CN102384385B - LED (light emitting diode) lamp with high heat dissipation performance - Google Patents

LED (light emitting diode) lamp with high heat dissipation performance Download PDF

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Publication number
CN102384385B
CN102384385B CN 201110309280 CN201110309280A CN102384385B CN 102384385 B CN102384385 B CN 102384385B CN 201110309280 CN201110309280 CN 201110309280 CN 201110309280 A CN201110309280 A CN 201110309280A CN 102384385 B CN102384385 B CN 102384385B
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led
circuit board
provided
plate
printed circuit
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CN 201110309280
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Chinese (zh)
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CN102384385A (en )
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马国富
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宁波市柯玛士电器实业有限公司
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Abstract

本发明提供了一种高散热性能的LED灯,属于LED灯技术领域。 The present invention provides a high heat dissipation performance LED lights, LED belongs to the technical field light. 它解决了现有的LED灯散热效果差的问题。 It solves poor conventional LED lamp heat. 本高散热性能的LED灯包括主体灯壳和灯头,主体灯壳和灯头之间设有连接座,主体灯壳内设有LED灯、印制电路板、散热盘和LED驱动电路板组,印制电路板的一面设置有LED灯,另一面安装在散热盘上,散热盘背面设有LED驱动电路板组,印制电路板上设置有LED灯一侧的板面上设有回光罩,灯头与LED驱动电路板组之间设有连接线,散热盘朝向印制电路板的一侧喷涂有镀铜层,印制电路板与散热盘紧贴设置且在位于LED灯的散热底板处开设有导热通孔,导热通孔内设有导热材料。 This high heat dissipation performance of the LED lamp comprises a connecting base provided between the body and the cap lamp housing, the lamp housing and the base body, the body is provided with the LED lamp housing, a printed circuit board, the heat dissipation plate and the LED driving circuit board group, India circuit board side is provided with a LED light, other surface mounted on the heat plate, the back of the heat sink plate provided with an LED driving circuit board group, the printed wiring board is provided with a reticle provided with a return side surface of the LED lights, is provided with a connecting line between the base and the LED driving circuit board group, the heat sink plate toward a side of the printed circuit board is sprayed with a copper plating layer, a printed circuit board disposed in close contact with the heat sink plate and the bottom plate defines the heat radiation of the LED light there are thermal vias, through-hole is provided with a thermally conductive heat-conducting material. 本LED灯具有散热效果好的优点。 This LED lamp has the advantages of good cooling effect.

Description

一种高散热性能的LED灯 A high-performance heat lamp LED

技术领域 FIELD

[0001] 本发明属于LED灯技术领域,涉及一种高散热性能的LED灯。 [0001] The present invention belongs to the technical field LED lamp, relates to a high thermal performance of the LED lamp.

背景技术 Background technique

[0002] LED的散热现在越来越为人们所重视,这是因为LED的光衰和其寿命是直接和其结温有关,散热不好结温就高,寿命就短。 [0002] LED heat attention now more and more people, this is because the LED light decline and its lifetime is directly related to its junction temperature, heat is not good junction temperature is high, the life is short.

[0003] LED发热的原因是因为所加入的电能并没有全部转化为光能,而是一部分转化成为热能。 [0003] The reason is because the LED of the added heat energy into light, and not all, but a portion is converted into heat energy. LED的光效目前只有1001m/W,其电光转换效率大约只有20〜30%左右,也就是说大约70%的电能都变成了热能。 LED light efficiency is currently only 1001m / W, only about 20 to 30% of its electro-optical conversion efficiency, that is to say about 70% of the electrical energy into heat.

[0004] 现在有不少厂商把很多LED晶粒集成在一起以得到大功率的LED。 [0004] There are many manufacturers to integrate a lot of LED die together to get high-power LED. 这种LED的功率可以达到5W以上,大多以10W,25W,和50W的功率等级出现。 This LED power can reach more than 5W, most of 10W, 25W, and 50W power level appears. 为了把多个LED晶粒(以共晶(Eutectic)或覆晶(Flip-Chip)封装)连接在一起,因为这些晶粒极为精细,所以需要采用精确的印制电路进行连接。 In order to the plurality of LED dies (eutectic (of Eutectic) or flip chip (Flip-Chip) package) are connected together, because these very fine grains, it is necessary to use a printed circuit connecting accurate.

[0005] 由于LED芯片的热容量很小,一点点热量的积累就会使得芯片的结温迅速提高,如果长时期工作在高结温的状态,它的寿命就会很快缩短。 [0005] Since the heat capacity of the LED chip is small, a little accumulation of heat that will increase the junction temperature of the die rapidly, long working at the high state if the junction temperature, its life will be shortened very quickly. 然而这些热量要能够真正引导出芯片到达外部空气,要经过很多途径。 However, these calories can really guide the chip to the outside air, to go through a lot of ways. 具体来说,LED芯片所产生的热,从它的金属散热块出来,先经过焊料到铝基板的PCB,再通过导热胶才到铝散热器,导热散热过程中所要经过的界面太多,影响散热效果。 Specifically, the heat generated by the LED chip, from which a metal heat sink block out through the first to the PCB solder the aluminum substrate, and then only by a thermally conductive adhesive to an aluminum heat sink, thermal cooling process to go through the interface too much, impact heat radiation.

发明内容 SUMMARY

[0006] 本发明的目的是针对现有的LED灯所存在的上述问题,而提出了一种散热效果较好的LED灯。 [0006] The present invention is directed to the above-described problems of the conventional LED lamp is present, while presenting a better cooling effect of the LED lamp.

[0007] 本发明的目的可通过下列技术方案来实现:一种高散热性能的LED灯,包括主体灯壳和灯头,所述主体灯壳和灯头之间设有连接座,所述主体灯壳内设有LED灯、印制电路板、散热盘和LED驱动电路板组,所述印制电路板的一面设置有所述LED灯,另一面安装在所述散热盘上,所述散热盘背面设有与LED灯相配的LED驱动电路板组,所述印制电路板上设有包围所述LED灯的回光罩,所述灯头与LED驱动电路板组之间设有连接线,其特征在于,所述的散热盘朝向印制电路板的一侧喷涂有镀铜层,印制电路板与散热盘紧贴设置且在位于LED灯的散热底板处开设有导热通孔,导热通孔内设有可将散热底板和镀铜层固定连接在一起的导热材料。 [0007] The object of the present invention can be achieved by the following technical solutions: A high heat dissipation performance LED lamp comprising a lamp housing and a lamp body, the lamp envelope is provided between the connecting base and the base of the main body, the lamp housing body equipped with an LED lamp, a printed circuit board, heat sink plate and the LED driving circuit board group, the printed circuit board is provided on one side of the LED lamp, the other side of the heat radiating plate mounted on the back surface of the heat dissipation plate LED driving circuit board is provided with the LED lights matching group, the printed circuit board is provided to surround the LED lamp mask back with a connecting line between the base and the LED driving circuit board group, wherein wherein said heat sink plate toward a side of the printed circuit board is sprayed with a copper plating layer, a printed circuit board and the heat radiating plate is provided in close contact with a thermal vias defines the bottom plate of the heat sink of the LED lamp, the thermally conductive through hole thermally conductive material may be provided with a fixed base plate and connected together heat copper plating layer.

[0008] 对于IW以上的大功率LED,通常它的散热底板是和两个电极是绝缘的。 [0008] For the above IW high power LED, which is usually cooling plate and the two electrodes are insulated. 为了使它能够更直接散热,我们将散热底板直接和散热盘焊接在一起。 To make it more direct heat, we will direct the base plate and the heat radiating plate are welded together. 但是一般的散热器都是铝合金制成的,是无法焊接的,为此我们需要先在散热盘上喷镀铜。 But often, the radiator is made of aluminum alloy, it is not welded, for which we need to spray on the copper cooling plate. 这样一来,减少了LED到散热盘之间的界面,免除掉印制电路板的热阻和导热硅胶或硅片的热阻,从而大大提高了散热效率。 Thus, reducing the LED to the interface between the heat sink plate, eliminating printed out resistance and thermal silica or silicon board thermal resistance, thereby greatly improving the cooling efficiency.

[0009] 在上述的一种高散热性能的LED灯中,所述的导热材料为锡,散热底盘和镀铜层之间通过低温焊锡工艺焊接在一起。 [0009] In the high thermal performance of an LED lamp, the thermally conductive material between tin, copper plating layer by heat chassis and welded together a low temperature soldering process.

[0010] 在上述的一种高散热性能的LED灯中,所述的印制电路板是通过先在铝表面微弧氧化形成一层氧化铝薄膜,再用溅射或丝网印刷制作电路层而制成的。 [0010] In the high thermal performance of an LED lamp, the printed circuit board by first forming a thin film layer of aluminum oxide on the aluminum surface micro-arc oxidation, sputtering or screen printing and then making circuit layer made of. 采用这种方法的最大优点是结合力强,而且导热系数高达2.1ff/mK,而且氧化层的热膨胀系数和铝差不多,所以它的剥离强度高达5N/mm以上。 The biggest advantage of this approach is a combination of strong, high thermal conductivity and 2.1ff / mK, and the thermal expansion coefficient and an aluminum oxide layer is about the same, so that the peel strength of up to 5N / mm or more.

[0011] 在上述的一种高散热性能的LED灯中,所述的印制电路板为柔性电路板。 [0011] In the high thermal performance of an LED lamp, the printed circuit board is a flexible circuit board.

[0012] 与现有技术相比,本高散热性能的LED灯使LED的散热底板与散热盘直接接触,减少了LED到散热盘之间的界面,免除掉印制电路板的热阻和导热硅胶或硅片的热阻,从而大大提高了散热效率。 [0012] Compared with the prior art, the high thermal performance of the LED lamp of the LED in direct contact with heat radiating base plate, reducing the interface between the LED to the heat sink plate - without having the printed circuit board and the heat resistance silica or silicon resistance, thus greatly improving the heat dissipation efficiency.

附图说明 BRIEF DESCRIPTION

[0013] 图1是本高散热性能的LED灯的结构示意图。 [0013] FIG. 1 is a schematic view of the present high heat dissipation performance of the LED lamp.

[0014] 图中,1、主体灯壳;2、灯头;3、连接座;4、印制电路板;41、导热通孔;41a、导热材料;5、LED灯;51、散热底板;6、LED驱动电路板组;7、散热盘;71、镀铜层;8、回光罩;81、扩口罩部;811、定位销部;82、平面部;9、透镜;10、连接线。 [0014] FIG, 1, the lamp body case; 2, base; 3, connecting base; 4, the printed circuit board; 41, thermal vias; 41a, thermally conductive material; 5, LED lights; 51, cooling plate; 6 , LED driving circuit board group; 7, heat sink plate; 71, copper plating layer; 8, back to the reticle; 81, mask portion expanded; 811, the positioning pin portion; 82, flat portion; 9, lens; 10, connection line.

具体实施方式 Detailed ways

[0015] 以下是本发明的具体实施例并结合附图,对本发明的技术方案作进一步的描述,但本发明并不限于这些实施例。 [0015] The following are examples of specific embodiments of the present invention taken in conjunction with the accompanying drawings, technical solutions of the present invention will be further described, but the present invention is not limited to these embodiments.

[0016] 如图1所示,本高散热性能的LED灯包括主体灯壳1、透镜9和灯头2,主体灯壳I开口部螺纹连接有透镜9,该透镜9为弧面罩状,其一面为凸弧面状,该透镜9弧面的最大弧度为2/5 ,主体灯壳I与透镜9形成蘑菇头状,主体灯壳I和灯头2之间通过连接座3连接。 [0016] As shown in FIG 1, the high thermal performance of the LED lamp comprises a lamp main body housing 1, the lens 9 and the cap 2, the lamp envelope body opening portion I screwed lens 9, the lens 9 as an arc-shaped face mask, one side a convex arc shape, the maximum curvature of the curved surface of the lens 9 2/5, I lamp housing body is formed with a mushroom head shaped lens 9, through a connection 3 is connected between the base body 2 and the cap lamp housing I.

[0017] 主体灯壳I内安装有LED灯5、印制电路板4、散热盘7和LED驱动电路板组6等部件,其中印制电路板4 一面上安装有LED灯5,另一面安装在散热盘7上,散热盘7背面连有与LED灯5相配的LED驱动电路板组6,安装有LED灯5 —侧的印制电路板4的板面上连有包围LED灯5的回光罩8,并且该回光罩8与散热盘7相插接。 [0017] I within the lamp housing body is mounted with an LED lamp 5, the printed circuit board 4, the heat sink plate 7 and the LED driving circuit board like member 6 group, wherein the printed circuit board 4 is mounted on one side of the LED lamp 5, the other surface mount on the heat sink plate 7, the heat sink plate 7 is connected with a back surface of the LED lamp 5 Matching the LED driving circuit board 6 group is attached to the LED lamp 5 - plate-side surface of the printed circuit board 4 is connected to surround the LED back light 5 mask 8, 8 and the reticle back plate 7 with connector and the radiator. 回光罩8包括包围LED灯5的扩口罩部81和用于与印制电路板4连接的平面部82,平面部82中部制有一供LED灯5穿入回光罩8的方孔,扩口罩部81呈扩口喇叭状,扩口罩部81的深度和最大宽度的比值为1/14,扩口罩部81外壁上还制有可与散热盘7相连接的凸出的定位销部811,在灯头2与LED驱动电路板组6之间接有连接线10。 8 comprises a back surrounding the reticle mask enlarged portion 81 of the LED 5 and 82, the central planar portion 82 made of a flat portion connected to the printed circuit board 4 has a LED for back light penetrates the mask 5 square hole 8, expanded mask portion 81 form a flared trumpet-shaped, the maximum expansion ratio of the depth and width of the mask portion 81 is 1/14, a mask enlarged outer wall portion 81 is also formed with a positioning pin projecting portion 811 may be connected to the heat sink plate 7, in the base board 2 and the LED group 6 of the driving cable 10 indirectly. 本实施例中,印制电路板4是通过先在铝表面微弧氧化形成一层氧化铝薄膜,再用溅射或丝网印刷制作电路层而制成的。 In this embodiment, the printed circuit board 4 is formed by first forming a thin film layer of aluminum oxide on the aluminum surface micro-arc oxidation, sputtering or screen printing and then preparing circuit layers made.

[0018] 散热盘7朝向印制电路板4的一侧喷涂有镀铜层71,印制电路板4与散热盘7紧贴设置且在位于LED灯5的散热底板51处开设有导热通孔41,使LED散热底板41直接暴露在散热盘7的盘面上,然后再在导热通孔41处采用低温焊锡进行焊接。 [0018] The heat sink plate 7 toward the side of the printed circuit board 4 is sprayed with a copper plating layer 71, the printed circuit board 4 against the heat radiating plate 7 is provided with a thermal vias and defines the bottom plate 51 in the heat sink of the LED lamp 5 41, the LED 41 is directly exposed to the heat dissipation plate heat radiating plate 7 in the disk, and then low-temperature solder welded at the thermal vias 41.

[0019] 本文中所描述的具体实施例仅仅是对本发明精神作举例说明。 Specific Example [0019] described herein is merely illustrative for spirit of the invention. 本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,但并不会偏离本发明的精神或者超越所附权利要求书所定义的范围。 Those skilled in the art of the present invention can be made to the specific embodiments described various modifications or additions, or a similar alternative embodiment, but without departing from the spirit of the invention or exceed defined in the appended claims range.

Claims (4)

  1. 1.一种高散热性能的LED灯,包括主体灯壳⑴和灯头(2),所述主体灯壳⑴和灯头(2)之间设有连接座(3),所述主体灯壳(I)内设有LED灯(5)、印制电路板(4)、铝合金散热盘(7)和LED驱动电路板组(6),所述印制电路板(4)的一面设置有所述LED灯(5),另一面安装在所述铝合金散热盘(7)上,所述铝合金散热盘(7)背面设有与LED灯(5)相配的LED驱动电路板组(6),所述印制电路板(4)上设有包围所述LED灯(5)的回光罩(8),所述灯头(2)与LED驱动电路板组(6)之间设有连接线(10),其特征在于,所述的铝合金散热盘(7)朝向印制电路板(4)的一侧喷涂有镀铜层(71),印制电路板(4)与铝合金散热盘(7)紧贴设置且在位于LED灯(5)的散热底板(51)处开设有导热通孔(41),导热通孔(41)内设有可将散热底板(51)和镀铜层(71)固定连接在一起的导热材料(41a)。 A high heat dissipation performance LED lamp comprising a lamp body and the base ⑴ housing (2), provided with connecting base (3), the lamp body case (I ⑴ between the lamp and the base shell (2) of the body ) is provided with LED lamps (5), the printed circuit board (4), aluminum cooling plate (7) and the LED driving circuit board group (6), the printed circuit board (4) is provided on one side of the LED lamp (5), mounted on the other surface of the aluminum cooling plate (7) on the aluminum alloy heat radiating plate (7) is provided with a back surface of the LED lamp (5) to match the LED driving circuit board group (6), the printed circuit board is provided to surround the LED lamp (5) back mask (8) (4), is provided with a connecting line between the base (2) and the group of the LED driving circuit board (6) ( 10), characterized in that the aluminum alloy heat radiating plate (7) towards the printed circuit board (4) side sprayed with a copper plating layer (71), the printed circuit board (4) cooling the aluminum alloy plate ( 7) provided close to and defines the thermal vias (41) located at the LED light radiating base plate (5) (51), the thermal vias (41) may be equipped with heat dissipating base plate (51) and a copper plating layer ( 71) fixed to the thermally conductive material joined together (41a).
  2. 2.根据权利要求1所述的一种高散热性能的LED灯,其特征在于,所述的导热材料(41a)为锡,铝合金散热盘和镀铜层(71)之间通过低温焊锡工艺焊接在一起。 The thermal performance of a high-LED lamp according to claim 1, characterized in that by low-temperature soldering process between the thermally conductive material (41a) is tin, aluminum and copper heat sink plate layer (71) welded together.
  3. 3.根据权利要求1或2所述的一种高散热性能的LED灯,其特征在于,所述的印制电路板(4)是通过先在铝表面微弧氧化形成一层氧化铝薄膜,再用溅射或丝网印刷制作电路层而制成的。 The thermal performance of a high or 1 2 LED lamp according to claim, wherein said printed circuit board (4) is formed by a first micro-arc oxidation in the surface layer of aluminum oxide aluminum film, produced by sputtering or screen printing a circuit layer formed.
  4. 4.根据权利要求1或2所述的一种高散热性能的LED灯,其特征在于,所述的印制电路板(4)为柔性电路板。 The thermal performance of a high or 1 2 LED lamp according to claim, wherein said printed circuit board (4) is a flexible circuit board.
CN 201110309280 2011-09-30 2011-09-30 LED (light emitting diode) lamp with high heat dissipation performance CN102384385B (en)

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WO2014166113A1 (en) * 2013-04-12 2014-10-16 深圳市银盾科技开发有限公司 Highly heat-conductive led welding method
CN103759235A (en) * 2014-01-31 2014-04-30 芜湖市神龙新能源科技有限公司 LED radiating method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1215735A1 (en) 2000-12-13 2002-06-19 Chao-Chin Yeh Improved structure of lamp
CN201103878Y (en) 2007-08-10 2008-08-20 甘 翠 LED light source and lamp using the same
CN101649968A (en) 2008-08-13 2010-02-17 佶益投资股份有限公司 Light-emitting diode illumination apparatus
CN102155666A (en) 2011-04-18 2011-08-17 黄晓华 Highly efficient heat radiation LED (Light Emitting Diode) lamp

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06349451A (en) * 1993-06-03 1994-12-22 Fujitsu Ltd Light source and liquid crystal display using it

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1215735A1 (en) 2000-12-13 2002-06-19 Chao-Chin Yeh Improved structure of lamp
CN201103878Y (en) 2007-08-10 2008-08-20 甘 翠 LED light source and lamp using the same
CN101649968A (en) 2008-08-13 2010-02-17 佶益投资股份有限公司 Light-emitting diode illumination apparatus
CN102155666A (en) 2011-04-18 2011-08-17 黄晓华 Highly efficient heat radiation LED (Light Emitting Diode) lamp

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平6-349451A 1994.12.22

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