CN102376586A - 电子器件用复合球的制造方法 - Google Patents
电子器件用复合球的制造方法 Download PDFInfo
- Publication number
- CN102376586A CN102376586A CN2010102592212A CN201010259221A CN102376586A CN 102376586 A CN102376586 A CN 102376586A CN 2010102592212 A CN2010102592212 A CN 2010102592212A CN 201010259221 A CN201010259221 A CN 201010259221A CN 102376586 A CN102376586 A CN 102376586A
- Authority
- CN
- China
- Prior art keywords
- electronic device
- plating
- tin layer
- smoothing processing
- complex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010259221.2A CN102376586B (zh) | 2010-08-18 | 2010-08-18 | 电子器件用复合球的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010259221.2A CN102376586B (zh) | 2010-08-18 | 2010-08-18 | 电子器件用复合球的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102376586A true CN102376586A (zh) | 2012-03-14 |
CN102376586B CN102376586B (zh) | 2016-03-30 |
Family
ID=45794990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010259221.2A Active CN102376586B (zh) | 2010-08-18 | 2010-08-18 | 电子器件用复合球的制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102376586B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104801879A (zh) * | 2014-01-28 | 2015-07-29 | 千住金属工业株式会社 | Cu芯球、焊膏和焊料接头 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6518667B1 (en) * | 2000-02-29 | 2003-02-11 | Allied Material Corporation | Semiconductor package using micro balls and production method thereof |
JP2005290505A (ja) * | 2004-04-02 | 2005-10-20 | Mitsubishi Materials Corp | 鉛−スズ合金ハンダめっき液 |
JP2007142314A (ja) * | 2005-11-22 | 2007-06-07 | Mitsubishi Electric Corp | はんだ接合用前処理装置、その前処理方法およびそれを適用した電子部品実装装置、電子部品 |
-
2010
- 2010-08-18 CN CN201010259221.2A patent/CN102376586B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6518667B1 (en) * | 2000-02-29 | 2003-02-11 | Allied Material Corporation | Semiconductor package using micro balls and production method thereof |
JP2005290505A (ja) * | 2004-04-02 | 2005-10-20 | Mitsubishi Materials Corp | 鉛−スズ合金ハンダめっき液 |
JP2007142314A (ja) * | 2005-11-22 | 2007-06-07 | Mitsubishi Electric Corp | はんだ接合用前処理装置、その前処理方法およびそれを適用した電子部品実装装置、電子部品 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104801879A (zh) * | 2014-01-28 | 2015-07-29 | 千住金属工业株式会社 | Cu芯球、焊膏和焊料接头 |
CN107097014A (zh) * | 2014-01-28 | 2017-08-29 | 千住金属工业株式会社 | Cu芯球的制造方法 |
CN107097014B (zh) * | 2014-01-28 | 2019-07-16 | 千住金属工业株式会社 | Cu芯球的制造方法 |
US10370771B2 (en) | 2014-01-28 | 2019-08-06 | Senju Metal Industry Co., Ltd. | Method of manufacturing cu core ball |
Also Published As
Publication number | Publication date |
---|---|
CN102376586B (zh) | 2016-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5633776B2 (ja) | 電子部品用複合ボールの製造方法 | |
JP5418894B2 (ja) | 電子部品用複合ボールの製造方法 | |
CN104637836B (zh) | 晶圆加工装置 | |
CN103985667A (zh) | 电性连接结构及其制备方法 | |
CN104272438A (zh) | 用于清洁电镀衬底保持器的方法和装置 | |
JP2007214571A (ja) | 均一な共平面性を有する多層フリップチップバンプの高さを制御する方法及び関連装置 | |
JP2007525595A (ja) | メッキ装置及び方法 | |
JP2001319994A (ja) | 半導体パッケージとその製造方法 | |
CN102779641A (zh) | 电子部件 | |
US9050654B2 (en) | Method of manufacturing composite ball for electronic parts | |
CN1701649B (zh) | 一种焊料供给方法以及焊料凸起形成方法 | |
TW570993B (en) | Sputtering target producing very few particles, backing plate or apparatus within sputtering device and roughening method by electric discharge machining | |
CN102376586A (zh) | 电子器件用复合球的制造方法 | |
CN104625941B (zh) | 晶圆加工装置 | |
US20190357346A1 (en) | Heat dissipation substrate, method for preparing same, application of same, and electronic device | |
KR101014839B1 (ko) | 3차원 SiP의 관통형 비아와 범프의 전기화학적 가공방법 | |
CN104466589A (zh) | 一种可伐合金玻封连接器镀镍方法 | |
KR101196972B1 (ko) | 전자부품용 복합 볼의 제조방법 | |
CN114934267A (zh) | 一种改善结构钢基底表面平整性的方法 | |
Wu et al. | Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging | |
EP3564988A1 (en) | Heat-dissipating substrate, preparation method and application thereof, and electronic component | |
CN105296944A (zh) | 一种具有抗氧化镀层的靶材组件 | |
KR20080071075A (ko) | 전해니켈도금장치 및 반도체장치의 제조방법 | |
CN104440513A (zh) | 硅片加工装置及方法 | |
US20090221152A1 (en) | Etching Solution And Method For Structuring A UBM Layer System |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: NEOMAX CO., LTD. Effective date: 20140818 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140818 Address after: Tokyo, Japan, Japan Applicant after: Hitachi Metals Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: Hitachi Metals Co., Ltd. Applicant before: Neomax Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220113 Address after: No. 508-51, Wen Xian Road, Bende District, Tainan, Taiwan, China Patentee after: ACCURUS SCIENTIFIC Co.,Ltd. Address before: Tokyo, Japan Patentee before: HITACHI METALS, Ltd. |
|
TR01 | Transfer of patent right |