CN102372426A - A method for segmenting a circular plate made of a brittle material into a plurality of rectangular single boards with the help of a laser - Google Patents
A method for segmenting a circular plate made of a brittle material into a plurality of rectangular single boards with the help of a laser Download PDFInfo
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- CN102372426A CN102372426A CN2011101934946A CN201110193494A CN102372426A CN 102372426 A CN102372426 A CN 102372426A CN 2011101934946 A CN2011101934946 A CN 2011101934946A CN 201110193494 A CN201110193494 A CN 201110193494A CN 102372426 A CN102372426 A CN 102372426A
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000463 material Substances 0.000 title claims abstract description 19
- 238000000926 separation method Methods 0.000 claims description 42
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 230000035882 stress Effects 0.000 description 16
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 208000010392 Bone Fractures Diseases 0.000 description 1
- 206010017076 Fracture Diseases 0.000 description 1
- 208000013201 Stress fracture Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
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- Materials Engineering (AREA)
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- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a method for segmenting a circular plate made of a brittle material into a plurality of rectangular single boards with the help of a laser, wherein, a separating crack(2)is introduced along a specified separating line with the help of the laser. In order to achieve the purpose of the invention, namely, the separating crack(2) can be generated reliably and can follow the walking direction of the specified separating line accurately, the invention provides a special principle., so that a laser beam can be guided on the separating line orderly in terms of time and space to form the separating crack(2).
Description
Technical field
The present invention relates to a kind of method, utilize this method can through introduce by means of laser thermic stress will by the material that is prone to embrittlement for example the flat board processed of glass, pottery or semiconductor material be divided into a plurality of orthogonal veneers.In DE10 2,007 033 242 A1, a kind of method of the same type has been described.
Background technology
Knownly can cut apart the material that is prone to embrittlement through introduce thermic stress by means of laser.For this reason for the defiber along regulation produces stress, be directed with laser beam align material surface and along the trend of the defiber of said regulation.Apply the refrigerant bundle and then for heated zone, produce tensile stress thus.
If the stress-difference that produces is higher than the stress-at-break of material and on the starting point of defiber, have a breach, start tearing of material from this indentation, there so.
The microfracture that exists if such breach is not; For example from the cut edge of machinery; And exist, must produce an initial breach so wittingly, but this for example realizes through the laser apparatus with high-energy-density of diamond cut off wheel or well focussed.For the latter, can use the processing laser apparatus or also can use one second laser apparatus.According to the internal structure of material, can meet the requirements of the separation crack of deep torn grain or complete penetrable material.
In order for example when manufacturing is used for the display panel of mobile telephone or similarity piece or when making wafer, flat board to be divided into a plurality of identical orthogonal veneers; According to prior art flat board is at first cut and then rotate one 90 ° cutting angle along a plurality of first defibers that extend parallel to each other, be cut along a plurality of second defibers that extend in parallel subsequently.Through the setting with the point of crossing of the defiber of 90 ° of angle of intersection, produced the orthogonal veneer thus, its side length is through the interval determination of defiber.
Conclusively for the quality of the veneer of manufacturing like this be: separate the crack and accurately constitute along the defiber of regulation.
In DE 10 2,007 033 242 A1, confirmed on the point of crossing, to occur such mass defect.Formed separation crack is not perpendicular to one another at the place, point of crossing, this means to separate fissured trend deviates from the defiber of regulation in the zone in point of crossing trend.This defective is attributed to thermic stress influencing each other along the seamed edge against each other that constitutes through the separation crack.This problem so solves, that is, make through being separated in each partition distance that forms on the first direction.
Yet proof in practice, when the perimeter line of flat board deviates from rectangular shape and when separation crack when not being perpendicular to peripheral surface, formed separation crack also deviates from the defiber of regulation at the peripheral adjacent section start of itself and plate to be split.
This particularly occurs in the case, that is, perimeter line is crooked.Mainly be that the flat board with circular perimeter line has practical significance, as being divided into the wafer disk of each single chip.This in theory flat board for example also can have trilateral, Polygons, oval in shape or have the peripheral surface of free forming.At least some defibers are not perpendicular to peripheral surface under all these situation.
Consequent problem should be set forth by means of the flat board of a circle by means of accompanying drawing 1a and 1b, and it will be cut apart along 10 defibers.According to prior art, dull and stereotyped 1 cut apart as stated realize along defiber 2, and they are provided with being parallel on the direction that is perpendicular to one another of dull and stereotyped 1 diameter.Said defiber becomes row to arrange from peripheral surface, and flat board at first is along at all defibers 2.1 to 2.5 on the first direction and and then cut apart along all defibers 2.6 to 2.10 quilts on other direction.
All defibers 2, except its trend and defiber that flat board 1 diameter overlaps, with one surrounding an entering angle [alpha] that is different from 90 ° with the tangent tangent line in the intersection point place of peripheral surface, this angle is along with diminishing with the increase of the distance of diameter.
Because since the thermic stress that sepn process forms at the starting point place of defiber (promptly in the fringe region at flat board) one at the starting point place with the mutually tangent direction of peripheral surface (next being called tangential direction) go up propagate and only the component of vertical projection on defiber of this stress be conclusive for the power of tearing along the defiber of stipulating of component crackle; So along with the increase of the distance of diameter, separate fissured formation and departed from predetermined defiber.
Critical from one in addition, the thickness with material, the distance beginning that designated port is relevant with cutting parameter, the power of tearing that is used to start sepn process becomes too small.
Other problem maybe be particularly has minimum seamed edge length being divided into and (produces during＜1mm) chip.In the test of implementing, observe, the trend in the separation crackle edge region that when cutting apart, is caused deviates from the defiber of regulation and all the time towards edge curvature.Possible explanation is the symmetric propagation perpendicular to defiber of thermic stress, and said thermic stress receives the resistance of different sizes according to the quantity of material of the adjacency in the defiber both sides.Crackle is towards extending and bending than the direction of slight drag.
Summary of the invention
Task of the present invention is; Providing a kind of is used for having the method that the flat board that is different from the orthogonal perimeter line is divided into a plurality of orthogonal single-pieces; Utilize this method to cause thermal stresses by means of laser; This stress causes forming the separation crack, and extend along the distribution of the defiber of stipulating accurately in said separation crack.
For the method that is used for the flat board of being processed by the material that is prone to embrittlement is divided into a plurality of orthogonal veneers; Wherein extend along being perpendicular to one another based on thermic stress by means of laser, form the separation crack that flat board is cut apart with the spaced apart defiber of regulation; Wherein will aim at dull and stereotyped laser beam at least in part successively along said defiber guiding; Above-mentioned task so realizes: in first step from a starting point on the peripheral surface of flat board; Utilization is divided into two parts along a separation crack of a defiber with flat board; Thereby separate the crack along this and form two collinear seamed edges; In second step, introduce along all defibers that extend perpendicular to said seamed edge from each starting point on formed seamed edge respectively and separate the crack; Form a plurality of parts thus, and introduce along the defiber that extends perpendicular to said other collinear seamed edge in all separation crack in third step, therefore at last flat board is divided into a plurality of veneers with other collinear seamed edge.
Advantageously, separate fissured introducing time sequence and be, separate the crack and introduce along such defiber successively respectively, to be divided into the mean line of seamed edge of that part of two parts nearest with utilizing this to separate the crack for this defiber.
In order to shorten process duration, advantageously, produce a plurality of separation crack in one direction simultaneously, it cuts apart a plurality of distinct portions.
In order further to shorten process duration, advantageously in third step, separate the crack along introducing from the defiber at an edge to the dull and stereotyped another one edge of flat board.
The each several part that also advantageously, between each single step, will form is separated from each other through drawing process.
Also should on the starting point of defiber, before introducing the separation crack, introduce initial breach.
Particularly advantageous ground aforesaid method can be used in the flat board of branch cyclotomy.Then first defiber is confirmed along diameter, thereby the flat board that the first separation crack will be justified is halved.
Advantageously, the first separation crack is also confirmed on vertical direction with it and the interval of all other defiber is confirmed with reference to them.
Description of drawings
Next set forth method of the present invention in detail in example ground by means of accompanying drawing, accompanying drawing illustrates:
Fig. 1 a-b is used to set forth the sketch according to the incision principle of prior art;
Fig. 2 a-c is used to set forth the sketch of incision principle according to the method for the invention;
Fig. 3 a-b has the flat board of the circle of defiber, can find out therein along defiber and introduce the fissured principle of separation.
Embodiment
Next this method is set forth by means of the flat board 1 of circle.Yet this method also can be used for and dull and stereotyped peripheral shape separating plate irrespectively, and advantageously is suitable for separating such flat board, and its perimeter line is different from rectangle.
This method is particularly suitable for the wafer disk of circle is separated into each one orthogonal chip.
Introducing separates the crack and realizes with the same manner with the method for describing in the prior art, wherein guides with respect to flat board along predetermined defiber with the surface of laser beam aligning flat board and from starting point.
The conclusive difference part of method of the present invention is introduced and is separated fissured principle or mechanism, and it depends on to begin to introduce from where and separates the crack and with which kind of order.
Fig. 1 a illustrates a kind of flat board 1 of circle, has 10 defiber 2.1-2.10 on this example ground.The introducing order of these defibers is represented with the successive number designation, separates the crack as described above according to the principle of prior art and also is introduced into along these defibers with this introducing order.
In order to set forth problem to be solved, Fig. 1 b schematically illustrates respectively the stress that forms according to the principle of prior art at the starting point place of defiber.
Utilize according to the method for the invention, flat board should (as shown in Figure 1) utilize the identical layout of defiber or identical pattern to be divided into a plurality of veneers.
At flat board 1 shown in Fig. 2 a-c, in this flat board, introduce step by step and separate the crack.In order to keep view clear, on each direction, only should introduce three defibers.
At the flat board that has 18 defibers shown in accompanying drawing 3a and the 3b, introduce the fissured time sequence of separation in one direction so that particularly illustrate along defiber.
Ultimate principle according to the method for the invention is that each separates crack (limiting one of them veneer after it) should be from such starting point, and thermic stress is perpendicular to separating crack propagation in this starting point.This is so reliably obtaining under the situation, that is, defiber (separating the crack should extend along these defibers accurately) is perpendicular to the collinear seamed edge.
In addition, dull and stereotyped 1 division should advantageously so realize, that is, make each separate the both sides, crack at least at the starting point place in abutting connection with identical materials amount as far as possible.
In a first step (shown in accompanying drawing 2a), dull and stereotyped 1 separates the crack through one is divided into two parts, forms two collinear seamed edges thus.This cuts apart advantageously so realization, that is, make dull and stereotyped 1 to be halved.
If flat board is the flat board of circle, the diameter of the flat board of so should binary separation crack inevitable and circle overlaps, is somebody's turn to do the separation crack thus and extends perpendicular to the tangent line on the peripheral surface.The stress that produces at the starting point place with the same perpendicular to the seamed edge that defiber extends from a collinear seamed edge, extends perpendicular to defiber therefore ideally.And then two parts that in first step, form for example are utilized in the drawing process of describing among the DE 10 2,007 033 242 and move apart each other.Preferably be spaced apart 5 to 10 μ m between these two parts.
In second step (shown in accompanying drawing 2b), from all separation crack of two seamed edges that form along introducing at a upwardly extending defiber of the first party perpendicular to these two seamed edges.This means from dull and stereotyped 1 center and have rightabout crack line along a defiber generation respectively.
Advantageously process initial breach in advance at the section start of predetermined defiber respectively, it can scratch device by means of diamond or hard metal and mechanically realize or contactlessly realize by means of laser.
In ensuing sepn process, separating the crack advantageously is not to introduce along defiber side by side successively, but will half-and-half divide equally through separating the part that had produced already as far as possible respectively.Advantageously, in second step, introduce separating fissured first defiber along it confirms and confirms each parallel with it defiber from this first defiber along the area mean line of two semicircular parts that produced.
On the fissured whole length of said separation along said first defiber, it is identical separating fissured material at opposite sides amount at this.Introduce along the nearest defiber in center from the seamed edge of this part respectively with regard to part to be split respectively successively in all other the separation crack on equidirectional.Therefore separating on the fissured starting point separating crack material at opposite sides amount at each at least is much at one.This process is continuity so further, on first direction, is introduced into along defiber until all separation cracks.
This way has reduced the material resistance difference and has therefore guaranteed to separate the high precision straight line trend of crack along the trend of the defiber of regulation on the propagation direction of the stress that is caused.As the result of second step, dull and stereotyped 1 is cut into a plurality of parts, that is, and and the part of a plurality of strips.
Then in a third step, realize bar is divided into veneer, that is, bar is cut apart perpendicular to the seamed edge that forms.
Advantageously processing initial breach in advance on the edge at each bar on the defiber of regulation.Possible embodiment is the breach of the minimum in the edge region, also can be the designated port that on its whole length, links up in defiber inside.
After processing initial breach, advantageously realize other drawing process, it should stop the seamed edge contact during ensuing sepn process.
In third step (shown in accompanying drawing 2c), be similar to now all separation cracks of second step from existing seamed edge along introducing at the upwardly extending defiber of second party.
Different with second step (in second step, constitute respectively and separate the crack) along a defiber, in third step, constitute a plurality of separation crack successively along a defiber, they limit through the collinear seamed edge that in second step, produces of bar.These seamed edges are accurately perpendicular to the separation crack that will newly produce.Because the veneer with edges abut flat board that form does not have the orthogonal shape, so they are waste materials, are not important with the fissured quality of the separation of its qualification therefore.Unessential be with the edge section adjacency separate the crack whether the follow separate line trend or perhaps they be not formed fully yet.Because ensuing separation crack is again from a seamed edge perpendicular to this separation fracture propagation, this ensuing separation crack also has desired quality again.
Therefore the separation crack of in third step, introducing need not to introduce in the opposite direction from dull and stereotyped 1 center by the strong hand; As shown in Fig. 2 c; But also can introduce in identical direction from dull and stereotyped 1 edge, this in addition cause shortening process duration with comparing.
Therefore each separates crack (limiting an orthogonal single-piece after it) in the method; Except the first separation crack at starting point place; All form perpendicular to collinear seamed edge, thermic stress is to be introduced into for separating crack best mode for the specified distribution of the defiber of regulation thus.
In the separation crack of all generations shown in Fig. 3 a, wherein the principle of their introducings illustrates through mark and successive numeral number.Different with the principle of setting forth according to Fig. 2 a-2c, at this as stated, the separation crack that in third step, is introduced into is introduced into from dull and stereotyped 1 edge.
Starting point is in one direction separated fissured direction through square symbology and introducing respectively and is utilized arrow to represent respectively.Be clear that on the separation crack of the small number shown in this can be greatly just to clearly signal and quantity many times.How they introduce along defiber the numbering that the utilization of separation crack increases successively with the successive numeral.Defiber with identical numbering can be introduced before introduce in the separation crack of next higher number simultaneously or in turn.
Need promptly carry out relative movement between dull and stereotyped 1 at laser beam and the workpiece that parting tool is promptly aimed at dull and stereotyped 1 surface respectively between three described steps of method.In described example, relate to 90 ° of rotations, 90 ° of rotations of flat board 1 preferably to be processed.Can a plurality of laser beams be aimed at dull and stereotyped 1 simultaneously in order to introduce the separation crack simultaneously.
Claims (8)
1. be used for the flat board of being processed by the material that is prone to embrittlement (1) is divided into the method for a plurality of orthogonal veneers; Wherein extend along being perpendicular to one another based on thermic stress by means of laser, form the separation crack (2) that dull and stereotyped (1) is cut apart with the spaced apart defiber of regulation; The laser beam that wherein will aim at dull and stereotyped (1) is at least in part successively along said defiber guiding; It is characterized in that, in first step,, utilize along a separation crack (2.1) of a defiber flat board (1) is divided into two parts from a starting point on the peripheral surface of dull and stereotyped (1); Thereby separate crack (2.1) along this and form two collinear seamed edges
In second step, introduce along all defibers that extend perpendicular to said seamed edge from each starting point on formed seamed edge respectively and separate crack (2.2-2.5), form a plurality of parts thus with other collinear seamed edge, and
Introduce along the defiber (2.6.1-10 to 2.8.1-10) that extends perpendicular to said other collinear seamed edge in all separation crack in third step, therefore at last flat board (1) is divided into a plurality of veneers.
2. the method for claim 1; It is characterized in that; The introducing time sequence of in each single step, separating crack (2) is; Separate the crack and introduce along such defiber successively respectively, to be divided into the mean line of seamed edge of that part of two parts nearest with utilizing this to separate the crack for this defiber.
3. method as claimed in claim 2 is characterized in that, produces a plurality of separation crack (2) simultaneously in one direction.
4. the method for claim 1 is characterized in that, in third step, separates crack (2.6.1-10 to 2.8.1-10) along introducing from the defiber at an edge to the another one edge of dull and stereotyped (1) of dull and stereotyped (1).
5. the method for claim 1 is characterized in that, the each several part that between each single step, will form is separated from each other through drawing process.
6. the method for claim 1 is characterized in that, on the starting point of defiber, separates crack (2) in introducing and introduces initial breach before.
7. like the application of one of above-mentioned claim 1 to 6 described method, be used for the flat board (1) of branch cyclotomy, it is characterized in that, the position of first defiber overlaps with the diameter of dull and stereotyped (1).
8. application as claimed in claim 7 is characterized in that, so stipulates defiber, makes two diameters with flat board (1) in the defiber be perpendicular to one another overlap and the interval of all other defiber is confirmed with reference to these two defibers.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010032029A DE102010032029B4 (en) | 2010-07-21 | 2010-07-21 | Method for separating a round flat plate made of brittle material into several rectangular individual plates by means of laser |
| DE102010032029.3 | 2010-07-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102372426A true CN102372426A (en) | 2012-03-14 |
| CN102372426B CN102372426B (en) | 2015-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110193494.6A Expired - Fee Related CN102372426B (en) | 2010-07-21 | 2011-07-12 | The flat board of the circle made by the material by easy embrittlement by means of laser is divided into the method for multiple rectangular single boards |
Country Status (4)
| Country | Link |
|---|---|
| KR (2) | KR102127015B1 (en) |
| CN (1) | CN102372426B (en) |
| DE (1) | DE102010032029B4 (en) |
| TW (1) | TWI548478B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104838483A (en) * | 2012-12-17 | 2015-08-12 | 新加坡科技研究局 | Wafer dicing apparatus and wafer dicing method |
| CN108428674A (en) * | 2017-02-14 | 2018-08-21 | 英飞凌科技股份有限公司 | Multiple substrate and its manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012210527A1 (en) | 2012-06-21 | 2013-12-24 | Robert Bosch Gmbh | Method of making a diode and diode |
| US10468304B1 (en) * | 2018-05-31 | 2019-11-05 | Semiconductor Components Industries, Llc | Semiconductor substrate production systems and related methods |
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| JP4659300B2 (en) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | Laser processing method and semiconductor chip manufacturing method |
| JP4182001B2 (en) * | 2002-03-12 | 2008-11-19 | 三星ダイヤモンド工業株式会社 | Method and apparatus for processing brittle materials |
| KR20070005604A (en) * | 2004-04-27 | 2007-01-10 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method for forming vertical crack on brittle board and vertical crack forming apparatus |
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| JP5054496B2 (en) * | 2007-11-30 | 2012-10-24 | 浜松ホトニクス株式会社 | Processing object cutting method |
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2010
- 2010-07-21 DE DE102010032029A patent/DE102010032029B4/en active Active
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2011
- 2011-07-01 TW TW100123293A patent/TWI548478B/en active
- 2011-07-12 CN CN201110193494.6A patent/CN102372426B/en not_active Expired - Fee Related
- 2011-07-18 KR KR1020110071032A patent/KR102127015B1/en active IP Right Grant
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2019
- 2019-02-08 KR KR1020190014893A patent/KR20190016527A/en not_active Application Discontinuation
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| JP2001058281A (en) * | 1999-06-18 | 2001-03-06 | Mitsuboshi Diamond Industrial Co Ltd | Scribing method using laser beam |
| CN1447779A (en) * | 2000-08-24 | 2003-10-08 | 肖特玻璃制造厂 | Method and device for cutting flat glass plate into number of rectangular plates |
| CN1868943A (en) * | 2005-05-27 | 2006-11-29 | 肖特股份有限公司 | Method of mechanically breaking a scribed flat workpiece of brittle fracturing material |
| US20080217311A1 (en) * | 2005-08-06 | 2008-09-11 | Gabriele Eberhardt | Method For Severing Brittle Flat Materials by Laser Beam With Previously Produced Traces |
| CN1986140A (en) * | 2005-12-21 | 2007-06-27 | 詹诺普蒂克自动化技术有限公司 | Method and apparatus for separating wafer as a disk made of fragile materials |
| CN101342639A (en) * | 2007-07-12 | 2009-01-14 | 詹诺普蒂克自动化技术有限公司 | Method and device for dividing a plane-parallel plate made of a brittle material into a plurality of individual plates by means of a laser |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104838483A (en) * | 2012-12-17 | 2015-08-12 | 新加坡科技研究局 | Wafer dicing apparatus and wafer dicing method |
| CN108428674A (en) * | 2017-02-14 | 2018-08-21 | 英飞凌科技股份有限公司 | Multiple substrate and its manufacturing method |
| CN108428674B (en) * | 2017-02-14 | 2022-04-19 | 英飞凌科技股份有限公司 | Composite substrate and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102372426B (en) | 2015-12-16 |
| TW201213035A (en) | 2012-04-01 |
| TWI548478B (en) | 2016-09-11 |
| KR20190016527A (en) | 2019-02-18 |
| DE102010032029B4 (en) | 2012-09-13 |
| DE102010032029A1 (en) | 2012-01-26 |
| KR20120009405A (en) | 2012-02-01 |
| KR102127015B1 (en) | 2020-06-26 |
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