CN202025020U - Test socket capable of automatically removing dust - Google Patents
Test socket capable of automatically removing dust Download PDFInfo
- Publication number
- CN202025020U CN202025020U CN2011200457540U CN201120045754U CN202025020U CN 202025020 U CN202025020 U CN 202025020U CN 2011200457540 U CN2011200457540 U CN 2011200457540U CN 201120045754 U CN201120045754 U CN 201120045754U CN 202025020 U CN202025020 U CN 202025020U
- Authority
- CN
- China
- Prior art keywords
- chip
- connector body
- external vacuum
- test
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to a test socket capable of automatically removing dust, which mainly comprises a base plate, a connector body, a chip, a passageway and an external vacuum nozzle, wherein the connector body is fixed on the base plate, the chip is one part of the connector body, the passageway surrounds the chip, and the external vacuum nozzle is arranged on the side face of the test socket. The test socket can prevent the dust from being accumulated in the socket, so that the times for cleaning and maintaining the socket are reduced, and the test efficiency is effectively improved.
Description
Technical field
Test jack is a kind of a kind of equipment that is electrically connected in field widespread uses such as integrated circuit testing, Department of Electronics's tracking, programmable chip burning, circuit malfunction analyses.Particularly in the integrated circuit testing industry, test jack is one of key that guarantees test yield, raising testing efficiency as the interface between test machine system and the chip under test.
Background technology
The cost of integrated circuit automated test device is very high, therefore improves testing efficiency, reduces the number of times of shutting down because of test jack maintenance, cleaning, and is extremely important.In QFN packaged integrated circuits test process, particularly spring probe phenomenon on every side is particularly serious in socket for debris accumulation, and therefore traditional socket needs regularly to shut down except that chip, ultrasound wave cleaning.
The utility model content
For solving the problems of the technologies described above, the utility model provides following technical scheme:
A kind of test jack of automatic debris removal, it mainly is made up of base plate, connector body, chip, runner and external vacuum slot, wherein connector body is fixed on the base plate, chip is the part of connector body, runner is centered around around the chip, and an external vacuum slot is arranged in the side of test jack.
Wherein, the test jack of above-mentioned automatic debris removal, external vacuum slot is by the external vacuum pump of external vacuum slot interface.Automatically the chip of the test jack of debris removal is in the centre of connector body.
During use, open vacuum pump, the chip that chip under test can be brought siphons away, thereby can avoid debris accumulation in socket, thereby reduces the number of times of socket cleaning maintenance, effectively improves testing efficiency.
Description of drawings
Fig. 1 is the structural drawing of the utility model test jack;
Fig. 2 is the sectional view of the utility model test jack;
Fig. 3 is the runner distribution plan of the utility model test jack.
Wherein, 1 is base plate, and 2 is connector body, and 3 is runner, and 4 is chip, and 5 is external vacuum slot interface, and 6 are gas flow, and 7 is socket main body, and 8 is air flue, and 9 is external vacuum slot.
Embodiment
A kind of test jack of automatic debris removal, it mainly is made up of base plate 1, connector body 2, chip 4, runner 3 and external vacuum slot 9, wherein connector body 2 is fixed on the base plate, chip 4 is in the centre of connector body 2, runner 3 is centered around around the chip 4, one external vacuum slot 9 is arranged in the side of test jack, and external vacuum slot 9 can pass through external vacuum slot interface 5 external vacuum pumps.
During use, open vacuum pump, the chip that chip under test can be brought siphons away, thereby can avoid debris accumulation in socket, thereby reduces the number of times of socket cleaning maintenance, effectively improves testing efficiency.
Claims (3)
1. the test jack of an automatic debris removal, it mainly is made up of base plate, connector body, chip, runner and external vacuum slot, wherein connector body is fixed on the base plate, chip is the part of connector body, runner is centered around around the chip, and an external vacuum slot is arranged in the side of test jack.
2. the test jack of automatic debris removal according to claim 1 is characterized in that: external vacuum slot is by the external vacuum pump of external vacuum slot interface.
3. the test jack of automatic debris removal according to claim 1 is characterized in that: chip is in the centre of connector body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200457540U CN202025020U (en) | 2011-02-24 | 2011-02-24 | Test socket capable of automatically removing dust |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200457540U CN202025020U (en) | 2011-02-24 | 2011-02-24 | Test socket capable of automatically removing dust |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202025020U true CN202025020U (en) | 2011-11-02 |
Family
ID=44849965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200457540U Expired - Fee Related CN202025020U (en) | 2011-02-24 | 2011-02-24 | Test socket capable of automatically removing dust |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202025020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107356852A (en) * | 2016-05-03 | 2017-11-17 | 无锡华润安盛科技有限公司 | TSOT apparatus for testing chip |
-
2011
- 2011-02-24 CN CN2011200457540U patent/CN202025020U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107356852A (en) * | 2016-05-03 | 2017-11-17 | 无锡华润安盛科技有限公司 | TSOT apparatus for testing chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111102 Termination date: 20200224 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |