extracts certain degree of vacuum, it is characterized in that, after upper a slice silicon chip finishes to manufacture in processing chamber, lower a slice silicon chip does not also enter before processing chamber, increase the step that the base pressure of pump detects, for detection of the base pressure state of pump that is arranged in process cycle.
In further embodiment of the present invention, after upper a slice silicon chip finishes to manufacture, lower a slice silicon chip is the one-time process cycle before also not entering processing chamber, and this one-time process cycle comprises silicon chip manufacturing step and chamber clean step successively.
In further embodiment of the present invention, in silicon chip manufacturing step, silicon chip is arranged in processing chamber.
In further embodiment of the present invention, in chamber clean step, silicon chip is not in processing chamber.
In further embodiment of the present invention, base pressure testing conditions step is specially: after upper a slice silicon chip finishes to manufacture, lower a slice silicon chip does not also enter before processing chamber, and before chamber clean step finishes, inserts the base pressure detecting step to pump.
In further embodiment of the present invention, if the air pressure base pressure numerical value that chamber is measured lower than setting value, effect of testing pump meets the requirements, and makes other silicon chip enter processing chamber to complete next process cycle.
In further embodiment of the present invention, if the air pressure base pressure numerical value that chamber is measured is greater than or equal to setting value, and 3 seconds air pressure base pressure numerical value that inner cavity chamber measures still greater than or equal to setting value, system alarm is set, and automatically skip detection condition step, stops starting the manufacture process of lower a slice silicon chip.
The present invention is owing to having adopted above-mentioned technology, and the good effect that makes it to have is:
By increasing and set specific condition step, be used for the base pressure of automatic testing pump before technique formula finishes.Detection is arranged on a slice silicon chip and finishes after manufacture, and lower a slice silicon chip does not also enter before processing chamber.The full-automatic base pressure of effectively realizing pump detects, and prevents because the silicon chip that the particle that pump inefficacy produces causes is scrapped.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of process cycle process;
Fig. 2 is a kind of schematic diagram of method of full-automatic testing pump inefficacy.
Embodiment
Provide the embodiment of the method for a kind of full-automatic testing pump inefficacy of the present invention below in conjunction with accompanying drawing.
Fig. 2 is a kind of schematic diagram of method of full-automatic testing pump inefficacy, shown in Figure 2.The method that a kind of full-automatic testing pump of the present invention lost efficacy, silicon chip is to be sent to successively in processing chamber to carry out manufacture process, and pump is used to processing chamber to extract certain degree of vacuum, before the one-time process cycle 1 finishes, after upper a slice silicon chip finishes to manufacture, lower a slice silicon chip does not also enter before processing chamber, increases the base pressure testing conditions step 3 of a pump, is used for automatically detecting the base pressure state of the pump that is arranged in process cycle 1.
The present invention also has following mode of execution on the basis of the above:
The one-time process cycle 1 specifically includes carries out a silicon chip manufacturing step (by selecting technique to manufacture menu 11) and a chamber clean step (by selecting chamber clean menu 12), simultaneously, in silicon chip manufacturing step, silicon chip is arranged in processing chamber; When silicon chip is in chamber clean step, silicon chip is not in processing chamber.Then chamber is carried out to base pressure detection, if the air pressure base pressure numerical value that chamber is measured meets the requirements, other silicon chip is entered to processing chamber to complete process cycle 2 next time.
The mode of execution that the present invention takes is on the basis of the above as follows:
Use base pressure testing conditions step 3 to detect.Before chamber clean step finishes, allow pump with maximum capacity, processing chamber be vacuumized with the time about 10 seconds, at this moment the air pressure in chamber is the base pressure of pump capacity.The meaning that increases the base pressure detection of pump is: be to realize by the detection to chamber pressure to the base pressure detecting step of pump, if chamber pressure for example, lower than setting value (8mTorr, this numerical value sets in advance according to actual needs, the concrete numerical value that the application provides and as the restriction of this invention), think that the vacuum drawn ability of pump is normal, it is qualified that chamber pressure meets detection, the automatic skip detection condition of system step, makes other silicon chip enter processing chamber to complete process cycle 2 next time, if chamber pressure for example, greater than or equal to setting value (8mTorr, this numerical value sets in advance according to actual needs, but must be clear that, the concrete numerical value that the application provides and as the restriction of this invention), and (this numerical value sets in advance according to actual needs within 3 seconds, specifically numerical value the restriction as this invention, this number range can also be done other adjustment according to actual needs) the air pressure base pressure numerical value measured of chamber is still greater than or equal to setting value 8mTorr, think that the vacuum drawn ability of pump is abnormal, the system that arranges produces reports to the police, and automatically jump out testing conditions step, stop starting the manufacture process of lower a slice silicon chip.
In sum, the method that uses a kind of full-automatic testing pump of the present invention to lose efficacy, set specific condition step by increasing before technique formula finishes, be used for the base pressure of automatic testing pump, the full-automatic base pressure of effectively realizing pump detects, and prevents because the silicon chip that the particle that pump inefficacy produces causes is scrapped.Thereby the waste while avoiding manually shutting down resource consumption that manual detection brings and machine, also solves too low the brought production capacity risk of frequency of traditional detecting method simultaneously.
The foregoing above specific embodiments of the invention being described, is specifically related to the occurrence that some pressure or time sets, and only for for the ease of understanding the present invention, but does not form restrictive condition of the present invention.
Above specific embodiments of the invention are described.It will be appreciated that, the present invention is not limited to above-mentioned specific implementations, and the method for wherein not describing in detail to the greatest extent and processing procedure are construed as to be implemented with the common mode in related domain; Those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.All any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
1. the method that full-automatic testing pump lost efficacy, wherein, silicon chip is to be sent to successively in processing chamber to carry out manufacture process, and pump is used to processing chamber and extracts certain degree of vacuum, it is characterized in that, after upper a slice silicon chip finishes to manufacture in processing chamber, lower a slice silicon chip does not also enter before processing chamber, increase the step that the base pressure of pump detects, for detection of the base pressure state of pump that is arranged in process cycle;
Wherein, if the air pressure base pressure numerical value that chamber is measured lower than setting value, effect of testing pump meets the requirements, and makes other silicon chip enter processing chamber to complete next process cycle; If the air pressure base pressure numerical value that chamber is measured is greater than or equal to setting value, and 3 seconds air pressure base pressure numerical value that inner cavity chamber measures still greater than or equal to setting value, system alarm is set, and automatic skip detection condition step, stops starting the manufacture process of lower a slice silicon chip.
2. the method that full-automatic testing pump lost efficacy according to claim 1, it is characterized in that, after upper a slice silicon chip finishes to manufacture, lower a slice silicon chip is the one-time process cycle before also not entering processing chamber, and this one-time process cycle comprises silicon chip manufacturing step and chamber clean step successively.
3. the method that full-automatic testing pump lost efficacy according to claim 2, is characterized in that, in silicon chip manufacturing step, silicon chip is arranged in processing chamber.
4. the method that full-automatic testing pump lost efficacy according to claim 2, is characterized in that, in chamber clean step, silicon chip is not in processing chamber.
5. the method that full-automatic testing pump lost efficacy according to claim 1, it is characterized in that, base pressure testing conditions step is specially: after upper a slice silicon chip finishes to manufacture, lower a slice silicon chip does not also enter before processing chamber, and before chamber clean step finishes, insert the base pressure detecting step to pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110194146.0A CN102418691B (en) | 2011-07-12 | 2011-07-12 | Novel method for fully automatically detecting pump failure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110194146.0A CN102418691B (en) | 2011-07-12 | 2011-07-12 | Novel method for fully automatically detecting pump failure |
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| CN102418691A CN102418691A (en) | 2012-04-18 |
| CN102418691B true CN102418691B (en) | 2014-12-10 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115596657B (en) * | 2022-12-14 | 2023-03-24 | 中海油田服务股份有限公司 | Motor pump detection system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101173953A (en) * | 2006-09-30 | 2008-05-07 | 亚申科技研发中心（上海）有限公司 | System and method for sampling tests |
| CN101360678A (en) * | 2005-12-05 | 2009-02-04 | 恩特格里公司 | Error volume system and method for a pump |
| CN101506949A (en) * | 2006-08-24 | 2009-08-12 | 东京毅力科创株式会社 | Apparatus and method for processing substrate, method of manufacturing semiconductor device, and recording medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4138267B2 (en) * | 2001-03-23 | 2008-08-27 | 株式会社東芝 | Semiconductor manufacturing apparatus, vacuum pump life prediction method, and vacuum pump repair timing determination method |
| JP4149691B2 (en) * | 2001-08-31 | 2008-09-10 | 株式会社東芝 | Method for predicting life of rotating machine for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus |
| JP2003077907A (en) * | 2001-08-31 | 2003-03-14 | Toshiba Corp | Method and system for avoiding abnormal stop of manufacturing apparatus |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360678A (en) * | 2005-12-05 | 2009-02-04 | 恩特格里公司 | Error volume system and method for a pump |
| CN101506949A (en) * | 2006-08-24 | 2009-08-12 | 东京毅力科创株式会社 | Apparatus and method for processing substrate, method of manufacturing semiconductor device, and recording medium |
| CN101173953A (en) * | 2006-09-30 | 2008-05-07 | 亚申科技研发中心（上海）有限公司 | System and method for sampling tests |
Non-Patent Citations (1)
| Title |
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| JP特开2002-285974A 2002.10.03 * |
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| CN102418691A (en) | 2012-04-18 |
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