CN102384385A - LED (light emitting diode) lamp with high heat dissipation performance - Google Patents
LED (light emitting diode) lamp with high heat dissipation performance Download PDFInfo
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- CN102384385A CN102384385A CN2011103092800A CN201110309280A CN102384385A CN 102384385 A CN102384385 A CN 102384385A CN 2011103092800 A CN2011103092800 A CN 2011103092800A CN 201110309280 A CN201110309280 A CN 201110309280A CN 102384385 A CN102384385 A CN 102384385A
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- circuit board
- heat dissipation
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Abstract
The invention provides an LED (light emitting diode) lamp with a high heat dissipation performance, belongs to the technical field of LED lamps, and is used to solve the problem of poor heat dissipation effect of the existing LED lamp. The LED lamp with the high heat dissipation performance comprises a main body lamp shell and a lamp cap; a connection seat is arranged between the main body lamp shell and the lamp cap; the main body lamp shell is internally provided with an LED lamp, a printed circuit board, a heat dissipation plate and an LED driving circuit board group; one surface of the printed circuit board is provided with the LED lamp, and the other surface of the printed circuit board is installed on the heat dissipation plate; the rear surface of the heat dissipation plate is provided with the LED driving circuit board group; the board at one side of the printed circuit board which is provided with the LED lamp is provided with a return light cover; a connection line is arranged between the lamp cap and the LED driving circuit board group; a copper coating layer is sprayed and coated on one side of the printed circuit board facing to the heat dissipation plate; the printed circuit board and the heat dissipation plate are pasted tightly, and a heat conduction through hole is formed at the heat dissipation bottom plate of the LED lamp; and the heat conduction through hole is provided with a heat conduction material. The LED lamp has the advantage of good heat dissipation effect.
Description
Technical field
The invention belongs to LED lamp technical field, relate to a kind of LED lamp of high heat dispersion.
Background technology
The heat radiation of LED is more and more paid attention to by people now, and this is that the bad junction temperature of dispelling the heat is just high because the light decay of LED is directly relevant with its junction temperature with its life-span, and the life-span is just short.
The LED reason for heat is because the electric energy that is added all is not converted into luminous energy, but a part transforms into heat energy.The light efficiency of LED has only 100lm/W at present, and its electro-optical efficiency approximately has only about 20～30%, that is to say that about 70% electric energy has all become heat energy.
There are many manufacturers to integrate a lot of LED crystal grain to obtain high-power LED now.The power of this LED can reach more than the 5W, and mostly with 10W, the power grade of 25W and 50W occurs.In order to link together a plurality of LED crystal grain (with eutectic (Eutectic) or cover crystalline substance (Flip-Chip) encapsulation), because these crystal grain are very meticulous, so need to adopt accurate printed circuit to connect.
Because the thermal capacity of led chip is very little, little by little the accumulation of heat will make the junction temperature of chip improve rapidly, if be operated in the state of high junction temperature over a long time, its life-span will shorten very soon.Yet these heats are wanted really to be guided out chip and are arrived extraneous air, pass through a lot of approach.Specifically, the heat that led chip produced is come out from its heat dissipation metal piece, through the PCB of scolder to aluminium base, just arrives aluminium radiator through heat-conducting glue more earlier, in the heat conduction and heat radiation process the interface that will pass through too many, influence radiating effect.
Summary of the invention
The objective of the invention is to the existing the problems referred to above of existing LED lamp, and proposed a kind of radiating effect LED lamp preferably.
The object of the invention can be realized through following technical proposal: a kind of LED lamp of high heat dispersion; Comprise main body lamp housing and lamp holder; Be provided with Connection Block between said main body lamp housing and the lamp holder, be provided with LED lamp, printed circuit board, heat dissipation plate and led drive circuit plate group in the said main body lamp housing, the one side of said printed circuit board is provided with said LED lamp; Another side is installed on the said heat dissipation plate; The said heat dissipation plate back side is provided with and LED lamp matched L ED drive circuit board group, and said printed circuit board is provided with the light echo cover that surrounds said LED lamp, is provided with connecting line between said lamp holder and the led drive circuit plate group; It is characterized in that; Described heat dissipation plate is coated with copper plate towards a side of printed circuit board, and printed circuit board and heat dissipation plate are close to and are provided with and offer the heat conduction through hole at the radiating bottom plate place that is positioned at the LED lamp, is provided with the Heat Conduction Material that can radiating bottom plate and copper plate be fixed together in the heat conduction through hole.
For the great power LED more than the 1W, its radiating bottom plate and two electrodes are insulation usually.For it can more directly be dispelled the heat, we with radiating bottom plate directly and heat dissipation plate weld together.But general radiator all is an aluminium alloy to be processed, and can't weld, and we need spraying plating copper on heat dissipation plate earlier for this reason.So, reduced LED to the interface between the heat dissipation plate, the thermal resistance of printed circuit board and the thermal resistance of heat conductive silica gel or silicon chip are fallen in release, thereby have improved radiating efficiency greatly.
In the LED of above-mentioned a kind of high heat dispersion lamp, described Heat Conduction Material is a tin, welds together through the eutectic welding process of tin between heat radiation chassis and the copper plate.
In the LED of above-mentioned a kind of high heat dispersion lamp, described printed circuit board is through forming one deck aluminum oxide film at the aluminium surface by micro-arc oxidation earlier, making circuit layer with sputter or serigraphy again and process.The great advantage that adopts this method is that adhesion is strong, and thermal conductivity factor is up to 2.1W/m.K, and the thermal coefficient of expansion of oxide layer and aluminium are similar, so its peel strength is up to more than the 5N/mm.
In the LED of above-mentioned a kind of high heat dispersion lamp, described printed circuit board is a flexible PCB.
Compared with prior art; The LED lamp of this high heat dispersion makes the radiating bottom plate of LED directly contact with heat dissipation plate; Reduced LED to the interface between the heat dissipation plate, the thermal resistance of printed circuit board and the thermal resistance of heat conductive silica gel or silicon chip are fallen in release, thereby have improved radiating efficiency greatly.
Description of drawings
Fig. 1 is the structural representation of the LED lamp of this high heat dispersion.
Among the figure, 1, the main body lamp housing; 2, lamp holder; 3, Connection Block; 4, printed circuit board; 41, heat conduction through hole; 41a, Heat Conduction Material; 5, LED lamp; 51, radiating bottom plate; 6, led drive circuit plate group; 7, heat dissipation plate; 71, copper plate; 8, light echo cover; 81, flared shroud portion; 811, alignment pin portion; 82, planar portions; 9, lens; 10, connecting line.
The specific embodiment
Below be specific embodiment of the present invention and combine accompanying drawing, technical scheme of the present invention is done further to describe, but the present invention is not limited to these embodiment.
As shown in Figure 1; The LED lamp of this high heat dispersion comprises main body lamp housing 1, lens 9 and lamp holder 2, the main body lamp housing 1 peristome lens 9 that have been threaded, and these lens 9 are the cambered surface cover shape; It simultaneously is that convex arc is planar; The maximum radian of these lens 9 cambered surfaces is 2/5 π, and main body lamp housing 1 forms the mushroom head with lens 9, connects through Connection Block 3 between main body lamp housing 1 and the lamp holder 2.
Parts such as LED lamp 5, printed circuit board 4, heat dissipation plate 7 and led drive circuit plate group 6 are installed in the main body lamp housing 1; Wherein on printed circuit board 4 one sides LED lamp 5 is installed; Another side is installed on the heat dissipation plate 7; Heat dissipation plate 7 back sides are connected with and LED lamp 5 matched L ED drive circuit board groups 6, be equipped with on the plate face of printed circuit board 4 of LED lamp 5 one sides and be connected with the light echo cover 8 that surrounds LED lamp 5, and this light echo cover 8 plugs with heat dissipation plate 7.Light echo cover 8 comprises the flared shroud portion 81 and the planar portions 82 that is used for being connected with printed circuit board 4 that surrounds LED lamp 5; Planar portions 82 middle parts are shaped on one and supply LED lamp 5 to penetrate the square hole of light echo cover 8; It is horn-like that flared shroud portion 81 is enlarging; The degree of depth of flared shroud portion 81 and the ratio of Breadth Maximum are 1/14, also are shaped on the alignment pin portion 811 of the protrusion that can be connected with heat dissipation plate 7 on flared shroud portion 81 outer walls, between lamp holder 2 and led drive circuit plate group 6, are connected to connecting line 10.In the present embodiment, printed circuit board 4 is through forming one deck aluminum oxide film at the aluminium surface by micro-arc oxidation earlier, making circuit layer with sputter or serigraphy again and process.
Specific embodiment described herein only is that the present invention's spirit is illustrated.Person of ordinary skill in the field of the present invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Claims (4)
1. the LED lamp of a high heat dispersion; Comprise main body lamp housing (1) and lamp holder (2); Be provided with Connection Block (3) between said main body lamp housing (1) and the lamp holder (2); Be provided with LED lamp (5), printed circuit board (4), heat dissipation plate (7) and led drive circuit plate group (6) in the said main body lamp housing (1); The one side of said printed circuit board (4) is provided with said LED lamp (5), and another side is installed on the said heat dissipation plate (7), and said heat dissipation plate (7) back side is provided with and LED lamp (5) matched L ED drive circuit board group (6); Said printed circuit board (4) is provided with the light echo cover (8) that surrounds said LED lamp (5); Be provided with connecting line (10) between said lamp holder (2) and the led drive circuit plate group (6), it is characterized in that, described heat dissipation plate (7) is coated with copper plate (71) towards a side of printed circuit board (4); Printed circuit board (4) and heat dissipation plate (7) are close to and are provided with and locate to offer heat conduction through hole (41) at the radiating bottom plate that is positioned at LED lamp (5) (51), are provided with the Heat Conduction Material (41a) that can radiating bottom plate (51) and copper plate (71) be fixed together in the heat conduction through hole (41).
2. the LED lamp of a kind of high heat dispersion according to claim 1 is characterized in that, described Heat Conduction Material (41a) is a tin, welds together through the eutectic welding process of tin between heat radiation chassis and the copper plate (71).
3. the LED lamp of a kind of high heat dispersion according to claim 1 and 2 is characterized in that, described printed circuit board (4) is through forming one deck aluminum oxide film at the aluminium surface by micro-arc oxidation earlier, making circuit layer with sputter or serigraphy again and process.
4. the LED lamp of a kind of high heat dispersion according to claim 1 and 2 is characterized in that, described printed circuit board (4) is a flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103092800A CN102384385B (en) | 2011-09-30 | 2011-09-30 | LED (light emitting diode) lamp with high heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103092800A CN102384385B (en) | 2011-09-30 | 2011-09-30 | LED (light emitting diode) lamp with high heat dissipation performance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102384385A true CN102384385A (en) | 2012-03-21 |
| CN102384385B CN102384385B (en) | 2013-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103092800A Expired - Fee Related CN102384385B (en) | 2011-09-30 | 2011-09-30 | LED (light emitting diode) lamp with high heat dissipation performance |
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| Country | Link |
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| CN (1) | CN102384385B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103759235A (en) * | 2014-01-31 | 2014-04-30 | 芜湖市神龙新能源科技有限公司 | LED radiating method |
| WO2014166113A1 (en) * | 2013-04-12 | 2014-10-16 | 深圳市银盾科技开发有限公司 | Highly heat-conductive led welding method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06349451A (en) * | 1993-06-03 | 1994-12-22 | Fujitsu Ltd | Light source and liquid crystal display using it |
| EP1215735A1 (en) * | 2000-12-13 | 2002-06-19 | Chao-Chin Yeh | Improved structure of lamp |
| CN201103878Y (en) * | 2007-08-10 | 2008-08-20 | 甘翠 | LED light source and lamp using the same |
| CN101649968A (en) * | 2008-08-13 | 2010-02-17 | 佶益投资股份有限公司 | Light-emitting diode illumination apparatus |
| CN102155666A (en) * | 2011-04-18 | 2011-08-17 | 黄晓华 | Highly efficient heat radiation LED (Light Emitting Diode) lamp |
-
2011
- 2011-09-30 CN CN2011103092800A patent/CN102384385B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06349451A (en) * | 1993-06-03 | 1994-12-22 | Fujitsu Ltd | Light source and liquid crystal display using it |
| EP1215735A1 (en) * | 2000-12-13 | 2002-06-19 | Chao-Chin Yeh | Improved structure of lamp |
| CN201103878Y (en) * | 2007-08-10 | 2008-08-20 | 甘翠 | LED light source and lamp using the same |
| CN101649968A (en) * | 2008-08-13 | 2010-02-17 | 佶益投资股份有限公司 | Light-emitting diode illumination apparatus |
| CN102155666A (en) * | 2011-04-18 | 2011-08-17 | 黄晓华 | Highly efficient heat radiation LED (Light Emitting Diode) lamp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014166113A1 (en) * | 2013-04-12 | 2014-10-16 | 深圳市银盾科技开发有限公司 | Highly heat-conductive led welding method |
| CN103759235A (en) * | 2014-01-31 | 2014-04-30 | 芜湖市神龙新能源科技有限公司 | LED radiating method |
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| Publication number | Publication date |
|---|---|
| CN102384385B (en) | 2013-09-18 |
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Owner name: NINGBO KOMAES ELECTRICAL INDUSTRY CO., LTD. Free format text: FORMER OWNER: NINGBO KOMAES SOLAR TECHNOLOGY CO., LTD. Effective date: 20121119 |
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Effective date of registration: 20121119 Address after: 315041, 83, rosefinch village, Jiangdong District, Zhejiang, Ningbo Applicant after: NINGBO KOMAES ELECTRICAL INDUSTRIAL CO.,LTD. Address before: 315171 Zhejiang city of Ningbo province Yinzhou District Ji Shi Gang Zhen Feng Village Applicant before: NINGBO KOMAES SOLAR TECHNOLOGY Co.,Ltd. |
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Address after: 315171 Zhejiang city of Ningbo province Yinzhou District Ji Shi Gang Zhen Feng Village Applicant after: NINGBO KOMAES ELECTRICAL INDUSTRIAL CO.,LTD. Address before: 315041, 83, rosefinch village, Jiangdong District, Zhejiang, Ningbo Applicant before: NINGBO KOMAES ELECTRICAL INDUSTRIAL CO.,LTD. |
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Granted publication date: 20130918 Termination date: 20210930 |